Abstract: Thermal energy exposed at the outer surface of an information handling system housing is managed by spreading the thermal energy across the housing X and Y axes while restricting heat transfer from the housing at the Z axis. For example, a graphene outer surface couples to an aerogel substrate strengthened by a carbon fiber laminate. The graphene spreads thermal energy that escapes through the housing across the housing outer surface to limit the impact of thermal energy at any particular location, such as proximate to the location of a processor.

Abstract: An electronic device having a heat generating part in an internal space between a front case and a rear case wherein the rear case is integrally molded with a metal sheet and the metal sheet is given relief shapes which increase its surface area, whereby the heat of the heating generating part is dissipated from the rear case and conduction to the front case is reduced. The relief shapes can be formed from a wave shape. The rear case may be made a bathtub shape. Relief shapes of the metal sheet may be exposed at the inside space of the electronic device at the side wall part of the rear case or its vicinity. As a result, the heat which is generated inside the housing of a small electronic device can be efficiently dissipated from the back side and conduction of heat to the front side can be made difficult.

Abstract: A data storage system and a method of cooling the data storage system are presented. The data storage system includes: an enclosure; one or more drawer structures disposed within the enclosure, wherein at least one of the drawer structures is configured to receive one or more electronic devices; and one or more temperature control elements positioned adjacent to the bottom of the at least one drawer structure, wherein at least one of the temperature control elements is arranged in use to thermally communicate with at least one of the electronic devices.

Abstract: The inner edge of a hole 23 surrounding the outer circumference of a first heat sink 61 includes two edges 23a and 23b that are positioned on opposite sides to each other with the first heat sink 61 therebetween. An upper frame (shield) 20 includes spring portions 24 on one edge 23a, which is in contact with the first heat sink 61 to push the first heat sink 61 toward the other edge 23b. Further, the upper frame 20 includes, the other edge 23b, a position determining portion 25 to which the first heat sink 61 is pressed. According to the above electronic apparatus, it is possible to define the position of a metallic component by a shield covering a circuit board and to cause the metallic component and the shield to be in contact stably.

Abstract: An exemplary electronic device includes a container, a fan assembly and a duct received in the container. The fan assembly includes a centrifugal fan and a fin group thermally contacting an electronic component in the container. An air passage is defined between each adjacent fins of the fin group. An inner side of the fin group is mounted on an outlet of the centrifugal fan. A bottom surface of the fin group and an inner surface of the container cooperatively define a first channel therebetween. The duct includes an inlet and a first outlet. Airflow guided by the centrifugal fan flows through the duct and the first channel to cool a bottom end of the fin group, then is absorbed into the centrifugal fan from an inlet of the centrifugal fan, and then flow through the air passages of the fin group to cool a central portion the fin group.

Abstract: Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The method includes, for instance: securing a housing about an electronic component to be cooled, the housing at least partially surrounding and forming a compartment about the electronic component to be cooled; disposing a fluid within the compartment, wherein the electronic component to be cooled is at least partially immersed within the fluid, and wherein the fluid comprises water; and providing a deionizing structure within the compartment, the deionizing structure comprising deionizing material, the deionizing material ensuring deionization of the fluid within the compartment, wherein the deionizing structure is configured to accommodate boiling of the fluid within the compartment.

Abstract: To provide electronic equipment having a heat discharging function capable of achieving the maximum in the signal processing capability of a portable terminal by preventing the functional restriction of the portable terminal by effectively discharging exothermic heat from the portable terminal at the time of coupling the portable terminal whose function is restricted by heat generation to an external device, as well as a heat discharging system and a heat discharging method.

Abstract: According to an exemplary embodiment, a power semiconductor package includes a power module having a plurality of power devices. Each of the plurality of power devices can be a power switch. The power semiconductor package also includes a double-sided heat sink with a top side in contact with a plurality of power device top surfaces and a bottom side in contact with a bottom surface of the power module. The power semiconductor package can include at least one fastening clamp pressing the top side and the bottom side of the double-sided heat sink into the power module. The double-sided heat sink can also include a water-cooling element.

