Abstract: A thermal management system for use in a sealed communications module and associated systems and methods are disclosed herein. In some embodiments, the communications model includes a sealed housing and a circuit board assembly having one or more heat-generating electronic components positioned within the housing. The thermal management system is coupled to the circuit board assembly and positioned to disperse heat from the one or more electronic components. The thermal management system includes a first thermal pathway, a second thermal pathway, and a third thermal pathway. The first thermal pathway has a first end attached to the circuit board assembly and a second end positioned near the side wall of the housing. The second thermal pathway is coupled to the second end of the first thermal pathway. The third thermal pathway is coupled to the second end of the first thermal pathway.

Abstract: A device for raising a temperature in at least one portion of a vehicle from a low temperature value to a temperature value increased above this, has at least one electronic component producing waste heat. The at least one electronic component is formed as a processor. Furthermore, a controller is provided, being designed to command the processor to provide a computing capacity in a heating mode, and to supply the waste heat generated upon performing at least one computation of the processor to the at least one portion of the vehicle. The disclosure furthermore relates to a method for raising a temperature of at least one portion of a vehicle from a low temperature value to a temperature value increased above this.

Abstract: A film wrapping display includes a display device configured to display information in a display area by emitting light, a transparent plate disposed on a display surface side of the display device, a bezel disposed around a periphery of the display device and including a support portion that supports the transparent plate, and a film continuously attached to both of the transparent plate and the bezel. A periphery of the display area where the transparent plate is supported by the support portion is an edge portion. The edge portion includes a decorative layer whose pattern or color is different from that of the display area.

Abstract: An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.

Abstract: According to at least one aspect of the present disclosure, an information-technology-design system is provided comprising at least one processor coupled to at least one memory, wherein the at least one processor is configured to receive information-technology-device information indicative of a plurality of information-technology devices in a space, the information-technology-device information including information-technology-device-location information, temperature information, and capture-index information, determine, based on the information-technology-device information, a containment type of the plurality of information-technology devices, select, based on the containment type, at least a portion of the capture-index information, determine, based on the information-technology-device-location information, the temperature information, and the at least the portion of the capture-index information, a respective cooling-performance assessment for each information-technology device of the plurality of informa

Abstract: A portable electronic device with a movable door cover including a host, at least one door cover pivoted to the host to be opened or closed relative to the host, at least one linking member connected to the door cover, a shape-memory alloy (SMA) spring connected between the linking member and the host, and a heat source disposed in the host is provided. The SMA spring is affected by heat generated from the heat source to form at least two stretching states, and drives the door cover through the linking member to form at least two states including said being opened or closed.

Abstract: A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, that is a material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.

Abstract: An electronic controller is provided and includes a printed wiring board (PWB) on which electronics are operably disposed, a power supply configured to supply power to the electronics, a heat sink and one or more thermal conductors anchored to the PWB to assume and move between first and second connection states in first and second thermal conditions, respectively. The first connection states are characterized in that the one or more thermal conductors are thermally attached to the PWB and the power supply and thermally disconnected from the heat sink. The second connection states are characterized in that the one or more thermal conductors are thermally attached to the PWB and the power supply and to the heat sink.

Abstract: Systems, methods, and computer-readable media are disclosed for systems-in-packages that are encapsulated, at least partially, by a coating serving as electromagnetic interference (EMI) shielding, thereby isolating and otherwise protecting components in the systems-in-package from interference. The systems-in-packages may include one or more capacitive sensors in communication with a portion of the EMI shielding that serves as a sensing pad. In this manner, the system-in-package may benefit from EMI shielding and capacitive touch sensing capability without the complexity and increased cost of a separate capacitive touch sensor and sensing pad.

Abstract: Devices configured to direct heat flow are disclosed, as well as methods of forming thereof. A device may include a self-assembling heat flow object. The self-assembling heat flow object may include a material having one or more self-assembling properties that cause the material to react to an environmental stimulus and one or more thermal pathways. An application of the environmental stimulus causes the self-assembling heat flow object to deploy and arrange the one or more thermal pathways for directing thermal energy to one or more locations.

Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

Abstract: An image forming apparatus including a storage device storing, from among data to be retained when the power is shut off, either or both of important protection data, being a type determined to be important in advance, and protection data, to be retained when the power is shut off other than the important protection data, at respective predetermined timings. A detection information acquirer receives detection information from a sensor detecting at least one of: a change in either or both of direction and tilt, vibration, a predetermined operation, an approaching person, a person entering a room, and a person entering a predetermined area. A protection processor starts processing for writing either or both of the important protection data and the protection data into the storage device in response to the detection information received by the detection information acquirer, at timings different from the predetermined timings.

