Abstract: The present invention discloses a backlight module and a ventilation component thereof, and a back plate of the backlight module is provided with a plurality of the ventilation components. The ventilation component comprises: a tubular body, a ventilating filter, a filter washer, and a fixing ring. The tubular body is hollow, and the ventilating filter is carried in the tubular body. The ventilating filter can communicate the internal air with the external air of the backlight module circulate to effectively descend the temperature of the internal air, so that the thermal expansion of the light guide plate in the backlight module can be decreased to prevent from generating an optical problem.

Abstract: A high-density server includes a plurality of server enclosures, each of which includes an enclosure housing with a pair of module decks, a pair of power source units, a plurality of cooling fans, and two pairs of server modules. Cooling fans are linearly aligned and positioned in proximity to the rear opening of the enclosure housing with upper rear openings thereabove and lower rear openings therebelow, while server modules are installed in module decks inside the enclosure housing in an insertable/removable manner. Server modules have module trays for mounting electronic components and interface units. Interface units are retractively inserted into upper rear openings or lower rear openings in connection with power source units when server modules are moved in front-rear directions along module decks inside the enclosure housing. The server enclosure is equipped with a redundant power transmitter establishing redundant multiple connection between power source units and server modules.

Abstract: An air cooled switching unit for a motor drive includes a forced air cooling chamber and a convective cooling chamber separate from the forced air cooling chamber. An exhaust port of the forced cooling chamber is configured to direct exhaust air across an outlet of the convective cooling chamber to induce an increased air flow through the convective cooling chamber thereby increasing the cooling capacity of the convective cooling chamber.

Abstract: An exemplary electronic device includes an electronic component, a heat dissipation device, a casing, and a heat insulation layer. The heat dissipation device is positioned on the electronic component for dissipating heat generated by the electronic component. The electronic component and the heat dissipation device are located at an inner side of the casing. The heat insulation layer is located on the heat dissipation device and is close to the casing. The heat insulation layer is made of aerogel material.

Abstract: A cooling system includes a fixing device and a fan. The fixing device includes a fixing rack and a latching rack. The fixing rack includes a first latching arm and two opposite supporting arms protruding from two ends of the first latching arm. The latching rack includes a second latching arm and two opposite adjusting arms protruding from two ends of the second latching arm. The adjusting arms can be adjustably fixed to the supporting arms at different positions to adjust a distance between the first latching arms and the second latching arm to releasably fix the fan between the first latching arm and the second latching arm.

Abstract: An exemplary embodiment of an electronic device includes a cover including a first hole, and a heat dissipating assembly. The heat dissipating assembly includes a movable board including a second hole and slidably connected to the cover, and a heat magnifying device received inside the cover and adjacent to a heat element. The heat magnifying device includes a moving end secured with the movable board. When the heat element is maintained room temperature, the first hole and the second hole are staggered from each other to seal the cover. When heat generated by the heat element heats the heat magnifying device and causes the moving end of the heat magnifying device to move under thermal expansion and drive the movable board to slide relatively to the cover, and the first hole of the cover and the second hole of the movable board are communicated with each other.

Abstract: The present disclosure relates to an adjustable air suction device, comprising a driving structure, an air suction structure, and a link structure. The driving structure and the air suction structure are disposed on a housing of an electronic device. The link structure is disposed inside the housing. Both ends of the link structure correspond to the driving structure and the air suction structure, respectively. The driving structure drives one end of the link structure to move towards a first direction, and drives the other end of the link structure to move towards a second direction. The other end of the link structure pushes the air suction structure, and projects from the housing. Besides, the air suction structure corresponds to a heat dissipating device of the electronic device and draws a great deal of fluids into the electronic device for dissipating the heat of the electronic components in the electronic device.

Abstract: An exemplary electronic device includes an electronic component, a heat dissipation device, a fixing member and a casing contained the electronic component, the heat dissipation device and the fixing member therein. The heat dissipation device thermally contacts the electronic component. The fixing member includes a main body and an engaging portion extending from the main body. The engaging portion fixes the heat dissipation device to the fixing member. Fasteners extend through the casing and engage the main body of the fixing member to secure the fixing member on the casing.

Abstract: A chassis extension module includes an extension housing structure and a support structure. The extension housing structure is to be attached to a housing structure of another module. Attachment of the extension housing structure to the housing structure of the other module expands an inner volume of an assembly.

Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device.

