Abstract: An IO system board included in an electronic device includes, in addition to a first section board that includes first ventilating holes and second section board that includes second ventilating holes, a third section board that includes third ventilating holes. Accordingly, a larger amount of cooling air is taken in via an air intake surface of a rack of the electronic device, flows into a casing of the IO system board, and then flows over a first sub circuit board, thus cooling a first heat-generating component.

Abstract: A substrate cooling apparatus is configured to include: a mounting table including a mounting surface for mounting a substrate thereon; a projection provided on the mounting surface for supporting a rear surface of the substrate; a coolant flow path through which a coolant flows, provided in the mounting table for cooling the mounting surface; a plurality of gas discharge ports provided in a circumferential direction at a peripheral edge portion of the mounting surface for discharging a cooling gas for cooling the substrate; a gas suction port provided at a center portion of the mounting surface for sucking the cooling gas; and a groove provided in the mounting surface for diffusing the cooling gas in a circumferential direction of the substrate. The substrate cooling apparatus configured as described above can cool the substrate mounted on the mounting surface with high uniformity.

Abstract: A heat management system may include a generally planar printed circuit board extending in a first plane, heat-generating electrical components mounted on a first side of the PCB, and an air baffle coupled to the PCB and configured to direct air flow across some of the components. The air baffle may include a generally planar air baffle body extending in a second plane parallel to and offset from the first plane of the PCB such that at least one of the components is located in an area between the air baffle body and the PCB, an opening in the generally planar body, and a generally planar wing coupled to the air baffle body at a first side of the opening and extending toward the PCB at an askew angle relative to the first plane of the air baffle body, the wing being configured to facilitate air flow through the opening.

Abstract: An opacity baffle is disclosed that can be permanently secured to the back face of an electronic apparatus to cover ventilation openings or other openings that render the apparatus visually unsecure. The opacity baffle in one example comprises a grill and ventilation material that are secured together at their edges resulting in a rigid structure. The grill contains openings to promote ventilation within the apparatus, and the ventilation materials allows for air flow despite being visually opaque. One-way fasteners can be used to secure the baffle to the back face, which when inserted in place cannot be removed without evident tampering. The baffle and fasteners can be provided with the apparatus when sold or can be sold separately, allowing a particular customer to affix the baffle if needed to meet security requirements, or not if such security measures are unnecessary.

Abstract: An electronic device includes a chassis, an air-guiding housing mounted in the chassis, and an airflow control member. The chassis includes a base panel with a plurality of ventilation holes. The air-guiding housing comprises an airflow passage aligned with the plurality of ventilation holes. The airflow control member includes a shielding plate attached on the base panel. The airflow control member is movable between a first position and a second position. In the first position, the shielding plate is located beside the air-guiding housing, and the airflow passage is communicated with the plurality of ventilation holes for allowing air flowing to an outside of the chassis via the plurality of ventilation holes. In the second position, the shielding plate is located between the air-guiding housing and the base panel for closing the plurality of ventilation holes and preventing air flowing to the outside of the chassis.

Abstract: A cover of a chassis includes a board defining an opening, and a vent plate slidably mounted to the board and covering the opening. The vent plate defines a number of vents. The vent plate can be slid to adjust the vents to align with or stagger from the opening.

Abstract: A cabinet to be interposed between an above ground or underground sump and the control panel for said sump. All electrical connections between the control panel for the operation of the sump or lift station and the sump or lift station itself are disposed within this cabinet. The cabinet has two abutting closed sections, an A section having an open bottom and at least one vented side and a vented door; and a B section having a bottom panel and non-perforated sides and door. A pair of aligned intermediate rear panels close off each section, the only connection between said sections being a cable entry seal disposed in aligned openings in each intermediate rear panel for the passage of cabling from the A section to be mounted for termination in the B section. Any conventional cabling termination means can be employed in the B section.

Abstract: An electronic control cabinet for a fire detection panel and/or extinguishing control panel, including a housing having a fastening structure for modules including a module housing in which an electronic assembly is arranged, the housing having entry and exit openings for an air flow wherein a cooling device for the modules to be cooled includes horizontal first and second ducts between two essentially vertical first and second ducts, the respectively first ducts guiding a cold-air flow to the modules to be cooled and the respectively second ducts leading a warm-air flow away from the modules to be cooled, and the horizontal ducts having openings for the air flow of the cold and warm air at those places where the modules to be cooled are arranged.

