Electrical Attachment Of Slider/head Patents (Class 360/234.5)
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Patent number: 8810966Abstract: A slider for a disc drive assembly may be attached to various substrates during manufacture and installation in the disc drive assembly. In some examples, a slider attachment system includes a substrate, a first diffusion barrier layer formed over the substrate, a first solder-wettable protection layer formed over the first diffusion barrier layer, a second diffusion barrier layer formed over the first solder-wettable protection layer, and a second solder-wettable protection layer formed over the second diffusion barrier layer. The first and second solder-wettable protection layers may be formed of a material that is inert to a chemical etchant that can chemically dissolve the diffusion barrier layers. In use, solder may be applied to the second solder-wettable protection layer to wet and dissolve the layer. If the substrate needs to be detached and reattached, etchant can chemically dissolve the second diffusion barrier layer to expose the first solder-wettable layer for reattachment.Type: GrantFiled: March 12, 2013Date of Patent: August 19, 2014Assignee: Seagate Technology LLCInventor: Lijuan Zhong
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Patent number: 8786975Abstract: In one embodiment, a magnetic head slider includes a substrate, at least two elements (read element, write element, and/or heater element) positioned adjacent to the substrate, a resistance detection element positioned near the two elements, a pair of conductive terminals in an accessible position and coupled to each of the two elements, a protective film surrounding the two elements and the resistance detection element, a first and a second thin conductive wire extending from the resistance detection element and terminating at an edge of the protective film, a third thin conductive wire extending from one of the pair of conductive terminals for a first of the two elements and terminating at an edge of the protective film, and a fourth thin conductive wire extending from one of the pair of conductive terminals for a second of the two elements and terminating at an edge of the protective film.Type: GrantFiled: May 10, 2011Date of Patent: July 22, 2014Assignee: HGST Netherlands B.V.Inventors: Tomomitsu Inoue, Hideo Yamakura, Takateru Seki
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Publication number: 20140198411Abstract: A magnetic head includes a slider substrate having a trailing edge and multiple bonding pads arranged on the trailing edge in a row. Each of the bonding pads includes a seed layer adhered to the trailing edge and electrically connected with the slider substrate, a soldering layer formed on the seed layer and adapted for connecting with a suspension, and at least one solder nonwettable layer adhered to the trailing edge and connected with at least one side of the seed layer. The structure of the magnetic head is simple and stable, which can prevent the bonding pads bridging and shorting-circuit. An HGA and a disk drive unit with the same, a manufacturing method for the magnetic head are also disclosed.Type: ApplicationFiled: February 19, 2013Publication date: July 17, 2014Applicant: SAE Magnetics (H.K.) Ltd.Inventors: Li ping PENG, Shen kuang Sidney CHOU, Chi hung YUEN, Yan bin WANG, Lu Xiao
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Patent number: 8756795Abstract: A method for manufacturing a read head includes the step of depositing a conductive filler into a plurality of holes that extend through a wafer. Each of the holes extends from a wafer top surface to a wafer bottom surface. Each of the holes includes an inner surface that includes an insulative layer. The method further includes the steps of fabricating a read transducer on the wafer top surface, and depositing a plurality of electrically conductive leading connection pads on the wafer bottom surface. The plurality of electrically conductive leading connection pads are in electrical contact with the conductive filler.Type: GrantFiled: March 21, 2012Date of Patent: June 24, 2014Assignee: Western Digital (Fremont), LLCInventors: Mark D. Moravec, Subrata I Gusti Made, Santi Pumkrachang
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Publication number: 20140154952Abstract: Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 ?m, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes.Type: ApplicationFiled: November 30, 2012Publication date: June 5, 2014Applicant: HGST NETHERLANDS B.V.Inventors: David P. DRUIST, Glenn P. GEE, Unal M. GURUZ, Edward H. LEE, David J. SEAGLE, Darrick T. SMITH
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Publication number: 20140139953Abstract: A micro-milliactuator, a micro-microactuator, an actuator arm assembly, a hard disk drive and a method for operation of the hard disk are provided. In accordance with one aspect, the actuator arm assembly includes an arm, a slider for reading and writing information to disk media in response to read/write signals, and an actuator selected from the group comprising a micro-milliactuator and a micro-microactuator. The actuator has the slider mounted thereon and supports it above the disk media. The actuator includes one or more piezoelectric actuators for horizontally shifting the slider in response to actuator control signals. The actuator further includes one or more sensors physically coupled thereto for vibration sensing, compensation and suppression, the one or more sensors generating sensor signals in response to sensed vibrations during operation, wherein the actuator control signals are generated at least partially in response to the sensor signals.Type: ApplicationFiled: November 18, 2013Publication date: May 22, 2014Applicant: Agency for Science, Technology and ResearchInventor: Michael Hatch
