Abstract: A plasma display device is provided with a chassis supporting a PDP on its front surface, circuit boards located within a specific region of the back surface of the chassis, a back cover including an edge portion covering the outside of the specific region of the back surface of the chassis and a projecting portion accommodating the plurality of the circuit boards, and a fan arranged inside a space defined by the projecting portion. The peripheral wall of the projecting portion is provided with a plurality of air inlets and a plurality of air outlets.

Abstract: A housing includes a first chamber having an exhaust aperture to provide fluid communication with an outside environment, a wall disposed in the first chamber and containing an electrical component, wherein a thermal energy generated by the electrical component is transferred from the first chamber to the outside environment through the exhaust aperture, a second chamber formed adjacent the first chamber and including a control means for the electrical component, and a means for selectively providing access to the first chamber and the second chamber.

Abstract: An electric device includes: first opening 7 provided on rear panel 4 to exhaust internal air out of casing 1; first partition 12 covering second opening 8 provided on left side panel 2 and having fourth opening 10; second partition 13 covering third opening 9 provided on right side panel 3 and having fifth opening 11; and radiator 14 disposed so as for opening 14C at one end to faceopening 7. The configuration can prevent weld spatters or the like from coming into casing 1 directly.

Abstract: A storage unit includes: a storage section containing an information processing apparatus; an intake section allowing intake of a cooling medium into the information processing apparatus for cooling the information processing apparatus; a discharge section receiving the cooling medium discharged from the information processing apparatus; a cooling medium flow generating section configured to control intake and discharge of the cooling medium; a partition section isolating the intake section and the discharge section from each other; an aperture formed in the partition section; a detector section configured to detect an inflow of the cooling medium, discharged from the discharge section, through the aperture; and a controller section configured to control the cooling medium flow generating section in accordance with a result of the detection of the detector section.

Abstract: A test slot cooling system for a storage device testing system includes a storage device transporter having first and second portions. The first portion of the storage device transporter includes an air director and the second portion of the storage device transporter is configured to receive a storage device. The test slot cooling system includes a test slot housing defining an air entrance and a transporter opening for receiving the storage device transporter. The air entrance is in pneumatic communication with the air director of the received storage device transporter. The test slot cooling system also includes an air mover in pneumatic communication with the air entrance of the test slot housing for delivering air to the air director. The air director directs air substantially simultaneously over at least top and bottom surfaces of the storage device received in the storage device transporter.

Abstract: A heat dissipation system includes a computer case has a base plate and a back plate perpendicularly to the base plate, a heat sink, a first fan and an air duct. The heat sink is positioned in the computer case in contact with a first heat source. The first heat source and the back plate define a first air channel therebetween. The first fan is positioned in the computer case adjacent to a first side of the heat sink. The first fan is configured to generate airflow through the heat sink in such a manner that airflow flows from the computer case outside is sucked into the computer case via the first air inlet and the first air channel. The air duct is positioned in the computer case adjacent to a second side of the heat sink. The heat sink heats the airflow from the first fan. The warm airflow heated by the heat sink is then blown out of the computer case by the first fan via the air duct.

Abstract: A display apparatus has a display panel, a circuit unit which controls the display panel, a first chamber which accommodates the display panel, a second chamber which arranged behind the first chamber, the second chamber accommodates the circuit unit, a cooling device which cools the display panel, and a ventilating part which ventilates between the first and the second chamber. The air emitted from the cooling device is led to the back side of the display panel via the front side thereof, and then ventilates the ventilating part.

Abstract: A storage apparatus S comprises a disk controller 1 for controlling data I/O processing between a host H and a disk unit 2. The disk controller 1 includes a plurality of circuit board modules each having a circuit board 210 and a module case 200 storing the same, and a chassis 100 shaped like a hollow cylinder having a front side opening and a rear side opening and configured to store the circuit board modules from the front and rear side openings. A CM module 20 is configured to introduce cooling air from a cooling fan 10F through an opening provided on at least one side surface toward a circuit component mounted on the circuit board 210. A MP module 30 is configured to introduce cooling air by a cooling fan 10R through an opening provide on a front surface of the module case 200.

Abstract: An electronic device includes a chassis having a bottom wall. A motherboard is disposed on the bottom wall. A riser card is perpendicularly connected to the motherboard. An airflow duct is located on the bottom wall of the chassis. A securing member is mounted to the airflow duct. The securing member includes a supporting piece secured to the airflow duct, and a securing piece is pivotally mounted to the supporting piece. The securing piece is engaged with the supporting piece to clamp an expansion card between the supporting piece and the securing piece.