Abstract: The present disclosure provides a wiring device with integrated DC output interfaces alongside AC output interfaces. The wiring device converts AC power received from the grid into DC power that can be used directly by DC loads. In certain example embodiments, the wiring device includes USB receptacles as the DC output interfaces. The wiring device also includes various power management enhancement features. Some such features include crimping and soldering electrical wires directly to the AC output contacts and a midframe for insulating certain components inside the wiring device from heat generated by other components.

Abstract: A heat dissipation apparatus with an antenna is provided. The heat dissipation apparatus includes a housing, a heat-insulation structure, a fan and an antenna. The heat-insulation structure is disposed on the housing and the heat-insulation structure has a plurality of heat dissipation holes. The fan is disposed in the housing and an air exhaust channel is formed between the fan and the heat-insulation structure. The antenna is disposed in the air exhaust channel.

Abstract: A method and system for providing a customized storage container includes a generally rectangular housing and at least one printed circuit board contained within the rectangular housing. The customized storage container encloses a first row of interconnector modules that are positioned adjacent to a first, open end of the rectangular housing. The customized storage container also encloses a second row of interconnector modules positioned adjacent to the first, open end of the rectangular housing. At least one air vent is positioned along a side of the rectangular housing and adjacent to a second, closed end of the rectangular housing. According to one exemplary embodiment, the storage container can comprise a single printed circuit board for supporting the first and second row of interconnector modules. In another exemplary embodiment, the storage container can comprise two printed circuit boards for supporting the first and second rows interconnector modules.

Abstract: A system for cooling an electronic image assembly using ambient gas. The system contains a plurality of channels place behind the electronic image assembly and preferably in conductive thermal communication with the image assembly. Ambient gas is ingested into the display housing and directed to a first manifold which distributes the ambient gas to the plurality of channels. A second manifold preferably collects the ambient gas from the channels after absorbing heat from the electronic image assembly and/or channels. The second manifold then preferably directs the ambient gas towards an exit aperture and out of the display housing. Circulating gas may also be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing.

Abstract: A car electric equipment case module includes a housing, a covering structure, an electric equipment set, and a fan. The housing has a side wall, a containing space containing the electric equipment set and a first ventilator formed on the side wall. The covering structure includes a casing assembled to the housing and a block wall connected to the casing and extending outside the side wall to cover the first ventilator. An air channel connected the first ventilator is formed between the block wall and the side wall. The fan configured in the housing provides an air flow. The air flow flows into the containing space through the air channel and the first ventilator and flows out through a second ventilator formed on the covering structure, or flows into the containing space through the second ventilator and flows out through the first ventilator and the air channel.

Abstract: A computer system includes an enclosure, a printed circuit board, and an airflow guiding duct. The enclosure includes a bottom plate. The printed circuit board is mounted on the bottom plate. The printed circuit board includes a first heat generating element and a second heat generating element. The airflow guiding duct includes a top wall, a first sidewall, a second sidewall, a first mounting wall, and a second mounting wall. An input opening is surrounded by the top wall and the first and second sidewalls. A first output opening corresponds to the first heat generating element, and is surrounded by the top wall and the first and second mounting walls. A second output opening is defined in the second sidewall corresponding to the second heat generating element. An obtuse angle is defined between the second sidewall and the second mounting wall.

Abstract: An electronic apparatus has a plurality of basic structures arranged adjacent to each other in a direction perpendicular to a gravitation direction. Each of the basic structures includes a casing, a board placed parallel to the gravitation direction inside the casing, a first space with large ventilation amount and a second space with small ventilation amount formed by the board dividing the inner space of the casing, vents in the upper and lower surfaces of the casing, an electronic component placed on the board in the first space, and an electronic component placed on the board in the second space. The casings of adjacent basic structures are in communication through inner vents in respective side walls of the casings, and external vents in communication with the outside are provided in left and right side walls of the electronic apparatus.

Abstract: A server rack system includes a rack, servers, and a heat-dissipating wall. The rack has guiding rails, a front end, and a rear end opposite to the front end. The servers slidably configured on the guiding rails and in the rack are adapted for being moved into or out of the rack from the front end. The heat-dissipating wall is pivoted to the rear end and adapted for being folded against or unfolded away from the rear end. The heat-dissipating wall includes a fan wall. Fans lie on the fan wall. The fans are adapted for sucking cool air, such that the cool air enters the rack from the front end and passes through the servers. Heat exchange between the cool air and the servers is carried out to generate hot air that flows out of the rack through the heat-dissipating wall to dissipate heat of the servers.

