Abstract: A hybrid apparatus for charging electric vehicles and mining cryptocurrency is provided. The apparatus may comprise an electric power input associated with a rated maximum power capacity, an electric vehicle charger, a cryptocurrency miner and a power coordinator. The electric vehicle charger may have at least one vehicle power outlet and a maximum charger power draw from the electric power input. The cryptocurrency miner may have multiple cryptocurrency mining computers and a maximum miner power draw from the electric power input. Each mining computer may have an adjustable intensity level. The power coordinator may be configured to determine mining power availability within the rated maximum power capacity after prioritizing power demand by the electric vehicle charger, and to direct the cryptocurrency miner to continue mining cryptocurrency by adjusting the intensity levels of the mining computers such that the cryptocurrency miner consumes not more than the mining power availability.

Abstract: A system (20) for controlling an air conditioner (12) includes a plurality of pressure sensors (19) and a controller (13). Each of the pressure sensors (19) is positioned at an air inlet (15) of each of the racks (11). The controller (13) is configured to receive pressure values from the pressure sensors (19) and control an airflow rate of the cooling air supplied from the air conditioner (12) based on the pressure values. The controller (13) is configured to set a target pressure value for each pressure sensor (19) (S300), acquire a current pressure value for each pressure sensor (S401), calculate a pressure drop value for each pressure sensor (19) between the current pressure value and the target pressure value (S402), and adjust the airflow rate based on a maximum value among the plurality of the pressure drop values (S403 to S410).

Abstract: A management system controls environmental conditions to facilitate operating state changes of individual information technology (IT) equipment within a data center. A management controller accesses a specification data structure containing environmental conditions specified to enable each one of the IT components to function in operational operating state(s). The management controller determines a temperature range specified in the specification data structure for a first IT component that is scheduled to transition into a first operational state. The management controller adjusts a temperature set point of supply air provided by the data center to the first IT component to be within the temperature range. In response to determining that the interior air temperature is within the temperature range, the management controller triggers activation of the first IT component into the first operating state.

Abstract: Scalable-bandwidth aggregation boxes are disclosed that allow scalable electrical connection bandwidth of multiple servers in a rack to aggregation modules and compact bifurcatable optical cables to connect the aggregation modules to switches, while minimizing switch faceplate connector area requirements by using optical connectors. Users of a system including scalable-bandwidth aggregation boxes can choose a desired bandwidth cable to connect a server to a switch via an aggregation box. An aggregation box may include a scalable-bandwidth electrical connector on a faceplate, signal lines coupled between the scalable-bandwidth electrical connector and a board connector in the housing, and a serviceable bandwidth-aggregation module removably disposed in the housing.

Abstract: An electrical power module comprising power components and supports, each including at least one metal portion, the metal portions of the supports forming a substrate of the electrical power module, at least one support comprising two angled metal portions that are angled relative to each other at an angle that is greater than 0°, each power component being fastened to two metal portions of two distinct supports by being positioned between said two metal portions, the electrical power module being arranged in such a manner that electrical power currents going to or coming from the power components flow in the metal portions of the supports.

Abstract: Described herein is an airflow management system and method. The system includes a top layer and a bottom layer, and each of the layers has a dedicated air flow management and hardware system that are operated independently. The top layer is a drop ceiling air plenum, and can store fan coils arranged in a hot aisle containment fashion or a cold hair containment fashion. The top layer receives fresh air from its own air source, and exhausts hot air through its own exhaust. The bottom layer can include server racks arranged in a hot aisle containment fashion or a cold aisle containment fashion. One or more servers in the bottom layer can include an air cooling component and a liquid cooling component, and receive cooling liquid from the top layer and receives cooling air from its own air source.

Abstract: An air shroud includes first and second channels, a center bypass port, and a center deflector. The first channel directs a first airflow over a first heat sink of a first processor. A first hot airflow leaves a first rear portion of the first channel. The second channel directs a second airflow over a second heat sink of a second processor. A second hot airflow leaves a second rear portion of the second channel. The center bypass port directs a third airflow away from a first set of memory modules. The center deflector is in physical communication with the first and second channels. The center deflector directs a first portion of the third airflow to the first rear portion of the first channel, and a second portion of the third airflow to the second rear portion of the second channel.