Abstract: A control unit is proposed which makes it possible to prevent connection problems between a package box and a backboard and prevent damage to the connector of the backboard. The control unit comprises a unit cover in which a first package box, which comprises a predetermined function and on the rear side of which a first connector is provided, is inserted into the corresponding spatial area so as to move over a shelf from an open end [of the unit cover]; and a backboard which is disposed inside the unit cover and on which a second connector is provided in a position where the first package box, inserted in the corresponding spatial area, mates with the first connector, wherein the shelf is provided with a protrusion which rotatably supports the first package box in a fan direction.

Abstract: A structure for storing and cooling electronics comprising a frame support, an internal equipment chamber mounted to the frame support, wherein the internal equipment chamber comprises a tubelike structure defining openings in a front and a back of the internal equipment chamber, and wherein the internal equipment chamber is configured to support electronic equipment such that the weight of the electronic equipment is born by the frame support and not the internal equipment chamber, and a plurality of removable panels disposed around the frame such that a gap is formed between the exterior of the internal equipment chamber and the plurality of removable panels, wherein air may circulate in the gap between the internal equipment chamber and the plurality of removable panels to help regulate a temperature within the internal equipment chamber.

Abstract: The present invention relates to a heat radiating structure in all-in-one computers, comprising a pedestal, mainframe module and back cover. The mainframe module is contained in a containing stand behind the pedestal, and a motherboard is included in the containing space in front of a mainframe module base. The motherboard's CPU sticks through a radiator to a heat radiating aluminum plate in the rear of the containing space, while the hard disk drive is close to the heat radiating aluminum plate, and the pedestal is covered by the back cover on the back. With the heat radiating aluminum plate to quickly conduct heat and its multiple heat radiating holes, heat dispersing holes behind the containing stand and hollowed grooves on the back cover to convect hot air.

Abstract: A heat dissipation system includes an enclosure, and a mainframe module enclosed in the enclosure. The mainframe module includes a baseboard with a motherboard and a mass storage device attached to the baseboard, a first cooling fan mounted on a top surface of the motherboard, and an air guiding panel attached on the baseboard surrounding the mass storage device. The air guiding panel guides cool air to the mass storage device along a first direction and out of the mainframe module by the first cooling fan in a second direction perpendicular to the first direction.

Abstract: A server includes a server enclosure having an accommodating room with a front area and a rear area and a top plate defining a first intake hole communicating with the accommodating room, a first component module and a second component module respectively at the front and rear areas, a first fan module and a second fan module in the accommodating room. The first fan module is for forcing air to flow from the front area to the rear area. The second fan module includes an air-guiding housing and a fan inside the air-guiding housing. The air-guiding housing has a second intake hole aligned with the first intake hole, and an exhaust hole opening toward the rear area. The fan draws air outside the server enclosure through the first and second intake holes, and blows the air toward the rear area through the exhaust hole.

Abstract: An electronic device includes an enclosure and a first air guiding duct mounted in the enclosure. The first air guiding duct includes a first part and a second part. The first part defines a first air channel and a second air channel. The second part defines a third air channel communicating with the first air channel and a fourth air channel located at a side of the second air channel. A guiding wall is located in the second air channel and extends from the second air channel to the fourth air channel. When air flows from the first part to the second part of the first air guiding duct, air flows from the first air channel to the third channel to cool a first electronic component, and flows from the second air channel to the fourth air channel by the guiding wall to cool a second electronic component.

Abstract: An electronics compartment is disclosed with a component space which is sealed off from a surrounding environment by walls. An internal panel is arranged in the component space along a wall of the electronics compartment for delimiting an internal channel between the wall and the internal panel. An external panel is arranged along a same wall of the electronics compartment as the internal panel, but outside the component space for delimiting an external channel between the wall and the external panel. Air flowing in the internal channel and external channel can improve heat transfer through the wall, and cool electric components in the component space.

Abstract: An electronics compartment with a component space which is sealed off from a surrounding environment by walls, including an internal panel arranged in the component space along a wall of the electronics compartment for delimiting an internal channel between the wall and the internal panel. Air flowing in the internal channel can improve transfer of heat through the wall, and consequently, cools electric components in the component space.

Abstract: According to one embodiment, a television receiver includes: a housing comprising an air intake vent and an air exhaust vent; a circuit board device in the housing; a fan in the housing, the fan configured to supply airflow to the circuit board device; an elastic member configured to be placed in an opening of the housing or inside the housing; and a flexible sheet-like first member in the housing at a position where the flexible sheet-like first member covers at least a part of the opening, the flexible sheet-like first member configured to support the elastic member.

