Abstract: A cooling circulation system of a server includes a cabinet assembly, a plurality of first fan modules, a plurality of second fan modules, and two air guide hoods. The first fan modules and the second fan modules are disposed on the cabinet assembly. The first fan modules blow a first airflow towards a first direction, and the second fan modules blow a second airflow towards a second direction. The air guide hoods are respectively installed on two ends of the cabinet assembly. The first airflow and the second airflow join each other through the air guide hoods, so as to form a cooling circulation loop inside the cabinet assembly.

Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct.

Abstract: A fan assembly includes a housing; a plurality of fan units mounted in the housing; and a flex printed circuit board (PCB) having a first portion, the first portion of the flex PCB electrically connected to each of the plurality of fan units, the flex PCB having a second portion, the second portion of the flex PCB including a printed circuit assembly (PCA), the PCA having mounted thereon a connector to connect to a PCA disposed within a chassis.

Abstract: A modular computing system for a data center includes one or more data center modules including rack-mounted computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. One or more air handling modules are coupled to the data center modules. The data center module may include two pre-fabricated portions, each portion including a row of racks of computer systems. The two computing module portions of the data center module may combine to form a computing space when coupled to one another.

Abstract: A cooling system including several air jet elements, a heat exchange assembly and a frame is provided. The cooling system is applied to a rack server configured to receive a plurality of electronic assemblies. The air jet elements receive a high-pressure air and convert the high-pressure air into a low-temperature air. The heat exchange assembly is disposed in the frame and is connected to the air jet elements so as to perform a heat exchange between the low-temperature air and a high-temperature air generated by the rack server so as to lower the temperature of the high-temperature air. The frame is applied to accommodate the heat exchange assembly.

Abstract: A container data center includes a container and a number of information processing systems arranged in two rows. The container includes a top wall, a bottom wall opposite to the top wall, and opposite sidewalls connected between the top wall, the bottom wall, and a raised floor supporting the information processing systems. Each of the sidewalls defines an outlet and an intake respectively to above and below the raised floor. Two groups of the fans respectively are mounted in the air outtake holes of the container. Two air ducts are respectively arranged between the sidewalls and the rows of the data processing systems. Air outside the container flows into the container through the intake to cool the information processing systems, and is guided to the corresponding outlets by the air ducts to be exhausted out of the container by the fans.

Abstract: A system and method of reducing consumption of electricity used to cool electronic computer data center, networking, and telecommunications equipment, and to reduce the incidence of thermal failure of electronic components, includes provision of one or more partitions to reduce the volume of the cooled environment supplying coldest possible cooled air from air conditioning systems to a chamber adjacent to the cooling air intake side of electronic components, preventing dilution of the supplied cooling airflow by warmer air from outside of the reduced volume environment, and controlling the delivery of cooling air flow through the reduced volume of the cooled environment.

Abstract: A container data center includes a container, servers, a monitoring device, a cooling system, and a controller. The container is divided into first regions and a second region which are separated from each other. The servers are received in the respective first regions. The monitoring device is for monitoring the servers and received in the second region. The cooling system includes a first generator for generating a first cool airflow, a second generator for generating a second cool airflow for the second region, an air pipe connecting the first regions and directing the first cool airflow to the first regions, and valves arranged in the air pipe. Each valve is positioned between each two adjacent first regions. The controller controls the first generator, the valves and the second generator.

Abstract: A container data center includes a mobile container and a number of servers. The mobile container includes a main room receiving the servers, and an air shower room isolated from the main room. The air shower room includes an outer door, an inner door, a blower, and a dust absorber. The outer door connects the air shower room and is used to separate the air shower room from the outer environment. The inner door connects the air shower room and is used to separate the air shower room from the main room. The blower and the dust absorber are secured on two opposite walls of the air shower room respectively, the blower being configured for blowing air towards the dust absorber.

