Abstract: Provided is an electronic module including a housing case for housing a relay, a heat transfer sheet placed on one wall portion of the housing case, a bus bar that is connected to the relay and is partially in contact with the heat transfer sheet, and a pressing portion that presses the bus bar against the heat transfer sheet.

Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.

Abstract: A display device includes a display panel including a first area, a bending area, and a second area, and comprising a plurality of pixels disposed in the first area, a driving chip disposed on an upper surface of the second area of the display panel and electrically connected to the plurality of pixels, a support layer disposed on a lower surface of the first area of the display panel, and a spacer disposed on the lower surface of the first area and overlapping the support layer in a plan view, wherein the spacer comprises an upper layer, a lower layer, and a base layer having a thermal conductivity greater than a thermal conductivity of the upper layer and a thermal conductivity of the lower layer, and in case that the bending area of the display panel is folded, the spacer overlaps the driving chip in a plan view.

Abstract: Embodiments disclosed herein include an electronics package and methods of forming such electronics packages. In an embodiment, the electronics package comprises a package substrate, and a first die coupled to the package substrate. In an embodiment, a cavity is formed through the package substrate. In an embodiment, the cavity is within a footprint of the first die. In an embodiment, the electronics package further comprises a thermal stack in the cavity. In an embodiment, the thermal stack contacts the first die.

Abstract: An image pickup apparatus, having a grip portion, an image sensor, and a mount portion receives attachment of an interchangeable lens, includes a control circuit, a display panel disposed on a rear face side of an exterior member, and a heat dissipation fan disposed on a bottom surface side of the exterior member. The image sensor, control circuit, and display panel are arranged in an optical axis direction. A duct, having a first vent, is disposed between the grip and mount portions of a front face of the exterior member, extends in the optical axis direction from a top toward a bottom surface side between substrates of the image sensor and the control circuit, and connects to a second vent formed across an optical axis. The heat dissipation fan is disposed inside the duct and is located on bottom surface sides of the image sensor and the control circuit substrates.

Abstract: A motor controller including a control box and a control panel disposed in the control box. The control box includes at least a first chamber and a second chamber. The control panel is disposed in the first chamber.

Abstract: An electrical module assembly is provided. The electrical module assembly includes a circuit board with a first circuit-board surface and a second circuit-board surface defining a cavity, and an antenna disposed on the first circuit-board surface. The electrical module assembly also includes a wafer-level packaged (WLP) die embedded in the cavity. The WLP die has a first WLP die surface and a second WLP die surface. The second WLP die surface has electrical contacts thereon. The circuit board includes vias that extend from the antenna through the circuit board to the first WLP die surface to interconnect the antenna and the WLP die. The electrical module assembly further includes a second circuit board coupled to the second circuit-board surface, and coupled to the WLP die at the electrical contacts on the second WLP die surface of the WLP die.

Abstract: A single device having both thermal and alignment features is provided to mechanically align and more efficiently cool multiple heat generating components. The device includes one or more thermal structures and assembly alignment features, in which the one or more thermal structures make thermal contact with a plurality of heat generating components. The assembly alignment features control the positions of the heat generating components during assembly of the heat generating components onto a common substrate.

Abstract: It is an object to provide a flow rate sensor device having improved sensor responsiveness compared with the prior art. The present invention is a flow rate sensor device including a sensor element that detects a flow rate, wherein a sensor unit on which the sensor element is mounted and a drive substrate including a drive control circuit are connected through a connection portion narrower than a width of the drive substrate. Thus, a heat source in the drive substrate and a heat source in the sensor unit can be separated by the connection portion that is thin in width, and the thermal influence from the drive substrate to the sensor unit can be suppressed. Therefore, good sensor responsiveness can be maintained.

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.

Abstract: A package-integrated power semiconductor device is provided, which includes at least one power transistor coupled to a current path, a current measurement device and a package. The current measurement device is electrically insulated from and magnetically coupled to the current path. The current path and the current measurement device are arranged so as to enable the current measurement device to sense the magnetic field of a current flowing through the current path. The at least one power transistor, the current measurement device, and the current path are arranged inside the package. Further, a power module assembly including the package-integrated power semiconductor device as well as a method of operating the package-integrated power semiconductor device are provided.

Abstract: The present application has an object of restricting a temperature rise caused by heat generated by an electronic part or a connection member mounted on a substrate, and includes a first heat conducting member that thermally couples the bus bar extended to a housing side and the housing, a second heat conducting member that thermally couples a capacitor and the housing, and a third heat conducting member that thermally couples a semiconductor element and the housing, wherein each of the bus bar, the substrate, the capacitor, and the semiconductor element is cooled.