Abstract: An electronic device includes a computer, a circuit board, a supporting base attached to a top surface of the circuit board, and a backboard attached to a bottom surface of the circuit board. The case includes a bottom plate. The circuit board defines a through hole. A CPU is located on the supporting base. The backboard defines a retaining hole. The supporting base defines a fixing hole. A heat sink is attached to the supporting base and contacted the CPU. A fixing member is engaged with the retaining hole, the fixing hole and the through hole, to engage the backboard and the supporting base to the circuit board.

Abstract: Various computing devices and methods of thermally managing the same are disclosed. In one aspect, a method of thermally managing a computing device is provided where the computing device includes a housing that has a wall adapted to contact a body part of a user, a circuit board in the housing, and a semiconductor chip coupled to the circuit board. The method includes placing a first heat spreader in thermal contact with the semiconductor chip and the circuit board but separated from the wall by a gap.

Abstract: A device mounting system is provided. The device 720 can include a plurality of device mounting posts 730, 740. The system can further include a transition member 100 including an transition mounting feature 150 and at least one receiver 140 adapted to accommodate a first portion of the device mounting features 730. The system can also include a backing member 100 comprising at least one receiver 140 adapted to accommodate the remaining portion of the device mounting features 740 and a transition mounting receiver 240 adapted to accommodate, the transition mounting feature 150.

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract: According to one embodiment, a heat radiation block is pressed in contact with a heat receiving plate of an apparatus body, a heat receiving block receives its reaction force via a heat pipe and thus moves. A drawer section and the heat radiation block are fixed and held in the apparatus body after the movement of the heat receiving block.

Abstract: A system for removing heat from a computing device includes a carrier and one or more heat removal elements. The carrier includes a carrier surface having a carrier surface pattern. The carrier surface pattern includes coupling portions. The coupling portions of the carrier surface pattern selectively couple, at different locations on the pattern, the heat removal elements to the carrier. The heat removal elements conduct heat from heat producing components of the computing device to the carrier. The carrier conducts heat away from the heat removal elements.

Abstract: A retaining device for a printed circuit board includes an expandable bladder. The bladder is responsive to a source of pressurized fluid for selectively clamping a printed circuit board within a slot of an associated cooling and/or storage chassis. A method for retaining a circuit card within a chassis includes pressurizing a volume of fluid, and filling an expandable bladder with the pressurized fluid; wherein filling of the bladder causes its expansion and clamps a circuit card within the chassis.

Abstract: A method of forming a heat-dissipating structure for semiconductor circuits is provided. First and second semiconductor integrated circuit (IC) chips are provided, where the first and second semiconductor chips each have first and second opposing sides, wherein the first and second semiconductor IC chips are configured to be fixedly attached to a top surface of a substantially planar circuit board along their respective first sides. The respective second opposing sides of each of the first and second semiconductor IC chips are coupled to first and second respective portions of a sacrificial thermal spreader material, the sacrificial thermal spreader material comprising a material that is thermally conductive. The first and second portions of the sacrificial thermal spreader material are planarized to substantially equalize a respective first height of the first semiconductor chip and a respective second height of the second semiconductor chip.

Abstract: The invention provides a load distributed heat sink system for securing a heat sink to a heat-generating electronic component while distributing the load on the circuit board. Provided is a heat sink system having heat sink, a heat sink clip, and a circuit board. The heat sink is generally disposed on one side of the circuit board over a component, and the heat sink clip is generally disposed on the opposing side of the circuit board. The ends of heat sink clip reach to the other side and attach onto the heat sink on. The heat sink clip further includes a load spreader, which is urged onto the circuit board by the heat sink clip, both retaining the heat sink system in place and distributing load on the circuit board.