Abstract: A cooling device for rack mount equipment comprises an extensible side duct, open on its inner and rear-facing sides which redirects warm exhaust air exiting vents in the side of a chassis towards the rear of an enclosure holding the chassis. An apparatus incorporating the cooling device may be installed in a rack with the extensible side duct in a retracted position. The extensible side duct may extend under the influence of air pressure, forming a plenum in fluid communication with the interior of a chassis on which it is mounted such that warm air exiting the chassis is collected in the plenum formed by the extensible side duct and directed out towards the rear of the chassis. Use of the apparatus permits conventional front-to-back cooling airflow patterns to be maintained even with chassis having side exhaust vents.

Abstract: An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.

Abstract: An electronic device includes a first body, a second body, a baffle, and a drive mechanism. The second body includes an opening on a bottom surface thereof, and the baffle is disposed on the bottom surface to cover the opening. The baffle is pivotally connected to the second body to rotate with respect to the second body. The drive mechanism includes a pivot, a linkage and a cam. The pivot connects the first body and the second body. The linkage is sleeved over the pivot. The cam is sleeved over the linkage and located corresponding to the baffle. While the first body rotates with respect to the second body, the pivot rotates with the first body and drives the linkage to make the cam rotate. Meanwhile, the cam pushes the baffle and makes the baffle rotate and expose part of the opening to enhance cooling effect of the electronic device.

Abstract: A mounting apparatus includes a mounting base, a securing plate attached to the mounting base, and an enclosure. The mounting base defines an opening. The securing plate includes a securing portion secured to the mounting base. The enclosure extends through the opening and is attached to the securing plate. A circuit board, used to secure a power supply, is received in the enclosure and is attached to the securing plate.

Abstract: A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.

Abstract: A high-voltage apparatus includes a battery device, a high-voltage control device, a housing, and a cooling structure. The cooling structure includes a first cooling channel to cool the battery device, a second cooling channel to cool the high-voltage control device, a connection channel connecting the first cooling channel to the second cooling channel, and a ventilator. The connection channel has a first opening portion connected to the first cooling channel, a second opening portion connected to the second cooling channel, and an inner flow path to communicate the first opening portion to the second opening portion. A sectional area of the first opening portion and a sectional area of the second opening portion are each set to be smaller than a sectional area of the inner flow path.

Abstract: A holding structure for a touch panel has a display panel, a touch panel for allowing an input operation, a supporting frame for holding the display panel at an entire peripheral edge a piezoelectric device for applying vibration to the touch panel in accordance with the operation of the touch panel, a casing for holding the display panel and the touch panel via the supporting frame, and a flexible resin sheet integrally provided to the front surface side of the touch panel. The flexible substrate is formed to have a size entirely larger than a glass substrate on a rear surface side of the touch panel. The peripheral edge of the flexible substrate is held by a rear surface of a peripheral edge of the opening of the casing and a supporting member fixed to the casing.

Abstract: A method for cooling an electronic device having first and second flow paths for transmitting a coolant. The method includes assessing a merit of impelling the coolant along the first flow path relative to impelling the coolant along the second flow path. When the relative merit is above a threshold, coolant is impelled along the first flow path. When the relative merit is below the threshold, coolant is impelled along the second flow path.

Abstract: A robot control device according to one aspect of the embodiment includes a casing, a control circuit, and a fan. The control circuit is allocated in the inside of the casing and controls a robot to be controlled. In the casing, an intake portion is arranged in a top plate and one side plate, and an exhaust portion is arranged in a side plate adjacent to the side plate in which the intake portion is arranged. Further, the fan releases outside air sucked into the casing from the intake portion to the outside of the casing through the exhaust portion.

Abstract: A metal cooling plate functioning includes a plurality of through cooling patterns. Each cooling pattern includes a ventilation through hole and two “V”-shaped annular grooves, each annular groove surrounding the outside the ventilation through hole. Each side of the cooling plate defines the “V”-shaped annular groove, where the annular grooves being paired are directly opposing each other. Areas of the metal cooling plate directly between respective bottoms of the opposing grooves form an annular plastic zone in which electrical resistance is higher than a resistance of the metal base at all other areas.

Abstract: An electronic device includes a chassis and an air guiding apparatus. The chassis includes a bottom wall, a first sidewall, a second sidewall, a first end wall, a second end wall, a circuit board mounted on the bottom wall, and a fan. The air guiding apparatus includes a flexible air guiding piece. The first and second end walls each define a number of vents. A chip is mounted on the circuit board. The fan is installed in the chassis adjacent to the vents of the second end wall. The air guiding apparatus is fixed to the first end wall. A first end of the air guiding piece is stretchable to be fixed to the second end wall. The air guiding piece, the first sidewall, the first end wall, and the second end wall cooperatively bound an airflow channel for receiving the fan and the chip.