Abstract: There is provided an electronic apparatus which includes a heat-generating member, and first and second fans configured to include first and second air outlets, respectively, the first and second fans facing the heat-generating member, wherein each of the first and second air outlets includes a main region and a sub-region separated by respective center lines of the first and second air outlets, when the first and second fans are viewed from a direction perpendicular both to a direction in which the first and second fans are arranged and to a direction in which air passing through the first and second air outlets flows, the volume of air passing through each of the main regions is larger than the volume of air passing through each of the sub-regions, and the main regions are adjacent to each other.

Abstract: An electronic device includes an enclosure, a circuit board, and an air duct. The enclosure includes a bottom plate, the bottom plate defining a vent opening. The circuit board is attached to the bottom plate. A first heat generating part and a second generating part are located on the circuit board. The air duct is secured to the circuit board. The air duct defines a first air flows guiding passage and a second airflow guiding passage. When air flows through the vent opening, the first air flows guiding passage is configured to guide air flows to dissipate heat generated by the first heat generating part, and the second air flows guiding passage is configured to guide air flows to dissipate heat generated by the second heat generating part.

Abstract: A semiconductor cooling device for transferring heat from a semiconductor die (111). The semiconductor cooling device includes a heat dissipator (112) that may be thermally coupled to a semiconductor module (111) to be cooled for dissipating heat from the semiconductor die (111); a housing (150) in or on which the semiconductor die (111) is mounted; a fluid flow passage (153) for providing a forced fluid flow within the housing (150); and a fluid path (155) arranged to guide the forced fluid flow in a first direction between the fluid flow passage (153) and the heat dissipator (112) and further arranged to guide the fluid flow along the heat dissipator (112) in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.

Abstract: Electronic equipment includes a body case, a control unit, a partition board, and a heat exchanger attached to the partition board. The heat exchanger includes a hot-air passage for carrying hot air heated in the body case; a first blower for blowing the hot air into the hot-air passage; a cool-air passage for carrying cooling air from outside the body case, the cooling air being lower in temperature than the hot air; and a second blower for blowing the cooling air into the cool-air passage.

Abstract: An enclosure of an electronic device includes a chassis, a sliding plate slidably disposed on the chassis, and a pivot member. A number of vent holes and a location hole are defined in the chassis. A number of teeth are formed on a sidewall bounding the location hole. A through slot is defined in the sliding plate. A toothed rack is formed on a sidewall bounding the through slot. The pivot member extends through the through slot and the location hole. The pivot member includes a toothed portion engaging with the toothed rack and the teeth, and a smooth neck. When the toothed portion disengages from the teeth, the neck is pivotably received in the location hole, the pivot member is pivoted to drive the sliding member to slide relative to the chassis by the toothed portion rolling on the toothed rack, thereby exposing or covering the vent holes.

Abstract: An electronic apparatus includes a casing, a separation structure, a fan, a first heat generating element and a heat conducting module. The casing has an air inlet and an air outlet. An inner portion of the casing includes first and second areas connected to the air inlet and the air outlet respectively. The separation structure is disposed at a border between the first and the second areas to separate the first and second areas. The fan is disposed in the first area adjacent to the air inlet and adapted to provide a heat dissipation airflow. The heat dissipation airflow flows through the air inlet, the first area, the second area and the air outlet sequentially. The first heat generating element is disposed in the second area. The heat conducting module is connected between the fan and the first heat generating element.

Abstract: An electronic device including a main body, a heat dissipation fan and at least one block is provided. The main body has a side shell and a bottom shell. The side shell has a first air inlet and a first air outlet. The heat dissipation fan is disposed in the main body and has at least one second air inlet and at least one second air outlet. The second air outlet is aligned to the first air outlet. The block is disposed in the main body to form a channel with the bottom shell and the dissipation fan. The channel is extended between the second air inlet and the first air inlet, so as to guide airflow to pass through the first air inlet and the second air inlet sequentially and enter the heat dissipation fan.

Abstract: A display apparatus includes a display unit; a chassis member provided at the rear side of the display unit; a fan attached to the chassis member; a first circuit substrate that is provided between the display unit and the chassis member and of which the component-mounting surface is arranged at a position facing the fan side; and a second circuit substrate that is provided between the display unit and the chassis member and of which the component-mounting surface is arranged to face the display unit side.

Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.

Abstract: A cable management system is provided that includes a cable management rack for accommodating a heat generating device, a first baffle mounted with respect to a first upright of the rack and for redirecting a rearward flow of cool air sideways from a space adjacent a front side of the rack, and/or a second baffle mounted with respect to a second upright of the rack and for redirecting a sideways flow of exhaust air from the rack and through the second upright into a space adjacent a rear side of the rack. A method of cooling a heat-generating device mounted in or on a cable management rack includes providing a sideways flow of cooling air into the rack and into the device.

