Abstract: A suspension having a magnetic head assembly 1 mounted thereon is provided, wherein the magnetic head assembly comprises: a write head 1-2; a read head 1-1; and a resistive heating element 1-3 for controlling the flying heights of the magnetic heads, wherein the wires HTx and GTx for the resistive heating element is disposed such that they sandwich the wires RxX and RxY for the read head. The wires for the resistive heating element may be disposed between the wires for the write head and the wires for the read head. Furthermore, the waveform of the current or voltage to the resistive heating element has a time constant of 1 ?sec or more, the resistive heating element having wires disposed near the wires of the read head.

Abstract: A magnetic head assembly is provided. The magnetic head assembly includes a slider in which a head element is mounted. A flexure supports the slider. The flexure includes a pair of outriggers, a connection portion, and a tongue portion. A flexible wiring substrate is fixedly bonded to the surface of the flexure. An electrode pad of the slider and an electrode pad of the flexible wiring substrate are bonded to each other by solder. A plurality of solder bonded portions are arranged on the connection portion. A deformable portion is formed in the pair of outriggers and located on an extended line on which the solder bonded portions are arranged, so that the free end side of the flexure is deformable.

Abstract: A holding portion, on which a slider having a magnetic element for recording and/or replaying is held is provided on a second supporting portion of a supporting member, in which conductive patterns are formed. A plurality of fixing portions are formed in the holding portion and when the slider is sandwiched between the plurality of fixing portions, the slider is electrically connected with the conductive patterns.

Abstract: One embodiment of the present invention provides a slider including a slider body, a magnetic reader disposed on the slider body, a magnetic writer disposed on the slider body, and an electronic lapping guide disposed on the slider body. The slider also includes a first row of contact pads disposed on the slider body and coupled to the magnetic reader and the magnetic writer and a second row of contact pads disposed on the slider body and coupled to the electronic lapping guide. The electronic lapping guide may be electrically isolated from the magnetic reader and magnetic writer.

Abstract: A method which enables easy removal of a magnetic head slider soldered to a suspension and easy reuse of the removed parts. In the method for removing the magnetic head slider, heat is applied to a suspension to which at least a part of the magnetic head slider is joined by solder so as to remove the magnetic head slider from the suspension. The heating is locally applied to the junction area of the magnetic head slider and the suspension, which is joined by the solder.

Abstract: A slider structure that allows a grounded heater element to be employed, while also allowing a decision of whether the slider is to be an “up” slider or a “down” slider to be made in a late stage in the formation of the slider. The slider includes electrical contact pads for making electrical connection with the heater element. The slider also includes a dedicated ground path formed on the slider body at a location that is removed from either of the first and second contact pads, ground path providing electrical connectivity to the slider body. At a late stage in the manufacture of the read and write head, a determination can be made as to which contact pad is to be a ground pad, and that pad can be electrically connected with the ground path.

Abstract: A micro-actuator for a HGA includes a frame having a pair of side arms and a connection plate that interconnects the two side arms at one end thereof; a PZT element attached to at least one of the side arms; and an electrical connection shifting device to connect with the PZT element and the connection plate physically. The electrical connection shifting device is electrically connected with the PZT element for shifting an electrical connection position of the micro-actuator with a suspension of the HGA from the PZT element to the connection plate. The invention also discloses a HGA and a disk drive unit with the micro-actuator.

Abstract: Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.

Abstract: A magnetic head slider supporting apparatus comprises: a suspension flexibly supporting a slider; and a flexible wiring board. The suspension incorporates a load beam. The flexible wiring board is disposed along the load beam. The flexible wiring board includes: first and second lines for connecting a write element that the slider includes to a read/write processing circuit; and third and fourth lines for connecting a read element that the slider includes to the read/write processing circuit. The flexible wiring board further includes two conductors for generating two parasitic capacitances for reducing potential differences created between the third and fourth lines due to write signals transmitted through the first and second lines.

Abstract: Disclosed is a system and a method for reducing high frequency interference pickup by the read element of the magneto-recording head. The reduction is achieved by reducing the parisitic capacitance between certain elements of the magnetic head. In one embodiment, the areas of the pads and leads, including the areas of the leads over the S1 and the areas of the sensor leads, are reduced. A second implementation involves increasing the separation between the pads and leads and the substrate material. Copper studs or vias may be used to connect the contact pads and the underlying layers. A third implementation includes using a low dielectric constant material as a spacer layer between conductors (leads, pads, magnetic shields) and the substrate.

