Abstract: An electrode is formed on a chip-like electronic part of the type having a central axis, a polygonal cross section as viewed in a plane which is perpendicular to the central axis, a plurality of side surfaces extending in respective planes which are generally parallel to the central axis, and a pair of end surfaces extending generally parallel to the central axis, each adjacent pair of side surfaces meeting along a respective edge of the chip-like electronic part. The electrode is formed by applying a first band of conductive material to at least one of the side surfaces and applying a second band of conductive material to the remaining side surface(s) in such a manner that the first and second bands meet at respective ones of the edges and together form a continuous band of conductive material extending around the outer periphery of the chip-type electronic part.

Abstract: A multilayer ceramic capacitor includes a substantially cuboid-shaped laminated body formed with alternately stacked conductive layers and ceramic dielectric layers, and a pair of external electrodes respectively disposed at opposite end portions of the laminated body. The conductive layers are corrugated, and each of the conductive layers has a nonuniform and spatially varying thickness. Thus the surface area of the conductive layers is substantially increased, which in turn results in the increment of the electrostatic capacitance of the multilayer ceramic capacitor. Further, interrupted regions having the layer thickness of zero are formed on the conductive layer and since the boundary portions are pointed toward neighboring conductive layers, a strong electric field is formed threat. Accordingly, the electrostatic capacitance becomes increased.

Abstract: The present invention provides a new type of thin-film capacitor which is insensitive to breakdown voltages during its mounting on a printed circuit board. Said capacitor has an insulating substrate having at least two internal electrode layers which are mutually separated by means of a dielectric layer. The substrate also has two end contacts each of which are electroconductively connected to one of said internal electrode layers. According to the invention, the capacitor also has breakable electrically conductive means, preferably formed as a metal layer, which means are electrically connected to said end contacts. The presence of said breakable electrically conductive means between said end contacts prevents damage due to electrical storage which can arise during the mounting of the capacitor on a printed circuit board.

Abstract: An electronic component device includes first and second lead terminals arranged to hold an electronic component element, e.g. a piezoelectric resonator, and are electrically connected to the piezoelectric resonator. In the first and second lead terminals, first and second substantially L-shaped end sections are provided at ends of first and second substantially linear lead terminal bodies. The electronic component device is held by a first side and a second side of the first substantially L-shaped end section and a first side and a second side of the second substantially L-shaped end section. Lead terminals arranged to be joined to and to hold the electronic component element between the lead terminals. The lead terminals are arranged such that the distance between the lead terminals does not need to be changed even when electronic component elements having different thicknesses are used.

Abstract: An electrode is formed on a chip-like electronic part of the type having a central axis, a polygonal cross section as viewed in a plane which is perpendicular to the central axis, a plurality of side surfaces extending in respective planes which are generally parallel to the central axis, and a pair of end surfaces extending generally parallel to the central axis, each adjacent pair of side surfaces meeting along a respective edge of the chip-like electronic part. The electrode is formed by applying a first band of conductive material to at least one of the side surfaces and applying a second band of conductive material to the remaining side surface(s) in such a manner that the first and second bands meet at respective ones of the edges and together form a continuous band of conductive material extending around the outer periphery of the chip-type electronic part.

Abstract: A low inductance capacitor mounting structure for capacitors of multilayer printed circuit boards is provided. The capacitor mounting structure includes pads onto which a capacitor is mounted and vias or slots for connecting the solder pads to an upper conductor plane and a lower conductor plane. In the mounting structure, current is carried across the width of the solder pads so that a current in the solder pads flows directly underneath the current in the capacitor. This confinement of the magnetic filed which is between the capacitor and solder pads reduces the inductance of the associated magnetic path. The mounting structure also provides the lower conductor plane slightly below the upper conductor plane. The close spacing of the conductor planes confines a magnetic field, which is around the set of via or slot segments between the two conductor planes, so as to reduce inductance of the associated magnetic path.

