Abstract: A heat dissipation module suitable for a host apparatus is provided. The heat dissipation module has a shell body. The shell body has a heat conductive side and an air outlet-inlet side. The air outlet-inlet side has an air outlet and an air inlet. A contact sink having a fixing portion and a contact portion is installed on the heat conductive side such that the contact portion contacts a position requiring heat dissipation in the host apparatus. A heat conductive tube is disposed in the shell body between the fixing portion of the contact sink and the air outlet. A heat dissipation fin is disposed on the air outlet. A waterproof fan is installed on the air outlet. The shell body and the contact sink define an enclosure having waterproof edges except for openings on the air outlet-inlet side.

Abstract: A cooling module for cooling a semiconductor is provided and includes a land grid array (LGA) interposer, a substrate with an LGA side and a chip side, a cooler, a load frame attached to the substrate and formed to define an aperture in which the cooler is removably disposable, a spring clamp removably attachable to the load frame and configured to apply force from the load frame to the cooler such that the substrate and the cooler are urged together about the semiconductor and a load assembly device configured to urge the load frame and the LGA interposer together.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the at least some of the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit. The frame has such a shape that at least some of the electronic components constituting the internal unit are disposed inside the frame. The frame includes a terminal block on which input/output terminals for inputting and outputting controlled power are mounted for providing connection between the input/output terminals and external devices.

Abstract: An electric power converter includes a cooler and an electronic circuit. The cooler includes a heat sink, a cooling fan, and a wind tunnel. A plurality of radiator fins are provided on a heat-sink base in the heat sink. The cooling fan is configured to feed cooling air through the plurality of radiator fins. The wind tunnel covers the plurality of radiator fins and the cooling fan. The electronic circuit includes a plurality of rectifiers and a plurality of input terminals. The plurality of rectifiers are provided on a side of the heat-sink base opposite to the plurality of radiator fins and are arranged side by side in a longitudinal direction of the heat-sink base. The plurality of input terminals are connected to the plurality of rectifiers with band-shaped conductors and are provided on a side of the plurality of rectifiers opposite to the heat sink.

Abstract: A housing for a chip arrangement is provided, the housing including: a carrier including a first carrier side configured to receive a chip arrangement, a second carrier side and one or more through-holes extending from the first carrier side to the second carrier side; at least one electrical connector inserted through a through-hole, the at least one electrical connector arranged to extend from the second carrier side to the first carrier side; wherein the at least one electrical connector may include: a first portion on the first carrier side; a second portion on the first carrier side, wherein the first portion is configured to extend away from the first carrier side at an angle to the second portion; and a third portion on the second carrier side, wherein the third portion is configured to extend away from the second carrier side at an angle to the second portion.

Abstract: The present disclosure relates to a film or a composite that provides excellent heat removal capabilities and improved chemical stability and methods of forming the film and the composite. The film can be a layer of a nanomaterial. The composite can include a nanomaterial and a thermal interface material (TIM). The methods generally involve dispersing the nanomaterial in a carrier when forming the film or the composite.

Abstract: According to one embodiment of the invention, an apparatus comprises a heat dissipation unit, such as a heat sink, that encases wireless logic in order to completely surround such logic. When adapted as a wireless network device, a casing further encases the heat dissipation unit. The casing includes a plurality of slots that are aligned with heat-radiating elements positioned around the periphery of the heat dissipation unit to allow for cooling by convection.

Abstract: Disclosed is a member that contains electronic components. Using the member, when, for example, a vehicle or the like carrying electronic components such as an inverter collides with an external object, there is prevented damage to a housing containing the electronic components, which would otherwise occur due to interfering objects. Furthermore, the disclosed member can dissipate heat produced by the contained electronic components. The member includes a housing for containing electronic components, a cooling passage that is provided inside the housing and uses a refrigerant to cool the electronic components, and a heat dissipation part that dissipates heat from the cooling passage and prevents the housing from being damaged by impacts from external interfering objects.

Abstract: An electronic apparatus having a heat-dissipating structure capable of efficiently releasing heat generated at electronic components to the outside, superior in work efficiency at the time of assembly, and capable of avoiding misalignment in the electronic components.