Abstract: A system according to one embodiment comprises a slider having an air bearing surface side and a flex side, the flex side being positioned on an opposite side of the slider as the air bearing surface side; electrical pads on the flex side of the slider; and a heating device in electrical communication with the electrical pads, where the heating device comprises a least one optical element A method according to one embodiment comprises positioning pads of a heating device towards pads on a slider; detecting an impedance in a circuit including the pads of the heating device; moving the heating device relative to the slider to minimize the impedance; and coupling the heating device to the slider. Additional systems and methods are provided.

Abstract: A slider for magnetic data recording, the slider including a plurality of solder pads that are embedded into the head. The solder pads can be formed during the formation of read and/or write heads, and can each be contained within a cavity. These cavities can be photolithographically patterned so that they can be formed very close together. In addition, because the solder pads are contained within the cavities, they do not flow into one another as would standard solder balls so that the embedded solder balls can be spaced much more closely together than standard solder balls can, without the risk of shorting between solder pads.

Abstract: In the case of employing the wire bonding for the actual element detection in the air bearing surface polishing process and the solder bonding for the connection between the terminals in the assembly process, it has been virtually impossible to satisfy requirements of both of the wire bonding and the solder bonding. According to the embodiment of the invention an MR head and a write head are stacked on an element formation surface of a slider. A lead line connected to electrodes of the MR head is connected to MR element terminals 20 via a copper stud. An outgoing line from coils of the write head is connected to write element terminals via a copper stud. The stacked body of the MR head and the read head, the lead line, and the coil outgoing line are covered with an alumina protection film. The MR element terminals and the write element terminals are formed on the alumina protection film.

Abstract: A method for de-tabbing a dielectric tab extending between and bonded to first and second stainless steel portions of a disk drive head suspension component. Exemplary first and second stainless steel portions are a flexure base region and a flexure tongue. The method includes applying laser energy to the dielectric tab. The laser energy is characterized by one or more parameters, e.g., a pulse width and/or an energy density, causing de-bonding of the dielectric tab from the first and second stainless steel portions.

Abstract: A head assembly for a data storage device. The head assembly has a suspension. The head assembly also includes a contact pad coupled to the suspension. The head assembly also includes a slider. The slider is coupled to the suspension at the slider mounting point. The slider mounting point is at least partially bounded by polyimide standoffs. The polyimide standoff closest to the contact pad is positioned to reduce the effect of the solder shrinkage moment.

Abstract: A method and apparatus for electrically coupling a slider to a controller circuit are disclosed. In one embodiment, a pre-amplifier with an integrated electrical connector (I-connector) may be connected via an electrical trace to a slider and via a head stack assembly flexible circuit to a control circuit. The pre-amplifier may have two parallel series of spring probe claws, two parallel series of contact pegs, two slots, or a slot and a rotary cam.

Abstract: A magnetic head part is constituted by a reproducing head part having a GMR device and a recording head part acting as an inductive electromagnetic transducer which are laminated on a support. The magnetic head part further comprises a heater. One of poles of the heater is electrically connected to a heater electrode pad disposed on a first surface of a head slider. The other pole is electrically connected to a substrate constituting the support, and is energized by way of a second surface of the head slider.

Abstract: A slider having bonding pads opposite an air bearing surface and a method for producing the same is disclosed. Bonding pads are formed on the side of a slider assembly opposite the air bearing surface (ABS) to allow electrical probing devices on the slider while applying pressure to the slider during the lapping process and to allow a flip chip bonding process of the slider to the suspension thereby reducing or eliminating the need to bend wires and attach to the end of the slider body.

Abstract: An area 5 for mounting a magnetic head is formed on a metal board 1, a conductive layer 4 is formed as a circuit pattern via an insulation layer 2 interposed outside this area and up to a metal board 1. A pattern end 4 to be a connection terminal for connection with the terminal of the magnetic head is formed on the circuit pattern, an end face 4a of the pattern end 4 is aligned with an end face 2a of the insulation layer 2 directly beneath it or protruded in the terminating direction from the end face 2a, thereby providing a structure preventing irradiation of a laser beam on the insulation layer 2.

Abstract: An electrical connection assembly includes a body, an electrically insulative layer supported by the body, a first bond pad defined on the electrically insulative layer, a first electrical contact pad defined on the electrically insulative layer and electrically isolated from the first bond pad, a circuit located adjacent to the electrically insulative layer defining a second bond pad and a second electrical contact pad that are electrically isolated from each other, and an electrically conductive bonding material that electrically and mechanically links the first and second bond pads. After setting, the electrically conductive bonding material biases the first and second electrical contact pads against each other in order to create an electrical connection therebetween.