Abstract: There is provided a portable apparatus including a top layer portion, a bottom layer portion, and a frame layer portion provided between the top layer portion and the bottom layer portion, wherein the frame layer portion is formed of a rigid material and comprises a plurality of compartmented openings, and wherein the compartmented openings are formed as volumes of spaces partitioned by an arrangement of crosspiece portions forming at least a part of the frame layer portion, and a circuitry component constituting a part of the portable apparatus is placed within at least one of the compartmented openings.

Abstract: The invention relates to heat dissipation means for use with electrical and/or electronic apparatus to provide for the improved cooling of at least one component within the housing of the apparatus. The heat dissipation means includes a first portion located internally of the housing at or adjacent to the at least one component to be cooled and the means is formed of a material to allow the same to be passed via the first portion to an interface and onto a second portion located externally of the housing to allow the heat to be dissipated therefrom to the external environment more effectively. This allows heat to be dissipated without the need for moving heat dissipation means to be provided and avoids the noise and/or vibration which can be created.

Abstract: A heat sink mounting device includes a touching plate and a mounting member. The touching plate defines a locking hole. The mounting member includes a locking post. The locking post includes a body and two protrusions protruding from the body. An inner surface of the locking hole defines two cutouts. The touching plate includes two blocking blocks extending from an edge of the locking hole on a bottom surface of the touching plate. The two protrusions extend out of the two cutouts and abut the bottom surface of the touching plate. One of the two protrusions is located between the two blocking blocks, to prevent the body from rotating freely in the locking hole.

Abstract: An electrical equipment casing includes a circuit board on which many electrical parts are mounted and a heat sink to which the circuit board is fixed. The heat sink is provided with a reactor housing dent that opens in a surface on which the circuit board is placed and radiator fins that reach a bottom portion of the reactor housing dent on a surface opposite to the surface on which the circuit board is placed at a position surrounding an outer circumference of the reactor housing dent. The reactor is housed in the reactor housing dent and a terminal thereof is electrically connected to the circuit board. This structure of the electrical equipment casing can contribute to an achievement of both of a size reduction of the overall casing and enhanced heat dissipation of the reactor.

Abstract: A heat dissipation device includes a heat sink and an air duct mounted to the heat sink. The heat sink includes a board and a number of fins extending up from the board. The air duct includes an installation piece pivotably mounted to a side of the heat sink, and a blocking piece extending substantially perpendicularly out from an end of the installation piece.

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine foil may be in a parallel position or a rotated position, in embodiments.

Abstract: A data processing system includes an enclosure, one or more airflow manifold structures within the enclosure, and a plurality of data processor cards mounted within the enclosure. Each one of the one or more airflow manifold structures has an air inlet portion and an air outlet portion. Each one of the data processor cards extends substantially parallel to each other one of the data processor cards. Each one of the data processor cards includes an airflow duct having an air inlet portion thereof covering a portion of the air outlet portion of at least one of the one or more airflow manifold structures and includes a plurality of data processing units within the airflow duct.

Abstract: A computer casing includes several electronic components, a first heat sink, a side plate, a second heat sink, a container, a pump, and a tube. The first heat sink is attached to an electronic component, and defines a channel including an inlet and an outlet. The side plate defines an opening. The second heat sink is fixed to the side plate and covers the opening. The second heat sink includes a first side facing the opening and an opposite side external to the side plate. The container is used to store coolant and is fixed to the first side of the second heat sink. A pump is connected to the container. The tube includes a first end connected to the pump and a second end connected to the inlet of the channel of the first heat sink, and stays in contact with the first side of the second heat sink.

Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

Abstract: A pluggable module, includes: an insertion gate through which an electronic module is inserted and removed; a guide rail, including a spring support unit provided with a spring unit and a bearing unit located near the insertion gate, to guide the electronic module; and a heat sink plate, including, at one end portion, a fulcrum bar to be inserted into the bearing unit so as to move in a pressing direction of the spring unit, the heat sink plate being pushed up at the other end portion by a leading end of the electronic module so as to be pressed against the electronic module.

