Abstract: A predictive method is used to compensate for intermediate batch sensitivities which inevitably occur during resist batch changeover. The compensation is applied to historical dose levels to arrive at a new dose level estimating an optimum dose. When the system discovers that a new batch of resist is loaded to a tool, historical data is used to calculate a reference dose for each tool. A batch factor is continuously calculated and using historical data along with the batch factor, a dose adjustment is made to maintain proper image size.

Abstract: A dioptric projection optical system for imaging a reduced image of a pattern on a first surface onto a second surface using radiation-transmitting refractors. The projection optical system has a front lens unit of a positive refracting power and a rear lens unit of a positive refracting power. An aperture stop is located in the vicinity of a rear focal point of the front lens unit.

Abstract: A photolithography process with multiple exposures is provided. A photomask is placed and aligned above a wafer having a photoresist formed thereon at a predetermined distance. Multiple exposures are sequentially performed on the photoresist through the photomask. Each of the multiple exposures is provided with a respective illuminating setting that is optimized for one duty ratio of the photomask. Thereby, an optimum through-pitch performance for pattern transfer from the photomask unto the photoresist is obtained. Then, a development is performed on the photoresist.

Abstract: A method of obtaining an optimum exposure condition of a step-and-scan exposure apparatus, the step-and-scan exposure apparatus synchronously moving a mask and a substrate relative to an illumination light to transfer a pattern of the mask onto a plurality of shot areas on the substrate, the method comprising the steps of determining an unevenness of an illuminance of the illumination light, adjusting the illumination light to change the illuminance within a predetermined range, inputting a plurality of first exposure conditions into the step-and-scan exposure apparatus, testing the plurality of first exposure condition in a step-and-repeat mode.

Abstract: A tool for placing an identifying mark on a semiconductor wafer has a bundle of optical fibers that can be illuminated in a pattern representing an identifying character. Light from the fibers is focused on a photoresist layer during wafer manufacture and a pattern of dots is etched into the wafer to represent the character. The dots are too small to be seen with the human eye but the character can be read by a human or by a machine. The character is etched as part of a conventional etch step in manufacturing the wafer and it is easily repeated as a series of manufacturing steps obscure the original mark.

Abstract: In a step S1, an excimer laser control unit sets a central wavelength command value, an integral spectrum distribution command value, and an exposure pulse number in a laser internal control unit. In a step S2, the laser internal control unit receives the central wavelength command value, the integral spectrum distribution command value, and the exposure pulse number from the excimer control unit, and executes an actual exposure when an exposure command is received. In a step S3, the laser internal control unit, after executing exposure, measures the central wavelength of the pulse and the spectral distribution, and corrects any discrepancy between the actually measured central wavelength and the central wavelength command value by outputting a drive command to the narrow-band module so that the central wavelength of the succeeding pulse substantially matches the central wavelength command value. In a step S4, spectral distribution data is integrated with each exposure.

Abstract: Methods and apparatus for varying the number and intensity of beams of a photo-lithographic light source for exposing photoresist material include beam dividers and beam focusing means. Methods include producing an incident light beam having uniform intensity distribution, refracting the incident light beam into a plurality of divergent beams, refracting the plurality of divergent beams into a plurality of parallel beams, and exposing an object with light of the plurality of parallel beams. Apparatus includes source of light beam having uniform intensity distribution, first refracting element for refracting the light beam into a plurality of divergent beams, second refracting element for refracting the plurality of divergent beams into a plurality of parallel beams, and means for exposing the object with light of the plurality of parallel beams. Variations in the separations of the refractive elements allows for the control of the size, shape, and dispersion patterns of resultant beams.

Abstract: An image reproducing apparatus to reproduce input image data supplied from an image data supply source as a visible image, which comprises a display, a printer, and an image processing device which shares hardware for processing the input image data to obtain image data to be represented on the display and image data for image recording with the printer. The image processing device includes an image processing section to subject the input image data to specified image processing steps and a data converting section to convert the thus processed data to the image data for displaying and the image data for image recording. The apparatus can reduce the distinction between the image to be represented on the display and the image to be reproduced on the hard copy, or the distinction found on the images reproduced in the image output devices due to the output properties thereof, with reduced cost of the image processing device.