Abstract: A mobile computing apparatus includes a shell, a circuit board, a first heat-dissipation module, a centrifugal fan for exhaust, and a centrifugal fan for convection. The shell has a first through hole. The circuit board is disposed on the shell, and has a first heat-generation device. The first heat-dissipation module has a first heat-absorption end and a first heat-dissipation end, and the first heat-absorption end thermally contacts with the first heat-generation device. The centrifugal fan for exhaust has a first gas outlet, and the first heat-dissipation end is located between the first gas outlet and the first through hole, so that the centrifugal fan for exhaust exhausts to an outside of the shell. The centrifugal fan for convection is configured in the shell, and exhausts to an inside of the shell. Therefore, gas flow circulation occurs in the shell, so that the mobile computing apparatus has a desirable heat-dissipation effect.

Abstract: An enclosure includes a housing, partition plates received in the housing, hard disk drives fixed between the partition plates, a cover fixed to the housing, a printed circuit board received in the housing and a fan assembly fixed within the housing. The housing includes a bottom plate and a pair of side plates. Each side plate has a guiding device mounted thereon. The guiding device includes a supporting element fixed to the side plate, a fixing element fixed with the printed circuit board, and a rod pivotably connecting the fixing element with the supporting element. The partition plates each have a hook, and the printed circuit board defines multiple slots corresponding to the hooks. The printed circuit board can be driven towards the partition plates by the fixing element around the supporting element so that the slots are aligned and locked with the hooks.

Abstract: An electronic assembly includes an electronic device and a solar shield coupled to the electronic device. The solar shield has an attachment portion which attaches to the electronic device, and a shield portion coupled to the attachment portion. The shield portion prevents direct sunlight from substantially reaching a section of the electronic device. The shield portion defines (i) at least a portion of an air intake, (ii) at least a portion of an air exhaust, and (iii) at least a portion of an air passageway which extends from the air intake to the air exhaust. The air passageway overlies the section of the electronic device enabling ambient air adjacent the air intake to form natural convective airflow into the air intake and out the air exhaust through the air passageway to carry away heat from the section of the electronic device during electronic operation of the electronic device.

Abstract: A system includes a rack, one or more computer systems mounted in the rack, and two or more alternating current (AC) fans mounted in the rack. The AC fans move air through the computer systems mounted in the rack. At least one of the AC fans can move air through at least two of the computer systems mounted in the rack.

Abstract: A data center includes a row of one or more racks. Computer systems are mounted in the racks. A cold aisle is on a first side of the rack row and a hot aisle is on the second side of the rack row. An air handling system moves air from the cold aisle on the first side of the row of racks through computer systems in at least one of the racks and exhausts air from the computer systems into the hot aisle on the second side of the row of racks. The computer systems include input/output connectors, power input connectors, and power supply air inlets on the first side (cold-aisle side) of the row. One or more power rack power distribution units are provided on the first side (cold-aisle side) of the row.

Abstract: An electronic device includes a bottom plate, a circuit board, a fan, and an airflow guide member. The circuit board is fixed to the bottom plate. The fan is arranged at the front of the circuit board. The airflow guide member is arranged between the fan and the circuit board. The airflow guide member includes an airflow guide wall for guiding most of airflow upwards to the top of the circuit board. A number of slots is defined in the airflow guide wall, for allowing only a minimum portion of the airflow to flow underneath the circuit board.

Abstract: An electronic device includes: a chassis for housing an electronic unit; and a hold member capable of holding to a fan unit blowing air toward the electronic unit and attachable to and detachable from a plurality of positions of the chassis.

Abstract: An electronic equipment cabinet includes a chassis and a fan coupled thereto. The fan is configured to move an airstream through the chassis. A plenum is coupled to the chassis and has a first opening in a first side located to receive the airstream, and a second opening in an adjacent second side. An airflow diverter is located within the plenum. The airflow diverter has a surface oriented to redirect the airstream between the first opening and the second opening.

Abstract: In an electric connection box, a heat insulation wall is vertically extended in a case. This forms, between the heat insulation wall and the inner wall of the case, an ascending flow path where air can ascend and a descending flow path where air can descend. An upper communication opening and a lower communication opening that connect between the ascending flow path and the descending flow path are arranged at the upper end and the lower end, respectively, of the heat insulation wall. A relay is placed in the ascending flow path. Among the regions of the case, a region forming the descending flow path is provided with a heat radiation wall section for releasing heat of air in the descending flow path to the outside of the case.