Abstract: An electronic device can be provided with a housing having at least one wall defining a cavity and a flow sensor at least partially contained within the cavity. The flow sensor may be configured to detect a flow characteristic related to the flow of a fluid through a first portion of the cavity. The electronic device may also include a processor configured to alter a performance characteristic of the electronic device based on the detected flow characteristic.

Abstract: Resistivity to dust and cooling performance are improved by a simple structure. Electronic apparatus (image display apparatus) 1 includes: housing 31 that forms sealed inner space 33; circuit unit 39 that is provided in inner space 33; first partition plate 34 that is provided in inner space 33 and that has upper/lower partition portion 7, wherein upper/lower partition portion 7 at least partially extends in a lateral direction extending above at least a part of circuit unit 39 and that terminates in front of both lateral sides of housing 31; and first fan 5, 6 that is provided through upper/lower partition portion 7.

Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.

Abstract: A heat dissipation system in a box type chassis of a communication device includes an upper heat dissipation channel and a lower heat dissipation channel, which both have an air exhaust vent and an air intake vent, the air intake vent and the air exhaust vent of the upper heat dissipation channel and the lower heat dissipation channel are defined on sidewalls of the box type chassis, and the air intake vent of the upper heat dissipation channel is located above the air exhaust vent of the lower heat dissipation channel. An air baffle is arranged in the box type chassis to generate a circulative airflow in the box type chassis, and therefore, heat dissipated by a circuit board is circulated in the box type chassis through the airflow, the temperature in the box type chassis reaches an extent that prevents vapor from condensing or even becoming a water film.

Abstract: An electronic device comprises an enclosure, an air blower disposed within the enclosure, an air blower mounting member for mounting the air blower within the enclosure, and a card holder that is disposed using part of the air blower mounting member so as to overlap with the air blower mounting member in the thickness direction and that holds a card.

Abstract: In one embodiment a blower comprises a case comprising a first surface, a second surface opposite the first surface, and a side wall extending between portions of the first surface and the second surface, wherein the side wall comprises an air inlet and an air outlet, an impeller disposed in the case and rotatable about an axis of rotation extending between the first surface and the second surface. Portions of the side wall are disposed at least a first distance from the axis of rotation and the impeller is to define a circumferential airflow path within the case, and the impeller is to create an airflow in the circumferential airflow path between the air inlet and the air outlet.

Abstract: An electronic device including a fan unit capable of setting an air blowing direction toward any of an interface plate side of a casing and a back plate side opposite to the interface plate; a power supply unit; a first housing portion capable of housing the power supply unit and provided within the casing to be close to the back plate; a second housing portion capable of housing the power supply unit and provided within the casing to be close to the interface plate; a detection portion that detects the air blowing direction of the fan unit and a position where the power supply unit is housed; and a warning portion that operates based on the detection portion to give a warning in a case where the air blowing direction of the fan unit is different from the side where the casing houses the power supply unit.

Abstract: An electronic device comprises a case having an air ventilation hole and an opening, a heat source, a radiator disposed inside the case and in thermal contact with the heat source, and an air current generator. The radiator comprises a body having a first and second lateral sides, and a third lateral side disposed therebetween. A first air inlet is disposed on the first lateral side. An air outlet exposed by the opening is disposed on the second lateral side, and a second air inlet is disposed on the third lateral side. The body comprising fins and a geometrical middle side of the fins is between the first and second lateral sides. The second air inlet corresponding to the air ventilation hole is between the geometrical middle side and the first lateral side. An air exhausting hole of the air current generator faces the first air inlet.

Abstract: According to one embodiment of the invention, an apparatus comprises a heat dissipation unit, such as a heat sink, that encases wireless logic in order to completely surround such logic. When adapted as a wireless network device, a casing further encases the heat dissipation unit. The casing includes a plurality of slots that are aligned with heat-radiating elements positioned around the periphery of the heat dissipation unit to allow for cooling by convection.