Abstract: An exposure apparatus for use in a photolithographic process, in which an illumination beam is attenuated, split by a beam splitter, and received by an integrator sensor which produces an illuminance detection signal. The illuminance detection signal and a desired illuminance signal from an exposure control system are supplied to a power supply system which powers a mercury-vapor lamp with a predetermined resolution such that the two signals may be equal to each other. The exposure control system determines any error in the illuminance on the wafer from the illuminance detection signal, and supplies a stage control system with correction values for the velocities at which a reticle stage and a wafer stage is to be moved for scanning. The light source may be powered with a constant input power, and an adjustment rod for adjusting the quantity of light of the illumination beam may be disposed in a light travelling region through which the light of the illumination beam from the light source travels.

Abstract: A exposure device including a lamp and integrator lens for exposure of a substrate having a plurality of rectangular exposure zones and including a substrate carrier capable of supporting a substrate. The substrate moves in the X-Y directions and the respective exposure zones on the substrate are progressively exposed. The exposure device also includes a holding part for the integrator lens, which is composed of a parallel arrangement of several lenses yielding a rectangular cross sectional shape, that enables the integrator lens to turn 90° around the optical axis of the incident light. This arrangement permits precise illumination of the exposure zones on the substrate as the exposure zones on the substrate change orientation.

Abstract: The present invention relates to a beam output control method in which an output from a pulse energy source that emits pulses of exposure beam used in an exposure apparatus is controlled. This method controls an output from the pulse energy source by changing a control mode in accordance with an operation of the exposure apparatus.

Abstract: In a scanning exposure apparatus and method, a pattern formed on a mask is transferred onto a substrate by scanning the mask and the substrate synchronously with respect to pulsed light emitted from a pulsed laser light source. A number of pulses of a light beam that are to be emitted to each point on the substrate during scanning exposure is determined, and the light source is controlled according to the determined number of pulses, so that the maximum scanning speeds of the mask and the substrate and/or the maximum oscillation period of the pulsed light are maintained during the scanning exposure process. In another arrangement, during the process of exposing a shot area on the substrate, integral values of the amount of exposure energy are detected at a plurality of points in that shot area. Based on this detection result, the oscillation frequency of the pulsed light that is to be emitted to the next shot area is determined so that the next shot area is exposed at an appropriate exposure level.

Abstract: A laser beam emitted from an exposure laser beam source has a uniform illuminance distribution after passing through a fly-eye lens selected according to the aperture stop. The exposure light is projected onto a reticle on which a predetermined pattern is formed, and the reticle pattern is projected onto a wafer by means of a projection optical system having a pupil filter inserted therein. A cleaning light beam branching off from the exposure light beam is projected through a beam splitter and a total reflection mirror onto the fly-eye lens located at a retraction position. A plane-parallel plate at the retraction position is irradiated with a cleaning light beam. The fly-eye lens and the plane-parallel plate are self-cleansed by the cleaning light beam, so that the transmissivity is kept higher than a predetermined value during standby.

Abstract: The present invention provides a system, comprising an exposure apparatus and a control mean electrically connected to the exposure apparatus, for calculating exposure energy (Ee). The control mean executes an exposure energy calculation program according to mask data, comprising an actual transparency percentage parameter (Ta) and a mask error, and a critical dimension (CD) specification, comprising at least a basic transparency percentage parameter (Tb), a transparency constant (Tc), a CD energy constant (Cc) and a basic exposure energy, to calculate the exposure energy and output the exposure energy to the exposure apparatus. In the exposure energy calculation program, the basic transparency percentage parameter (Tb) is firstly subtracted from the actual transparency percentage parameter (Ta). The resulting difference is then multiplied together with the transparency constant (Tc) parameter to calculate a transparency percentage difference energy.

Abstract: An exposure apparatus with optimum illumination conditions without dependence on the directionality of the fine pattern on a reticle comprises an illumination optical system for illuminating a reticle having a pattern to be transferred and a projection optical system for projecting and transforming the reticle pattern on a substrate. The illumination optical system has pupil shape forming unit for forming four substantially planar light sources on the plane in the vicinity of its pupil. These four substantially planar light sources are arranged at each substantial vertices of a narrow rectangle whose barycenter is located on the illumination optical axis.

Abstract: A light projection apparatus comprising a plurality of light emitting diodes (LEDs) of two or three primary colors adapted to provide light along a light path common to said LEDs. The output color of the collective diodes is controlled by displaying the various colors at carefully controlled intensities, and the resulting colored light projected through a transmissive LCD matrix interposed within the light path resulting in a light pattern. A mirror positioned within but at an oblique angle to the light path reflects the light pattern in a direction dictated by the angle of the mirror to the light path where the angle axis is modified by a pair of worm drives affixed to transverse axes of the mirror mount.