Abstract: The present invention provides an electronic component provided with the terminal electrode having a three layer structure comprising a first layer, a second layer and a third layer successively formed on each end face of the main electronic component, the second layer being a porous structure to advantageously absorb the stress caused by expansion and shrinkage of the wiring board, thereby preventing the main electronic component from suffering the stress, and the non-porous first layer maintaining good electrical continuity with the inner electrode while the non-porous third layer serving for preventing permeation of the solder liquid along with maintaining good electrical continuity to the outside, thereby preventing the ceramic component from being mechanically damaged due to expansion and shrinkage applied from the wiring board when the ceramic electronic component is packaged on the wiring board.

Abstract: A standing axial-leaded surface mount capacitor is formed of a dielectric chip capacitor sandwiched between first and second blocks. The end blocks have profiles to match the profile of said chip capacitor. The end blocks are conductive at least on their outer surfaces and serve as leads to attaching to metallic surface traces of a printed circuit. In one preferred embodiment, the end blocks are ceramic cubes with metallic surfaces on its faces. The metallized cubes give the device rotational symmetry about its long axis, so that the capacitor will have identical performance in any orientation. This feature makes it possible to automatically pick and place the device onto a circuit board. Preferably, the dielectric chip has a square profile of the same dimension as the ceramic cubes. The profile of the cubes and the chip can be 20 to 25 mils to match the width of a typical printed circuit trace. The capacitors can be of any typical value, i.e., between 0.05 and 300 pf.

Abstract: A thin-film component, for example a capacitor, a resistor and a coil, as well as combinations thereof. A substrate of an electrically insulating material (preferably glass), is provided with two U-shaped side contacts and with an electrical structure which is electrically connected to both side contacts. A flexible layer (preferably polyimide) is situated between the substrate and at least one of both legs of each of the U-shaped side contacts, which flexible layer is provided directly on the substrate surface, and in that the modules of elasticity of the material of the layer is below 50 GPa. By virtue of this measure, it is achieved that the components demonstrate a better resistance to standard bending tests. As a result, the product-failure percentage is reduced if these components are employed in flexible PCBs or in PCBs which are subjected to a vibration.

Abstract: A monolithic capacitor which can reduce equivalent series inductance (ESL) thereof includes a first extension of a first internal electrode which is extended onto two sides of a capacitor itself. A second extension of the first internal electrode is extended onto a first end face; and a first external terminal electrode and a second external terminal electrode are connected to the first extension and the second extension, respectively. In addition, a third extension of a second internal electrode opposing the first internal electrode is extended onto the two sides of the capacitor and a fourth extension of the second internal electrode is extended onto a second end face. The third extension and fourth extension are connected to a third external terminal electrode and a fourth external terminal electrode, respectively.

Abstract: A multi-capacitor module carries vertically-oriented surface mount tantalum capacitors. The module provides at least one conductor for coupling to the, substrate capacitor terminals that are distal thereto. The module occupies less space, when mounted to a circuit board substrate, than individually mounting the bases of the surface mount capacitors to the substrate. This allows more efficient use of volume within an implantable cardiac rhythm management device, reducing its size, or alternatively, increasing its implanted longevity.

Abstract: A variable capacitor has a stator, a rotor, and a cover. The stator includes a stator electrode and a stator terminal connected electrically to the stator electrode. The rotor includes a rotor electrode facing the stator electrode with a dielectric disposed therebetween. The cover is shaped so as to accommodate and hold the rotor so that it can be rotated relative to the stator. An adjustment hole is formed in the cover so as to permit insertion of a tool for rotating the rotor. A spring-action portion is formed around the adjustment hole to thereby press the rotor against the stator. The stator terminal is formed so as not to extend onto a stator surface facing an edge portion of the cover, thereby maintaining a relatively long distance between the stator terminal and the edge portion of the cover and that between the stator terminal and the rotor.

