Abstract: A wall mounted modular workstation system utilizes individually mountable modules, such as a keyboard/monitor module, a CPU module, and a medical supply module, that may be each be selectively positioned, mounted, rearranged, used or not used, and/or added or removed at a later time. The individually mountable modules are formed with mountings and vertically located openings for electrical lines and module to module ventilation, which reduce/prevent creation of dust during mounting or later modification of the system.

Abstract: A portable electronic device includes a housing formed with a first receiving space, and a second receiving space communicating spatially with the first receiving space. A keyboard is disposed within the second receiving space. A pop-up mechanism is disposed within the first receiving space, and includes a hollow post body disposed within the first receiving space, and an ejecting member disposed movably within the hollow post body and abutting against a bottom side of the keyboard. The ejecting member is movable between first and second height positions when the keyboard is pressed downwardly. When the ejecting member is in the first height position, the keyboard is in a horizontal position within the second receiving space. When the ejecting member is in the second height position, the keyboard is in a tilted position tilting outwardly from the second receiving space.

Abstract: A display device for an electronic appliance includes: a touch screen panel; an LCD panel; and an intermediate member provided between the touch screen panel and the LCD panel. The intermediate member has an air passage for allowing air to flow into and out of an interior space defined by the intermediate member between the touch screen panel and the LCD panel. The air passage has a plurality of paths oriented in different directions.

Abstract: A server system including a rack and an air cooling device is provided. The rack includes a plurality of support plates dividing the rack into a first chamber and a second chamber. A gap exists between each two adjacent support plates, communicating with the first chamber and the second chamber. The air cooling device includes a first unit defining a first inlet communicating with the first chamber and a first outlet communicating with the second chamber. The first unit cools the air taken from the first chamber via the first inlet, and outputs the cooled air into the second chamber via the first outlet.

Abstract: The present disclosure discloses a cooling system and an electronic device. The cooling system is configured to cool a circuit board assembly in an orthogonal architecture, where the circuit board assembly is arranged inside a cabinet. The cooling system includes: a first cooling air duct that allows air to flow from the front area of the cabinet corresponding to the region of the circuit board assembly into the cabinet and flow through the front portion of the circuit board assembly, then be distributed into two lateral sides of the circuit board assembly, and be discharged out of the cabinet; and a second cooling air duct that allows air to flow from the front area of the cabinet corresponding to one end of the circuit board assembly into the cabinet and through the rear portion of the circuit board assembly, and then be discharged out of the cabinet.

Abstract: A heat dissipation structure includes a circuit board that is disposed inside an outer casing having a chassis formed with air inlet holes, and in which a first electronic component generating heat when driven and a second electronic component not generating heat when driven are mounted on one surface of a base plate, and a heat sink that releases the heat generated in the first electronic component. Here, in the heat sink, a heat dissipation unit positioned facing the base plate, an eaves portion protruding from the heat dissipation unit, and a pair of enclosing portions protruding from ends of the eaves portion in a direction perpendicular to a protruding direction from the heat dissipation unit, and at least one of the air inlet holes is formed in a position facing the eaves portion.

Abstract: An electronic device includes a plurality of electronic components and a cooling system. The cooling system includes a chassis defining an airflow channel including an air inlet and an opposing air outlet, a fan assembly including a plurality of fans located at the air outlet, a valve assembly including a plurality of valve plates located at the air inlet, and a control unit controlling the operation of the fan assembly and of the valve assembly. When only some of the electronic components are operated, the operated electronic components send a signal to the control unit, the control unit calculates the particular valve plates and fans which need to be activated, and activates or starts only the relevant and required valve plates and fans to cool the electronic components.

Abstract: According to one embodiment, an electronic apparatus includes a housing including an outlet, a cooling fan in the housing, a component in the housing configured to serve as a wall guiding air from the cooling fan to the outlet, and a wind shielding portion between the component and an inner surface of the housing.