Abstract: An embodiment includes a transparent sash mounted integral to the perforated doors on racks which hold computer servers typically installed in data centers. The racks are arrayed in rows forming cold aisles and hot aisles. Cooled air introduced into the cold aisle flows through the racks and cools the servers, and subsequently is removed from the hot aisle. Embodiment sashes slide vertically and extend above the tops of the racks and form a sealing relationship with the data center ceiling and adjacent sashes, thereby preventing wasteful mixing and recirculation of cooled and heated air over the tops of the racks. Embodiments are raised and lowered manually or automatically. The controls for the movement of the sashes are tied to the building automation and fire alarm systems and the sashes are lowered automatically upon activation of the data center fire suppression system, thereby complying with code requirements and avoiding interference with the fire sprinkler and suppression systems.

Abstract: Embodiments of the present invention disclose an electronic equipment cooling system including: a cabinet; at least one electronic equipment chassis that is installed inside the cabinet; and an auxiliary cooling device including an air pressurizing device, an air supply plenum box, and an air-guiding device. The air supply plenum box is disposed on an inner side of the cabinet. The air pressurizing device is disposed at the top or bottom of the cabinet, and an air exhaust on a sidewall of the air pressurizing device is connected to a corresponding air intake on a sidewall of the air supply plenum box. The air-guiding device is installed inside the electronic equipment chassis, an air intake of the air-guiding device is connected to an air exhaust of the air supply plenum device, and an air exhaust of the air-guiding device faces a component inside the electronic equipment chassis.

Abstract: The present invention provides a modular circuit card configuration for distributing heat among a plurality of circuit cards. Each circuit card includes a housing adapted to dissipate heat in response to gas flow over the housing. In one aspect, a gas-cooled inverter includes a plurality of inverter circuit cards, and a plurality of circuit card housings, each of which encloses one of the plurality of inverter cards.

Abstract: A vehicular rooftop communication system (200) provides communication electronics (216) within a housing (210) formed of a removable rooftop enclosure (212) and a base (214). The housing (210) is removable and transferable to another vehicle. The vehicular rooftop communication system (200) does not require any access to the vehicle's trunk.

Abstract: A container data center includes a container having a raised floor defining a number of vents, a server system including a cabinet supported on the raised floor adjacent to the vents, a cooling device, an adjusting plate movably installed to the cabinet for covering or uncovering the vents, a driving member, a temperature sensor mounted to the cabinet, and a micro control unit (MCU) electrically connected to the driving member and the temperature sensor. The cooling device releases cooling air into the container under the raised floor. The temperature sensor senses the temperature in the cabinet. The MCU receives the sensed temperature and compares the sensed temperature with a preset temperature, to direct the driving member to drive the adjusting plate to move relative to the vents.

Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

Abstract: A cooling assembly for an electronic image assembly having an open and closed gaseous loop. A closed gaseous loop allows circulating gas to travel across the front surface of an image assembly and through a heat exchanger. An open loop allows ambient gas to pass through the heat exchanger and extract heat from the circulating gas. An optional additional open loop may be used to cool the back portion of the image assembly (optionally a backlight). Ribs may be placed within the optional additional open loop to facilitate the heat transfer to the ambient gas. The cooling assembly can be used with any type of electronic assembly for producing an image.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

Abstract: A fan box is provided with, in addition to an intake port in the front face, a second intake port at a wall surface position upstream of a fan. An Input/output unit disposed above or below the fan box comprises an exhaust notch that is aligned with the second intake port of the fan box, as well as an intake notch that is provided further to the rear than the exhaust notch. The intake notch is in communication with an air duct that opens in the front face of the processor and that leads to a unit box. The fan discharges through an exhaust port cooling wind that has flowed into the first intake port via an operation unit, as well as cooling wind that has flowed into the second intake port via the Input/output unit.

Abstract: Provided is an electronic apparatus including a cooling fan and a cover configuring an outer wall of an air flow path and having a heat sink arranged therein, and effectively utilizing a frame as a member for heat radiation. A cooling fan 40 is arranged on the opposite side of a circuit board across an upper frame 20 and attached to the upper frame 20. The electronic apparatus includes a cover having a shape for covering the air flow path and defining a wall of the air flow path together with the upper frame 20. Heat sinks 61 and 62 are arranged on the inner side of the cover 50.

Abstract: An electronic device includes two opposite sidewalls, a first end wall, and a second end wall. A first partition plate and a second partition plate are connected between the sidewalls. First fans are installed to a middle of the second partition plate, and Second fans are installed to two opposite ends of the second partition plate. An air duct is installed between the second partition plate and the second end wall, aligning with the first fans. Each second fan blows in a direction opposite to that each first fan does. The first fans generate airflow entering between the first partition plate and the second partition plate from the first end wall, and the first partition plate to exhaust through the second end wall. The second fans generate airflow entering between the first partition plate and the second partition plate from the second end wall.