Abstract: A semiconductor device and associated methods are disclosed. In one example, a processor die is coupled to a first side of a package substrate, and a memory die coupled to a second side of the package substrate. A system accelerator die is further coupled to the package substrate. In selected examples, the system accelerator die provides performance improvements, such as higher cached memory speed and/or higher memory bandwidth.

Abstract: A method of controlling a data center having a cold air cooling system, and at least one containment structure, comprising: determining a minimum performance constraint; determining optimum states of the cold air cooling system, a controlled leakage of air across the containment structure between a hot region and a cold air region, and information technology equipment for performing tasks to meet the minimum performance constraint, to minimize operating cost; and generating control signals to the cold air cooling system, a controlled leakage device, and the information technology equipment in accordance with the determined optimum states.

Abstract: Provided is a semiconductor device having excellent heat transferring performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50; a conductive shield can 20 having an opening 21, covering at least a part of the semiconductor element 30, and connected to a ground 60; a cooling member 40 located above the conductive shield can 20; and an electromagnetic wave absorbing thermal conductive sheet 10 formed between the semiconductor element 30 and the cooling member 40 at least through the opening 21 of the conductive shield can 20.

Abstract: Apparatuses and systems that include a keyboard baseplate including a concave structure with a logic substrate housed therein are disclosed. One apparatus includes a keyboard baseplate including a concave structure formed thereon and a lower surface having a side. The apparatus further includes a logic substrate provided on the side of the lower surface of the baseplate and housed within the concave structure. The logic substrate is configured to receive an analog signal generated by a sensor and convert the analog signal to a digital signal.

Abstract: Low-cost network switches and other computing systems are described herein. A low-cost network switch can operate at a lower ambient temperature (e.g., 55° C.) than conventional switches, thereby enabling the use of lower cost components (e.g., optical components that are not rated for operation at up to 70° C.). The network switch can utilize a power bar pass-through card that provides power from an enclosure bus bar to components of the network switch in lieu of a power supply unit. Additionally, ports of the network switch can operate in a 2×50G mode in which a network switch port capable of communicating at 100 Gbps interfaces with two external ports each capable of communicating at 50 Gbps. Communication in 2×50G mode can be supported by a four-channel Y-cable, in which the four channels are utilized by the network switch port and fan-out to two channels to each of the two external ports.

Abstract: A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.

Abstract: In various embodiments, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component coupled to or disposed within the wearable support. A thermal management structure can be provided in thermal communication with the electronic component. The thermal management structure can be configured to transfer heat from the electronic component away from the head of the user when the wearable support is disposed on the head of the user.

Abstract: An apparatus includes a housing, at least one processing device disposed within the housing and comprising a processor coupled to a memory, one or more sensors communicatively coupled to the processing device, one or more batteries configured to provide electrical power to the processing device, and one or more battery position actuators configured to modify a positioning of the one or more batteries relative to the housing. The processing device is configured to perform steps of obtaining information from the one or more sensors characterizing an operating state of the apparatus, monitoring the obtained information to detect one or more designated conditions affecting a health of the one or more batteries, and, responsive to detecting at least one of the one or more designated conditions, triggering the one or more battery position actuators to modify the positioning of the one or more batteries relative to the housing.

Abstract: An electrode body, which includes a positive electrode plate and a negative electrode plate, is contained in a battery case, which is composed of a rectangular casing and a sealing plate. A first positive-electrode tab group, which is composed of a plurality of positive electrode tabs, and a second positive-electrode tab group, which is composed of a plurality of positive electrode tabs, are disposed between the sealing plate and the electrode body. The first positive-electrode tab group and the second positive-electrode tab group are disposed so as to be displaced from each other in the longitudinal direction of the sealing plate. The first positive-electrode tab group and the second positive-electrode tab group are connected to different positions on a positive-electrode current collector.

Abstract: In some examples, a computing device may convert thermal energy to electricity. The computing device may include a stylus holder located on an edge of the enclosure and may be associated with a stylus detachably stored in the stylus holder. The stylus holder may be configured to hold a stylus when the stylus is not in use. The stylus may include one or more rechargeable batteries and one or more thermocouples to generate electricity to charge the one or more rechargeable batteries. The thermocouples may generate the electricity based on a temperature difference between a first location of the stylus that is heated to a first temperature by a user's body part (e.g., fingers) in contact with the stylus at the first location and a second location of the stylus that is at a second temperature that is lower than the first temperature.