Abstract: A light producing apparatus for irradiating a beam from a light source to a target to produce light having a wavelength different from the beam includes a first condensing optical system for condensing the beam from the light source, and an imaging optical system for imaging onto the target under a demagnification a condensing point of the beam by the first condensing optical system.

Abstract: An exposure apparatus includes a condensing optical system for condensing light from a light source to a specified plane, an imaging optical system for imaging the light in the specified plane onto a reticle or a mask or near the reticle or mask, a projection optical system for projecting a pattern on the reticle or the mask onto an object to be exposed; and

Abstract: A stage apparatus includes a stage, a member fixed to the stage and a weight compensation mechanism having at least three spring members for compensating for a weight of a structure including the stage and the member. A barycentric position of the structure deviates from a centroid of a polygon formed by support points of the at least three spring members. The spring constants of the at least three spring members are based on a relative positional relationship between the barycentric position of the structure and the at least three spring members so as to set at least one spring constant different from the other spring constants.

Abstract: An exposure apparatus, wherein light emitted from a relatively low output light source is selectively transmitted by a light path switching controller and mirrors to exposure units , amplifiers are provided near the exposure units, and the light from the light source is amplified there and then sent to the corresponding exposure units.

Abstract: The invention relates to a lighting system for a projection lighting system that comprises: a light source (1) that emits light of wavelengths of ≦193 nm, especially wavelengths between 10 nm and 20 nm; a collector unit (30, 32) for illuminating a mirror device that produces secondary light sources (14), said mirror device comprising at least one mirror (34) that is subdivided into grid elements (10, 40, 42, 100, 102); a diaphragm plane (16); one or more optical elements (36, 38) that represent the diaphragm plane (16) in the exit pupil (390) of the lighting system; an object plane (39) in which the images of the grid elements are substantially in line and illuminate a predetermined filed with an intensity distribution; an optical element (30, 310, 320, 330) that produces an intensity distribution in the exit pupil (390) that is defined by the kind and/or filling degree, said kind and/or filling degree of the intensity distribution being modifiable buy exchanging, displacing or deforming the optical elemen

Abstract: In an exposure control method and apparatus, pulsed illumination light from an excimer laser light source is reduced by an energy rough modulator before illuminating a reticle. The reticle and a wafer are moved or scanned relative to a projection optical system to sequentially transfer a pattern image of the reticle to individual shot areas on a wafer. An integrator sensor indirectly monitors the amount of exposure on the wafer, and an energy monitor monitors the energy of pulsed illumination light inside the excimer laser light source. Based on the result of measurement by the integrator sensor and the correlation between the result of measurement by the integrator sensor and the result of measurement by the energy monitor, the emission power of the excimer laser light source is finely modulated at a high speed without employing an energy fine modulator that finely modulates the transmittance by a mechanical drive and without causing an energy loss along the optical path of illumination light.

Abstract: An exposure apparatus that exposes an image of a pattern of a mask onto a photosensitive substrate with EUV radiation, and includes a radiation source unit and an exposure apparatus body unit. The exposure apparatus body unit includes an optical integrator, a mirror arranged in an optical path between the radiation source unit and the optical integrator, a detector arranged in an optical path of the exposure apparatus body unit, and a controller which is connected to the detector and which controls an inclination of the mirror based on an output from the detector. In addition, the radiation source unit and the exposure apparatus body unit are installed independently.

Abstract: In a slit scan type projection exposure apparatus, a predetermined number of pulsed lights are emitted from a pulsed light source to transfer a pattern on a reticle to a wafer while the reticle and the wafer are scanned at a constant speed with respect to an exposure area on the wafer. At that time, not only fluctuations of the energies of the pulsed lights but also fluctuations of light emission timing of the pulsed lights are taken into consideration.

Abstract: In one illustrative embodiment, a method is provided that comprises energizing a light source to provide light having a preselected intensity. A first photosensor, which is capable of delivering a first signal indicative of the intensity of the light source, is exposed to the light source. A second photosensor, which is also capable of delivering a second signal indicative of the intensity of the light source, is also exposed to the light source. Thereafter, the first and second signals are compared, and an error signal is delivered in response to detecting a significant difference between the first and second signals.