Abstract: In one implementation, an electronic device includes a first body portion, a second body portion movably coupled to the first body portion, a heat source, and a thermal conductor in thermal communication with the heat source. The heat source is disposed within one of the first body portion or the second body portion. The thermal conductor has a first end portion, a second end portion, and a flexible portion between the first end portion and the second end portion. The first end portion of the thermal conductor is disposed within the first body portion. The second end portion of the thermal conductor is disposed within the second body portion.

Abstract: A cage assembly is provided for receiving a pluggable module. The cage assembly includes a cage having a front end, a mounting side, and an internal compartment. The front end is open to the internal compartment of the cage. The internal compartment is configured to receive the pluggable module therein through the front end. A heat sink is mounted to the mounting side of the cage. The heat sink has a module side that is configured to thermally communicate with the pluggable module. An electromagnetic interference (EMI) gasket extends along at least a portion of an interface between the mounting side of the cage and the module side of the heat sink.

Abstract: A semiconductor recording medium recording and/or reproducing apparatus includes: a medium holder that has a medium housing unit in which a semiconductor recording medium is detachably housed; an exterior case that has a medium entrance through which the semiconductor recording medium is inserted and ejected, and in which the medium holder is housed in a state where the medium housing unit is opposed to the medium entrance; an openable and closeable cover that opens and closes the medium entrance; a heat sink that is contactable with the semiconductor recording medium housed in the medium housing unit; and a heat sink moving unit that moves the heat sink in cooperation with an opening and closing operation of the openable and closeable cover.

Abstract: A portable computer having a heat dissipation structure includes a main body in which a heat generation device generating heat is arranged, wherein a sealed space that is sealed to prevent intrusion of external water and an exposed space into which external air is taken, a heat transfer unit connected to the heat generation device and extended to the exposed space in the sealing space of the main body and transferring the heat of the heat generation device to the exposed space, and a heat dissipation unit arranged in the exposed space of the main body and dissipating the heat transferred by the heat transfer unit. The intrusion of water into the main body may be prevented and simultaneously the heat generated by the heat generation devices may be efficiently dissipated. Thus, the portable computer may be used even in an inferior outdoor environment during rain.

Abstract: Power switching circuitry has a heat absorbing structure, and a heat conductive substrate having power switching components on a first surface and a second surface adjacent to the heat absorbing structure. Electrically conductive members, comprising first and second members, are on the first surface and extend along a first axis orthogonal to the heat conductive substrate. The second portion is more remote from the heat conductive substrate, and has a smaller cross-sectional area than, the first portion to define a shoulder region orthogonal to the first axis. A circuit board is located on the shoulder regions, with the second portions extending through the circuit board. An urging mechanism urges the circuit board against the shoulder regions, whereby the electrically conductive members provide a current path between the heat conductive substrate and the circuit board, and urge the heat conductive substrate into thermal contact with the heat absorbing structure.

Abstract: A heat dissipation device for a notebook computer includes a heat dissipating plate and a bracket for supporting the heat dissipating plate. When the notebook computer is positioned on the heat dissipating plate, the notebook computer tends to slip towards the first side closest to the user rather than the second side away from the user, as the bracket makes the first side lower than the second side. Because a protrusion is provided on the bracket close to the first side, the tendency of slipping towards the first side is stopped by the protrusion, preventing the notebook from slipping off the heat dissipation device. This ensures the security of the notebook computer when it is used with the heat dissipation device.

Abstract: An AC photovoltaic module includes a DC photovoltaic module for converting solar energy to DC electrical power, and an inverter for converting DC electrical power to AC electrical power, the inverter being adapted for connection to a frame portion of the module and being sized and configured, and provided with arrangements of electrical components thereof, to dispense heat from the inverter, whereby to prolong operational life and reliability of the inverter.

Abstract: Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment.

Abstract: Some embodiments are directed to cooling frames for mezzanine cards, mezzanine card assemblies and circuit card assemblies. A recessed cooling frame may be used to dissipate heat generated by components of a mezzanine card. The cooling frame may be directly coupled to a host card or host card cooling frame, thereby reducing the number of interfaces and reducing the thermal resistance of the heat dissipation pathway. The cooling frames of some embodiments may provide more efficient heat dissipation and thereby allow higher performance mezzanine cards to be used. Some embodiments provide a mezzanine card assembly that conforms to the mechanical envelope dimensions of the VITA 20, VITA 42 or VITA 61 specifications.