Abstract: A computer system includes an enclosure, a printed circuit board, and an airflow guiding duct. The enclosure includes a bottom plate. The printed circuit board is mounted on the bottom plate. The printed circuit board includes a first heat generating element and a second heat generating element. The airflow guiding duct includes a top wall, a first sidewall, a second sidewall, a first mounting wall, and a second mounting wall. An input opening is surrounded by the top wall and the first and second sidewalls. A first output opening corresponds to the first heat generating element, and is surrounded by the top wall and the first and second mounting walls. A second output opening is defined in the second sidewall corresponding to the second heat generating element. An obtuse angle is defined between the second sidewall and the second mounting wall.

Abstract: An exemplary server system includes a server cabinet defining a space therein; a number of racks arranged in the space, a number of servers mounted in the racks, and a heat dissipation apparatus arranged under the racks. A channel is defined between the racks. Each of the servers includes a drawing fan. The heat dissipation apparatus includes a fan module and two heat exchangers respectively arranged at opposite sides of the fan module. The fan module is aligned with the channel for generating upward a flow of cooling air upward to the channel. During operation of the server system, the cooling air is drawn across the servers by the drawing fans to evacuate heat from the servers and becomes heated air, and the heated air flows down to the heat exchangers where the heat is dissipated from the heated air such that the heated air become the cooling air again.

Abstract: A server assembly includes a server, a number of first air ducts, and a number of second air ducts. A number of intakes and outlets are defined in a top of a chassis of the server. Each of the first and second ducts includes a hollow main body, and a connecting portion extending from a bottom of the main body. A first opening is defined in an end of the main body of each of the first and second ducts. A second opening is defined in each of the connecting portions of each of the first and second ducts. Outside air flows through the first air ducts, thereby flowing into the chassis to be heated, thereby cooling the server. The heated air is expelled out of the chassis through the second air ducts.

Abstract: In thermal management systems that employ EHD devices to motivate flow of air between ventilated boundary portions of an enclosure, it can be desirable to have some heat transfer surfaces participate in electrohydrodynamic acceleration of fluid flow while providing additional heat transfer surfaces that may not. In some embodiments, both collector electrodes and additional heat transfer surfaces are thermally coupled into a heat transfer path. Collector electrodes then contribute both to flow of cooling air and to heat transfer to the air flow so motivated. The collector electrodes and additional heat transfer surfaces may be parts of a unitary, or thermally coupled, structure that is introduced into a flow path at multiple positions therealong. In some embodiments, the collector electrodes and additional heat transfer surfaces may be proximate each other along the flow path. In some embodiments, the collector electrodes and additional heat transfer surfaces may be separate structures.

Abstract: A cooling system includes a fan and an air conducting cover. The air conducting cover includes a first airflow channel and an opposite second airflow channel. The first airflow channel includes a first air inlet and an opposite first air outlet, the second airflow channel includes a second air inlet and an opposite second air outlet. The first air inlet and the second air inlet are both aligned with the fan.

Abstract: A rackable server system includes a rack, a fan assembly mounted to a rear of the rack, and a number of server units slidably mounted in the rack. The fan assembly includes a frame defining a number of air passages, a number of door plates mounted to the frame and correspondingly arranged in the passages, and a number of fans fixed to a rear of the frame. The air passages are correspondingly aligned with the fans. The server units are correspondingly aligned with the air passages and resist against the door plates to pivot the door plates, thereby uncovering the air passages.

Abstract: According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.

Abstract: In order to increase the flexibility of the positioning of a stacked computer system within a data center, a removable fan unit is positioned within the computer system. The removable fan unit includes a fan housing that supports a fan electrically connected to a connector extending from a side of the fan housing. The connector of the removable fan unit may be electrically connected to a computer system-side connector in a first orientation to move air through the computer system in a first direction. The connector or another connector of the removable fan unit may be electrically connected to another or the same computer system-side connector in a second orientation to move air through the computer system in a second direction.