Abstract: Systems and methods for cooling large numbers of computing devices in a data center are disclosed. The computing devices have cooling fans that can have their fan speed set by management instructions. The devices are mounted in racks in a two-dimensional array and connected via network switches with ports corresponding to their location in the racks. The computer devices are oriented so that their cooling fans all exhaust waste heat to one side of the rack. Instructions are sent to the computing devices to set one or more attributes such as fan speed, operating frequency and voltage according to one ore more patterns. The patterns can be linear or nonlinear and can be shifted, rotated, or changed over time periodically or based on temperature or other performance measurements from the computing devices.

Abstract: An electronic device includes persistent storage enclosed within a housing. The housing is configured to protect the persistent storage during shipment of the electronic device by a common carrier. The electronic device may include at least one security door, which when in an open-state, may provide access to at least one of a data port, an aperture, a portion of a display, and/or the persistent storage. When the security door is in a closed-state and possibly locked, the persistent storage may be protected from environmental factors, such as dirt, weather, and tampering. In some embodiments, the aperture may enable airflow though the housing and may be fitted with a filter to remove debris from air that circulates into the housing.

Abstract: Some embodiments of an apparatus and system are described for a crossflow blower. An apparatus may comprise an enclosure having a first side and a second side where a portion of the first side is recessed in a direction of the second side. The enclosure may also comprise a first internal height between the first side and the second side and a second internal height between the recessed portion of the first side and the second side. The enclosure may also comprise a motor and a crossflow blower arranged to generate a flow of air between the first side and the second side in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.

Abstract: An expansion card holding mechanism is disposed on a flow guiding structure in a device casing. The expansion card holding mechanism includes a sliding slot structure and a sliding part. The sliding slot structure is disposed on the flow guiding structure and includes two opposite side walls. The sliding part includes a sliding body and a positioning portion. The sliding body is slidably disposed along a direction between the two side walls. The positioning portion protrudes from the sliding body and is slidably engaged with one of the two slide walls. The sliding body has a flow-guiding through hole and an expansion card holding slot. The flow-guiding through hole is aligned with a vent of the flow guiding structure in the direction, so that air flow can pass through the flow guiding structure and the sliding part for dissipating heat from an expansion card.

Abstract: A method and apparatus for efficiently dismantling hard disk drives, including a holder assembly to clamp a hard disk drive, a scanner that reads identification information of the hard disk drive. A chain conveyor belt indexes the hard disk drive to a position at which a logic board of the hard disk drive is peeled off and dropped into a bin, and to a position at which a lid of the hard disk drive is separated from a housing by way of a wedge, and indexes to a punch position at which magnets are punched in a direction from the logic board side of the hard disk drive. By separating and disposing the logic board and the lid, each hard disk drive is efficiently and securely dismantled.

Abstract: A data center may include a tape library rack module along with rack computer systems. The rack computer systems may be configured to provide computing capacity within a data center environment. In some embodiments, the tape library rack module may include an enclosure encompassing an interior of the tape library rack module, a rack within the interior, and a tape library unit mounted on the rack. The tape library rack unit may include tape cartridges configured to store data within a tape environment that is different than the data center environment. The tape library rack unit may be within a portion of the interior that is enclosed such that it is environmentally isolated from the data center environment. In some examples, the tape library rack module may include a cooling unit and/or a humidifier unit, which may provide the tape environment to the environmentally isolated portion of the interior of the tape library rack module.

Abstract: An information handling system includes a tray having a central processing unit. A main air duct component mounts on the tray over the central processing unit. The main air duct component includes a first portion having a first side vent region and a second side vent region. The main air duct component receives first and second side covers to cover the first and second side vent regions in response to the main air duct component being in a first configuration. The main air duct component receives a partition within the first portion to direct air flow out of the first and second side vent regions in response to the main air duct component being in a second configuration.