Abstract: A micro-electromechanical (MEM) synthetic jet actuator includes a semiconductor substrate having a cavity extending therethrough, such that a first opening is formed in a first surface of the semiconductor substrate and such that a second opening is formed in a second surface of the semiconductor substrate. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The first flexible membrane also includes an orifice formed therein aligned with the first opening. The MEM synthetic jet actuator also includes a second flexible membrane that is formed on at least a portion of the second surface of the semiconductor substrate and that extends over the second opening, and a pair of actuator elements coupled to the flexible membranes and aligned with the cavity to selectively cause displacement of the first and second flexible membranes.

Abstract: A power electronic device with cooling arrangement includes a housing that accommodates power electronic components. At least two adjacent axial fans are connected to the housing for inducing an airflow from outside into the housing in order to cool the power electronic components. Furthermore, the device can include a separating wall that extends outside the housing from between the at least two adjacent axial fans in order to reduce noise caused by the fans. Such a cooling arrangement can provide a power electronic device with effective cooling in compact size and also having an acceptable level of noise.

Abstract: An air filter for electrical equipment includes metallic filter media including a first outer layer, an opposing second outer layer, and at least one inner layer disposed between the first outer layer and the opposing second outer layer, and a frame disposed along a perimeter edge of the filter media configured to retain the filter media.

Abstract: An adjustable filler panel assembly, configured for use in an electronic equipment enclosure, includes a first panel and a second panel, each adapted to block airflow. The first panel has pairs of horizontally aligned adjustment openings formed therein, and the second panel has a pair of horizontally aligned attachment members disposed near one end. The first and second panels are connected to one another in an overlapping arrangement to form an air-blocking panel assembly with the attachment members of the second panel being aligned with and connected to a pair of adjustment openings of the first panel. In addition, the first panel and the second panel are telescopically adjustable relative to one another such that a length of the air-blocking panel assembly is selectively adjustable to fill at least a portion of an opening in the electronic equipment enclosure, thereby blocking air from flowing through the opening.

Abstract: According to one embodiment, an electronic apparatus includes a housing provided with air intake holes, a circuit board contained in the housing, with a heat producing component mounted on the circuit board, a heat sink contained in the housing, and a fan which sends cooling air to the heat sink in the housing, and includes a fan casing and an impeller contained in the fan casing. The fan casing includes a first suction port and a second suction port which face each other with the impeller inserted therebetween, and an exhaust port which faces the heat sink. The first suction port communicates with the air intake holes of the housing. The second suction port comprises an open area which faces the heat producing component in the housing, and another open area which is open to inside of the housing at a position deviated from the circuit board.

Abstract: A set-top box is provided that comprises a housing having a first vertical outer wall with a first vent and a second vertical outer wall with a second vent; a circuit board having a first heat source element and a second heat source element; a contoured heatsink in thermal engagement with the first heat source element, wherein the contoured heatsink overlies at least one-third of the circuit board and extends along the first vertical side wall; and a second heatsink contacting the second heat source element, wherein the second heatsink is located in only one half of the device and is aligned with the second vent. The multiple heatsinks and associated vents work in concert to improve heat dissipation.

Abstract: A server includes a rack, at least one server unit, at least one communication exchange unit, at least one rack control unit and an electric power transmission unit. The rack has a plurality of shelving spaces. The server unit, the communication exchange unit, and the rack control unit are moved into or moved out of a corresponding shelving space along a horizontal axis, respectively. The server unit is communicatively connected to the communication exchange unit, and communicates with the rack control unit through the communication exchange unit. The electric power transmission unit is disposed in the rack and runs adjacent to the shelving spaces along a vertical axis. After the server unit, the communication exchange unit and the rack control unit are moved into corresponding shelving spaces, the server unit, the communication exchange unit and the rack control unit are electrically connected to the electric power transmission unit.

Abstract: An electronic device includes a casing, a fan, and a heat sink. The casing defines a plurality of through holes therein. The fan defines air outlet at one side thereof facing the through holes of the casing. The air outlet includes a first portion and a second portion. Air pressure in the first portion is larger than air pressure of the second portion. The heat sink includes a first fin set arranged on the first portion and a second fin set arranged on the second portion. A first passage is defined between each two neighboring first fins. A second passage is defined between each two neighboring second fins. A width of the second passage is less than that of the first passage.