Abstract: A photovoltaic junction box that comprises a housing that has at least first and second sides and the second side has at least one heat dissipating component. A conductor plate is received in the housing. The conductor plate supports at least one heat emitting component and at least one heat conducting component corresponding to the heat dissipating component of the housing. A mounting flange extends from the second side of the housing. At least a first gap is located between the second side of the housing and the mounting flange. The gap creates an air channel that allows air to flow between the housing and the mounting flange.

Abstract: A method, programmed medium and system are provided for altering the airflow through an electronic device such as a laptop computer in response to overheating, and feedback about the state of use of a laptop computer. In an exemplary embodiment, a laptop case is constructed such that it has an alternate opening for each intake and/or exhaust port. The primary intake and/or exhaust port is located such that it does not interfere with the user while the laptop is being operated normally. When it is detected that an intake and/or exhaust port is potentially blocked, it is determined whether or not the laptop is actively being used. If the laptop is not being used when an overheated condition is detected, a predetermined action is taken to change the air input/output air flow through an alternate exhaust path.

Abstract: The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction.

Abstract: A power supply system includes a distribution board, two power supplies, an interface board, and a cable. The interface board comprises two parallel connectors arranged at a center portion of a first side of the interface board, a pair of vents respectively defined beside the two connectors, and a first adapter connector formed at an end portion of the first side. The distribution board is coupled to a second side of the interface board and comprising a second adapter connector arranged thereon. The power supplies are respectively connected to the two connectors and each defines an air vent in alignment with the vents of the interface board. The cable is connected between the first adapter connector and the second adapter connector.

Abstract: A fan assembly includes a housing; a plurality of fan units mounted in the housing; and a flex printed circuit board (PCB) having a first portion, the first portion of the flex PCB electrically connected to each of the plurality of fan units, the flex PCB having a second portion, the second portion of the flex PCB including a printed circuit assembly (PCA), the PCA having mounted thereon a connector to connect to a PCA disposed within a chassis.

Abstract: A fan includes, an impeller having propeller-shaped blades, a motor disposed inside of a hub to rotationally drive the impeller centered on the rotation axis, a tubular air duct forming an air passage on a periphery of the blades of the impeller and the rotation axis, wherein the rotation axis penetrates the inside of the air duct, and an exhaust outlet larger than an outer diameter of a rotation trajectory of the blades is formed on one end of the air duct, and an air flow guiding plate blocking an opening on an other end of the air duct in the rotation axis direction, a suction inlet through which the rotation axis passes being formed in approximately the center of the air flow guiding plate, wherein the blades are closer to the air flow guiding plate than the air duct.

Abstract: A filler panel for an electronics shelf is provided. The electronics shelf includes a plurality of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a back wall, a top wall, a bottom wall and a single side wall. The front wall, back wall, top wall and bottom wall are configured to fill a width of a slot of the electronics shelf. The side wall is configured to extend into a depth of the slot, The filler panel also includes an electromagnetic shielding portion comprising a conductive material that is coupled to the main body. The main body further includes one or more vents positioned in each of the top wall and the bottom wall, the vents configured to allow air flow though the main body.

Abstract: A heat exchange device includes a housing, an internal circulating fan, an external circulating fan and a heat exchange unit. The internal and external circulating fans and the heat exchange unit are disposed in the housing. The internal and external circulating fans are disposed at the same side relative to the heat exchange unit. A closed-type electronic apparatus including the heat exchange device is also disclosed.

Abstract: A PCB with improved cooling. Openings are provided below electronic components on the PCB of an electronics device. Raised mounts or bosses on the device housing or base extend into the openings and make contact with the electronic components to act as heat sinks. A thermal pad member can be positioned between the bosses and the components to aid in the contact and heat conduction. Other embodiments include direct contact of the raised mounts or bosses with the PCB and through openings are not provided.

Abstract: An enclosure includes a housing, partition plates received in the housing, hard disk drives fixed between the partition plates, a cover fixed to the housing, a printed circuit board received in the housing and a fan assembly fixed within the housing. The housing includes a bottom plate and a pair of side plates. Each side plate has a guiding device mounted thereon. The guiding device includes a supporting element fixed to the side plate, a fixing element fixed with the printed circuit board, and a rod pivotably connecting the fixing element with the supporting element. The partition plates each have a hook, and the printed circuit board defines multiple slots corresponding to the hooks. The printed circuit board can be driven towards the partition plates by the fixing element around the supporting element so that the slots are aligned and locked with the hooks.