Abstract: An information handling system includes a component portion and a cooling portion. The component portion includes one or more components of the information handling system. The cooling portion includes a cooling fan and a baffle. The cooling fan provides air flow to the components. The baffle being movable between a first position and a second position to change an area available for the air flow to the components. The baffle is in the first position in response to only a first one of the components being located within the component portion, and the baffle is in the second position in response to both the first component and a second one of the components being located within the component portion.

Abstract: A cabinet structure includes multiple cover members configured to spatially partition an inside from an outside of a cabinet, and a clearance communicating between the inside and the outside of the cabinet is left between two cover members, the two cover members being adjacent to each other, of the cover members, and a passage defined by the clearance and leading from the inside to the outside of the cabinet through the clearance has a shape with multiple bends.

Abstract: An electronic apparatus with a heat-dissipation system includes a heat-dissipation device including a base, a heat-dissipation structure rotatably disposed on the bottom base, and a drive mechanism configured to selectively rotate the heat-dissipation structure toward one of a plurality of predetermined orientations.

Abstract: An exhaust duct provided on a back surface side of an image forming apparatus, and including a plurality of air ducts through which air inside the apparatus is exhausted toward outside the apparatus, a plurality of filters provided in the plurality of air ducts, respectively, and which removes a fine particle included in the air exhausted through the air ducts, and a filter case that houses the plurality of filters in a manner that the filters are able to be taken out from the filter case are included, and the filter case is provided in a drawable manner to one of side surface sides in a right and left direction or to an upper surface side in an up and down direction of the image forming apparatus, from a front surface side to a back surface side of the image forming apparatus, with respect to the image forming apparatus.

Abstract: A disclosed unit device: two first circuit boards provided apart from each other in a horizontal direction; heat generating components respectively provided on the two first circuit boards; two second circuit boards provided between the two first circuit boards, arranged to stand at a distance from each other, and each having an opening; and a fan provided between the two second circuit boards and configured to cool the heat generating components on the two first circuit boards by drawing air through the opening of one of the second circuit boards and by expelling the air through the opening of the other second circuit board.

Abstract: A carrierless mass storage device retainer assembly for retaining a carrierless mass storage device in a vertical orientation comprises a generally horizontal supporting surface, a generally vertical backplane and a retainer. The supporting surface is configured to receive a first side surface of a carrierless mass storage device and to support it from below with its second side surface facing upwards in a generally vertical direction. The backplane is positioned adjacent an end of the horizontal supporting surface and has a connector configured to establish an electrical connection between the carrierless mass storage device and the backplane. The retainer comprises a bail coupled to the supporting surface and shaped to extend around the carrierless mass storage device and to contact at least its second side surface when it is installed.

Abstract: A rack-mountable computer system directs separate portions of a cooling airflow from an inlet air plenum in the computer system interior through separate air passages to remove heat from separate portions of a set of heat-producing components. The air passages can preclude a portion of cooling airflow removing heat from a component from being preheated by another component. Plenums and air passages can be established through the arrangement of components in the interior. Components can be arranged in progressive offsets throughout the depth of the interior to vary plenum flow area throughout the depth, which can progressively impede and redirect airflow through the inlet plenum into the air passages. Arrangements can include an angled row, a staggered configuration, etc. The computer system can include a chassis which can translate, while maintaining operation of hot-pluggable electronic components coupled throughout the depth, to enable swapping of hot-pluggable electronic components throughout the interior.

Abstract: Systems and methods for distributing power within a rack system, including a power distribution unit (“PDU”) and multiple servers, are provided. The internal power cable contains a first or a second power socket at one of its ends. The first power socket can be located on the same side as t the PDU while the second power socket can be located close to a PSU of the PSUs that are located on a different side of the PDU. The first power socket of the internal power cable can be connected to the PDU via a first short power cable. The PSU located on the different side of the PDU can be connected to the PDU via a second short power cable between the second power socket of the internal power cable and a power socket of the PSU, the internal power cable, and the first short power cable.