Abstract: The invention specifies an arrangement having at least one electrical module (2) which is arranged on a heat sink (3). The arrangement has: —first deflection elements (4) which are formed in or on the electrical module (2), —second deflection elements (5) which are formed in or on the heat sink (3), and—at least one flexible, cable- or strip-like tensioning element (1), —which is arranged between the first and second deflection elements (4, 5) under tension (F) in such a way that the electrical module (2) is pressed onto the heat sink (3). A converter and an aircraft having an arrangement of this kind and also a method for producing an arrangement of this kind are likewise specified.

Abstract: A carrier substrate and a packaging method, the carrier substrate including a first layer; a second layer; and a first glue layer between the first layer and the second layer, wherein the first glue layer is removably attached to the first layer.

Abstract: Provided is a highly reliable power circuit device. The power circuit device includes a printed substrate, a power circuit, and a housing. The power circuit is formed on the printed substrate. The housing is connected with the printed substrate. The power circuit includes secondary-side switching elements, at least one smoothing choke coil, and smoothing capacitors. Portions of a smoothing choke coil core serving as a core of the smoothing choke coil are inserted in opening portions formed in the printed substrate. A winding of the smoothing choke coil is formed on the printed substrate. The smoothing choke coil is located between a region C in which the smoothing capacitors are arranged and regions A and B serving as a second region in which primary-side switching elements and the secondary-side switching elements serving as electric elements are arranged.

Abstract: A circuit card assembly for a vehicle chassis is provided. The circuit card assembly may include a circuit card unit, a wedge-lock retainer unit, and a support bracket. The circuit card unit has a printed circuit board (PCB) defining a first fastener aperture. The wedge-lock retainer unit may define a second fastener aperture. The support bracket includes first and second elements. The first element may define a third fastener aperture and the second element may define a fourth fastener aperture. The PCB, the wedge-lock retainer unit, and the support bracket may be arranged with one another such that the first fastener aperture, the second fastener aperture, and the third fastener aperture are aligned with one another and such that the fourth aperture is oriented in alignment with a chassis aperture of a chassis.

Abstract: Provided is a connection structure for connecting electrodes of a plurality of capacitors, including: a circuit board that includes power source patterns and through holes into which the electrodes are inserted, the circuit board being placed on the capacitors; bolts that include shaft portions that are inserted into the through holes and are screwed into the electrodes of the capacitors and head portions that are formed integrally with the shaft portions and press the power source patterns to the electrodes via the circuit board, and spacer portions that are arranged in the through holes and support the bolts.

Abstract: An electrical component configured to reduce a decrease in lifetime of a solder bonding portion of a lead terminal, and a method for manufacturing the electrical component are provided. The electrical component includes a unit, a housing case, and a sealing member. The unit includes a circuit board, a cover member covering the circuit board, and a lead terminal integrated with the cover member and soldered to the circuit board. The housing case houses the unit. The sealing member is disposed between the cover member and the housing case. The method for manufacturing the electrical component includes positioning the unit with respect to the housing case while disposing a liquid sealing member as a precursor of the sealing member between the cover member and the housing case, and hardening the liquid sealing member after the positioning.

Abstract: An outdoors consumer electronics device such as a camera contains electrical equipment this is isolated from exterior moisture. The consumer electronics device includes a housing configured to contain the electrical equipment, a seal mounted to the housing, and a cover that is releasably installable onto the housing. The seal includes a top surface that forms an inclined plane related to a bottom plane extending through the bottom edges of the seal. When the cover is installed onto the housing, the seal is compressed along a planar surface. Once the seal is compressed, moisture is prevented from entering the interior of the housing. While the seal that is formed when the cover is mounted to the housing is planar, the sealed area is non-planar.

Abstract: System for cooling a power tool. One exemplary power tool includes a housing including an air intake and an air exhaust. The power tool further includes a motor and a fan configured to pull cooling air into the housing through the air intake, and exhaust the cooling air out of the housing through the air exhaust. The power tool further includes a plurality of field-effect transistors (FETs). The FETs couple the stator coils to a power source. The power tool further includes a FET board within the housing. The power tool further includes a heat sink within the housing. The heat sink includes a first mounting portion and a second mounting portion. Each of the mounting portions includes a horizontal fin extending toward a respective side of the housing. A plurality of vertical fins extends from a top surface of each of the horizontal fins.

Abstract: An optical transceiver may include a housing including a surface cutout. The surface cutout may be for receiving a locking tang from a cage and for being disengaged by a slide from an unlocking tool wherein the surface cutout is disposed on the housing at a position such that the surface cutout is entirely within the cage with respect to an electromagnetic interference (EMI) gasket of the cage when the optical transceiver is inserted into the cage.