Abstract: A component includes a substrate layer (1) of glass or Al.sub.2 O.sub.3, an anti-reaction layer (2) or a levelling layer (2), two electrode layers (3, 5) and a dielectric layer (4) as well as such a capacitor. Manufacture a component which provides for cost-effective, surface-mountable (SMD). The anti-reaction layer (2) on the glass substrate (1) or the levelling layer (2) on the Al.sub.2 O.sub.3 -substrate (1) is made of at least one specific material. An anti-reaction layer or a levelling layer (2) of one of the above-mentioned substances or a combination of several substances, enables a dielectric layer (4) to be provided by means of which a high capacitance value is achieved.

Abstract: Film capacitor of a film/foil or metallized embodiment with a wound or layered structure with a cup sheath or sheath made of thermosetting plastic material with axial or radial connecting wires, in which the sheathed film capacitor, which is a finished component once all the electrical parameters have been tested, is accommodated in a second sheath, which is designed as a cup, and the connecting wires are bent around onto mutually opposite outer sides of this second cup sheath and are in each connected to a connecting metal-sheet section.

Abstract: The present invention is to provide a monolithic capacitor for reducing an equivalent series inductance of a monolithic capacitor. The external terminal electrodes are respectively provided on four corners of the capacitor body. External terminal electrodes can also be provided on the side surfaces of the capacitor body. The first inner electrode is connected to two adjacent external corner terminal electrodes and preferably to the external side terminal electrode. The second inner electrode faces the first electrode through a dielectric layer and is connected to other two adjacent external corner terminal electrodes as well as to the external side terminal electrode. The current flowing through the inner electrodes is directed to a variety of directions, and since the current flow in the corner parts of the inner electrodes is smooth, the magnetic fluxes generated in association with the current are cancelled out, thereby reducing the equivalent series inductance.

Abstract: An improved structure for a thin multilayer capacitor where the electrodes are formed only on a portion of the ends of the package to reduce the footprint on the circuit board and the amount of noble metal used for each unit. The improved structure results from a manufacturing method that has additional advantages of reduced fabrication costs and fewer manufacturing steps.

Abstract: A process for making a solid electrolytic capacitor is provided which comprises the following steps. First, a capacitor element is prepared which includes a capacitor chip and an anode wire projecting from the capacitor chip. Then, the anode wire of the capacitor element is brought into contact with an anode lead. Finally, the anode wire is bonded to the anode lead at a connecting portion spaced from a tip of the anode wire.

Abstract: A monolithic ceramic capacitor having a plurality of dielectric ceramic layers, internal electrodes, and external electrodes electrically connected to the internal electrode, wherein the dielectric ceramic layers comprise (a) barium titanate having an alkali metal oxide impurity content of not more than about 0.02% by weight, (b) scandium oxide and/or yttrium oxide, (c) gadolinium oxide, terbium oxide and/or dysprosium oxide, (d) manganese oxide, (e) cobalt oxide, and (f) nickel oxide, and is a material containing (1) 100 mols represented by the compositional formula:(1-.alpha.-.beta.){BaO}.sub.m .cndot.TiO.sub.2 +.alpha.{(1-x)M.sub.2 O.sub.3 +xRe.sub.2 O.sub.3 }+.beta.(Mn.sub.1-y-z Ni.sub.y Co.sub.z)Owherein M.sub.2 O.sub.3 represents the above-mentioned (b); Re.sub.2 O.sub.3 represents the above-mentioned (c); 0.0025.ltoreq..beta..ltoreq.0.05; .beta./.alpha..ltoreq.4; 0<x.ltoreq.0.50; 0.ltoreq.1.0; 0.ltoreq.z1.0; 0.ltoreq.y+z<1.0; and 1.000<m.ltoreq.1.035, (2) about 0.5 to 5.

Abstract: Multi-terminal, layered capacitors having excellent attenuation characteristics over a wide frequency range. A four-terminal, layered capacitor has a dielectric sheet with an internal inductor electrode connecting an external input terminal to an external output terminal, dielectric sheets with internal capacitor electrodes connected to the external input terminal, and internal capacitor electrodes connected to the external output terminal, and dielectric sheets with internal ground electrodes connected to external ground terminals. All these dielectric sheets are integrally stacked and calcined to form a one-piece structure.