Abstract: An inexpensive and highly productive exposure device for directly scanning and exposing a photosensitive material sensitive to at least a UV region, based on digital data. As a motor controller moves an exposure head at a fixed speed in Y direction, image data is read one line of image data, each GLV element of a light modulator array is switched on/off by the read image data, and laser light from a high power light source of the exposure head is switched on/off. A UV-sensitive object to be exposed is exposed in X direction in a number of pixel units that substantially corresponds to the number of the GLV elements. The image data is scanned and exposed by one line in Y direction (main-scan). The motor controller moves a flat stage by one step in X direction (sub-scan). The object to be exposed is imagewise-exposed by repeating such scans.

Abstract: A lithographic projection apparatus comprising a first radiation system for providing a first projection beam of radiation; a second radiation system for providing a second projection beam of radiation; a support structure for supporting a first patterning structure and a second patterning structure, the first patterning structure serving to pattern the first projection beam according to a second pattern and the second patterning structure serving to pattern the second projection beam according to a second pattern; a substrate table for holding a substrate; a projection system for combining the first and second patterned beams and projecting the combined beam onto a target portion of the substrate.

Abstract: There is disclosed a light guide for guiding light from a light source in a longitudinal direction and radiating the light to illuminate an object to be illuminated, which includes a diffuser for diffusing the light from the light source along the longitudinal direction of the light guide, and a radiator for radiating the light diffused by the diffuser in a predetermined direction. By arranging the diffuser and the radiator so that a normal line passing through the center of the width of the diffuser is different from the predetermined direction at least in the vicinity of the light source when viewed in the longitudinal direction of the light guide, the illuminance distribution of the longitudinal direction of the light guide is uniformed.

Abstract: A masking aperture for a photomask illumination system provides controlled on-axis and off-axis illumination. The masking aperture has a dithered pattern of pixels. The intensity of the pattern controls the illumination of the photomask. The masking aperture pattern defines one or more zones of illumination. Zones comprise elements that are patterned in accordance with a selected wavelength of incident light to diffract the incident light into an illumination pattern for illuminating a photomask. Each of the elements is constructed with a matrix of pixels. In the preferred embodiment the array of pixels is 8×8. The number of elements is generally greater than 3×3.

Abstract: A lithographic device has a radiation system for supplying a projection beam of radiation; a mask table provided with a mask holder for holding a mask; a substrate table provided with a substrate holder for holding a substrate; and a projection system for imaging an irradiated portion of the mask onto a target portion of the substrate. The projection system is separated from the table by an intervening space which can be at least partially evacuated and which is delimited at the location of the projection system by a mirror from which the employed radiation is directed toward the substrate table. The intervening space contains a hollow tube located between the solid surface and the substrate table and situated around the path of radiation, the form and size of the tube being such that radiation focused by the de Jager et al. projection system onto the substrate table does not intercept a wall of the hollow tube.

Abstract: An apparatus has a pulse light source for emitting light pulses with varying light quantities, an illumination optical system for radiating the light pulses from the source onto a predetermined illumination region on a mask on which a transfer pattern is formed, and a projection optical system for projecting an image of the pattern onto a predetermined exposure region on a substrate, and which synchronously scans the mask and the substrate during the projection. The apparatus includes a measuring device for detecting intensities of the light pulses radiated onto the substrate during the scanning and measuring an integrated light quantity on each of a plurality of partial regions in the exposure region on the substrate on the basis of a detection signal of the intensities, wherein the partial regions are defined by a scanning speed of the photosensitive substrate and an oscillation interval of the light pulses.

Abstract: Disclosed are a projection exposure apparatus and a device manufacturing method using the same, in which a pattern of a reticle illuminated with laser light from a continuous emission excimer laser is projected on a substrate by use of a projection optical system. The projection optical system comprises a lens system made of a substantially single glass material. There is a pulse emission laser provided, for injecting pulse light into the continuous emission excimer laser, for injection locking. This structure assures accurate projection of the reticle pattern, while enabling improvements of the throughput.

Abstract: An projection exposure apparatus and method for illuminating a transfer pattern and forming an image upon a mask for exposure from the illumination light and transfer exposing the image of the pattern of the mask under the illumination light. Switching is performed between a normal illumination condition and a modified illumination condition based upon the numerical aperture of the illumination light; wherein the normal illumination condition occurs when the light quantity distribution at the illumination pupil plane is in a first region, including the optical-axis; and the modified illumination condition occurs when the light quantity distribution at the illumination pupil plane is in a second region, not including the optical-axis and wherein the pupil plane is an optical Fourier conversion surface of a pattern surface of the mask in an illumination system.