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Patent number: 8724249Abstract: A magnetic recording disk drive has a fly-height sensor on the slider that supports the read/write head. The head-disk spacing signal from the fly-height sensor utilizes the existing read path between the arm electronics (AE) module and the channel electronics module. A variable gain amplifier (VGA) on the AE module receives as one input the head-disk spacing signal and as the other input an emulated read signal. The output of the VGA is thus an oscillatory signal that emulates the read signal but whose amplitude varies as the head-disk spacing varies. A multiplexer (MUX) on the AE module multiplexes the amplified read signal from the read amplifier with the VGA oscillatory output signal on the read path back to the channel electronics module.Type: GrantFiled: December 20, 2011Date of Patent: May 13, 2014Assignee: HGST Netherlands B.V.Inventor: John Thomas Contreras
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Patent number: 8717711Abstract: According to one embodiment, a magnetic data system includes a magnetic disk medium, a magnetic head having a writer element and/or a reader element, an exothermic resistor element for thermal fly-height control (TFC), a contact detection sensor having a resistor element and at least one contact detection electrode, and an insulating film on a medium facing side of the magnetic head to protect the contact detection sensor, the insulating film having a thickness greater than the contact detection electrode, a drive mechanism for passing the magnetic disk medium over the magnetic head, and a controller electrically coupled to the magnetic head for controlling operation of the magnetic head, wherein the controller adjusts magnetic spacing between the magnetic head and the magnetic disk medium via thermal distortion of the exothermic resistor element. The contact detection sensor may be used as a second TFC resistor element.Type: GrantFiled: September 28, 2011Date of Patent: May 6, 2014Assignee: HGST Netherlands B.V.Inventors: Atsushi Kato, Hideaki Tanaka, Ichiro Oodake, Takao Yonekawa
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Patent number: 8717714Abstract: In a positioning and driving system including a rotating magnetic disk, a magnetic head slider that floats above the surface of the magnetic disk and writes data to and reads data from a track provided on the magnetic disk, an actuator that positions the magnetic head slider in a radial direction of the magnetic disk, and an amplifier that supplies electrical power to the actuator in accordance with the input signal and performs a driving operation, provided is the configuration of an electrothermal actuator driving system that obtains continuous displacement over the entire required operating range with respect to changes in an input voltage by using only one amplifier and that is incorporated into a feedback control system and is suitable for high-speed and high-precision positioning.Type: GrantFiled: March 7, 2011Date of Patent: May 6, 2014Assignee: Hitachi, Ltd.Inventor: Haruaki Otsuki
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Patent number: 8711521Abstract: A suspension for a head gimbal assembly includes a flexure having a laminated structure including a substrate layer, an insulating layer formed on the substrate layer, and a conducting layer formed on the insulating layer. And first bonding pads are formed on the conducting layer at a first surface of the flexure, so as to electrically connect with a slider via solder balls, and second bonding pads are formed on the substrate layer at a second surface of the flexure opposite to the first surface, so as to electrically connect with extra components formed at the second surface via solder balls. The suspension can connect slider and other extra components at two opposite surfaces of the flexure with a simplified and compacted structure and a reduced cost.Type: GrantFiled: September 30, 2011Date of Patent: April 29, 2014Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Xian wen Feng, Fu quan Pang, Hai ming Zhou
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Patent number: 8699187Abstract: A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal-joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal-joining.Type: GrantFiled: December 18, 2009Date of Patent: April 15, 2014Assignee: HGST Netherlands B.V.Inventors: Tetsuya Nakamura, Takahiro Sakai, Masahiko Katoh, Yasushi Inoue, Tetsuya Nakatsuka, Satoshi Kaneko, Masashi Okubo
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Patent number: 8675311Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.Type: GrantFiled: December 22, 2010Date of Patent: March 18, 2014Assignee: HGST Netherlands B.V.Inventors: John T. Contreras, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