Abstract: A display device has a display panel, a cabinet configured to accommodate the display panel, a ventilating portion configured to communicate with the space inside the cabinet, a lid configured to covers the ventilating portion, a first and second vents formed on the lid, a first hood provided on the first vent, the first hood has an opening facing the second vent, and a second hood provided on the second vent, the second hood has an opening facing the first vent.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a cooling fan in the housing including an intake and a discharge hole, and a wind shielding portion between the intake of the cooling fan and the discharge hole of the cooling fan. The wind shielding portion partitions at least partially an inner space of the housing.

Abstract: An electronic device including a first body, a rotating base and a transmission module is provided. The rotating base has a first ventilation opening. The rotating base is pivoted on the first body and suitable for rotating between a using position and a retracted position in relative to the first body. When the rotating base is located at the retracted position, the first ventilation opening is exposed from the first body. When the rotating base is located at the using position, the first ventilation opening is retracted in the first body. The transmission module is connected to the rotating base for outputting a mechanical force to actuate the rotating base.

Abstract: An electronic device includes a bottom plate, a cover plate, a dust collection box, and a dust cleaning apparatus. A heat sink is mounted in the bottom plate. The cover plate covers on the bottom plate. The cover plate defines a cutout. The dust collection box is placed on the bottom plate via the cutout. The dust cleaning apparatus is slidably mounted on the bottom plate. The dust cleaning apparatus moves relative to the heat sink to sweep dust of the heat sink into the dust collection box.

Abstract: An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.

Abstract: An electronic device includes: a plurality of slots where a plurality of electronic instruments are mountable; and an electronic instrument inserted in any of the plurality of slots; wherein the electronic instrument includes a flow rate limiting member that protrudes to a side of an adjacent slot where no electronic instrument is mounted and limits a flow rate of cooling air flowing through the adjacent slot.

Abstract: In accordance with the present disclosure, a system and method for an optimizable rack solution is presented. The system and method is directed to an optimizable rack that includes a frame. The frame has both a primary portion and a detachable portion. The primary portion may contain a primary enclosure and the detachable portion may container a secondary enclosure. Each of the primary enclosure and secondary enclosure are sized to hold a plurality of computing systems. Detaching the detachable portion of the frame both reduces the size and computing systems capacity of the frame.

Abstract: A system to remove heat from a heat-generating electronic component within a computer chassis and to contain electromagnetic radiation from traversing high-throughput vents in a bezel that forms a portion of the chassis containment structure comprises a heat sink having a fin structure with an inlet face, an outlet face and interconnected air channels therethrough, a base to engage the component and to transfer heat from the component to the fin structure, wherein the inlet face of the fin structure is disposed proximate the vents to block electromagnetic radiation from traversing the vents. In one embodiment, a heat pipe or a spreader bar moves heat from a base engaging a component distal from the bezel to the fin structure having an air inlet face proximal to the vents.

Abstract: With respect to a housing device having a plurality of slots in which plug-in units are mountable, division plates corresponding to the positions of the openings of the slots are put in the inside of a baffle section for changing the direction of the flow of cooling air released from the slots, and the division plates are used to divide the inside space of the baffle section into a plurality of regions corresponding to the slots, thereby reducing mutual interference of the cooling air from the slots in the baffle section and preventing a further increase in differences in the amount of passing air among the slots. Thereby, even if any difference occurs in the amount of passing air among the slots due to a structural factor, it is possible to reduce the deterioration of the cooling capacity of a slot through which relatively less amount of air passes.

Abstract: A keyboard including a case, a first fan, an air deflector and a keycap module is provided. The case includes a first side and a second side. The first side has an opening, the second side is disposed at a side of the first side and has at least one hole. The first fan is disposed at the second side and located between the first side and the second side. The air deflector is disposed between the first side and the second side of the case and corresponding to the hole of the second side and the opening of the first side. The keycap module is disposed at the opening of the first side.

Abstract: A system is provided in one example embodiment that includes at least one rack for electronic equipment, each rack including: at least one sensor configured to measure an environmental condition, an air conditioning system, an ingress port configured to allow air to flow into a corresponding rack from an environment surrounding the racks, and an egress port configured to allow air to flow out of a corresponding rack and into the environment surrounding the racks. The system also includes a housing that surrounds the racks and that defines the environment surrounding the racks. The air that flows out through the egress ports of the racks conditions the air in the environment surrounding the racks.