Abstract: A solid electrolytic capacitor has a molded casing containing therein a capacitor element, a first lead member connected to its anode and a second lead member connected to its cathode through a fuse. The second lead member is designed such that a relatively large capacitor element can be contained inside the casing although it must also have a large enough hole to allow a portion of the casing to penetrate therethrough to fasten it to the casing.

Abstract: An encapsulated solid electrolytic capacitor has an anode lead terminal, a cathode lead terminal, a capacitor element and a mold which is made of a synthetic resin material and encapsulates the capacitor element entirely. The capacitor element has an anode bar protruding longitudinally from a main body and is disposed between the anode lead terminal and the cathode lead terminal with the main body being electrically connected to the cathode lead terminal. The tip of the anode bar is welded to the anode lead terminal. The anode lead terminal has integrally formed with it a raised part which is L-shaped as seen longitudinally and is capable of having the anode bar inserted under its middle part, preventing it from becoming bent when it is soldered.

Abstract: A fixing part having a room in which a metal attachment leg is inserted to attach a capacitor unit is disposed on an outside face of a case. An electrode connected to a terminal of a capacitor element is disposed in the fixing part, and a lock part to be engaged with the inserted metal attachment leg is disposed, whereby when the metal attachment leg is inserted into the fixing part, the electrode of the fixing part is electrically contacted to the metal attachment leg by elasticity.

Abstract: A chip type electronic component is provided which includes a chip substrate having an opposite pair of end edges and an opposite pair of side edges between the pair of end edges. An opposite pair of first electrodes is formed in a layer on the chip substrate to extend from the end edges toward each other. Each first electrode has a narrower root portion closer to a corresponding end edge of the chip substrate and a wider head portion spaced from the corresponding end edge. An electronic element is formed in another layer on the chip substrate in electrical conduction with both of the first electrodes, and an insulating protective coating is formed on the chip substrate to entirely cover the electronic element together with the entire wider head portion of each electrode.

Abstract: A chip type thick film capacitor is provided which comprises an insulating chip (11) serving as a substrate and having a head surface (11a). The chip head surface (11a) is formed with a first lead electrode (12) and a second lead electrode (13) spaced from the first lead electrode (12). The chip head surface (11a) is also formed with a first capacitor electrode (14) in electrical conduction with the first lead electrode (12). The chip head surface (11a) is further formed with an auxiliary electrode (20) which is held in electrical conduction with the second lead electrode (13) but spaced from the first capacitor electrode (14) by a predetermined distance (D1). A dielectric layer (15) is formed on the first capacitor electrode (14), and a second capacitor electrode (16) is formed on the dielectric layer (15) in electrical conduction with the auxiliary electrode (20).

Abstract: A solid electrolytic chip capacitor in which L-shaped portions of the anode terminal and cathode terminal form slanting surfaces which project beyond the projecting side surfaces of the resin sheathing.

Abstract: An electronic device which has, on a rectangular insulating substrate, an input electrode and an output electrode, grounding electrodes and a conductor for electrically connecting the input electrode and the output electrode. The input electrode and the output electrode are disposed on both ends of the substrate. The grounding electrodes are disposed on side surfaces of the substrate in the center, and the conductor is disposed on an upper surface of the substrate. The conductor is a conductor with a high conductivity, a resistor or a coil. A capacity is generated between the conductor and the grounding electrode. If the conductor is a resistor, an RC circuit is formed.

Abstract: A capacitor mounting structure for printed circuit boards wherein the capacitor includes first and second terminals which are connected to first and second conductor planes in the printed circuit board. Three vias are mounted in the printed circuit board in a position to be aligned with the middle of the capacitor. A first conductor pad is mounted underneath one end of the capacitor and includes spaced apart extension portions which electrically attach to the first and third via. A second conductor pad is mounted under the other end of the capacitor and includes a central extension portion which attaches to the second or middle via. In this manner, the region available for generation of parasitic inductance is minimized thereby increasing the operating efficiency of the capacitor.