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Publication number: 20140063658Abstract: To uniformly determine the positional relationship between a main magnetic pole and a spin torque oscillator while independently optimizing the main magnetic pole and the spin torque oscillator. On a trailing end surface of a main magnetic pole, a step is provided at the boundary between the main magnetic pole and a gap material disposed on both sides thereof, and a spin torque oscillator is formed on the step. The spin torque oscillator is effectively separated into two regions by utilizing the step. Further, a part of the spin torque oscillator is removed so as to disable the unwanted region, thereby realizing a self-alignment type high frequency magnetic field assisted magnetic recording head structure such that the positions of the end portions of the main magnetic pole and the spin torque oscillator are aligned.Type: ApplicationFiled: August 16, 2013Publication date: March 6, 2014Applicant: HITACHI, LTD.Inventors: Junichiro SHIMIZU, Kikuo KUSUKAWA, Yo SATO, Masukazu IGARASHI
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Patent number: 8634168Abstract: A structure for preventing Electrostatic Discharge (ESD) damage to a magnetoresistive sensor during manufacture. The structure includes a switching element that can be switched off during testing of the sensor and then switched back on to provide ESD shunting to the sensor. The switch can be a thermally activated mechanical relay built onto the slider. The switch could also be a programmable resistor that includes a solid electrolyte sandwiched between first and second electrodes. One of the electrodes functions as an anode. When voltage is applied in a first direction an ion bridge forms across through the electrolyte across electrodes making the resistor conductive. When a voltage is applied in a second direction, the ion bridge recedes and the programmable resistor becomes essentially non-conductive.Type: GrantFiled: March 28, 2012Date of Patent: January 21, 2014Assignee: HGST Netherlands B.V.Inventors: Thomas Robert Albrecht, Robert E. Fontana, Jr., Bruce Alvin Gurney, Timothy Clark Reiley, Xiao Z. Wu
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Patent number: 8611050Abstract: Embodiments of the present invention relate to integral heating elements in solder pads for flip chip bonding. The integral heating elements are used to solder components together without exposing other locations and components in the assembly to potentially damaging temperatures. Embodiments of the invention may be used in manufacture of magnetic heads for EAMR hard disks to bond a laser sub-mount to an air-bearing slider without exposing magnetic head components to high temperatures.Type: GrantFiled: May 7, 2013Date of Patent: December 17, 2013Assignee: Western Digital (Fremont), LLCInventors: Mark D. Moravec, Lei Wang, Wentao Yan
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Patent number: 8593765Abstract: A head gimbal assembly having a stage fixed to a head-slider. A piezoelectric element which comprises; an upper surface, a first side surface, a second side surface, a lower surface, a first electrode, a second electrode, and a gap between the first and second electrodes on the lower surface, the piezoelectric element moving the stage by extension or contraction thereof according to a voltage applied to the first and second electrodes. A transmission wiring part which has a connection pad for the piezoelectric element. A cross-connector for physically and electrically cross-connecting the first electrode and the connection pad. An adhesive fixing part which is formed from an insulating adhesive and adhesively fixes the lower surface of the piezoelectric element to the transmission wiring part, between an end of the second electrode at the gap and the cross-connector.Type: GrantFiled: December 20, 2010Date of Patent: November 26, 2013Assignee: HGST Netherlands B.V.Inventors: Yoshio Uematsu, Tatsumi Tsuchiya, Tadaaki Tomiyama
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Patent number: 8587901Abstract: Examples of a magnetic recording head slider, a head gimbal assembly and methods of manufacturing each are disclosed. The magnetic recording head slider may comprise a slider body and a plurality of bond pads formed on a trailing edge of the slider body. Each of the plurality of bond pads may include a probe contact area and a soldering contact area. The probe contact area may be larger than the soldering contact area. The head gimbal assembly may include a suspension arm with conductive leads. A plurality of bond pads may be formed on the suspension arm in contact with the ends of the conductive leads. A width of a proximal portion of each of the bond pads may be greater than a width of a distal portion of each of the plurality of bond pads. The methods may include forming the above-described structures.Type: GrantFiled: December 30, 2009Date of Patent: November 19, 2013Assignee: Western Digital (Fremont), LLCInventors: Wachira Puttichaem, Adisak Tokaew, Tzong-Shii Pan
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Patent number: 8576516Abstract: A magnetic disc apparatus includes a micro actuator for two-stage actuator having a first stage and a second stage, and a slider mounted to the miro actuator and having a head element to perform recording and reproduction into/from a magnetic disc. A thermal actuator and a spring part are provided on a table, on which the slider is put. The thermal actuator is connected to the slider, and the thermal actuator includes a V-shaped thin film resistance.Type: GrantFiled: May 11, 2011Date of Patent: November 5, 2013Assignee: Hitachi, Ltd.Inventors: Seong-Hun Choe, Shigeo Nakamura