Abstract: An electronic apparatus includes: an outer casing in which an air inflow hole allowing outside air to flow into internal space and a heat releasing hole releasing air temperature of which has been increased in the internal space to the outside are formed; a circuit substrate arranged in the internal space of the outer casing and on which electronic components to be heat sources at the time of driving are mounted; and a heat sink having an attachment base attached to the circuit substrate and plural fins protruding from the attachment base, wherein the outer casing is provided with fluid guide portions positioned opposite to the plural fins of the heat sink and guiding the air with increased temperature, the fluid guide portions are inclined in directions toward the heat releasing hole and the plural fins are inclined to directions toward the heat releasing hole.

Abstract: Various embodiments of systems and methods are presented for effectively removing heat from electrical and electrical-mechanical devices which include relatively high-power Radio-Frequency (RF) components. Improved structure enhances the shielding of components from unwanted and potentially damaging over-heating. Improved structure also enhances the effectiveness by which heat is thermally dissipated by air convection.

Abstract: A monitor system having: a) a monitor for an electronic device with a frame and a substantially flat front wall, at which an image is projected; and b) a cover assembly with a front wall that is configured to block the flat front wall of the monitor with the cover assembly operatively engaged with the monitor. The cover assembly further has a mounting assembly that allows the cover assembly to be changed between: i) a first state wherein the cover assembly is fully separated from the monitor; and ii) a second state wherein the cover assembly is operatively engaged with the monitor. The mounting assembly has a pocket that opens in a first direction. The pocket is movable in the first direction relative to the monitor from a separated, pre-assembly position to cause a first part of the monitor to be seated in the pocket with the cover assembly in the second state.

Abstract: A flow control device and a related cooled electronic system are provided. The electronic system comprises a first heat dissipation component and a second heat dissipation component. The flow control device controls an amount of an air flow to the first heat dissipation component and the second heat dissipation component. In one illustrative embodiment, the flow control device comprises: a memory metal component coupled to the first heat dissipation component and the second heat dissipation component and a movable component comprising a first end and a second end. The first end is coupled to a point between two ends of the memory metal component and the second end is movable with respect to the first end. In response to a temperature difference between the first heat dissipation component and the second heat dissipation component, the second end approaches the first heat dissipation component or the second heat dissipation component.

Abstract: The invention concerns a converter as well as a cooling device and a method for cooling at least a first and a second group of electrically interconnected electrical components (SWA1, SWA2, SWA3, SWA4, SWA5, SWA6, SWA7, SWA8, SWB1, SWB2, SWB3, SWB4, SWB5, SWB6, SWB7, SWB8) in the converter, where the first and second groups are placed on opposite sides of a conductor leading to a connection terminal of the converter. The cooling device (22) comprises a first transporting arrangement (HSA1, HSA2, HSA3, HSA4, HSA5, HSA6, HSA7, HSA8, HSA9, COA1, COA2, COA3, COA4, COA5, COA6, COA7, COA8) transporting cooling medium (M) past the first group and a second transporting arrangement (HSB1, HSB2, HSB3, HSB4, HSB5, HSB6, HSB7, HSB8, HSB9, COB1, COB2, COB3, COB4, COB5, COB6, COB7, COB8) transporting the same cooling medium past the second group.

Abstract: A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger.

Abstract: A power supply system includes a distribution board, two power supplies, an interface board, and a cable. The interface board comprises two parallel connectors arranged at a center portion of a first side of the interface board, a pair of vents respectively defined beside the two connectors, and a first adapter connector formed at an end portion of the first side. The distribution board is coupled to a second side of the interface board and comprising a second adapter connector arranged thereon. The power supplies are respectively connected to the two connectors and each defines an air vent in alignment with the vents of the interface board. The cable is connected between the first adapter connector and the second adapter connector.

Abstract: This disclosure relates to a cooling structure for an electronic device including an inlet for conveying a flow in a first flow direction towards a first component and an outlet for conveying the flow further. To deter dirt particles from proceeding to electronic components, the cooling structure can include a second flow channel, which starts from a port oriented transversely to the first flow direction or away therefrom and receives part of the flow from the inlet, and which conveys the part of the flow to an electronic component located in the second flow channel.