Abstract: Various technologies for cooling a computer system are described. In accordance with one described embodiment, a fan assembly system for a computer comprises a fan operable for cooling the computer and a fan duct coupled with the fan. The fan duct comprises a number of attaching features. The fan is suspended at least one component of the computer. Moreover, the suspended fan enables air to flow between the fan and the component (e.g., a heatsink) to facilitate cooling of the component.

Abstract: A container data center includes a container and a number of information processing systems arranged in two rows. The container includes a top wall, a bottom wall opposite to the top wall, and opposite sidewalls connected between the top wall, the bottom wall, and a raised floor supporting the information processing systems. Each of the sidewalls defines an outlet and an intake respectively to above and below the raised floor. Two groups of the fans respectively are mounted in the air outtake holes of the container. Two air ducts are respectively arranged between the sidewalls and the rows of the data processing systems. Air outside the container flows into the container through the intake to cool the information processing systems, and is guided to the corresponding outlets by the air ducts to be exhausted out of the container by the fans.

Abstract: An electronic apparatus includes the following: a heat dissipation chamber that is formed by liquid tightly separating the inside of a main unit case with a partition, has an inlet air vent and an outlet air vent in the partition, and includes a heat dissipation portion; a cooling fan that is located in the heat dissipation chamber; an inlet that is provided in the main unit case to introduce outside air into the heat dissipation chamber through the inlet air vent; and an outlet that is provided in the main unit case to exhaust an air flow sent from the cooling fan to the outside through the outlet air vent. An air channel that extends from the inlet air vent through a side wall of the main unit case to communicate the heat dissipation chamber with the inlet is liquid tightly sealed from the internal space of the main unit case with a sealing wall.

Abstract: A server including a rack, at least one chassis, a plurality of electronic modules, and a cable module is provided. The rack has an opening. The chassis is movably disposed in the rack along a first axis, and moves in and out the rack through the opening. The electronic modules are vertically and detachably disposed in the chassis. A plurality of channels parallel to a second axis and each of the channels is disposed between two adjacent electronic modules, and the first axis is perpendicular to the second axis. The cable module is disposed at a side of the chassis. The cable module is connected to at least one of the electronic modules. When the chassis is moved out from the rack, the electronic module connected to the cable module is next to the opening of the rack.

Abstract: An enclosure includes a bracket with a bottom wall, a circuit board mounted to the bottom wall but spaced from the bottom wall, an electronic element mounted to the circuit board, a fan arranged on the bottom wall and facing the space between the circuit board and the bottom wall, and a guiding member attached to the circuit board to block the space between the circuit board and the bottom wall.

Abstract: An air guiding device is mounted on a main board. The air guiding device and the main board cooperatively form an air passage therebetween for allowing cooling air to pass therethrough. The air passage includes an inlet at a first end of the air guiding device, a first outlet at an opposite second end of the air guiding device, and a second outlet. The air guiding device includes a top wall, two sidewalls, and a shielding assembly. The top wall includes the second outlet therein at an intermediate portion thereof. The second outlet opens toward the second end. The sidewalls extend downwardly from opposite sides of the top wall. The shielding assembly is positioned on the top wall for regulating a size of the second outlet.

Abstract: Embodiments of remote exhaust for dissipating heat in computers or other electronic devices are disclosed. An exemplary method may include coupling branch lines to each of a plurality of fan-less chassis in the rack system. The method may also include coupling the branch lines to at least one main line. The method may also include connecting the main line to at least one exhaust pump to remove heat generated in each of the plurality of fan-less chassis to a physically remote environment.

Abstract: The invention provides modular air management devices for directing or diverting air flow within an equipment cabinet or enclosure to provide adequate cooling for non-“front to back” breathing electronic devices, and include a scoop assembly, a tray assembly, a vertical mount assembly, and a shroud assembly. The air management devices are designed to direct air flow to and from “side to side” breathing and “side inlet, rear exhaust” electronic equipment. The assemblies may be mounted inside or outside enclosure rails and may be augmented with fan assemblies.