Abstract: Method and apparatus provide for cooling a system. For example, a network communication system may include a central processing unit (CPU) and a fan controller. A chassis includes a plurality of receiving portions, each portion configured to receive a field replaceable unit (FRU). The chassis may also include a fan and a temperature sensor. The system CPU is configured to load a plurality of environmental profiles into fan controller memory, each profile indicating a fan speed for the fan based on a temperature reading from the temperature sensor. The fan controller is to determine a first configuration of the network communication device as to which FRUs are installed in the chassis and to select an environmental profile from the fan controller memory to use based on the determined first configuration.

Abstract: An apparatus for supporting and cooling an electronic device and methods of using the apparatus. The apparatus can include a housing for a cooling system and a support cradle for receiving the electronic device and engaging the electronic device with the cooling system.

Abstract: One embodiment of a method of providing ventilation to electronic equipment comprises receiving exhaust air flow from first electronic equipment positioned next to a ventilation structure; directing the exhaust air flow out of exhaust fan assembly of the ventilation structure; receiving cold air from an intake fan assembly of the ventilation structure; and directing the cold air to an intake vent of second electronic equipment positioned next to the ventilation structure.

Abstract: An active array heat sink cooled by natural free convection is disclosed. A long extruded heat sink is partitioned into multiple, shorter zones separated by gaps having horizontal baffles. The gaps and baffles serve to act as air vents and air inlets for the convection currents. As such, the heat transfer for the overall heat sink is improved because hot convection currents are vented and replaced by cool ambient air along the length of the heat sink.

Abstract: An electronic device enclosure includes a casing, an air duct mounted in the casing, and a latching member. The air duct includes a receiving bracket formed on the air duct for receiving an uninterruptible power supply module. The latching member is covered on the receiving bracket to position the uninterruptible power supply module. A first side of the latching member is rotatably connected to the receiving bracket, and a second side of the latching member is detachably latched to the receiving bracket.

Abstract: An electronic device includes a case having an exhaust vent, an electronic component, a radiation component including radiation fins adjacent to the exhaust vent and formed of first plates disposed parallel to one another to form first air channels, the radiation component radiating the heat received from the electronic component to air passing through the first air channels, a fan disposed at a position having a space from the radiation fins to send air toward the radiation fins, a dust filter including second plates disposed parallel to one another to form second air channels and disposed in the space between the radiation fins and the fan to transfer the air to the radiation fins while capturing dust. The dust filter is removable and the second plates have a shape to be inserted in the first air channels so as to push the dust out of the first air channels.

Abstract: A server system has an air inlet side and an air outlet side. The server system includes two server rack modules arranged side by side and a controller electrically connected to the server rack modules. Each server rack module includes a cabinet having a first side close to the air inlet side, multiple server hosts detachably disposed in the cabinet and a fan component. The fan component, disposed at the first side, includes multiple fans electrically connected to the controller. The first side of one of the cabinets abuts against the second side of the other cabinet. When the fan components operate, an air flow is formed in the cabinets. The server hosts are located in the flow path of the air flow. When one of the fans is failed, the controller is adapted for increasing a rotational speed of the fan component close to the air outlet side.

Abstract: An adjustable blocking arrangement for electronic hardware or computer racks, for preventing the undesired leakage of air through rack spaces not filled with hardware. An airflow control device is provided comprising a flexible web and a magazine adapted to receive the part of the flexible web that is not deployed. The device is adapted such that a length of the web may be deployed to sealingly block a space in the rack that is not filled with hardware modules, to prevent the flow of air through the space. The device may comprising a detection system adapted to detect the space in the rack that is not filled with hardware modules, and a processing system adapted to receive a signal from the detection system, and as a function of the signal to automatically deploy or retract the flexible web so as to sealingly block the space.

Abstract: An electronic device and housing thereof are provided. The electronic device includes housing, a partition, multiple electronic elements, and a fan. The housing has a side edge, where the side edge is provided with a slit. The partition is disposed in the case, is separated by a distance with the slit, and divides the interior of the case into a first and a second space. The partition has a through hole, the second space is in communication with the first space through the through hole, and the first space is in communication with the outside of the case through the slit. The electronic elements and the fan are disposed in the second space, and an air outlet of the fan is adjacent to the through hole, so that air in the second space can be driven to flow from the first space to the outside through the slit.