Abstract: In an electronic component such as a multilayer ceramic capacitor having an external electrode which is formed on an outer surface of an element body provided with an internal electrode, an inner layer is formed by baking silver paste, for example, on only an end surface of the element body to be connected to the internal electrode, in order to provide a sufficient thickness to the external electrode for reducing dc resistance while avoiding a bad influence exerted by wet plating. An outer layer is formed by dry plating to cover the inner layer and an end portion of the element body. The outer layer is formed by a first layer of a nickel alloy, for example, and a second layer of silver, for example.

Abstract: A capacitor mounting structure for printed circuit boards wherein the capacitor includes first and second terminals which are connected to first and second conductor planes in the printed circuit board. Three vias are mounted in the printed circuit board in a position to be aligned with the middle of the capacitor. A first conductor pad is mounted underneath one end of the capacitor and includes spaced apart extension portions which electrically attach to the first and third via. A second conductor pad is mounted under the other end of the capacitor and includes a central extension portion which attaches to the second or middle via. In this manner, the region available for generation of parasitic inductance is minimized thereby increasing the operating efficiency of the capacitor.

Abstract: A hermetically sealed capacitor including a metal tape (e.g, copper) having an adhesive on one side and being folded and wrapped around the capacitor winding in the manner that a Christmas package is wrapped. After wrapping, the tape initially extends beyond both ends of the capacitor. The tape is then folded at one end of the capacitor. The seam of the tape overlapping itself (along the length of the capacitor) and the fold at the one end of the capacitor are each soldered. On the other end of the capacitor, a ceramic header having a through hole (for one of the capacitor leads) is positioned. The tape extends beyond the ceramic header and is folded so as to make contact with the ceramic header. The seam between the metal tape and the ceramic piece is then soldered. In this way, a small, hermetically sealed capacitor is obtained.

Abstract: A method for manufacturing multi-layer ceramic capacitors wherein the internal electrodes are formed by introducing molten metallic material into the void layers of a ceramic dielectric body. The method comprises of applying and baking paste of silver or platinum/silver on the opposite end surfaces of ceramic dielectric body to form first external electrodes and introducing molten metallic material into void layers through injection openings which are in communication with the void layers and open at side surfaces of the ceramic dielectric body to form internal electrodes. The ceramic dielectric body can be filled with molten metal for relative short time and under low pressure as compared with a prior art ceramic dielectric body having porous penetrable barriers.

Abstract: There is provided terminal electrodes and methods of manufacture thereof which overcome the drawbacks of the prior art multilayer ceramic capacitor, namely, thickened terminal electrodes and size variation (low size precision) thereof. A ceramic main body (11) is provided with internal electrodes (12) therein, and terminal electrodes (13) on a front and a rear sides, and at least one of adjacent four sides. The terminal electrode (13) is formed as a three-layer structure consisting of a first external electrode layer (14) of metal highly adhesive to ceramic, a second external electrode layer (15) of metal having solderability, and a third external electrode layer (16) of metal having solder wettability. The three-layer structure of the terminal electrode is approximately 1 to 3 .mu.m thick.

Abstract: Wells are formed in an external surface of a semiconductor device package body. Capacitors are disposed within the wells at least partially, and preferably fully within the body. Cleaning channels are formed underneath the capacitors, for removing residual flux and/or solder.

Abstract: A chip component incorporating an electrical or electronic function member (2) and having terminal elements (7, 8) is integrated in a pre-fabricated housing (9) of cup shape composed of insulating material, with the function member (2) being held in the housing (9) by supporting elements (12) so as to form at least one air gap (10) that is 1 mm less wide and that separates the function member (2) from the inner housing surfaces (11) on all sides except where the function member (2) is fixed in the housing (9) with small-area supporting elements (12).