Abstract: There is provided an exposure method including the steps for arranging an object to be exposed and a transparent plate that includes a thin film, within such a range that near field light from the thin film may operate on the object, the thin film having a light transmittance that changes according to an intensity of light of incidence, and exposing the object with the near field light generated by projecting a pattern on a mask onto the thin film of the transparent plate.

Abstract: To provide an electron exposure apparatus capable of providing high resolution and performing electron exposure at high speed, integrated tips are used, only the tips provided at ends control distances between the tips and the surface of a wafer and the tips used for electron exposure follow the wafer according to deformations of cantilevers, which occur due to the Coulomb force resultant from a voltage applied to each tip.

Abstract: An illumination system and exposure apparatus and method involving illuminating a surface over an illumination field (IF) having an arcuate shape. The illumination system comprises a light source (54) for providing a light beam (100), and an optical integrator (56). The optical integrator comprises a first reflective element group (60) having an array of first optical elements (E) each having an arcuate profile corresponding to the arcuate shape of the illumination field. Each of the first optical elements has an eccentric reflecting surface (RSE) comprising an off-axis section of either a spherical surface (S) or an aspherical surface (ASE). The array of first optical elements is designed so as to form a plurality of arcuate light beams (108) capable of forming a plurality of light source images (1).

Abstract: A wavelength shift generated by the manufacturing error of an alignment scope is corrected and adjusted to minimize generation of another aberration and enable high-precision position detection. The alignment scope has a detection system (4) for detecting a position detection mark on a wafer (6) to be detected at a predetermined magnification by using light emitted by a light source (401). The detection system (4) incorporates two wedge optical members (410a, 410b) which constitute a wedge optical member group (410). The two wedge optical members are arranged such that their adjacent wedge surfaces are inclined at a predetermined angle in a direction perpendicular to the detection optical axis, and these adjacent wedge surfaces become parallel to each other. The interval between the wedge optical members (410a, 410b) is adjusted to correct the wavelength-dependent position shift amount of the detection system (4).

Abstract: The present invention provides an exposure device in which availability of the emitted light is high, optical crosstalk is reduced, and an image can be formed at high resolution. Concave microlenses are formed on one surface of the exposure device facing a photosensitive material, and organic EL elements are formed on the other surface. The organic EL elements are disposed at some of portions at which anode lines and cathode lines intersect each other. A diameter D of an aperture of the microlens is n times an array pitch p of each organic EL element, n lines of the cathode lines are formed, and the organic EL elements arranged on one cathode line are shifted from those on another cathode line in a main-scanning direction by the array pitch p. Accordingly, exposure spots, which are exposed by the organic EL elements incorporated in the n lines of the cathode lines, are offset without overlapping one another, and the entire photosensitive material can be exposed.

Abstract: An exposure apparatus for transferring a pattern formed on a mask to a photosensitive substrate is provided with an illumination optical system for illuminating a local area on the mask with a light beam, a projection optical system for projecting the pattern of the mask to the photosensitive substrate and a scanning device for scanning synchronously the mask and the photosensitive substrate, and a device for setting a width of an exposure area in a scan direction of the photosensitive substrate conjugate with an illumination area on the mask with respect to the projection optical system, to integer times as large as a distance which the photosensitive substrate moves during an interval between pulse emissions from the light source.

Abstract: A laser beam emitted from an exposure laser beam source has a uniform illuminance distribution after passing through a fly-eye lens selected according to the aperture stop. The exposure light is projected onto a reticle on which a predetermined pattern is formed, and the reticle pattern is projected onto a wafer by means of a projection optical system having a pupil filter inserted therein. A cleaning light beam branching off from the exposure light beam is projected through a beam splitter and a total reflection mirror onto the fly-eye lens located at a retraction position. A plane-parallel plate at the retraction position is irradiated with a cleaning light beam. The fly-eye lens and the plane-parallel plate are self-cleansed by the cleaning light beam, so that the transmissivity is kept higher than a predetermined value during standby.

Abstract: An apparatus for exposing a wafer to ultraviolet light with a constant intensity emitted from a super-high pressure mercury lamp along an exposure beam path. A shutter opens and closes the exposure beam path. When the mercury lamp cannot be turned off during non-exposure, the mercury lamp is driven to maintain the intensity of the ultraviolet light constant when the shutter is open, and the mercury lamp is driven to maintain current, voltage or power for driving the mercury lamp constant when the shutter is closed, thereby decreasing deterioration in the mercury lamp.