Abstract: The present bonded structure uses metal ball to bond or weld the respective bonding surfaces of electrical pads which are arranged to face the same direction. The structure can be controlled visually and thus enables a high connection quality of no short circuit. In addition, the bonding operation of the bonded structure is carried out without using pressure, thus it will not damage surroundings of the electrical components. Accordingly, the manufacture yield is significantly improved and the cost is prominently reduced. The present invention also discloses a bonding method and a head gimbal assembly and a head stack assembly and a drive unit using the bonded structure.

Abstract: Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

Abstract: A printed circuit that connects a head to a pre-amplifier circuit of a hard disk drive. The head has a pair of write bond pads and a pair of read bond pads. The printed circuit has a pair of read traces located in a first layer and connected to the read bond pads. The printed circuit also has a pair of write traces that are located in a second layer and connected to the write bond pads. The write traces cross with the read traces so that a head fabricated from a single head wafer can be used as a Up head in a hard disk drive.

Abstract: A slider having a lead circuitry configured to minimize capacitive coupling between leads in a slider having a read head, a write head and an extra device such as a heater element. The leads are configures so that wherever a pair of leads cross one another, they do so at right angles or at nearly right angles. The leads can cross one another at angles of between 45 and 135 degrees, but preferably cross one another at an angle of about 90 degrees. The leads are electrically insulated from one another by a dielectric material formed between them. By crossing a pair of leads at right angles to one another, the overlapping area between the leads is minimized, thereby minimizing the capacitive coupling between them.

Abstract: A composite head-electrical conditioner assembly that includes a slider with a transducer head and transducer bond pads. The transducer bond pads communicate a transducer level electrical signal with the transducer head. An integrated circuit substrate has a conditioning circuit and first substrate bond pads electrically connected to the transducer bond pads. The integrated circuit substrate has second substrate bond pads with a conditioned electrical signal that is transmittable over a circuit. The slider is rigidly mounted to the integrated circuit substrate to form an assembly that is flexibly mountable. A thermal isolation space is provided between the transducer and the conditioning circuit. The integrated circuit can be in the form of a cap that provides windage reduction.

Abstract: A slider has a slider substrate, a read sensor, a top shield and a bottom shield sandwiching the read sensor, and a write shield. The slider substrate is electrically connected to a substrate electrical connection which is adapted to provide a flying height control voltage to the slider substrate for realizing EFH control so that the bottom shield and the write shield both are electrically connected to a ground electrical connection to eliminate pits on shields of the slider as well as reduce electrostatic discharge (ESD) damage and noise during EFH operation. The slider also employs a bottom plate, a heater and a shunting circuit with shunting resistances to optimum reading and/or writing performance by further better preventing noise, cross-talk and ESD. The present invention also discloses a hard disk drive with the slider for adjusting the slider's flying height.

Abstract: An integrated lead flexure for a disk drive head suspension, comprising two or more spaced-apart traces extending between terminal connector pads and head connector pads, wherein the spacing between the traces substantially continuously decreases along at least a portion of the length of the traces.

Abstract: A recording head is disclosed that includes electrical pads on multiple surfaces. The recording head includes a substrate portion abutting a deposited portion. The deposited portion includes an air bearing surface (ABS) (or bottom surface), an end surface, and at least one other surface. The end surface is the surface traditionally used by head designers for electrical pads. In accord with the invention, one or more electrical pads are included on the other surfaces of the deposited portion (i.e., a surface other than the end surface). Electrical pads may also be included on the end surface.

Abstract: Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.

Abstract: A head actuator assembly of a disk device has a suspension which supports a head, an arm which supports the suspension and is rotatably supported by a bearing portion, signal wires which extend on the suspension and the arm and are connected electrically to the head, and a board unit. In manufacture, the signal wires are mounted on the suspension and the arm, and a connecting end portion of the board unit is connected to the signal wires mounted on the suspension and the arm. Thereafter, the head is mounted on the suspension and connected electrically to the signal wires.