Abstract: A heat dissipation substrate includes an insulating layer, a metal heat dissipation block, and a patterned structure layer. The insulating layer has a first surface, a second surface and at least one through hole. The metal heat dissipation block passes through the insulating layer from the second surface of the insulating layer and has an upper surface, a lower surface, and a contact surface. There is a first vertical height between the contact surface and the lower surface. The patterned structure layer includes a patterned circuit layer and at least one conductive structure layer. The patterned circuit layer is disposed on the first surface of the insulating layer, and the conductive structure layer is connected to the patterned circuit layer and extends to cover an inner wall of the through hole. The patterned circuit layer has a top surface, the conductive structure layer has a bottom surface.

Abstract: A liquid crystal device includes a heat sink, a plurality of heat-dissipating gels formed on the heat sink with intervals therebetween, and a liquid crystal display element disposed above the heat sink with the plurality of heat-dissipating gels interposed therebetween, the liquid crystal display element including a silicon substrate, a glass substrate, and a liquid crystal contained therebetween.

Abstract: There is provided a power supply that includes a primary block having an inverter circuit and a secondary block connected to the primary block, the secondary block having a transformer with a primary side connected to the inverter circuit and having a rectifier that is connected to a secondary side of the transformer and outputs DC power.

Abstract: A stack package includes a second semiconductor die stacked on the first semiconductor die, a third semiconductor die disposed on the lifting supporter. The third semiconductor die vertically and partially overlapping with the second semiconductor die.

Abstract: A transformer assembly includes a transformer with primary windings located on multiple layers and with secondary windings interleaved with the multiple layers and includes a substrate connected to the transformer and with a first transistor with first, second, and third terminals, in which the first terminal is connected to the secondary windings, the second terminal is connected to an output terminal of the transformer assembly, and the third terminal is a control terminal; first conductive layers; second conductive layers interleaved with the first conductive layers; a first via that is solid filled and that connects the first conductive layers and the first terminal; and a second via that is solid filled and that connects the second conductive layers and the second terminal.

Abstract: A cable connector assembly includes a housing having a first end mounted to an integrated circuit substrate over an integrated circuit component and a second end supporting a heat sink used to dissipate heat from the integrated circuit component. The housing includes a pocket receiving a cable module having a connector housing holding conductors and cables connected to the conductors. The connector housing has a mating end facing the integrated circuit substrate with the conductors arranged at the mating end for interfacing with integrated circuit conductors. A thermal shield is received in the pocket having an opening receiving the cables. The thermal shield has a thermal shielding wall positioned between the cables and the heat sink to provide a thermal barrier between the cables and the heat sink.

Abstract: A device includes a non-insulator structure, a first ILD layer, a first thermal via, and a first electrical via. The first ILD is over the non-insulator structure. The first thermal via is through the first ILD layer and in contact with the non-insulator structure. The first electrical via is through the first ILD layer and in contact with the non-insulator structure. The first thermal via and the first electrical via have different materials and the same height.

Abstract: A half-bridge power semiconductor module includes an insulating wiring board including a positive-electrode wiring conductor, a bridge wiring conductor, and a negative-electrode wiring conductor arranged on or above a single insulating plate in such a way as to be electrically insulated from each other. The back-surface electrodes of a high-side power semiconductor device and a low-side power semiconductor device are joined to the front sides of the positive-electrode wiring conductor and the bridge wiring conductor. Front-surface electrodes of the high-side power semiconductor device and the low-side power semiconductor device are connected to the bridge wiring conductor and the negative-electrode wiring conductor by a plurality of bonding wires and a plurality of bonding wires.

Abstract: An apparatus includes a chassis; a circuit board assembly; and a heat sink assembly. The circuit board assembly includes a component to be removably installed in the connector. The heat sink assembly forms a cover for the chassis. The heat sink assembly includes a first heat sink and a second heat sink. The first heat sink is attached to the chassis, and the first heat sink includes an opening in the cover that corresponds to a location of the component. The second heat sink is to be attached to the first heat sink to close the opening and to be removable from the first heat sink to allow access to the opening to service the component.

Abstract: The invention relates to an arrangement comprising a first electrical component, which has a pair of flat, spaced-apart first connection lugs, a second electrical component, which has a pair of flat, spaced-apart second connection lugs, wherein the first and second connection lugs are in each case connected in pairs in an electrically conductive manner, and an electrically conductive plate which is electrically insulated from the first and second connection lugs and which is arranged below the first and second connection lugs in the plane of the surfaces of the first and second connection lugs.