Abstract: A server including a rack, at least one chassis, a plurality of electronic modules, and a cable module is provided. The rack has an opening. The chassis is movably disposed in the rack along a first axis, and moves in and out the rack through the opening. The electronic modules are vertically and detachably disposed in the chassis. A plurality of channels parallel to a second axis and each of the channels is disposed between two adjacent electronic modules, and the first axis is perpendicular to the second axis. The cable module is disposed at a side of the chassis. The cable module is connected to at least one of the electronic modules. When the chassis is moved out from the rack, the electronic module connected to the cable module is next to the opening of the rack.

Abstract: A converter arrangement includes a housing having a first cooling air channel, at least one capacitor disposed in the housing, a fan for generating a cooling air flow, and a first power electronics module disposed in the housing between the at least one capacitor and the fan, as viewed in a direction of the cooling air flow. The first power electronics module is positioned in relation to the fan so as to only be cooled by a first partial air flow. A second partial air flow provided for cooling the at least one capacitor is routed via the first cooling air channel past the first power electronics module such that the second partial air flow is thermally separated from the first power electronics module.

Abstract: A server cabinet adapted for receiving servers therein includes a top plate and a bottom plate opposite to the top plate, a left side plate and a right side plate connecting with the top and bottom plates respectively, and a curtain assembly disposed at a front side of the server cabinet. The curtain assembly includes a pivot and a curtain coiled on the pivot. The curtain assembly defines through holes therein. The curtain is capable of spreading out from the pivot toward the bottom plate to thereby cover the front side of the server cabinet.

Abstract: A fan fixing device for fixing fan units includes two parallel first sidewalls, two parallel second sidewalls, and a number of fixing members. Each first sidewall defines a number of vent ports and includes a vertical plate, a lower plate, and an L-shaped engagement member. The lower plate and the engagement member are positioned at opposite sides of the vertical plate. The second sidewalls are connected between the first sidewalls. The second sidewalls and the first sidewalls cooperatively form a receiving room. The fixing members engage with between the engagement members of the first sidewalls, the fixing member is configured for securing the fan units to the two first sidewalls in the receiving room.

Abstract: To provide an image display apparatus that is allowed to incorporate a panel module with excellent mechanical strength even if a screen is upsized and the apparatus is slimmed down. Strengthening units are mounted along a horizontal direction on canopies provided on an upper portion and a lower portion of a panel module constituting a display unit of a large-size, thin image display apparatus. Also, supporting members are mounted on the upper and lower strengthening units in such a manner that the supporting members bridge between the upper and lower strengthening units, so that a stand, or a chain or a string to be used when hanging the image display apparatus is mountable to the supporting members. This prevents direct application of external force to the panel module.

Abstract: An electronic device including a main body, a rotating base, a motherboard and a driving module is provided. The rotating base has a first vent. The rotating base is pivoted to the main body and suitable for being rotated between an operating position and a retracting position. When the rotating base is located at the operating position, the first vent is exposed from the main body, and when the rotating base is located at the retracting position, the first vent is retracted in the main body. The driving module includes a controlling element and a first locking element. The controlling element is disposed on the main body and suitable for moving between an enable position and a disable position. The first locking element is connected to the controlling element, and the controlling element drives the first locking element to position the rotating base.

Abstract: An electronic device includes a main body and a rotating base. The rotating base has a first vent and is pivoted at the main body and adapted to rotate between an operating position and a retracted position relatively to the main body. When the rotating base is located at the operating position, the first vent is exposed out of the main body, and when the rotating base is located at the retracted position, the first vent is retracted into the main body.

Abstract: An exemplary container data center includes a container, servers received in the container; and a ventilating system for cooling the servers. The ventilating system includes a filter, an exhaust pipe and a blower. The filter includes a chamber and filtering fluid received in the chamber for dissolving dust in ambient air. The chamber defines an air inlet for entering the ambient air and an air outlet. The exhaust pipe has one end coupled to the air outlet of the filter and another end communicating an interior of the container. The blower drives the ambient air out of the filter to flow along the exhaust pipe to the container to cool the servers.