Abstract: Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.

Abstract: A circuit board module for being assembled to a case is provided. The circuit board module includes an electronic connector and a circuit board. The electronic connector is fixed to the circuit board. The circuit board has at least one first slot. The at least one first slot is configured for a fixing element to pass through and for the circuit board to be assembled to a case. The size of the at least one first slot allows the fixing element to move in a direction parallel to a surface of the circuit board in the at least one first slot. An electronic device having the circuit board module is also provided.

Abstract: An improved architecture is provided which enables significant convergence of the components of a system to implement virtualization. The infrastructure is VM-aware, and permits scaled out converged storage provisioning to allow storage on a per-VM basis, while identifying I/O coming from each VM. The current approach can scale out from a few nodes to a large number of nodes. In addition, the inventive approach has ground-up integration with all types of storage, including solid-state drives. The architecture of the invention provides high availability against any type of failure, including disk or node failures. In addition, the invention provides high performance by making I/O access local, leveraging solid-state drives and employing a series of patent-pending performance optimizations.

Abstract: An axial flow fan includes a fan frame and an impeller received in the fan frame. The fan frame includes a base shell and a flange being formed on the base shell. The base shell further includes an air inlet facing away from the flange. The flange includes a first air outlet. The flange further includes a second air outlet. Air flows through the second air outlet in a direction perpendicular to the air flowing through the first air outlet.

Abstract: An electronic device is provided. The electronic device includes a housing configured to form an external shape thereof, a first board disposed in a first direction that is away from the housing, wherein at least one processor is mounted at the first board, a second board disposed between the housing and the first board and electrically connected with the first board, and a thermistor mounted on the second board, wherein the at least one processor measures a temperature of the housing based on an electrical signal received from the second board.

Abstract: Provided is a thermally conductive resin composition having a specific gravity of 1.4-2.0 and an In-Plane thermal conductivity of 1 W/(m·K) or higher, and containing at least (A) 30-90% by mass of a thermoplastic resin, (B) 9-69% by mass of an inorganic filler having a thermal conductivity of 1 W/(m·K) or higher, and (C) 0.05-10% by mass of a crystallization accelerator.

Abstract: The invention provides a plug connector which, when abnormal heating occurs in a fitting portion with a counter connector, can sensitively cut off the current supply. The plug connector has: contacts; a body that holds the contacts; a metal shell that covers the body; and a printed circuit board on which the contacts are solder-connected. The body has a fitting portion with a counter connector. The board has a thermal protection circuit. The thermal protection circuit has a temperature switch that detects a temperature, and an FET that is disposed in a power supply wiring of the board. When the detected temperature of the temperature switch exceeds a predetermined temperature, the power supply wiring is cut off by the FET. In the plug connector, the board has a heat conduction pattern that conducts heat of the metal shell 60 to the temperature switch.

Abstract: An electronic device able to regulate its own working temperature and keep the same constant notwithstanding light or heavy processor activity includes a shell, a circuit board mounted on the shell, a control module and a heating element mounted on the circuit board, and a heat dissipation assembly. The connecting assembly includes a first heat dissipation component, a second heat dissipation component, and a connecting assembly. The first heat dissipation component includes a first heat-conducting board. an elastic component, and a second magnetic component. The second heat dissipation component includes a second support with a second heat-conducting board rotatably mounted. The connecting assembly rotatably connects the first support and the second support and brings the heat dissipation components together for high-temperature heat dissipation and separates same when low working heat is generated. The electronic device dissipates heat evenly through the heat dissipation assembly.

Abstract: A disclosed electronic device includes a graphite laminate having a plurality of layers laminated in a first direction, each layer containing graphite, where the graphite laminate has a portion in a stepwise form in which edges of the plurality of layers are offset from each other.

Abstract: An electronic control unit includes a plurality of heating elements, a substrate, a heat sink, and a housing. The substrate includes a heating region on which the plurality of heating elements are collectively mounted. The heat sink is provided to be opposed to one surface of the substrate, and includes a radiating part, which is disposed in correspondence to the heating region of the substrate and receives heat generated by the plurality of heating elements. The housing is provided to cover the other surface of the substrate. The heat sink includes a fixation part, which is disposed separately from the radiating part and to which an outer edge part of the housing is fixed.