Abstract: A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.

Abstract: A computer chassis cooling sidecar for cooling one or more computers in a chassis of computers in a data center, the sidecar including an air intake chamber and a chassis delivery chamber, the air intake chamber having a first opening at a bottom end for receiving air from beneath the data center through perforated tiles in the floor of the data center located on the side of the computer chassis, the air intake chamber having at the top end a directional vane shaped to direct airflow from the side of the chassis to a chassis delivery chamber; wherein the chassis delivery chamber resides in front or back of the chassis and has an opening to receive air from the air intake chamber and an opening to deliver the received air to the front or back of the computer chassis.

Abstract: Provided is an electronic apparatus capable of also supplying sufficient air flow to a heat generating device other than the heat sink. An electronic apparatus includes: a cooling unit (10) including a heat sink (13), and a cooling fan (15) for generating air flow for receiving heat of the heat sink (13); an upper wall member (40) connected to the cooling unit (10) so as to form an outer wall defining an air passage continuous with the cooling unit (10); and a power circuit (17) arranged in the air passage and serving as an object to be cooled.

Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct. The air-in duct is located on one side of the board slots, and the air-out duct is located on the other side of the board slots. The air-in duct is linked to the air-in chamber, and the air-out duct is linked to the air-out chamber.

Abstract: An exemplary server center includes a server, a heat dissipating system, and temperature controlling device. The heat dissipating system includes an exhaust fan, and an airflow tunnel connecting the exhaust fan with the server. The temperature controlling device includes a temperature sensor electrically connected to the server, and an airflow valve mounted on the airflow tunnel The temperature sensor is configured for detecting a temperature of the server and controlling the airflow valve to permit the airflow enter the airflow tunnel or not, according to the temperature obtained from the server.

Abstract: An exemplary embodiment of the present invention provides a silencer. The silencer includes an enclosure with a first airflow path configured to allow air to pass through the enclosure and attenuate noise entering the enclosure. The enclosure also includes an opening configured to provide a second airflow path if the first airflow path is obstructed.

Abstract: A rack server center includes servers, an air conditioning system for bringing cooling air to the rack server, and an air exhaust system located outside the rack server. The air exhaust system includes an exhaust fan, branch pipes, controlling valves, and a main pipe. Each branch pipe is connected with a corresponding server via a corresponding controlling valve. The branch pipes are connected with an inlet of the exhaust fan. The main pipe is connected with an outlet of the exhaust fan. The exhaust fan is configured for exhausting heated air generated by the servers out of the rack server via the branch pipes. Each server is configured for controlling the amount of the heated air entering a corresponding branch pipe by controlling the controlling valve connected with the corresponding branch pipe.

Abstract: A modular packet network device has a chassis in which multiple logic cards mate to the front side of an electrical signaling backplane. Logic power for the logic cards is supplied from a group of power converter cards that convert primary power to the logic voltages required by the logic cards. The power converter cards lie in a separate cooling path behind the backplane. Advantages achieved in at least some of the embodiments include removing primary power planes from the signaling backplane or portion of the backplane, providing redundant, upgradeable power modules whose individual failure does not cause logic card failure, and providing cool air to power converter circuits that would be subject to only heated air if located on the logic cards. Other embodiments are also described and claimed.

Abstract: A computer system has a chassis, a plurality of interconnected panels mounted on the chassis in a manner defining an interior space at least partially encompassed by the panels, a circuit assembly, an electrically-powered fan within the interior space, and an energy conversion device mounted within the interior space. One or more of the panels has an airflow opening therein. The circuit assembly is mounted on the chassis within the interior space and includes a heat generating system component. The heat generating system component includes a surface from which energy in the infrared (IR) electromagnetic spectrum is emitted during operation thereof. The energy conversion device is configured for converting the emitted infrared energy to electrical energy and is electrically connected to the electrically-powered fan for providing the electrical energy thereto.

Abstract: A fan module for dissipating heat from a computer server includes a mounting bracket and a fan mounted on the mounting bracket. The mounting bracket is mounted to an outside of the computer server. The mounting bracket is hollow and forms an air passage in an interior of the mounting bracket. The air passage is communicated with an interior of the computer server. An airflow generated by the fan flows into the interior of the computer server through the air passage to take heat away from the interior of the computer server.

Abstract: In a heat radiation mechanism of an electronic apparatus, an opening allowing flow of air between a first duct side and a second duct side is formed on a portion mounted with a heating device of a circuit board in an air flow route constituted by a first duct and a second duct, and heat generated from the heating device is radiated from a first vent hole or a second vent hole through the air flow route.