Abstract: An electrical junction comprising a first pair of leads and a second pair of leads. The first pair of leads and the second pair of leads comprise a Weyl semimetal. The junction comprises an electrical crossing arranged between the leads of the first pair and the leads of the second pair and is configured to provide an electrical connection between the leads of the first pair and the leads of the second pair. A related electrical device and a related neural network may be also presented.

Abstract: A method and apparatus for connecting a user equipment (UE) to a wireless communication network such as a 5th generation network. The network supports node-level tunneling. Node-level tunnels can be pre-configured prior to receipt of UE attach requests. The tunnels can be shared by plural UEs, flows, or services. A policy function is connected to a network management function and performs tasks such as applying constraints to the node-level tunnels. A session management function pre-establishes node-level tunnels based on policy information from the policy function. Operations of network elements such as the access network node and user plane function to handle UE attachment, session establishment, and handling of mobile-originated and mobile-terminated traffic are described. Also described is a method and apparatus for packet transmission in which packets are processed according to an identified tunnel type. The tunnel type can be identified using a field in the tunnel encapsulation header.

Abstract: A power conversion apparatus is provided, which comprises a housing, a mother board, a first electromagnetic filtering board, a second electromagnetic filtering board, a signal board, a capacitor board, and a heat-dissipation module. The housing includes a heat-dissipation wall and a coolant runner. The mother board is disposed upon the housing and comprises a first surface facing the housing and a power device. The heat-dissipation module includes an thermal conductive insulating sheet adhered to the heat-dissipation wall and an elastic clamp. When the mother board approaches the housing to clamp the power device in the accommodating space between the elastic clamp and the thermal conductive insulating sheet, the power device is pressed against by the elastic clamp and thus adhered to the thermal conductive insulating sheet, so that the power device is thermally coupled to the heat-dissipation wall and the coolant runner via the thermal conductive insulating sheet.

Abstract: In an embodiment, a three-level active neutral-point clamped (ANPC) converter system is provided. The system includes first and second Direct Current (DC)-bus structures that include at least one of a number of DC-bus capacitors on printed circuit boards (PCBs). The PCBs are laminated together with an air gap (e.g., one or more millimeters) in between for a thermal dissipation and an insulation creepage. The three DC-bus terminals include PCBs, and are electrically connected to the three-level power converter, which are typically mounted on a heatsink or a cold plate.

Abstract: Provided are a driver and a driver-integrated electric actuator that can suppress a temperature rise of the driver integrated with an electric actuator. A driver circuit of an electric actuator-integrated driver controls a current to be supplied to an electric actuator. A metal member (heat-conducting portion) conducts heat generated in the driver circuit. A driver sealing portion is fixed to the electric actuator and seals the driver circuit and the metal member. The metal member is extended to the electric actuator.

Abstract: A method and apparatus for connecting a user equipment (UE) to a wireless communication network such as a 5th generation network. The network supports node-level tunneling. Node-level tunnels can be pre-configured prior to receipt of UE attach requests. The tunnels can be shared by plural UEs, flows, or services. A policy function is connected to a network management function and performs tasks such as applying constraints to the node-level tunnels. A session management function pre-establishes node-level tunnels based on policy information from the policy function. Operations of network elements such as the access network node and user plane function to handle UE attachment, session establishment, and handling of mobile-originated and mobile-terminated traffic are described. Also described is a method and apparatus for packet transmission in which packets are processed according to an identified tunnel type. The tunnel type can be identified using a field in the tunnel encapsulation header.

Abstract: A memory package includes a multi-level package substrate, a first memory chip, a second memory chip, a first band pass filter and a second band pass filter. The multi-level package substrate includes a plurality of wiring layers and a plurality of insulating layers alternately stacked on one another. The first memory chip is on the multi-level package substrate, and includes a plurality of first memory cells and a first receiver. The second memory chip is on the first memory chip, and includes a plurality of second memory cells and a second receiver. The first band pass filter is in the multi-level package substrate, is connected to the first receiver, and passes a first data signal within a first frequency band. The second band pass filter is in the multi-level package substrate, is connected to the second receiver, and passes a second data signal within the first frequency band.

Abstract: A heat sink assembly for a pluggable module having a housing includes a plurality of discrete heat sink members in thermal communication with more than one wall of the housing. The heat sink members transfer heat from the pluggable module to the surrounding environment. The heat sink assembly also includes a spring member configured to exert a force on the plurality of discrete heat sink members for forcing the heat sink members into thermal engagement with the housing.