Abstract: A portable electronic device, which including a casing, a circuit board, a fan and a heat dissipating device, is disclosed. The circuit board is disposed in the casing and includes at least one electronic component thereon. The fan is disposed in the casing. The heat dissipating device is disposed in the casing and near the side of an air outlet of the fan. Gaps formed between the outer surfaces of the heat dissipating device and the inner surfaces of the casing as air flow channels. The portable electronic device isolates heat conducted to the casing of the portable electronic device via the gaps.

Abstract: A thermal interposer for a heat-generating electronic component located on an adapter card of a computer includes a thermally conducting planar body. The thermally conducting planar body may be configured to be coupled to the adapter card such that a first surface of the planar body is in thermal contact with a surface of the electronic component. The thermal interposer may also include a cold plate assembly removably coupled to a second surface of the planar body opposite the first surface. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly.

Abstract: Embodiments of semiconductor chip assemblies, and methods are shown that include adhesive thermal interface materials between a heat spreader and a semiconductor die. Assemblies and methods are shown where the heat spreader is not adhered to a substrate beneath the semiconductor die.

Abstract: The present application discloses a display device including a display panel for displaying images; a first thermal conduction layer including a flexible and compressively deformable portion in contact with the display panel, and a thermal conduction portion for conducting heat from the flexible portion; and a second thermal conduction layer in contact with the thermal conduction portion. The first thermal conduction layer conducts heat isotropically. The second thermal conduction layer with higher thermal conduction characteristics in an in-plane direction than the first thermal conduction layer forms a thermal conduction element with the thermal conduction portion. The thermal conduction element includes a first area corresponding to a center of the display panel and a second area closer to an edge of the display panel than the first area. The second area has higher thermal conductivity in the in-plane direction than the first area does.

Abstract: A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for dissipating the heat generated from the power module board and/or the power device. The thermal conductive sheet contains a plate-like boron nitride particle and the thermal conductivity in a direction perpendicular to the thickness direction of the thermal conductive sheet is 4 W/m·K or more.

Abstract: A mobile terminal is provided. The mobile terminal comprises at least one element, a connector selectively connected to another device to provide a data exchange path between the at least one element and the other device, and a thermal conduction frame having one side coming into contact with the at least one element and the other side coming into contact with the connector to transfer heat generated from the at least one element to the connector. The connector is connected to the element included in the mobile terminal and the other device through the thermal conduction frame to effectively transfer heat generated from the element to the other device through the connector.

Abstract: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.

Abstract: A heat dissipating apparatus comprises a first heat sink, a second heat sink and a fixing unit. The first heat sink comprises a connecting portion. The second heat sink comprises a connecting unit which is inserted into the connecting portion. The fixing unit includes an end portion exposed outside the connecting portion and a body accommodated in the connecting portion.

Abstract: A modular direct-current power conversion system is applied to receive a DC input voltage and output a DC output voltage. The modular direct-current power conversion system includes a main board and a plurality of DC power conversion modules. The main board includes a primary surface, a voltage input terminal, a voltage output terminal, a plurality of insertion regions, and a plurality of pin holders. When the DC power conversion module is inserted on the main board, the DC input voltage is inputted via the voltage input terminal to the DC power conversion module. The DC power conversion module converts the DC input voltage into a DC output voltage, and the DC output voltage is outputted via the voltage output terminal.

Abstract: A composite component includes a first joining partner, at least one second joining partner and a first joining layer situated between the first joining partner and the second joining partner. In addition to the first joining layer, at least one second joining layer is provided between the first and the second joining partner; and at least one intermediate layer is situated between the first and the second joining layer.

Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

Abstract: A high performance computing system includes one or more blade enclosures configured to hold a plurality of computing blades, a connection interface, coupled to the one or more blade enclosures, having one or more connectors and a shared power bus that distributes power to the one or more blade enclosures, and at least one power shelf removably coupled to the one or more connectors and configured to hold one or more power supplies. The system may further include the computing blades and the power supplies. The power shelf may include a power distribution board configured to connect the power supplies together on the shared power bus.