Abstract: An electronic device includes a main body, two air guiding plates, and a cover. The main body includes a bottom plate and two side plates extending up from opposite sides of the bottom plate. A number of mounting tabs extend from an inner side of each side plate, arranged in a row. A circuit board is supported on the bottom plate, and includes a number of electronic components located between the two rows of mounting tabs. A cutout is defined in a top of each mounting tab. A number of hooking slots are defined in a bottom of each air guiding plate. Top walls of the hooking slots of each air guiding plate are respectively supported by bottom walls of the cutouts of the corresponding row of mounting tabs. The cover is covered on a top of the main body and abuts tops of the air guiding plates.

Abstract: An electronic device includes: a fan; a housing configured to houses the fan, the housing including a vent hole configured to introduce outside air, a first air outlet configured to open to a blowing path from the fan, and a second air outlet configured to open at a different position with respect to the blowing path; and an opening and closing member configured to open and close the first air outlet.

Abstract: A computer system is provided. The computer system includes a housing, a mainboard, a first heat source, a second heat source and a flow field modulator. An inlet and an outlet are formed on the housing. The mainboard is disposed in the housing. The first heat source is located on a first location of the mainboard. The second heat source is located on a second location of the mainboard. The flow field modulator is disposed on the mainboard including a control unit, a piezoelectric element and a guiding sheet. The control unit is electrically connected to the mainboard. The piezoelectric element is electrically connected to the control unit. The guiding sheet is connected to the piezoelectric element.

Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: A system for cooling portable facilities which include heat generating electronics, interior fans, a heat sink integrally serving as part of a wall or ceiling, and an outer heat pipe assembly in thermal communication with the heat sink allowing for heat dissipation. External fans pull external air over the outer heat pipe assembly. A first transducer monitors inner air temperature within the portable building, a second transducer monitors the outer heat pipe assembly, and a third transducer is secured proximate to a fin side of the heat sink. A controller is connected to the transducers, fans, and power supply. Computer instructions monitor temperatures from the transducers, compare the temperatures to preset limits, and individually or simultaneously actuate, regulate, or turn off the fans when monitored temperatures meet or exceed preset limits.

Abstract: A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device.

Abstract: Systems and methods are provided for cooling electronic equipment in a data center. Ambient air is vertically circulated from a workspace across a plurality of rack-mounted electronic devices. The electronic devices are located in a plurality of trays such that each tray has a major plane that is substantially parallel to a side plane of the rack. The circulated air is cooled with a heat exchanger that is connected to a vertical end of the rack via a sealed interface. Multiple racks can be arrayed in a distributed cooling arrangement, which increases reliability and scalability of the data center.

Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: An electronic device includes a chassis and an air guiding apparatus. The chassis includes a bottom wall, a first sidewall, a second sidewall, a first end wall, a second end wall, a circuit board mounted on the bottom wall, and a fan. The air guiding apparatus includes a flexible air guiding piece. The first and second end walls each define a number of vents. A chip is mounted on the circuit board. The fan is installed in the chassis adjacent to the vents of the second end wall. The air guiding apparatus is fixed to the first end wall. A first end of the air guiding piece is stretchable to be fixed to the second end wall. The air guiding piece, the first sidewall, the first end wall, and the second end wall cooperatively bound an airflow channel for receiving the fan and the chip.

Abstract: A server includes a chassis, processing units and an airflow generating device. The processing units are disposed inside the chassis for heat dissipation of the processing units. Each processing unit includes a motherboard, an electric heat source, a heat dissipation fin set and a stopping air bag. The electric heat source is disposed on the motherboard, the heat dissipation fin set is attached to the electric heat source and the stopping air bag including an air inlet opening is located at space between the heat dissipation fin set and one of the processing units which is adjacent to the stopping air bag. When the airflow generating devices are operated, air is blown into the stopping air bag through the air inlet opening so that the stopping air bag is inflated to occupy the space to stop an airflow from flowing through the space.