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Publication number: 20130258527Abstract: A magnetic head includes a microwave-generating element connected to a ground line. The ground line is made shorter by connecting the ground line to a conductive slider substrate so that the microwave-generating element is in a short-circuited end condition. This allows a microwave excitation current to be efficiently supplied to the microwave-generating-element, thus enabling effective microwave-assisted recording.Type: ApplicationFiled: March 25, 2013Publication date: October 3, 2013Applicant: TDK CorporationInventors: Yoshikazu SOENO, Takuya ADACHI
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Patent number: 8533936Abstract: Systems and methods for pre-heating adjacent bond pads for soldering are provided. In one embodiment, the invention relates to a method for soldering adjacent bond pads, the method including directing an ultraviolet light beam onto the bond pads from a first angle relative to the bond pads for a preselected duration, heating a solder, and depositing the solder onto the bond pads from a second angle relative to the bond pads during the preselected duration, wherein the second angle is different from the first angle.Type: GrantFiled: January 26, 2011Date of Patent: September 17, 2013Assignee: Western Digital (Fremont), LLCInventors: Wachira Puttichaem, Adisak Tokaew, Aekasith Sapabodee
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Patent number: 8508888Abstract: A suspension board with circuit includes an external slider on which a magnetic head is mounted and an external electronic element provided in its vicinity. The suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface thereof, a first conductive pattern including a first terminal and laminated on the top surface side of the first insulating layer, a second insulating layer laminated on a back surface of the metal supporting board, and a second conductive pattern including a second terminal and laminated on the back surface side of the second insulating layer. The suspension board with circuit is formed with a communication space extending therethrough in a top-back direction and respective end edges of the first insulating layer and the second insulating layer protrude into the communication space to positions inner than that of an end edge of the metal supporting board.Type: GrantFiled: July 19, 2012Date of Patent: August 13, 2013Assignee: Nitto Denko CorporationInventor: Tetsuya Ohsawa
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Patent number: 8503132Abstract: A head gimbal assembly for a hard disk drive includes a head slider having a head element part which performs reading and/or writing of data to/from a magnetic disc and a suspension on which the head slider is mounted. Bonding pads formed on the head slider are formed on a side surface of the head slider except for an air bearing surface (ABS) which faces the magnetic disc and a back surface on a side opposite to the ABS. End peripheries of the bonding pads are arranged to be in contact with an end periphery of the side surface of the head slider which abuts on the back surface of the head slider.Type: GrantFiled: August 25, 2006Date of Patent: August 6, 2013Assignee: HGST Netherlands B.V.Inventor: Eiki Oosawa
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Patent number: 8477457Abstract: A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.Type: GrantFiled: September 9, 2011Date of Patent: July 2, 2013Assignee: HGST Netherlands, B.V.Inventors: Yuhsuke Matsumoto, Tatsumi Tsuchiya, Eiki Oosawa, Tatsushi Yoshida
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Patent number: 8472142Abstract: The present bonded structure uses metal ball to bond or weld the respective bonding surfaces of electrical pads which are arranged to face the same direction. The structure can be controlled visually and thus enables a high connection quality of no short circuit. In addition, the bonding operation of the bonded structure is carried out without using pressure, thus it will not damage surroundings of the electrical components. Accordingly, the manufacture yield is significantly improved and the cost is prominently reduced. The present invention also discloses a bonding method and a head gimbal assembly and a head stack assembly and a drive unit using the bonded structure.Type: GrantFiled: September 20, 2007Date of Patent: June 25, 2013Assignee: SAE Magnetics (H.K.) Ltd.Inventors: MingGao Yao, YiRu Xie
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Patent number: 8427783Abstract: A head-gimbal assembly. The head-gimbal assembly includes a suspension, a microactuator disposed on the suspension, and a head-slider bonded to the microactuator. The head-gimbal assembly further includes a connection pad disposed on the suspension, a connection pad disposed on the microactuator and formed over an edge between a side surface and a top surface of the microactuator to have a bend portion with an obtuse angle, and a metallic interconnection joint for interconnecting the connection pad of the suspension with the connection pad of the microactuator.Type: GrantFiled: November 19, 2009Date of Patent: April 23, 2013Assignee: HGST Netherlands B.V.Inventors: Tatsumi Tsuchiya, Haruhide Takahashi, Akio Takatsuka, Hideto Imai, Toshiki Hirano