Abstract: A cooling assembly for a dual electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of a pair of electronic image assemblies and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the electronic image assembly (optionally a backlight). The cooling assembly can be used with any type of electronic assembly for producing an image. Some embodiments use cross-flow heat exchangers comprised of corrugated plastic.

Abstract: A server assembly includes a first server and a first airflow guiding pipe. The first server comprises a front wall. An input hole is defined in the front wall. A first input opening and a first output opening are defined in the first airflow duct. The first output opening corresponds to the input hole so as to guide airflow into the inner of the first server to dissipate heat generated by the first server. The first airflow guiding pipe is connected to the first input opening of the first airflow duct, the first airflow guiding pipe is configured to receive and guide airflow into the first airflow duct.

Abstract: A cooling configuration is provided for chassis-mounted electronics boards. In one embodiment, the chassis comprises a housing and at least two electronics boards. The electronics boards may comprise communication boards having a plurality of ports. Cooling air spaces are defined above and below each board, permitting cooling air to be drawn over both sides of each board. Baffles may be provided at both sides of the boards for controlling the flow of air through the various air spaces, such as baffles extending down from a top of the housing or up from a bottom of the housing, or baffles located between the boards.

Abstract: The present invention pertains to a cage for thermal management and housing an electric module comprising a cage housing and having a top, bottom and side walls joined to form an interior cavity and the side walls defining a width of the interior cavity. The top wall may have an air inlet port and an air outlet port and the air inlet and outlet ports spaced apart by a length. The length may be most or all of the width, so that air entering the inlet port will travel over a portion of a side of an electronic module mounted in the cavity prior to exiting the outlet port.

Abstract: A container data center includes a mobile container, a support plate installed in the container adjacent and parallel to a bottom wall of the container. Also included are two server systems arranged on the support plate in two parallel rows and a number of brackets installed between the bottom wall and the support plate. Additionally, a blower is installed between the bottom wall and the support plate, and two heat exchangers are provided at opposite sides of the blower. Each of the brackets comprises a number of columns. Each of the columns defines an air channel facing the blower.

Abstract: In a storage device accommodating a plurality of memory devices in a general-purpose chassis provided from both of the surface sides thereof, a cooling device is provided on the front of the memory devices. This cooling device is allowed to freely move to leave available the area in front of the memory devices, thereby enabling maintenance and replacement of the memory devices from the both surface sides of the chassis. With such a storage device of a type using a general-purpose chassis, and inserting therein a plurality of memory devices from the both surface sides thereof, even if a cooling device is located on the front of the chassis, the memory devices can be subjected to maintenance and replacement.

Abstract: According to one embodiment of the present invention, a system is provided having a foundation that is modular in design. Each module has transport structures. Floor sections can be provided. A bearing plate can be provided on top of isolators supported on a foundation. A skeleton can also be constructed, which can support a heat exchanger assembly, which includes a plenum, a heat exchanger and air movers. A ducting assembly with boxes is supported by the skeleton. An equipment rack, such as a server rack, can be supported on the bearing plate. Any number of systems can be attached end to end, back to back, and/or vertically to form a system of a desired dimension. The entire system, once assembled and wired, can easily be moved with a transport assembly. The system can also be expanded in size and capacity as the operational needs increase.

Abstract: In accordance with at least some embodiments, a computer system includes an enclosure (202) configured to hold at least one resource unit (204). The computer system also comprises a plurality of mixed-flow ducted fans units (400) selectively attached to the enclosure (202). Each mixed-flow ducted fan unit (400) comprises a duct (102) having an intake diameter, a bellmouth diameter, and an exhaust diameter. The bellmouth diameter is less than the intake diameter and the exhaust diameter.

Abstract: The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems having parallel cooling air duct channels dedicated to providing cooling air for a converter heat sink and an inverter heat sink, respectively. In particular, a first duct channel through an inverter duct and a converter duct is dedicated to providing cooling air to the converter heat sink without cooling the inverter heat sink, whereas a second duct channel through the inverter duct and the converter duct is dedicated to providing cooling air to the inverter heat sink without cooling the converter heat sink.