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

Abstract: A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion and an extending portion. The heat-conducting portion is adhered between the heat-generating structure and the heat dissipation structure. The heat generated by the heat-generating structure is transmitted to the heat dissipation structure through the heat-conducting portion. The extending portion is connected to the heat-conducting portion and exposed to the heat-generating structure and the heat dissipation structure.

Abstract: A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

Abstract: A heatsink may include an area in thermal contact with a semiconductor microchip surface and a first trench of a first depth. The first trench may be substantially continuous around the area. A first substance, such as ferrite, may be positioned in the first trench to attenuate electromagnetic interference. A second trench having a second depth may be formed around and further from the area than the first trench. A second substance may be positioned in the second trench.

Abstract: An automated microscope apparatus, comprises an outer housing having an external wall; optionally but preferably an internal wall in said housing, and configured to form a first compartment and a separate second compartment in said outer housing; a microscope assembly in said housing, preferably in said first compartment; and a microprocessor in said housing, preferably in said second compartment; and optionally but preferably a heat sink mounted on said housing external wall, preferably adjacent said second compartment, with said microprocessor thermally coupled to said heat sink and operatively associated with said microscope assembly.

Abstract: A heat dissipation apparatus includes a shaped and resilient connecting plate, and a first heat-dissipating plate and a second heat-dissipating plate clamping down on a storage device to dissipate heat.

Abstract: A portable electronic device includes a housing, a radiating assembly, a display, a battery, and a heat sink assembly. The housing includes a front portion and a back portion opposite to the front portion. Both the radiating assembly, the display, the battery, and heat sink assembly are received in the housing. The heat sink assembly is a semiconductor cooling plate, and dissipates heat from the radiating assembly out of the housing.

Abstract: An electronic device comprises a cooler comprises a plurality of first locking members, a backboard defining pluralities of first and second positioning holes, and a circuit board. The backboard is attached to the cooler through the first locking members engaged with the second positioning holes. A first mounting member and a second mounting member are adapted to receive the heat generating component. The first mounting member defines a plurality of locking holes. The first positioning holes are among the second positioning holes. The second mounting member receives the heat generating component, the circuit board is between the second mounting member and the backboard, the first mounting member is secured to the circuit board; when the first mounting member receives the heat generating component, the circuit board is between the first mounting member and the backboard, the first mounting member is secured to the backboard.

Abstract: An exemplary embodiment of an electronic device includes a cover including a first hole, and a heat dissipating assembly. The heat dissipating assembly includes a movable board including a second hole and slidably connected to the cover, and a heat magnifying device received inside the cover and adjacent to a heat element. The heat magnifying device includes a moving end secured with the movable board. When the heat element is maintained room temperature, the first hole and the second hole are staggered from each other to seal the cover. When heat generated by the heat element heats the heat magnifying device and causes the moving end of the heat magnifying device to move under thermal expansion and drive the movable board to slide relatively to the cover, and the first hole of the cover and the second hole of the movable board are communicated with each other.

Abstract: An automotive power converter may include a cold plate, a printed circuit board spaced away from the cold plate and including at least one heat generating electrical component attached thereto, and another printed circuit board disposed between the cold plate and the printed circuit board spaced away from the cold plate. The converter may further include at least one thermally conductive element configured to provide a thermally conductive path from the at least one heat generating electrical component to the cold plate. The at least one thermally conductive element may pass through the printed circuit boards.

Abstract: In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.

Abstract: An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract: The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The laptop computer can include a uni-body top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing.

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: The present invention relates to a heat radiating structure in all-in-one computers, comprising a pedestal, mainframe module and back cover. The mainframe module is contained in a containing stand behind the pedestal, and a motherboard is included in the containing space in front of a mainframe module base. The motherboard's CPU sticks through a radiator to a heat radiating aluminum plate in the rear of the containing space, while the hard disk drive is close to the heat radiating aluminum plate, and the pedestal is covered by the back cover on the back. With the heat radiating aluminum plate to quickly conduct heat and its multiple heat radiating holes, heat dispersing holes behind the containing stand and hollowed grooves on the back cover to convect hot air.

Abstract: A mobile device includes a housing having a plurality of surfaces. A processor is located within the housing. The processor heats a portion of one or more of the surfaces of the housing. A temperature sensor detects a temperature of the portion of the surface. The rate of energy consumption by the processor is adjusted based on the temperature of the portion of the surface of the housing.