Abstract: Embodiments of the present invention help to provide a flying height adjusting type magnetic head slider with reduced influence of a heater coil induction field. According to one embodiment, a magnetic head slider comprises a heater, a read element, and a write element, which are formed on a substrate. The heater is formed between a lower magnetic shield of the read element and the substrate by meandering a heater coil in direction Y going away from ABS. Magnetic fields by generated in direction Y orthogonal to a track width direction X of the lower magnetic field upon energization of the heater coil are offset each other, exerting no influence on the magnetized state in the track width direction X of the lower magnetic shield. A magnetic field hx induced in the track width direction X of the lower magnetic shield is coincident with the magnetizing direction of the lower magnetic shield, acting to maintain the magnetized state of the lower magnetic shield.

Abstract: Embodiments of the invention provide a head/slider supporting structure which has connection properties excellent in solder ball connections of a slider pad and a lead pad. According to one embodiment, in a head/slider supporting structure for connecting a slider and a lead wire by re-flowing a solder ball, a connection distance between a slider pad and an extreme end portion of the lead wire is reduced to enhance the performance of solder connection. The lead wire is inclined forwardly of the slider pad.

Abstract: A head gimbal assembly (HGA) has an improved interconnection between a head slider and a suspension of the HGA. The interconnection is achieved by using a reverse surface of an air bearing surface of the head slider as bonding surface to provide more space for arranging more slider electrical bonding pads thereon. The head slider is mechanically and electrically connected to the suspension at the bonding surface to have good performance on shocking conditions. The suspension further has an attitude control layer located between the head slider and the suspension. The attitude control layer serves as a datum plate for the head slider lying thereon and supporting the head slider so as to ensure the head slider a good attitude and reduce variation of slider flying height. The present invention also discloses a magnetic disk drive with the improved HGA and a fabricating method for the HGA.

Abstract: Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m2) of an electrode stud are in a relation of R2?4S.

Abstract: Apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.

Abstract: An apparatus includes a load beam, a slider coupled to the load beam by a gimbal assembly and including an optical transducer, an optical fiber for transmitting light directly toward the transducer, and a mounting structure for adjusting the position of an end of the optical fiber. Data storage devices that include the apparatus are also included.

Abstract: A suspension having a magnetic head assembly 1 mounted thereon is provided, wherein the magnetic head assembly comprises: a write head 1-2; a read head 1-1; and a resistive heating element 1-3 for controlling the flying heights of the magnetic heads, wherein the wires HTx and GTx for the resistive heating element is disposed such that they sandwich the wires RxX and RxY for the read head. The wires for the resistive heating element may be disposed between the wires for the write head and the wires for the read head. Furthermore, the waveform of the current or voltage to the resistive heating element has a time constant of 1 ?sec or more, the resistive heating element having wires disposed near the wires of the read head.

Abstract: An interconnect that may reduce a head slider's exposure to electrostatic discharge events and may dissipate charging of the head is provided. Conductive and nonconductive adhesives are used to adhere a head slider to the interconnect. An electromagnetic interference generating circuit generates current that flows through the conductive adhesive bonding the head slider to the flexure arm. The electromagnetic interference current breaks down the resistance of the conductive adhesive to dissipate an electrostatic voltage charge on the head slider. This may prolong the life of the head slider and a read/write head coupled to the head slider.

Abstract: The invention concerns a transducer device and assembly. A transducer device and assembly according to the invention comprise sheet of electrical insulator covering connection pads of a transducer component. The sheet of electrical insulator has on its surface connection pads that have galvanic contacts with the connection pads of the transducer component. Inside or on a surface of the sheet of electrical insulator there are electrical conductors connected with the connection pads of the sheet of electrical insulator. With the aid of the sheet of electrical insulator equipped with the connection pads and electrical conductors the transducer component can be mounted to a wiring board in a desired orientation, i.e. the connection pads of the transducer component do not need to be against the wiring board.

Abstract: A thermal flying height adjustment slider capable of being mounted on a small-sized thin film magnetic head slider is provided wherein terminals of an energizer serving as a heater prevent corrosion of pole pieces and the number of terminals is reduced. In one embodiment, one of terminals of the energizer serving as the heater is electrically connected to the lower pole piece, so that a relay terminal for a heating device is used also as the terminal for preventing the corrosion of pole pieces.

Abstract: A composite type thin-film magnetic head is provided, which comprises: a write head element; a pair of terminal pads for the write head element; a pair of lead conductors for the write head element, electrically connecting the write head element to the pair of terminal pads for the write head element; a read head element; a pair of terminal pads for the read head element; and a pair of lead conductors for the read head element, electrically connecting the read head element to the pair of terminal pads for the read head element. The pair of lead conductors for the write head element and the pair of lead conductors for the read head element are formed into patterns that have no overlapped portions with each other through only an insulating layer.