Abstract: The present disclosure is generally directed to efficiently cooling converter and inverter components of a drive system. Present techniques relate to a motor drive duct system that facilitates efficient cooling and access to motor drive components. The motor drive duct system includes duct channel paths that are parallel and adjacent to one another. The duct system includes a converter section that houses a converter heat sink, an inverter section that houses an inverter heat sink, an exhaust section, and an air inlet section. The converter section and the inverter section are configured to be attached and detached from each other at end sections that are angled to receive one another. Further, the inverter section, converter section, and air inlet section are configured to roll into and out of a cabinet, which facilitates access to field wiring.

Abstract: A computer system may include a chassis defining a front and a rear. The chassis may include a vertically oriented midplane disposed therein, the midplane including a plurality of front module slots for receiving front electronic modules from the front of the chassis, and a plurality of rear module slots for receiving rear electronic modules from the rear of the chassis. A cooling system may be provided within the chassis and may generate an upwardly-directed front air flow within the chassis directed at selected ones of the front electronic modules and an upwardly-directed rear air flow within the chassis directed at selected ones of the rear electronic modules. The front air flow is separate from and independent of the rear air flow. The selected front and rear electronic modules may be disposed in the chassis so as to separate the front air flow into a plurality of substantially equal front air streams and the rear air flow into a plurality of substantially equal rear air streams, respectively.

Abstract: A reversible air flow fan system is described. A fan tray assembly is coupled with a chassis and a removable fan and bracket assembly that is oriented in a first direction. This removable fan and bracket assembly is configured to be removable from the fan tray assembly and being recoupled with the fan tray assembly in a second direction opposite the first direction. An air duct is coupled with and enables the exchange of air between the removable fan and bracket assembly and a first surface of the chassis. A sensor coupled with the fan tray assembly is configured for coupling with at least one bracket of the removable fan and bracket assembly when the removable fan and bracket assembly is oriented in the first direction.

Abstract: A rack server center includes servers, an air conditioning system for bringing cooling air to the rack server, and an air exhaust system located outside the rack server. The air exhaust system includes an exhaust fan, branch pipes, controlling valves, and a main pipe. Each branch pipe is connected with a corresponding server via a corresponding controlling valve. The branch pipes are connected with an inlet of the exhaust fan. The main pipe is connected with an outlet of the exhaust fan. The exhaust fan is configured for exhausting heated air generated by the servers out of the rack server via the branch pipes. Each server is configured for controlling the amount of the heated air entering a corresponding branch pipe by controlling the controlling valve connected with the corresponding branch pipe.

Abstract: A server cabinet adapted for receiving servers therein includes a top plate, a bottom plate opposite to the top plate, a left side plate and a right side plate connecting with the top and bottom plates respectively, and a front side plate disposed between the top and bottom plates. The front side plate defines through holes therein. A total area of the through holes in an upper half portion of the front side plate is different from a total area of the through holes in a lower half portion of the front side plate. The front side plate is rotatable in a plane defined by the front side plate.

Abstract: A system for thermal management of electronic equipment. The system can include a cabinet forming an enclosure for the electronic equipment, wherein the cabinet has an inlet and an outlet. Additionally, the system can include a supply channel connected with the cabinet inlet, wherein the cabinet is positioned on a floor and the supply channel is under the floor; an exhaust channel, wherein at least a portion of the exhaust channel is in proximity to the cabinet outlet. Furthermore, the system can include a plurality of flexible barriers forming a thermal curtain for directing air exiting the outlet of the cabinet to the exhaust channel, and wherein a position of the barriers is adjustable.

Abstract: An airflow duct for guiding air toward two heat sink apparatuses in computer includes a duct body fixed in a computer case, a first air guide channel and a second air guide channel defined in the duct body. The duct body has an air inlet and an air outlet. The first air guide channel forms a first air outlet, which opens towards a first heat sink apparatus in the computer case. The second air guide channel forms a second air outlet, which opens towards a second heat sink apparatus in the computer case. The first and second air guide channels guide air from the air inlet to the first and second heat sink apparatuses, through the first and second air outlet openings to dissipate heat respectively from the first and second heat sink apparatuses. A first air guide channel height is greater than that of the second air guide channel.