Abstract: A heat sink includes a contact portion, a first support rib, a second support rib, a third support rib and a fourth support rib radially extended from the contact portion, and a plurality of parallel fins radially extended from the first support rib, the second support rib, the third support rib and the fourth support rib between two adjacent support ribs. The contact portion contacts with a first heat source. A distance from the contact portion to an edge of the plurality of parallel fins between the first support rib and the second support rib is a first distance. A distance from the contact portion to an edge of the plurality of parallel fins between the third support rib and the fourth support rib is a second distance. The first distance is less than the second distance.

Abstract: Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufacturing the heat exchanger, a semiconductor device wherein warping (bending) of an intervening member and a frame is suppressed, and a method for manufacturing the semiconductor device are also disclosed. Specifically disclosed is a heat exchanger wherein a fin member provided with a plurality of fins forming flow channels for a refrigerant is arranged within a frame which forms the outer casing. The frame has a first frame member (a first wall portion) to which insulating plates (intervening members) interposed between the frame and heat-generating bodies (semiconductor elements are welded. The insulating plates (intervening members) have a linear expansion coefficient different from that of the frame.

Abstract: An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

Abstract: A heat dissipating module includes a heat sink and an aerofoil deflector above the heat sink. The heat sink has an upper surface corresponding to the camber of the deflector, to increase the speed and efficiency of a cooling airflow passing therethrough, the airflow generated by a fan.

Abstract: An electronic unit having a housing including a heat generating first component, a heat generating second component and a cooling system disposed in the housing, wherein during operation of the unit, the first and second components are cooled by the cooling system, and the first component connects to the second component via a heat-conducting connection such that a lower temperature of the first component and a higher temperature of the second component converge.

Abstract: An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat sink configured to be thermally coupled to at least one cabinet. When the at least one cabinet is thermally coupled to the at least one heat sink, the at least one heat sink draws heat from the at least one cabinet.

Abstract: An electronic device includes a motherboard and a heat dissipating plate. The motherboard includes a base. The base includes a number of ports and an electronic element. The heat dissipating plate includes a substrate and a number of fasteners extending out from the substrate for engaging with the number of ports of the motherboard. The substrate defines a bulging cavity for engaging with and dissipating heat from the electronic element.

Abstract: An enclosure is provided. A housing (120) can have one or more walls (130). At least one of the one or more walls (130) can include a thermally conductive, carbonaceous member (100). The thermally conductive, carbonaceous member (100) can be partially or completely encapsulated within one or more electrically non-conductive materials.

Abstract: An auxiliary device for conductively removing the heat produced by one or more components on an electronic card includes a heat sink covering all or part of the card. The device includes at least a first heat-conducting element mounted to absorb the heat produced by the one or more components, a movable second heat-conducting element, a heat pipe connecting the first element with the second element, and clamping means designed to press the movable second element against a cold wall.

Abstract: The invention relates to an electrical connector assembly. The electrical connector assembly includes a main circuit board having a through hole, a processor, and an auxiliary circuit board. The processor includes a chip and a substrate. The chip is electrically connected to the substrate and located in the through hole. The substrate is at least partially located in the through hole. The auxiliary circuit board has a transitional connecting surface. A first conducting region and a second conducting region electrically connected to each other are disposed on the transitional connecting surface. The first conducting region is electrically connected to the substrate, and the second conducting region is electrically connected to the main circuit board.

Abstract: A cold plate has blades arranged to be interleaved with memory modules or memory module sockets. A liquid cooling loop is thermally coupled to the blades of the cold plate.

Abstract: A ruggedized communications data center is provided. The ruggedized communications data center includes a ruggedized enclosure having a main body. The ruggedized enclosure includes a secured sealed access cover affixed to the main body, a backplane support structure within the main body, and a backplane coupled to the backplane support structure within the main body. The backplane includes a plurality of connectors to connect with a plurality of cards including at least one connector to connect to a power supply card, at least one connector to connect to a switch matrix card, and at least one connector to connect to a module card. The backplane also includes a first plurality of electrical connections to electrically connect a power supply card with a switch matrix card and a module card and a second plurality of electrical connections to electrically connect a switch matrix card with a module card.

Abstract: A cooling structure for electronic equipment includes a plurality of cooling structural members on a same substrate. In the cooling structural members, a plurality of heating components having a same shape are connected to one thermal diffusion part through a first thermal conductive member. Each of thermal diffusion parts of the plurality of cooling structural members is connected to one heat dissipator through a second thermal conductive member.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.