Abstract: A metalized film capacitor according to the present invention includes a capacitor element obtained by winding or stacking metalized films, solder layers respectively formed on outermost layers on both end faces of the capacitor element, and a coating resin which coats the capacitor element. Exposed electrodes of the capacitor are obtained by polishing and removing the coating resin from the solder layers to entirely or partially expose the solder layers. The melting point of the exposed electrode is slightly higher than that of a surface-mounting solder, and therefore good soldered portions can be obtained without causing fusing or deformation of the electrodes.

Abstract: A plastic-film wound capacitor having a cast resin, cast-coated cup encapsulation and connecting wires which radially make contact with the wound capacitor body can be simply and economically manufactured in chip configuration. The connecting wires of the chip capacitor are bent through 180.degree. and connected, respectively, to a sheet metal section on the outside of the cup encapsulation.

Abstract: A metallized capacitor is formed by winding at least two thin metallized dielectric films into a cylinder, the ends of which are sprayed or metallized and connected to externally mounted terminals. A protective interrupter is provided by connecting a very thin electrically conductive strip to one of the metallized ends and running the conductive strip over the surface of the outside metallized film to one of the externally mounted terminals. The capacitor so formed is embedded in heat cured epoxy so that the strip is integrated within the rigid epoxy case. Accordingly, the strip will tear or separate on any swelling or cracking of the epoxy case due to a faulty capacitor and thereby interrupt the power supply. The conductive strip may be scored at intervals along the length thereof in order to enhance its shearing or tearing ability.

Abstract: Method for making novel, dip-coated monolithic ceramic capacitors from a pair of parallel integral multi-lead carrier strips 10 and 10a. Each of a plurality of capacitor bodies 18 is positioned and restrained between the wide contact faces 15, 15a of a pair of leads 13, 13a, soldered and dip-coated while the leads 13 and 13a are retained as integral parts of the carrier strips 10 and 10a.

Abstract: An electric capacitor which can be soldered to a printed circuit board in the manner of a chip component, without damaging the capacitor, has capacitor plates with electrodes therebetween arranged in a stack, the electrodes alternatingly terminating at opposite end faces of the capacitor, at which a metal plating is applied, with a portion of respective bands of flexible metal being disposed adjacent each metal plating forming current leads, with the portion of the band adjacent the metal plating being encapsulated with the capacitor, and a remaining portion of each band projecting outside of the encapsulation and being bent at least partially around exterior sides of the encapsulation and forming soldering surfaces.

Abstract: A tubular capacitor is formed as follows. A ceramic tube comprising an outer ceramic cylinder and a plurality of radial walls is extruded. The extruded body may also include a second ceramic cylinder coaxial with the first. The one or more cylinders and the radial walls form a plurality of longitudinal passages. After the extrudate is fired and cut, the surfaces of the passages and the remaining surfaces of the cylinder or cylinders are metallized. Selected regions of metalization are removed to form discrete electrodes. The end terminations each comprise a base member from which there extends a plurality of prongs. Some of the prongs extend into the longitudinal passages, whereas others make contact with the outer surface of the outer cylinder and the inner surface of the inner cylinder.

Abstract: A tubular capacitor is formed as follows. A ceramic tube comprising an outer ceramic cylinder and a plurality of radial walls is extruded. The extruded body may also include a second ceramic cylinder coaxial with the first. The one or more cylinders and the radial walls form a plurality of longitudinal passages. After the extrudate is fired and cut, the surfaces of the passages and the remaining surfaces of the cylinder or cylinders are metallized. Selected regions of metalization are removed to form discrete electrodes. Two sets of electrodes are respectively connected to first and second electrical termination means.