Abstract: A high performance computing system with a plurality of computing blades has at least one computing blade that includes one or more computing boards and two side rails disposed at either side of the computing board. Each side rail has a board alignment element configured to hold the computing board within the computing blade, so that a top of the computing board is coupled to, and adjacent to, a portion of the board alignment element.

Abstract: An electronic device includes: a casing in which electronic components including a heat-emitting component which emits heat during operation are accommodated; a heat-dissipating component including a plurality of fins to which heat emitted in the heat-emitting component transfers; a fan operable to supply cooling air to the heat-dissipating component; and a cleaning component movable on an end surface of the fins along the side nearer the fan with the cleaning component abutting against the end surface of the fins. In these features, dust on the end surface of the fins can be automatically removed by moving the cleaning component in the case of the spatial orientation of the electronic device being changed. Therefore, an effect of removing heat emitted in the heat-emitting components, by using cooling air supplied from the fan, can be continuously obtained.

Abstract: A device including a heat-absorbing component, and one or more heat-generating components. At least one heat-generating component is located in proximity to an inner surface of the heat-absorbing component, and a gap exists between the at least one heat-generating component and the inner surface of the heat-absorbing component. The device further including an insulator, located in the gap, including an insulator structure enclosing atmospheric pressure gas, where the atmospheric pressure gas has a thermal conductivity lower than air.

Abstract: An electronic device comprises a case, a heat source and a radiator. The heat source is disposed inside the case. The radiator is disposed on the case and the radiator is kept away from the heat source at a distance. The radiator comprises a case body. A plurality of cellular compartments formed by a plurality of partition plates is disposed inside the case body. The cellular compartments are filled with a heat dissipation material. The radiator absorbs the heat of the heat source through thermal radiation.

Abstract: A battery pack includes a secondary battery, an outer case receiving the secondary battery, and a cooling unit disposed at a predetermined position of the outer case, wherein the cooling unit includes a first heatsink disposed toward the inside of the outer case, a second heatsink disposed toward the outside of the outer case, and a thermoelectric device between the first heatsink and the second heatsink.

Abstract: An information handling system's thermal management is selectively altered by coupling a thermal barrier to the bottom surface of the information handling system chassis so that an air channel insulates against the passage of thermal energy from the bottom surface. A vent opening in a side of the thermal barrier allows airflow through the air channel to a vent opening of the information handling system. The airflow through the air channel cools the base of the thermal barrier so that an end user will experience reduced thermal energy if the information handling system rests on the end user, such as in the end user's lap.

Abstract: A heat dissipating structure is provided and it covers a printed circuit board (PCB) including at least one interface card slot. The heat dissipating structure includes a board, at least one heat sink and at least one interface card opening. The board has a first surface and a second surface which are opposite to each other. The second surface of the board faces the PCB. The heat sink is formed at the first surface of the board. The interface card opening penetrates through the first surface and the second surface of the board, so as to make the interface card slot exposed in the interface card opening.

Abstract: An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.

Abstract: Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins.

Abstract: A heat dissipating module includes a main body, a heat dissipating unit and at least one resilient engaging unit. A side of the heat dissipating unit is connected to the main body and the other side of the heat dissipating unit contacts against at least one heat component. An end of the at least one resilient engaging unit is connected to a side of the main body and the other end of the at least one resilient engaging unit engages with a side of a fastening base. The at least one resilient engaging unit is for resiliently pressing the main body so that the dissipating unit contacts with the at least one heat component closely.

Abstract: Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar to the display screen. The thermally insulating component is coplanar to the display screen. The thermally insulating component is located between the display screen and the heat dissipating component. The coupler is for thermally coupling the base portion to the cover portion. The coupler includes a first component and a second component. The first component is coupled to the region configured to generate heat. The second component is coupled to the heat dissipating component of the cover portion. The coupler provides a path for transferring heat.