Abstract: To cooled down a circuit to an appropriate temperature. An electronic device is provided with a low-temperature-side deformation member, and a high-temperature-side deformation member. In this electronic device, when a temperature of a circuit to be cooled becomes higher than a set temperature that is lower between two different set temperatures, the low-temperature-side deformation member deforms, and comes in contact with a heat dissipation member having a smaller heat capacity between two heat dissipation members having different heat capacities. In addition, when the temperature of the circuit becomes higher than a set temperature that is higher between the two different set temperatures, the high-temperature-side deformation member deforms, and comes in contact with a heat dissipation member having a larger heat capacity between the two heat dissipation members.

Abstract: A circuit unit (10) includes a circuit body (11) having a resin portion (12) covering a circuit, first terminals (15) projecting from one edge of the resin portion (12) and second terminals (16) projecting from another edge part of the resin portion (12). A fixing member (20) made of metal is configured to fix the circuit body (11) to a base member (BM) by being mounted on the base member (BM) while being held in contact with the resin portion (12). A cover (30) having receptacles (35, 36) is fit to mating connectors (50A, 50B) while covering the first and second terminals (15, 16). The cover (30) is configured to cover the circuit body (11) and the fixing member (20). The cover (30) is formed with an opening (33) for exposing the fixing member (20) to outside.

Abstract: Devices configured to direct heat flow are disclosed, as well as methods of forming thereof. A device may include a self-assembling heat flow object. The self-assembling heat flow object may include a material having one or more self-assembling properties that cause the material to react to an environmental stimulus and one or more thermal pathways. An application of the environmental stimulus causes the self-assembling heat flow object to deploy and arrange the one or more thermal pathways for directing thermal energy to one or more locations.

Abstract: An image display device includes a display unit that displays an image so as to be visually recognized by an observer, a holding member that holds the display unit and has at least a portion thereof exposed to the outside, and a heat conduction member, having a sheet shape, which is connected to the holding member. The display unit includes an image forming device that forms the image. The heat conduction member comes into contact with the image forming device so as to be capable of heat conduction, and transmits heat of the image forming device to the holding member.

Abstract: A modular apparatus is provided. The modular apparatus includes: a modular board apparatus and a carrier board apparatus. The modular board apparatus includes a processor and a first connector. The carrier board apparatus includes a second connector arranged to be paired with the first connector to electrically connect the carrier board apparatus to the modular board apparatus. The processor determines a first modular type of the first connector and the second connector according to a first modular type signal from the carrier board apparatus and a second modular type signal from the modular board apparatus. When the first modular type matches a predetermined modular type of the processor, the processor transmits signals corresponding to the first modular type to the carrier board apparatus through the first connector and the second connector.

Abstract: In one embodiment, there is provided a computer-implemented method for evaluating ceiling plenum airflow patterns and cooling performance of equipment in a data center. The method includes receiving data related to equipment in the data center, receiving data related to the ceiling plenum, determining first parameters related to airflow and to pressure in the ceiling plenum using a first airflow model, determining second parameters related to airflow through a plurality of equipment racks and to pressure across the plurality of equipment racks using a second airflow model distinct from the first airflow model, determining a coupling relationship between airflow through the equipment racks and airflow into the ceiling plenum, adjusting the first parameters based on at least the second parameters and the coupling relationship, determining a sufficiency of airflow through the equipment racks, and storing, on a storage device, an indication of the sufficiency of airflow through the equipment racks.

Abstract: An electronic apparatus capable of performing efficient dissipation of heat generated within the apparatus, thereby making uniform the exterior temperature of the apparatus, without increasing the manufacturing costs and size of the apparatus. The electronic apparatus includes a circuit board having an electric component as a heat source mounted thereon, a thermal connection member forming part of a battery chamber, a heat pipe having one end connected to the electric component and the other end thermally connected to the thermal connection member, and a battery insertion part forming part of the battery chamber. The battery insertion part is disposed closer to a battery insertion port than the thermal connection member is. The battery insertion part is formed of a material lower in thermal conductivity than the thermal connection member.

Abstract: An externally rigid to semi-rigid wearable computer case for housing various computer components may include two different types of external sides: ventilated-sides and a non-ventilated side. In some embodiments, the wearable computer case may have four to five ventilated-sides. The ventilated-sides and the non-ventilated side together may form an enclosure for housing the various computer components. The ventilated-sides may include ventilation-holes. The ventilation-holes in a given ventilated-side may provide for a ratio of void space to non-void space (in terms of external surface area) that may be substantially from and including 0.6 to 0.4. Some embodiments may also provide for hot swap battery pack(s) that may be external to the wearable computer case and that may provide at least some electrical power to the various computer components housed within the wearable computer case. The wearable computer case and/or the hot swap battery pack(s) may be for VR/AR/MR use.