Abstract: An electronic device includes: a first housing that includes an inlet and an outlet on one end; a second housing; and a linkage section that links the second housing to the first housing such that the second housing can be opened and closed. The device is configured such that the second housing divides at least a part of a space between the inlet and the outlet while the second housing is in the open position relative to the first housing. While the second housing is opened relative to the first housing, the second housing divides the space between the inlet and the outlet, thereby preventing the exhausted warm air from being drawn into the electronic device.

Abstract: A display assembly is provided for a computing device. The display assembly includes an exterior shell that (i) is translucent or clear, (ii) has at least a rounded exterior surface, and (iii) a substantially flat underside along at least a mid-section of the exterior shell.

Abstract: An electronic equipment includes an air flow control unit that controls an air flow generated by an air blow. The electronic equipment includes an expanding unit that is disposed behind the air flow control unit, includes an additional electronic circuit for an electronic circuit mounted on a main board, which are cooling targets of the air blow, and expands a function of the electronic circuit of the main board. The expanding unit has a hollow structure casing and includes the additional electronic circuit in an inside of the hollow structure casing. The air flow control unit has an opening part to allow the air flow to pass through and a blocking part to block the air flow, and supplies most of the air flow into the inside of the hollow structure casing of the expanding unit by the opening part and the blocking part, the blocking part including a vent.

Abstract: A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between the first and second surfaces. At least one first aperture in fluid communication with the chamber can be disposed on the second surface, while at least one second aperture in fluid communication with the chamber can be disposed on the first surface. A fluid mover, having a fluid inlet and a fluid discharge, can be disposed proximate the second aperture. Fluid from the chamber can provide an inflow to the fluid inlet and an outflow from the fluid discharge can be directed to the exterior of the electronic enclosure.

Abstract: A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.

Abstract: An apparatus is provided for facilitating cooling of an electronics rack of a data center. The apparatus includes: an airflow director mounted to the electronics rack to redirect airflow exhausting from the electronics rack through an airflow return pathway back towards an air inlet side of the rack; an air-to-liquid heat exchanger disposed within the airflow return pathway for cooling redirected airflow before exiting into the data center near the air inlet side of the rack; an air temperature sensor for monitoring air temperature of the redirected airflow; and an automated isolation door associated with the airflow director for automatically blocking airflow exhausting from the air outlet side of the electronics rack from passing through the airflow return pathway back towards the air inlet side of the rack responsive to temperature of the redirected airflow exceeding a defined temperature threshold.

Abstract: A high density switching platform arranges multiple circuit cards interconnected by a single backplane. A single backplane has three sets of circuit cards on one side. A shared ventilation chamber on the other side of the backplane draws ambient air through each of the three sets of circuit cards independently. The air flow also allows cooling of power modules that supply power to the circuit cards. The platform allows interconnection of its circuit cards with circuit cards in adjacent platforms.

Abstract: An apparatus with some embodiments is described having ducts positioned above and below a main device housing to provide cooling air flow to at least a portion of the top and bottom surfaces of the associated computing device. In some embodiments, the device is a mobile computing device. In some embodiments, air may be drawn through inlets located on at least one side of the device. The inlet air may be supplied via upper and lower air ducts to an air mover positioned on an opposite side of the device. In some embodiments, air discharged from the air mover may be supplied to a main housing of the device in which heat producing components may be located. Other embodiments are described.

Abstract: A cooling device for rack mount equipment comprises an extensible side duct, open on its inner and rear-facing sides which redirects warm exhaust air exiting vents in the side of a chassis towards the rear of an enclosure holding the chassis. An apparatus incorporating the cooling device may be installed in a rack with the extensible side duct in a retracted position. The extensible side duct may extend under the influence of air pressure, forming a plenum in fluid communication with the interior of a chassis on which it is mounted such that warm air exiting the chassis is collected in the plenum formed by the extensible side duct and directed out towards the rear of the chassis. Use of the apparatus permits conventional front-to-back cooling airflow patterns to be maintained even with chassis having side exhaust vents.

Abstract: A first conduit is externally attached to one of two opposing sidewalls of electronic equipment and a second conduit is externally attached to the other of the opposing sidewalls. Each conduit has an open end, a closed end, and a side having a vent that is aligned with a vent in the sidewall of the electronic equipment to which that conduit is attached. The first conduit takes air in through its open end, channels the air in a direction substantially orthogonal to the direction of air flowing through the electronic equipment, and directs the air into the electronic equipment through its aligned vents. The second conduit receives air from the electronic equipment through its aligned vents, channels the air in a direction that is substantially orthogonal to the direction of air flowing through the electronic equipment, and exhausts the air through the open end of the second conduit.