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Patent number: 8427786Abstract: A head suspension has a head to write and read information to and from a recording medium, a load beam to apply load onto the head, a device arranged on the head, and a flexure. The device operates on low-frequency signals to achieve a function other than a write/read function. The flexure is attached to the load beam and supports the head. The flexure includes a base material made of a conductive thin plate and a base insulating layer formed on the base material. A wiring structure formed on the head suspension has a write wiring, a read wiring, a device wiring, and an intermediate insulating layer. The device wiring is formed wider than the read wiring and includes positive/negative wires that are laid one on another with the intermediate insulating layer interposed between the positive/negative wires.Type: GrantFiled: April 26, 2011Date of Patent: April 23, 2013Assignee: NHK Spring Co., Ltd.Inventor: Hajime Arai
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Patent number: 8422170Abstract: A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.Type: GrantFiled: September 21, 2011Date of Patent: April 16, 2013Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Shen kuang Sidney Chou, Chi hung Yuen, Yan bin Wang, Shu ming Zhang, Bin Zhao, Ming liang Lin
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Patent number: 8400736Abstract: An assembly includes a slider having an air bearing surface and a slider mounting surface opposite the air bearing surface. The slider mounting surface includes first, second, third, and fourth slider pads. A first slider trace electrically shorts the first slider pad with the third slider pad. A second slider trace electrically shorts the second slider pad with the fourth slider pad. A transducing head is supported by the slider. The transducing head includes a positive terminal electrically connected to the first slider pad and a negative terminal electrically connected to the second slider pad. The first, second, third, and fourth slider pads can be connected to pads on a connection circuit with interleaved traces.Type: GrantFiled: July 27, 2009Date of Patent: March 19, 2013Assignee: Seagate Technology, LLCInventors: Michael Allen Greminger, Jon Karsten Klarqvist
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Publication number: 20130033785Abstract: A suspension for a head gimbal assembly includes a flexure having a laminated structure including a substrate layer, an insulating layer formed on the substrate layer, and a conducting layer formed on the insulating layer. And first bonding pads are formed on the conducting layer at a first surface of the flexure, so as to electrically connect with a slider via solder balls, and second bonding pads are formed on the substrate layer at a second surface of the flexure opposite to the first surface, so as to electrically connect with extra components formed at the second surface via solder balls. The suspension can connect slider and other extra components at two opposite surfaces of the flexure with a simplified and compacted structure and a reduced cost.Type: ApplicationFiled: September 30, 2011Publication date: February 7, 2013Applicant: SAE Magnetics (H.K.) Ltd.Inventors: Xian wen Feng, Fu quan Pang, Hai ming Zhou
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Patent number: 8351158Abstract: A slider includes a slider body having a first side and edges defined adjacent to the first side, at least two separate insulators each adjacent to the first side of the slider body and supported by the slider body, and a conductive trace adjacent to each of the at least two separate insulators and opposite the first side of the slider body. The at least two separate insulators each are in physical contact with the slider body along the first side of the slider body such that the at least two separate insulators are physically attached to the slider body to electrically insulate each conductive trace from the slider body.Type: GrantFiled: March 11, 2011Date of Patent: January 8, 2013Assignee: Seagate Technology LLCInventors: Jianxin Zhu, David A. Sluzewski, Lance E. Stover, Joel W. Hoehn, Kevin J. Schulz
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Patent number: 8320081Abstract: A magnetic recording head includes a trailing surface and a plurality of bonding pads arranged on the trailing surface and in a row adapted for both bonding and testing. Each of the bonding pads has at least one side portion being coated with electrically conductive solder nonwettable coat to prevent short circuit between the adjacent bonding pads. The invention also discloses a head gimbal assembly with the magnetic recording head and a disk drive unit having such head gimbal assembly.Type: GrantFiled: April 20, 2010Date of Patent: November 27, 2012Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Shenkuang Chou, Liping Peng, Kayip Wong, Yanbin Wang, Lu Xiao, Bin Zhao