Abstract: In one illustrative embodiment, a method is provided that comprises energizing a light source to provide light having a preselected intensity. A first photosensor, which is capable of delivering a first signal indicative of the intensity of the light source, is exposed to the light source. A second photosensor, which is also capable of delivering a second signal indicative of the intensity of the light source, is also exposed to the light source. Thereafter, the first and second signals are compared, and an error signal is delivered in response to detecting a significant difference between the first and second signals.

Abstract: A projection exposure apparatus including an irradiation optical system including a light source and irradiating a mask with irradiation light beams, a projection optical system for projecting an image of a pattern of the mask on a substrate, a plurality of first fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed surface with respect to the pattern of the mask in the irradiation optical system or on a plane adjacent to the same and having a center located at a plurality of positions which are eccentric from the optical axis of the irradiation optical system, a plurality of second fly-eye type optical integrators each having an emission side focal plane disposed on a Fourier transformed plane with respect to the incidental end of each of a plurality of the first fly-eye type optical integrators or on a plane adjacent to the same and being disposed to correspond to a plurality of the first fly-eye type optical integrators, and a light divider for dividing

Abstract: An apparatus for calibrating a printer of a photofinishing system includes a reference film strip carrying at least one reference image; a reference chart carrying multiple renderings of the reference image representing different printer exposures; and a substrate carrying printer correction factors needed to change a photographic print obtained from the reference image on the reference film strip, to match any desired rendering on the reference chart. A method of producing the above reference chart, and a method of calibrating a printer of a photofinishing system, are also provided.

Abstract: There is disclosed a light guide for guiding light from a light source in a longitudinal direction and radiating the light to illuminate an object to be illuminated, which comprises a diffuser for diffusing the light from the light source along the longitudinal direction of the light guide, and a radiator for radiating the light diffused by the diffuser in a predetermined direction. By arranging the diffuser and the radiator so that a normal line passing through the center of the width of the diffuser is different from the predetermined direction at least in the vicinity of the light source when viewed in the longitudinal direction of the light guide, the illuminance distribution of the longitudinal direction of the light guide is uniformed.

Abstract: A lithographic projection apparatus including at least one temperature control member that at least partly surrounds at least one component selected from a group comprising mask and substrate tables, the projection system and an isolated reference frame for controlling the temperature of the surrounded components. The surface finish of the member is chosen to help keep the components which it partly surrounds isothermal during operation.

Abstract: A method of operating a lithographic projection apparatus comprises forming a spot of radiation at the wafer level using a pinhole at reticle level. A sensor is defocused with respect to said spot such that it is spaced apart from said wafer level. The sensor is scanned beneath the spot to measure the angular intensity distribution of radiation at the spot and to determine the intensity distribution at the pupil plane of the projection lens system.

Abstract: A projection exposure apparatus for transferring, by projection exposure, a pattern of a first object onto a second object while scanning the first and second objects in synchronism with each other, includes an illumination optical system having a secondary light source forming system for forming a secondary light source and a slit disposed with a space from the first object or a plane conjugate thereto, the illumination optical system being operable to illuminate the first object with light supplied from a light source of a pulse light emission type and having a slit-like irradiation region defined through the slit on a light path of the illumination optical system, a projection optical system for projecting the pattern of the first object onto the second object, and a control system for controlling an exposure parameter so that an integrated exposure intensity upon the first object and in the scan direction in accordance with a change in size of the secondary light source.

Abstract: A lithographic projection apparatus includes a radiation system for supplying a projection beam PB of radiation having a propagation direction, a support structure MT for supporting patterning structure, the patterning structure serving to pattern the projection beam according to a desired pattern MA, a substrate table WT for holding a substrate and a projection system PL for projecting the patterned beam PB onto a target portion C of the substrate W, wherein the lithographic projection apparatus further comprises a sensor MM for measuring a movement of the projection beam PB perpendicular to its propagation direction and a controller CM to control a received dose of said projection beam PM on a target portion C of the substrate W in response to an output from said sensor MM.

Abstract: An apparatus for exposing a wafer to ultraviolet light with a constant intensity emitted from a super-high pressure mercury lamp along an exposure beam path. A shutter opens and closes the exposure beam path. When the mercury lamp cannot be turned off during non-exposure, the mercury lamp is driven to maintain the intensity of the ultraviolet light constant when the shutter is open, and the mercury lamp is driven to maintain current, voltage or power for driving the mercury lamp constant when the shutter is closed, thereby decreasing deterioration in the mercury lamp.