Abstract: Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction established by a nonionic air moving device. Each ionic air moving device comprises an ion emitter electrode disposed a spaced distance from a collector electrode, wherein a controller independently controls an electrical potential between the emitter and collector electrodes of each ionic air moving device for affecting the rate of airflow through one or more of the plurality of airflow zones.

Abstract: A cable management rack is provided within which or upon which a heat-generating device is mountable, and which encompasses a vertical rectangular frame open in a front and a rear of the frame. The rack includes a first upright and a second upright attached to opposite respective lateral sides of a base and a top member, and respective side-facing panels. Each of the panels defines a plurality of vent holes arranged in an array and permit the rack to receive a sideways flow of cooling air into a first side of the rack through one of the vent hole arrays for cooling a heat-generating device mounted between the panels, and permit the rack to discharge a sideways flow of exhaust air through the other vent hole array. Each of the array of vent holes may manifest a honeycomb pattern of vent holes, and each of the vent holes may manifest an hexagonal shape.

Abstract: A computer system includes a chassis, a motherboard, a heat sink and an airflow guiding duct. The chassis includes a chassis bottom wall, a first chassis sidewall, and a second chassis sidewall. The first chassis sidewall defines a first ventilation hole. The second chassis sidewall defines a second ventilation hole. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The airflow guiding duct is configured to guide airflow flowing from the second ventilation to the first ventilation hole. A fan is received inside the airflow guiding duct.

Abstract: Components of an elevator system are cooled using natural convective airflow in conjunction with thermoelectric heating and cooling. Rising air within the hoistway is funneled into a cold air duct (20) and a warm air duct (22). As air flows vertically upward through the cool air duct (20) and the warm air duct (22), a thermoelectric module (14) cools air in the cool air duct (20) and heats air in the warm air duct (22). The cool air stream in the cool air duct (20) is circulated past the elevator component (12), and is drawn upward into a common exhaust duct (28) by the faster flowing warm air stream in the warm air duct (22).

Abstract: A storage device transporter includes a transporter body having first and second body portions. The first body portion is configured to be engaged by automated machinery for manipulation of the storage device transporter. The second body portion is configured to receive and support a storage device. The first body portion is configured to receive and direct an air flow over one or more surfaces of a storage device supported in the second body portion.

Abstract: A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening.

Abstract: An apparatus, system, and method are disclosed for directing power supply airflow. A power supply is disposed adjacent a first end of a chassis. The chassis comprises a z axis from the first end to a second end of the chassis and an x axis orthogonal to the z axis. A bay is disposed adjacent the first end of the chassis along the x axis from the power supply. The bay comprises at least one storage device. A chamber is disposed adjacent the first end of the chassis adjacent the bay along the x axis between the bay and the power supply. A first baffle is disposed offset from the power supply, the bay, and the chamber along the z axis toward the second end. The first baffle forms a first section and isolates a first airflow in the first section from a second airflow.

Abstract: Computer systems with air cooling systems and associated methods are disclosed herein. In several embodiments, a computer system can include a computer cabinet holding multiple computer modules, and an air mover positioned in the computer cabinet. The computer system can also include an airflow restrictor positioned proximate to an air outlet of the computer cabinet, and an overhead heat exchanger mated to the computer cabinet proximate to the air outlet.

Abstract: A cooling system includes a system air intake, a system air outlet, a fan, and a noise-reducing outlet. The fan includes a fan intake, and a fan outlet. The fan drives airflow, from the system air intake through the fan intake, the fan outlet, and the system air outlet. The noise-reducing outlet is located adjacent to the fan outlet. When the airflow exits through the fan outlet, a portion of the airflow exits through the noise-reducing outlet.

Abstract: An apparatus has a plurality of printed board units each including a printed board, a frame to have the printed board arranged therein, a first rail to be arranged at a first lower end of an inner wall of the frame having the printed board located thereon in a lower opening of the frame, and a second rail to be arranged at a second lower end opposed to the first lower end in the opening; a housing including a rail holding unit to movably hold the first rail of a first printed board unit and the second rail of a second printed board unit adjacent to the first printed board unit among the plurality of printed board units; and a cooling fan to be arranged on an upper side or underside of the housing to send air into the frame.