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Patent number: 8320083Abstract: An electrical interconnect and a method of making an electrical interconnect in which a conductor has been substantially plated with a first protective metal shell, such as nickel, and a second outer metal shell, such as gold, before a covercoat has been applied. Such an electrical interconnect can be characterized as having an even-thickness outer shell on both its terminal pads and underneath the covercoat adjacent to the terminal pads, without overhangs or gaps near the bottom of the covercoat caused by surface etching during production.Type: GrantFiled: December 6, 2007Date of Patent: November 27, 2012Assignee: Magnecomp CorporationInventors: Christopher Dunn, Keith A. Vanderlee
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Patent number: 8307538Abstract: A method for manufacturing an head gimbal assembly (HGA) according to the present invention is comprised of: a step for preparing a thin film piezoelectric actuator including a first piezoelectric laminate having a first piezoelectric layer, and a second piezoelectric laminate having a second piezoelectric layer; a step for preparing a suspension; a fixing step for fixing the thin film piezoelectric actuator to the suspension; a first repolarization treatment step for performing repolarization treatment to the first piezoelectric layer after the fixing step; and a second repolarization treatment step for performing repolarization treatment to the second piezoelectric layer after the fixing step.Type: GrantFiled: March 1, 2010Date of Patent: November 13, 2012Assignees: TDK Corporation, SAE Magnetics (H.K.) Ltd.Inventor: Kenjiro Hata
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Publication number: 20120281315Abstract: A method and apparatus for processing sliders for a disk drives. The apparatus includes at least one gimbal structure adapted to engage at least one slider. The gimbal structure permits the slider to move in at least pitch and roll. A processing media is positioning opposite a surface on the least one slider to be processed. A preload mechanism biases the slider toward the processing media. One or more fluid bearing features are provided on at least one of the slider or the processing media configured to generate aerodynamic lift forces at an interface of the processing media with the surface of the slider during movement of the processing media relative to the slider. Various processing media are also disclosed.Type: ApplicationFiled: March 19, 2012Publication date: November 8, 2012Inventors: Karl Schwappach, Zine-Eddine Boutaghou
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Patent number: 8295011Abstract: A slider for a head gimbal assembly includes a trailing surface, a plurality of connection pads arranged on the trailing surface adapted for both bonding the slider to a suspension of the head gimbal assembly and testing the performance of the slider. At least a part of the connection pads each comprises a bonding portion and a testing portion electrically connected to the bonding portion and larger than the bonding portion, all the bonding portions and the rest part of the connection pads are arranged in a first row and the testing portions are arranged outside the first row. The slider of the present invention has a new pad layout to facilitate bonding of the connection pads and permit to provide additional pads thereon to connect the additional sensors therein for precise reading and writing, thereby improving the performance of the slider. The invention also discloses a head gimbal assembly and a disk drive unit including the same.Type: GrantFiled: April 20, 2010Date of Patent: October 23, 2012Assignee: SAE Magnetics (H.K.) Ltd.Inventors: Shenkuang Chou, Lu Xiao, Juren Ding, Kayip Wong, Yanbin Wang, Liping Peng
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Patent number: 8289652Abstract: Method and apparatus for a head gimbal assembly (HGA) which incorporates a microactuator. In accordance with various embodiments, a gimbal assembly has a gimbal island disposed within an aperture of a gimbal plate, which is mechanically decoupled from the gimbal island. At least one microactuator element is attached between the gimbal island and the gimbal plate to allow rotation of the gimbal island independent of the gimbal plate. The gimbal assembly is suspended from a dimple which extends from the gimbal island.Type: GrantFiled: October 22, 2010Date of Patent: October 16, 2012Assignee: Seagate Technology LLCInventors: Razman Zambri, Michael Allen Greminger, John Stuart Wright
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Patent number: 8289651Abstract: Methods and apparatus to control heat dissipation in hard-disk drives (HDDs) are disclosed. A disclosed example apparatus comprises a semiconductor die, a ground bump positioned on the die, and a hard-disk drive writer head positioned on the die relative to the ground bump based on a thermal impedance.Type: GrantFiled: April 14, 2008Date of Patent: October 16, 2012Assignee: Texas Instruments IncorporatedInventor: Ramlah Binte Abdul Razak
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Patent number: 8279558Abstract: An assembly includes a slider and a suspension assembly. The slider includes an air bearing surface and a slider mounting surface opposite the air bearing surface. There are a plurality of slider pads on the slider mounting surface. The suspension assembly includes a plurality of suspension pads on a suspension mounting surface. Each of the suspension pads is connected to one of the slider pads with a solder joint so that the slider mounting surface has at least one of a pitch, roll, or yaw angle with respect to the suspension mounting.Type: GrantFiled: November 4, 2011Date of Patent: October 2, 2012Assignee: Seagate Technology LLCInventors: Joel David Limmer, Bradley Jay Ver Meer