Abstract: A recording apparatus, including: a recording head having an actuator including first and second groups of terminals arranged in a direction; a flexible wiring member connected at one end thereof to the terminals and at the other end thereof to an external signal source and including first and second band-like regions which respectively correspond to the first and second groups of terminals and which extend generally in the direction, the first and second band-like regions respectively including first and second groups of wires disposed thereon and first and second connecting portions at the one end of the flexible wiring member which are respectively connected to the first and second groups of terminals, wherein at least a portion of one of the first and second band-like regions which extends from one of the first and second groups of terminals that is more distant from the other end of the flexible wiring member is disposed so as to overlap (a) the other of the first and second groups of terminals which is

Abstract: A side-by-side read/write head includes a self-aligned trailing shield, where a rear edge of the trailing shield is defined by the same lithography/etching process used to define a rear edge of a read sensor. A plurality of read sensor layers and a pole tip structure adjacent the read sensor layers are formed over a wafer. A non-magnetic layer is deposited over the pole tip structure. A patterned resist is then formed over both the read sensor layers and the non-magnetic layer. With the patterned resist in place, read sensor materials of the read sensor layers are etched away so as to define the rear edge of the read sensor. Non-magnetic materials of the non-magnetic layer are simultaneously etched away so as to form an etched region which defines the rear edge for the trailing shield.

Abstract: Embodiments include a method for forming a head suspension assembly. A spacer layer is formed in or on a silicon wafer. A transfer film including an opening defining the shape of a slider support membrane is provided, and the opening is filled with a resin material. The transfer film with the resin material therein is positioned over the silicon wafer so that at least a portion of the resin material is positioned adjacent to the spacer layer. The resin material is baked to form a glassy carbon material. The spacer layer is etched to form a trench in the silicon wafer adjacent to the glassy carbon material, and a slider is positioned on the glassy carbon material over the trench.

Abstract: Gimbal designs are provided that minimize adverse dynamic performance of a HDD suspension, particularly subsequent to head-disk-interface (HDI) interactions. The improvement of operational performance can be seen in graphical representations of the vibrational modes of a gimbal mounted slider subsequent to such HDI interactions. Each gimbal design includes a ramp limiter formed as two separated arms connected by one or two transverse bars and a routing of conducting traces that relieves stress and minimally contacts these bars.

Abstract: A method of making a multi-piece head suspension for a rigid disk drive. The method includes providing a first layer including a mounting region with an integral boss tower attached to a stiffener by one or more positioning tabs; attaching a second layer including a spring region to an interface between the mounting region and the stiffener; attaching a flexure to the stiffener; and removing the positioning tabs. The flexure can optionally be a portion of the second layer.

Abstract: A method of rounding corners of a slider's trailing edge by applying at least a first voltage to terminals of a bending device coupled to the slider. The slider including terminals, possibly bending device and/or vertical micro-actuator. The flexure finger, head gimbal assembly, with trace path(s) to the terminals. The head stack assembly, embedded circuit, and hard disk drive applying at least first voltage when loading/unloading the head stack assembly from ramp. Manufacturing the slider, the flexure finger, the head gimbal assembly, the head stack assembly, the embedded circuit, and the hard disk drive, as well as these items as products of the invention's manufacturing processes.

Abstract: A system and method for an improved magnetic head arm assembly (HAA), reducing complexity of design and difficulty of manufacture, is disclosed.

Abstract: A manufacturing method of an HAA includes a step of fixing a first lead conductor member onto a suspension, a step of attaching a second lead conductor member to at least one actuator arm, a step of fixing the suspension onto the at least one actuator arm, a step of electrically connecting the first lead conductor member fixed on the suspension with the second lead conductor member attached on the at least one actuator arm, a step of, thereafter, fixing a head slider provided with at least one head element onto the suspension, and a step of electrically connecting the at least one head element with the first lead conductor member.

Abstract: According to an embodiment of the present invention, an improved method and system are provided. In one embodiment, a conductive connection is made between two metal layers separated by an intermediate insulating layer by providing vias between one of the metal layers and the insulating layer. A conductor, such as a conductive sphere made of gold is disposed into the vias and pressed so as to create a conductive connection between the metal layers. In a further embodiment, vias are created in both metal layers. In such a case, a fixture support may be provided so that when the conductive sphere is pressed into the vias, it is also pressed into the support to improve the conductive connection.