Abstract: A system for harvesting energy for a vehicle includes an antenna, a DC bus, a receiver circuit, and an electrical load. The antenna is located on the vehicle and is configured to receive a plurality of signals in at least one of a 2.4 gigahertz band and a 5.9 gigahertz band. The receiver circuit is coupled to the antenna and the DC bus. The receiver circuit is configured to convert the plurality of signals to a DC signal that is transmitted onto the DC bus. The electrical load is coupled to the DC bus and is configured to operate at least when the vehicle is not running using the DC signal supplied by the receiver circuit.

Abstract: Devices, systems, and methods for cooling an autonomous vehicle computing system are provided. A modular cooling device can include a cooling baseplate and one or more modular heat frames. The cooling baseplate can include at least one planar cooling surface, an inlet configured to receive a cooling fluid, an outlet, and at least one cooling channel coupled between the inlet and the outlet. The at least one cooling channel can be configured to allow the cooling fluid to flow between the inlet and the outlet and provide cooling to the at least one planar cooling surface. Each modular heat frame can be configured to house at least one autonomous vehicle computing system component, be coupled parallel to the at least one planar cooling surface, and transfer heat from the at least one autonomous vehicle computing system component housed by the modular heat frame to the cooling baseplate.

Abstract: A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.

Abstract: A display apparatus and a method for producing the same are disclosed. The display apparatus includes a display panel, a first antistatic pattern, and an electronic component. The electronic component has a second antistatic pattern. The first antistatic pattern and the electronic component are provided at a side of the display panel away from the light-emitting side thereof in an inlaid manner.

Abstract: A module heatsink lifter for raising and lowering a heatsink enabling insertion and removal of a module includes a fixed base; a hinge connector of the fixed based coupled to the heatsink; and an actuator mechanism to raise and lower the heatsink through rotation about the hinge connector, wherein the actuator mechanism operates from a front faceplate based on push and pull movement to raise and lower the heatsink into a raised position and a lowered position. The heatsink includes a Thermal Interface Material (TIM) on a bottom portion which creates a thermal connection with the module when the heatsink is in the lowered position. The module can include a pluggable optical module.

Abstract: A reactor unit includes reactors; and a cooler. The reactors are disposed in at least one line on a reactor cooling surface that is one of outer surfaces of the cooler. The cooler has a cooling medium flow passage that is in contact with an inner surface on a reverse side of the reactor cooling surface. The cooling medium flows linearly from an inlet portion to an outlet portion of the cooling medium flow passage. A direction in which the cooling medium flows inside the cooling medium flow passage is same as a direction in which the reactors are disposed in the at least one line. Cooling fins are provided on the inner surface on the reverse side of the reactor cooling surface. A longitudinal direction of each cooling fin is same as the direction in which the cooling medium flows inside the cooling medium flow passage.

Abstract: An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening. The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.

Abstract: Provided is a current control apparatus including a first cooler that cools a switch element, a bus bar connected to the switch element, a core penetrated by the bus bar, a magneto-electric transducer, which is inserted into the core in order to detect a value of a current supplied to the switch element, a controller that controls the switch element, a case, and a cover, wherein the core includes an exposed disposal structure in which a part of the core is exposed to the exterior of the case as an exposed portion, and the current control apparatus further includes a divided cooling structure in which the exposed portion is cooled without being affected by the temperature of the first cooler that cools the switch element.

Abstract: A substrate provided in proximity to a case for improving heat radiation, and maintaining electrical insulation between the substrate and the case even when the substrate is warped, in the substrate having electronic parts mounted thereon and a case for housing the substrate. A case body of the case has a substrate placement surface for placing the substrate, the substrate placement surface is provided with a protruding portion protruding therefrom, and the substrate is fixed on the substrate placement surface, via a thermal interface material disposed on the substrate placement surface from a periphery of the protruding portion.

Abstract: A semiconductor package includes a semiconductor chip formed with a non-volatile semiconductor memory, a resin encapsulation that encapsulates the semiconductor chip, electrodes in a lattice (solder balls) formed and arrayed in a lattice on a bottom surface of the resin encapsulation. The solder balls include a signal electrode formed within the central region of the array and a dummy electrode formed outside the signal electrode.

Abstract: A semiconductor package includes a semiconductor chip formed with a non-volatile semiconductor memory, a resin encapsulation that encapsulates the semiconductor chip, electrodes in a lattice (solder balls) formed and arrayed in a lattice on a bottom surface of the resin encapsulation. The solder balls include a signal electrode formed within the central region of the array and a dummy electrode formed outside the signal electrode.