Abstract: An apparatus with some embodiments is described having ducts positioned above and below a main device housing to provide cooling air flow to at least a portion of the top and bottom surfaces of the associated computing device. In some embodiments, the device is a mobile computing device. In some embodiments, air may be drawn through inlets located on at least one side of the device. The inlet air may be supplied via upper and lower air ducts to an air mover positioned on an opposite side of the device. In some embodiments, air discharged from the air mover may be supplied to a main housing of the device in which heat producing components may be located. Other embodiments are described.

Abstract: In an axial fan, a housing includes a side wall arranged to surround an outer circumference of an impeller, and a substantially square or substantially rectangular flange arranged to project radially outward from an outer circumferential surface of the side wall. The side wall preferably includes three slit groups each including a plurality of slits arranged in a circumferential direction and arranged to extend through the side wall from an inner circumferential surface to the outer circumferential surface thereof. Two of the slit groups are defined in portions of the side wall which correspond to two adjacent corner portions in an upper half portion of the flange, while the remaining slit group is defined in a portion of the side wall which corresponds to a lower half portion of the flange. The upper and lower half portions are divided at a line parallel or substantially parallel to two opposing sides of the flange and passing through a central axis.

Abstract: In a casing, a printed circuit board is arranged such that a first side of the printed circuit board has a first angle of ?° with respect to a first side surface plate. A cooling device is arranged to have a second angle of ? with respect to the first side surface plate. Accordingly, an amount of cooling air flowing in and out via an air intake port and an air discharge port may be increased. Furthermore, by reducing the angle of the change in the flow direction of the cooling air flowing over the printed circuit board, the cooling air flowing over the printed circuit board may be made to efficiently flow through an air discharge port 119a. Furthermore, the efficiency with which a heat-generating component on the printed circuit board is cooled may be improved.

Abstract: A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger.

Abstract: A computer system includes a computer case, an enclosure, and a heat dissipating device. The computer case includes a rear plate with a plurality of ventilation holes. The enclosure includes a separating portion to divide the computer case into a first receiving area and a second area. The heat dissipating device includes a first heat sink, a second heat sink, a heat pipe and a fan. The first heat sink is attached to a chip, and the fan communicates with the second heat sink. The first heat sink and the fan are received in the first receiving area, and the second heat sink is received in the second receiving area. The heat pipe extends through the separating portion, and the plurality of ventilation holes, the first heat sink, the fan, the heat pipe, and the second heat sink together defines an air path for air flowing through.

Abstract: A memory cooling duct can include: a front end and a back end; a top that includes a fan mount disposed between the front end and the back end; a front end vent; a front edge, a back edge and opposing side edges that define a rectangular bottom opening; and a flexible lever at the front end that includes a locking surface for locking the memory cooling duct over a rectangular array of memory sockets. Various other apparatuses, systems, methods, etc., are also disclosed.

Abstract: A module type data center includes: a casing having an intake vent and an exhaust vent; a rack accommodating an electronic device; an air blower configured to introduce outside air into the casing through the intake vent and pass air through the rack from one of surfaces of the rack to another one of the surfaces of the rack; a shielding-slat unit including a plurality of shielding slats configured to change between an open state and a closed state and drive devices configured to drive the corresponding shielding slats. An inner space of the casing is divided into a first space defined between the one surface of the rack and the intake vent, a second space defined between the other surface of the rack and the exhaust vent, and a third space defined above the rack and allowing the second space to communicate with the first space.

Abstract: In the electronic device, an inlet 10 is provided on a front face 1c of a first housing 1. Thus, it is possible to reduce the possibility of the inlet 10 being blocked by objects. That is, when a user uses a notebook computer in a normal position, his body opposes the front face 1c in many cases. Thus, when the inlet is provided on the front face 1c, the inlet is less likely to be blocked than when it is provided on any other face of the first housing 1. For this reason, the cooling efficiency within the first housing 1 does not drop.