Abstract: An air guiding device is mounted on a main board. The air guiding device and the main board cooperatively form an air passage therebetween for allowing cooling air to pass therethrough. The air passage includes an inlet at a first end of the air guiding device, a first outlet at an opposite second end of the air guiding device, and a second outlet. The air guiding device includes a top wall, two sidewalls, and a shielding assembly. The top wall includes the second outlet therein at an intermediate portion thereof. The second outlet opens toward the second end. The sidewalls extend downwardly from opposite sides of the top wall. The shielding assembly is positioned on the top wall for regulating a size of the second outlet.

Abstract: Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module.

Abstract: A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.

Abstract: A housing, which may contain a hard disk drive, is configured to removably mount to a recessed surface of a console. The housing includes a lip and a biased latch arm so that the lip can be inserted into a corresponding feature in the recessed surface and the housing can be rotatably mounted to the recessed surface. The biased latch arm is retained by a latch arm retainer so that the housing is held in place. A cable connector extends from the bottom of the housing and is configured to connect to a receptor on the console when the housing is installed. When desired, a latch on the housing can be translated where the translation cause the biased latch arm to translate so as to clear the latch arm retainer. Thus the housing can be readily removed from the console. Preferably a portion of the housing extends beyond a wall of the recessed surface so that when installed, the housing alters the profile of the console.

Abstract: A server assembly includes a first server and a first airflow guiding pipe. The first server comprises a front wall. An input hole is defined in the front wall. A first input opening and a first output opening are defined in the first airflow duct. The first output opening corresponds to the input hole so as to guide airflow into the inner of the first server to dissipate heat generated by the first server. The first airflow guiding pipe is connected to the first input opening of the first airflow duct, the first airflow guiding pipe is configured to receive and guide airflow into the first airflow duct.

Abstract: An electronic device housing device includes a housing, a plurality of slots that are arranged side by side inside the housing, the slots each housing the electronic device, a gas passage that guides a gas flowing into each of the slots in a direction across the slots, a connection substrate provided inside the housing to extend upright, the connection substrate being arranged to face the slots, the connection substrate including a connected portion to which a connecting portion of the electronic device housed in each of the slots is to be connected, a ventilation port provided at an end portion of the connection substrate, the ventilation port allowing the gas to flow into through the gas passage from each of the slots, and a fan that sucks the gas flowing into each of the slots into the ventilation port through the gas passage.

Abstract: A system and method for chassis cooling is provided. A preferred embodiment comprises an orthogonal backplane along with a hybrid cooling air flow. One air flow is routed horizontally through aligned and suitable openings on the backplane, vertically over components to be cooled, and horizontally out of the chassis. A second air flow is routed horizontally over components and through aligned and suitable openings on the backplane before it is routed horizontally out of the chassis.

Abstract: The present invention pertains to a cage for thermal management and housing an electric module comprising a cage housing and having a top, bottom and side walls joined to form an interior cavity and the side walls defining a width of the interior cavity. The top wall may have an air inlet port and an air outlet port and the air inlet and outlet ports spaced apart by a length. The length may be most or all of the width, so that air entering the inlet port will travel over a portion of a side of an electronic module mounted in the cavity prior to exiting the outlet port.

Abstract: An electronic device includes a printed circuit board, a heat generating component disposed on the printed circuit board, and a casing including the printed circuit board and the heat generating component, the casing allowing an air flow to flow from an outside to an inside of the casing. The printed circuit board includes a first and second openings and an extending portion formed between the first and second openings so as to extend in a flow direction of the air flow in the casing, and the extending portion includes a conductive pattern and is located opposite the heat generating component.

Abstract: A heat dissipating system includes a shell, a main circuit board, at least two heat generating elements, and at least one fan. The shell includes a first sidewall, a second sidewall facing the first sidewall, and a third sidewall connected to the first sidewall and the second sidewall. The at least one fan are arranged on the first sidewall. The second sidewall defines a number of vents. The main circuit board is positioned between the at least one fan and the vents. The heat dissipating system further includes a connection assembly positioned between the first and second circuit boards. The main circuit board includes a first circuit board and a second circuit board. The first circuit board is electrically connected to the second circuit board through the connection assembly. The at least two heat generating elements are respectively positioned on the first circuit board and the second circuit board.