Abstract: A capacitive device having first and second electrical contacts and being configured for leadless attachment within electrical circuitry. The capacitive device has at least one layer of electrically and thermally insulative material covering all sides of the device; a plurality of access passages for accommodating electrical access to the first and second electrical contacts of the capacitive device through the at least one layer of thermally insulative material, each of which access passages is configured to limit thermal communication to the first and second electrical contacts; and contact pads associated with the first and second electrical contacts of the capacitor for effecting electrical contact through the access passages, which contact pads fill and extend a distance beyond the limits of each of the access passages to increase electrical contact area for the first and second electrical contacts accessible from without the at least one layer of thermally insulative material.

Abstract: This invention relates to a chip-like solid electrolyte capacitor of the face-bonding type mold-encapsulated with insulative resin, wherein the cathode terminal connected to the cathode layer of a capacitor element is provided with a U-shaped fixing portion, a neck portion smaller in width than the width of the fixing portion, a vertical portion having first and second bent portions and an external connection portion only, the U-shaped fixing portion of the cathode terminal being connected by soldering to the cathode layer of the capacitor element so that any mechanical stress imposed on the capacitor element during the encapsulation can be absorbed by the vertical portion without causing it to act on the capacitor element.

Abstract: A rolled type ceramic capacitor produced by the process comprising the steps of forming first and second inner electrodes alternately formed across insulating gaps on one surface of a single ceramic green sheet, rolling the ceramic green sheet with the inner electrodes formed thereon, whereby the first and second inner electrodes opposing to each other with the ceramic green sheet intervening therebetween, firing the rolled ceramic green sheet, and electrically connecting first and second outer electrode to the first and second inner electrodes, respectively. The ceramic capacitor can attain small size for large capacitance.

Abstract: Finished electrical components having wire lead terminals are converted to elements having planar terminations by placing end caps or shoes over the ends of an existing component. A finished film capacitor having radial wire leads that is presently on a distributor's shelf, ready for shipment, may be converted to a capacitor for solder reforming by the use of these conversion caps. The capacitor may then be secured in a planar fashion to a substrate.

Abstract: A tantalum condenser includes a metallic electrode cap; a tantalum material fitted to the metallic electrode cap; a cylindrical metallic electrode facing to the metallic electrode cap; a tantalum lead projected from one end surface of the tantalum material; and a projection formed integrally with one end surface of the metallic electrode, and welded to the tantalum lead, wherein a part of the metallic electrode cap, the tantalum material, a part of the metallic electrode, the tantalum lead and the projection are molded with synthetic resin.

Abstract: A ceramic chip capacitor having a metal foil terminal strip configuration which reduces high frequency inductance.

Abstract: A barrier layer capacitor and a process for producing that capacitor: A central reduction layer formed of ceramic material is produced with a rectangular cross-section. A reoxidation layer is formed on all of the surfaces and is removed from one of the surfaces. Grooves are formed in opposite surfaces, including the one from which the reoxidation layer has been removed. A metal layer is applied around the entire capacitor body, except on the surface from which the reoxidation layer has been removed. Narrow strips are removed from the metal layer on the sides adjacent the surface without the reoxidation layer and at a location slightly away from that reoxidation layer free surface. On the reoxidation layer free surface, a connection coating is applied which extends up to the unremoved portion of the solderable metal coating. The capacitor may be cut from an elongated bar.

Abstract: A lead wire for a miniature capacitor having a U-shaped clamp at one end and being removably attached to a carrier, such as a sprocketed ribbon, at the other end. Each of the U-shaped clamps grasps and holds a terminal end of the capacitor. The carrier is used with conventional geared wheels and reels to move the capacitors and lead wires from station to station during their assembly procedure. When assembly is completed, the leads can be removed from the carrier.

Abstract: Disclosed is an electronic component which includes soldered leads (30 and 31) for electrical connection to other components. The electronic component is typically a film or hybrid integrated circuit formed on an insulating substrate (10) which includes contact pads (20-23) on the periphery. Clip-on type leads (30 and 31) are soldered to these pads. The leads include a thin layer of nickel (36) formed at least in the jaw (32) of the clip-on lead to prevent the formation of brittle intermetallics by the interaction of solder components with the lead components.