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Patent number: 8279557Abstract: A system for poling piezoelectric devices comprises a plurality of thin-film components, a plurality of piezoelectric devices, a poling pad for poling the piezoelectric devices, a plurality of traces, and a plurality of current-limiting elements. The thin-film components are separated by dice lanes to form an array, and the piezoelectric devices are formed on the thin-film components. The traces connect the piezoelectric devices across the dice lanes in parallel to the poling pad. Each current-limiting element is connected in series with one of the piezoelectric devices, in order to limit current to individual piezoelectric devices that experience current-related failure.Type: GrantFiled: August 4, 2009Date of Patent: October 2, 2012Assignee: Seagate Technology LLCInventors: Michael Christopher Kautzky, Charles Everett Hawkinson, Daniel Paul Burbank, John Stuart Wright
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Patent number: 8259415Abstract: A slider includes a slider body and a bond pad. The bond pad is positioned on the slider body and has a bonding surface with a recessed channel for directing solder flow. Separately related, an assembly includes a suspension assembly including a suspension mounting surface and a suspension pad on the suspension mounting surface. A slider is positioned adjacent the suspension mounting surface, with a slider pad aligned with the suspension pad. A recessed channel is in at least one of the slider pad or the suspension pad. A solder joint is formed between the suspension pad and the slider pad and extends into the recessed channel.Type: GrantFiled: June 22, 2009Date of Patent: September 4, 2012Assignee: Seagate Technology LLCInventors: Erik Jon Hutchinson, Christopher Michael Unger
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Patent number: 8247700Abstract: A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a pair of wires arranged in spaced-apart relation, and a semiconductive layer formed on the insulating layer and electrically connected to the metal supporting board and the conductive pattern. The conductive pattern has a first region in which a distance between the pair of wires is small and a second region in which the distance between the pair of wires is larger than that in the first region. The semiconductive layer is provided in the second region.Type: GrantFiled: March 12, 2009Date of Patent: August 21, 2012Assignee: Nitto Denko CorporationInventors: Jun Ishii, Yasunari Ooyabu, Visit Thaveeprungsriporn
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Patent number: 8243391Abstract: Systems and methods for a slider and suspension assembly are discussed. The slider and suspension assembly comprises a slider, a suspension, and composite fiber solder. The composite fiber solder is coupled to the suspension and coupled to the slider. The composite fiber solder comprises a fiber, wherein the fiber is configured to increase a fracture resistance of the composite fiber solder compared to a solder without the fiber.Type: GrantFiled: September 26, 2008Date of Patent: August 14, 2012Assignee: Hitachi Global Storage Technologies, Netherlands B.V.Inventors: Yufei Han, Hanxiang He, Shaoyong Liu, Boon Kee Tan
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Patent number: 8218269Abstract: Gimbal designs are provided that minimize adverse dynamic performance of a HDD suspension, particularly subsequent to head-disk-interface (HDI) interactions. The improvement of operational performance can be seen in graphical representations of the vibrational modes of a gimbal mounted slider subsequent to such HDI interactions. Each gimbal design includes a ramp limiter formed as two separated arms connected by one or two transverse bars and a routing of conducting traces that relieves stress and minimally contacts these bars.Type: GrantFiled: August 15, 2011Date of Patent: July 10, 2012Assignee: SAE Magnetics (HK) Ltd.Inventors: Qinghua Zeng, Chao-Hui Yang, Yen Fu, Ellis Cha
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Patent number: 8213121Abstract: A method and apparatus for preventing solder bridging. The method includes providing a substrate layer upon which a solder pad is disposed. The method further includes providing a signal conductive layer within the substrate layer. The method also includes forming a solder pad upon the signal conductive layer. The solder pad has a base surface. The method additionally includes forming a barrier portion above the base surface of the solder pad. The barrier portion is for controlling solder flow during a reflow process.Type: GrantFiled: October 9, 2007Date of Patent: July 3, 2012Assignee: Hitachi Global Storage Technologies, Netherlands B.V.Inventors: Melvin J. A. Dela Pena, Edmar C. Escober, Sandy E. Joson, Teddy T. Tabarangao