Abstract: A climate management system for a power supply system including a plurality of cabinets is disclosed. The climate management system comprises a plurality of climate control units connected and in communication with each other, wherein each climate control unit is disposed in a corresponding cabinet to monitor, manage and control the corresponding cabinet, wherein one of the climate control units is defined as a master climate control unit and the other of the climate control units are defined as slave climate control units; and a control system unit connected and in communication with the master climate control unit. The master climate control unit is configured to collect, process and integrate the information transmitted from the slave climate control units and report the collected, processed and integrated information to the control system unit.

Abstract: The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems having parallel cooling air duct channels dedicated to providing cooling air for a converter heat sink and an inverter heat sink, respectively. In particular, a first duct channel through an inverter duct and a converter duct is dedicated to providing cooling air to the converter heat sink without cooling the inverter heat sink, whereas a second duct channel through the inverter duct and the converter duct is dedicated to providing cooling air to the inverter heat sink without cooling the converter heat sink.

Abstract: The present disclosure is generally directed to efficiently cooling converter and inverter components of a drive system. Present techniques relate to a motor drive duct system that facilitates efficient cooling and access to motor drive components. The motor drive duct system includes duct channel paths that are parallel and adjacent to one another. The duct system includes a converter section that houses a converter heat sink, an inverter section that houses an inverter heat sink, an exhaust section, and an air inlet section. The converter section and the inverter section are configured to be attached and detached from each other at end sections that are angled to receive one another. Further, the inverter section, converter section, and air inlet section are configured to roll into and out of a cabinet, which facilitates access to field wiring.

Abstract: An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

Abstract: An electronic device includes an enclosure. The enclosure includes a motherboard area and a power supply area adjacent to the motherboard area, which are both located at a first end of the enclosure, a hard disk drive area for mounting hard disk drives at a second end of the enclosure, and a fan area arranged between the motherboard area and the hard disk drive area.

Abstract: A kit for providing front-access cable terminations for rear-access shelf unit mounted in a rack system may comprise a terminal block panel, a terminal block, a set of extension cables, a rear panel, and a baffle. The terminal block panel may be configured to mount to the shelf unit. The terminal block may be mounted to the terminal block panel to provide front-access terminations for the shelf unit. The set of extension cables may provide electrical connection between the terminal block and one or more terminals disposed on a back plane associated with the shelf unit. The rear panel may be configured to attach to the shelf unit and to cover the set of extension cables. The baffle may be configured for installation in the rack system above the shelf unit and removable for access to the front-access terminations. The baffle may be configured to direct air flow rising from the rear-access equipment to the rear of the rack.

Abstract: A heat dissipating system includes an enclosure, which includes a rear plate and a side plate. A heat sink is mounted on the side plate. A power supply unit is mounted on the rear plate. A first fan is mounted in an inner room of the power supply unit. The power supply unit includes a bottom wall which defines a plurality of first vent holes and a rear wall which defines a plurality of second vent holes. The first fan is aligned to the plurality of second vent holes. The bottom wall is located above the heat sink. The first fan is adapted to rotate to drive air flowing in the power supply unit via the plurality of first vent holes from the heat sink, and following out of the power supply unit via the plurality of second vent holes.

Abstract: A car electric equipment case module includes a housing, a covering structure, an electric equipment set, and a fan. The housing has a side wall, a containing space containing the electric equipment set and a first ventilator formed on the side wall. The covering structure includes a casing assembled to the housing and a block wall connected to the casing and extending outside the side wall to cover the first ventilator. An air channel connected the first ventilator is formed between the block wall and the side wall. The fan configured in the housing provides an air flow. The air flow flows into the containing space through the air channel and the first ventilator and flows out through a second ventilator formed on the covering structure, or flows into the containing space through the second ventilator and flows out through the first ventilator and the air channel.