Abstract: An airflow duct for guiding air toward two heat sink apparatuses in computer includes a duct body fixed in a computer case, a first air guide channel and a second air guide channel defined in the duct body. The duct body has an air inlet and an air outlet. The first air guide channel forms a first air outlet, which opens towards a first heat sink apparatus in the computer case. The second air guide channel forms a second air outlet, which opens towards a second heat sink apparatus in the computer case. The first and second air guide channels guide air from the air inlet to the first and second heat sink apparatuses, through the first and second air outlet openings to dissipate heat respectively from the first and second heat sink apparatuses. A first air guide channel height is greater than that of the second air guide channel.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a partition, a first cooling fan, and a second cooling fan. The partition partitions an inside of the housing into a first chamber and a second chamber. The first chamber communicates with a first inlet, a third inlet, and a first outlet. The second chamber communicates with a second inlet and a second outlet. The first cooling fan locates above the third inlet in the first chamber, and includes a first intake configured to draw air in the first chamber, and a second intake configured to draw air outside the housing through the third inlet, the first cooling fan being configured to discharge the air to a heat sink. The second cooling fan locates in the second chamber and is configured to draw air in the second chamber, and to discharge the air to the second outlet.

Abstract: A server and cooler module arrangement includes a server accommodating a stack of an operating system and an electronic device in an accommodation chamber therein at one side and an access device unit in the accommodation chamber at an opposite side, and a cooler module, which comprises a rack mounted in a partition way in the accommodation chamber between the stack of operating system and electronic device and the access device unit and a plurality of fans respectively adjustably mounted in respective open frames at different elevations and adapted for drawing air or sending air toward different heat sources in the operating system, the electronic device and the access device unit for quick dissipation of waste heat.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: A heat-dissipating assembly for a server includes a housing in which a partitioning plate and a power supply mounted on one side of the partitioning plate are provided. The power supply includes a casing and a power-supplying module received in the casing. The heat-dissipating assembly includes a fan received in the casing and located outside the power-supplying module. The partitioning plate and the casing are respectively provided with a plurality of first heat-dissipating holes and second heat-dissipating holes. The first heat-dissipating holes and the second heat-dissipating holes are positioned to correspond to the fan. The airflow caused by the fan drives the air inside the housing to flow out of the housing via the first heat-dissipating holes and the second heat-dissipating holes. In this way, the heat-dissipating efficiency can be improved without affecting the arrangement of other electronic devices in the housing.

Abstract: A display unit is disclosed. A display apparatus includes a panel unit displaying images, a circuit unit provided a rear surface of the panel unit, a chamber surrounding the circuit unit, the chamber forming a predetermined space and at least one ventilation fan ventilating air inside the chamber along a circulation path passing beyond the circuit unit. According to a display apparatus according to the present invention, parts which are mounted in the display apparatus may be protected from external moisture or dust. Furthermore, heat radiation may be performed efficiently in the display apparatus according to the present invention even if environments of heat exchanging with an outside may not be formed enough in a structure of the display apparatus.

Abstract: A computer system includes a chassis and an airflow blocking plate. The chassis comprising a first chassis sidewall, a second chassis sidewall, and a drive bracket which is used to mount a disk drive. The drive bracket is secured in the chassis and abuts the first chassis sidewall, and the first chassis sidewall defines a first ventilation hole. The air flows into the chassis via the first ventilation hole. The airflow blocking plate secured in the chassis and located between the first chassis sidewall and the second chassis sidewall. The airflow blocking plate prevents the air from flowing back to the drive bracket.

Abstract: In accordance with at least some embodiments, a computer system include a chassis and a main airflow channel within the chassis. The computer system also includes multiple processors and multiple memory banks positioned in the main airflow channel. The computer system also includes a removable airflow guide assembly installed in the main airflow channel, wherein the removable airflow guide assembly divides the main airflow channel into a processor-side airflow channel and a memory-side airflow channel.

Abstract: An electronic unit includes: a circuit board that has a device mounting surface mounted with circuit devices and that is supported in a condition that the device mounting surface is arranged in a direction of gravity; an opposed member that is disposed in opposition to the circuit board so that a passage space through which a refrigerant for cooling the circuit devices passes is formed between the opposed member and the device mounting surface; an exhaust unit that is disposed in opposition to the circuit devices disposed on the circuit board and that exhausts the refrigerant having passed through the passage space; and a protruding member that is provided in an upper portion of the exhaust unit in the direction of gravity and that protrudes from the opposed member toward the circuit devices.

Abstract: A power supply cooling system comprises a computer device having at least one inlet for receiving an airflow generated by a cooling system removably couplable to the computer device, the computer device configured to receive power from the cooling system.