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Patent number: 8205323Abstract: In a manufacturing method for a head gimbal assembly, before mounting a slider on a suspension, coating films each made of solder are formed on respective terminals of a plurality of leads to be connected to a plurality of electrode pads of the slider. After mounting the slider on the suspension, the coating films are heated with laser light to thereby melt the solder, with the respective terminals of the plurality of leads in contact with the corresponding electrode pads via the respective coating films, whereby the terminals are electrically and physically connected to the electrode pads.Type: GrantFiled: December 22, 2009Date of Patent: June 26, 2012Assignee: TDK CorporationInventor: Hitoshi Iwama
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Patent number: 8184404Abstract: A suspension board with circuit includes a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed close to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed close to the auxiliary portion. The conductive pattern includes a first conductive pattern including a first terminal, and a second terminal connected to the magnetic head, and a second conductive pattern including a third terminal and a fourth terminal connected to the light emitting element. The first, second and third terminals are disposed on the board main body portion. The fourth terminal is disposed on the auxiliary portion. The back surface of the board main body portion is formed with a main-body-side interfitting portion. A back surface of the auxiliary portion is formed with an auxiliary-portion-side interfitting portion.Type: GrantFiled: January 14, 2010Date of Patent: May 22, 2012Assignee: NITTO DENKO CorporationInventors: Tetsuya Ohsawa, Toshiki Naito
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Patent number: 8173909Abstract: Inspection windows are cut or formed into the tail section of the flexure circuit tail in a hard disk drive Head Gimbal Assembly (HGA), or CIS, to enable visual inspection of the alignment of the CIS to the head preamp circuit, or FPC. The holes are made in the steel backing and base polyimide, and are positioned between adjacent conductive pads. In addition to facilitating visual inspection, the windows also enable rework of solder. Additionally, solder wicking holes may also be provided in the conductive pads and/or the polyimide and steel backing.Type: GrantFiled: October 19, 2007Date of Patent: May 8, 2012Assignee: Nitto Denko CorporationInventors: Alex Enriquez Cayaban, Vladimir Aleksic, Shuichi Wakaki
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Patent number: 8174793Abstract: A thin film magnetic head has a plurality of electrode terminals formed on substantially the same surface as the head formation surface on which magnetic head element is laminated. The plurality of electrode terminals is arranged in an array near and along the second side of the head formation surface that is opposite the first side on the ABS side, from which the functional end of the magnetic head is exposed. The plurality of electrode terminals is formed to include a pad and a protrusion formed along a part of the periphery of the pad.Type: GrantFiled: June 22, 2010Date of Patent: May 8, 2012Assignee: TDK CorporationInventors: Yasuhiro Hasegawa, Hiroshi Fumoto, Yoshiaki Tanaka, Katsuya Kanakubo, Shingo Miyata, Soji Koide, Noriyuki Ito
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Patent number: 8169751Abstract: A structure for preventing Electrostatic Discharge (LSD) damage to a magnetoresistive sensor during manufacture. The structure includes a switching element that can be switched off during testing of the sensor and then switched back on to provide ESD shunting to the sensor. The switch can be a thermally activated mechanical relay built onto the slider. The switch could also be a programmable resistor that includes to solid electrolyte sandwiched between first and second electrodes. One of the electrodes functions as an anode. When voltage is applied in a first direction an ion bridge forms across through the electrolyte across electrodes making the resistor conductive. When a voltage is applied in a second direction, the ion bridge recedes and the programmable resistor becomes essentially non-conductive.Type: GrantFiled: June 27, 2006Date of Patent: May 1, 2012Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventors: Thomas Robert Albrecht, Robert E. Fontana, Jr., Bruce Alvin Gurney, Timothy Clark Reiley, Xiao Z. Wu
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Patent number: 8164858Abstract: A novel read head includes a substrate having a trailing face and a leading face opposite the trailing face. The substrate includes a first hole therethrough that extends continuously from the trailing face to the leading face. The read head also includes a read transducer disposed on the trailing face, and a first plurality of electrically conductive trailing connection pads disposed on the trailing face. A first insulative layer is disposed on an inner surface of the first hole. A first electrically conductive filler is disposed in the first hole but is insulated from the substrate by the first insulative layer. A first electrically conductive leading connection pad is disposed on the leading face and is electrically connected to the first conductive filler.Type: GrantFiled: November 4, 2009Date of Patent: April 24, 2012Assignee: Western Digital (Fremont), LLCInventors: Mark D. Moravec, Subrata I Gusti Made, Santi Pumkrachang