Abstract: A computing device includes a case enclosure, a heat-generating electrical component, and a thermal insulator. The thermal insulator has a first surface adhesively bonded to the surface of the case enclosure and has a second surface adhesively bonded to the surface of the heat-generating component. The thermal insulator includes a layer of thermally-insulating material between the first and second surfaces, and the thermally-insulating material has a thermal conductivity less than 35 mW/m-K.

Abstract: Disclosed is an electronic device including: a component that generates heat while operating; a first battery capable of being charged and discharged; a second battery that is capable of being charged and discharged, and has a higher heat resistance than the first battery; and a housing accommodating the component, and providing a first space for accommodating the first battery and a second space for accommodating the second battery. The first space and the second space are arranged such that the temperature of the second battery becomes higher than that of the first battery on average, while the component is operating.

Abstract: A ground structure of a controller that is mounted in a construction machine such as a dump truck and has a case having an upper surface on which a connector receiver hole for a receptacle connector to be received is provided includes: a cable harness that is provided by a plurality of cables including a ground cable and is connected to the receptacle connector; and a connecting portion for the ground cable to be connected, the connecting portion being provided near the connector receiver hole on the upper surface.

Abstract: A heat dissipation assembly includes a main body, a heat conductor element, and a heat dissipation member. The heat conductor element is mounted to the main body and in thermal conductive contact with at least one electronic component. The heat dissipation member is mounted to the main body and is in thermal conductive communication with the heat conductor element. The heat generated by the at least one electronic component is transmitted through the heat conductor element to the heat dissipation member.

Abstract: A heat management apparatus for an electronic device that includes a heat spreader. The heat spreader has a top surface and a bottom surface. A first portion is coupled to the electronic device. A second portion extends away from the electronic device. The heat spreader has a heat conductivity of at least approximately 100 Watts per meter Kelvin (W/mK). In some configurations the heat spreader may comprise a woven graphite material or a graphene material with a heat conductivity of at least approximately 1000 W/mK.

Abstract: A display device, comprising a display panel, a back surface enclosure disposed on a back surface side of the display panel and comprising a concave portion formed in a concave shape on a display panel side, and a heat generating component disposed between the display panel and the back surface enclosure, wherein the concave portion comprises a plurality of holes that release heat from the heat generating component to an outside of the display device.

Abstract: A protective device capable of dissipating heat for protecting an electronic device includes a carrier and a flexible heat transfer unit. The carrier is used for correspondingly connecting to or receiving the electronic device therein and has a plurality of edges. The flexible heat transfer unit is arranged at one of the edges of the carrier and has a first and a second extended portion. The first extended portion is extended onto and connected to an inner side of the carrier, whereas the second extended portion is extended away from the carrier to connect to a flip cover. The first extended portion of the flexible heat transfer unit is in direct or indirect contact with a heat source of the electronic device, such that heat produced by the heat source can be transferred from the carrier to the flip cover via the flexible heat transfer unit.

Abstract: An electrical connector for mounting to a flexible substrate and for coupling with a mating connector having a low-profile. The connector comprises a cover portion arranged to extend in a plane parallel to the substrate so as to cover a mounting hole in the substrate. The connector further comprises a body portion comprising a connection port projecting from the cover portion, the connection port having electrical contacts within an end face of the port. The body portion further comprising an alignment collar arranged circumferentially around the connection port, the alignment collar being provided with an alignment feature at a discrete circumferential position for angularly aligning the mating connector with respect to the connection port.

Abstract: An interposer is provided that suppresses heat conduction more effectively between two heat sources when the interposer is placed between the heat sources. An interposer 24 comprises a body having a cavity 23 maintained in vacuum; insulating layers 22a and 22b formed respectively on upper and lower walls 20a and 20b of the body; and heat reflecting layers 21a and 21b formed respectively on the insulating layers 22a and 22b. The interposer 24 thermally insulates semiconductor devices 11a and 21a mounted respectively on upper and lower sides of the interposer 24.

Abstract: A display device, comprising a display panel, a back surface enclosure disposed on a back surface side of the display panel and comprising a concave portion formed in a concave shape on a display panel side, and a heat generating component disposed between the display panel and the back surface enclosure, wherein the concave portion comprises a plurality of holes that release heat from the heat generating component to an outside of the display device.