Abstract: A method for manufacturing a structure of a flexible printed circuit board that is installed on a substrate in a display device is provided.

Abstract: A power capacitor, in particular a DC link capacitor, having a capacitor housing which has a first housing wall, in particular made of metal, which is galvanically connectable to a housing of an electronics unit, in particular a power electronics unit, and planar energizing units for energizing the power capacitor. A first subregion of a first energizing unit extends in an inner space of the housing adjacent to and at a distance from the first housing wall or from a different housing wall of the capacitor housing that is conductively connected to the first housing wall. A layer made of a dielectric material other than air is situated between the first subregion of the first energizing unit and this housing wall.

Abstract: An Electronically Scanned Array (ESA) antenna is controlled via an optical domain without electrical conductors on the ESA Printed Wiring Board (PWB). Distribution of the control signal occurs over pulses of light through an optical medium separate from the ESA PWB. External to the ESA PWB are one or more optical wave guides functional as communications channels which connect the ESA optical receivers/transceivers with transmitters/transceivers interfaced to a system controller. The ESA is divided into groups of elements with serial busses and discrete signals driven by local controllers. The local controller for each group of elements may include one or more optical receivers (unidirectional) or transceivers (bidirectional). This concept offers a trade in electrical complexity associated with an ESA PWB for an additional manufactured medium redundantly supplying the control signal to the ESA as well as routing the RF data signal from the ESA to the system controller.

Abstract: A method, an apparatus, and a computer program product for performance management are provided. The apparatus may be an electronic device. The electronic device detects a change of form factor mode or ambient wind using a detection circuit or at least one sensor. The change of form factor mode may include at least one of folding the electronic device, unfolding the electronic device, rolling the electronic device, changing a flexible shape of the electronic device, or equipping a cover on the electronic device. A set of thermal control parameters may be determined based on the detected change. The set of thermal control parameters may be retrieved from a lookup table or calculated using a mathematical model. The electronic device adjusts the performance based on the set of thermal control parameters.

Abstract: Embodiments of the present invention disclose a heat dissipation assembly including: a cage, a TEC assembly, a mounting kit, an elastic carrier, and a heat pipe, where a window is provided in a side face of the cage, the TEC assembly is located on an outer side of the cage, and a cold side of the TEC assembly passes through the window and thermally communicates with the heat emitting device in the cage; the mounting kit is configured to mount the TEC assembly and enable the TEC assembly to move in a direction leaving or approaching the heat emitting device; and a heat absorption portion of the heat pipe is mounted on the elastic carrier, and the heat absorption portion that is of the heat pipe and that is mounted on the elastic carrier thermally communicates with a hot side of the TEC assembly.

Abstract: The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

Abstract: A retaining arrangement can secure an electronic module to a body. Two end wedges, each with a ramped end, can be mounted on a rail. At least one inner wedge can be slidably mounted on the rail between the two end wedges, with ramped ends of the at least one inner wedge engaging the ramped ends of the two end wedges. Each of the ramped ends can have a respective angle of between 20 degrees and 30 degrees. An even number of inner wedges can be provided. A pin extending through mounting holes in one of the end wedges, but not extending into the rail, can secure the end wedge to a screw for moving the retaining arrangement into the compressed configuration.

Abstract: An endoscope is provided and includes a flexible insertion tube; a distal end assembly provided at an end of the insertion tube; and a cooling medium tube provided in the inside of the insertion tube, and connected to the distal end assembly. A cooling medium for cooling the distal end assembly is introduced through one of the insertion tube and the cooling medium tube, and discharged through the other of the insertion tube and the cooling medium tube. Since the endoscope is configured such that the cooling medium directly contacts with a heating element or a conductor through which the heat of the heating element is conducted, the cooling effect of the front end portion of the endoscope is improved.

Abstract: An apparatus for mounting electronic components includes a linear actuator defining a longitudinal axis. A driver member is engaged to the linear actuator for motion along the longitudinal axis. The driver member defines a mounting plane and includes a wedge surface that is oblique facing in a direction that has a component towards the mounting plane and a component away from the longitudinal axis in a direction parallel to the mounting plane. A locking wedge is engaged with the wedge surface of the driver member to be driven both toward the mounting plane and lateral to the mounting plane away from the longitudinal axis by sliding along the wedge surface of the driver member with the actuator driving the drive member toward a center of the locking wedge.

Abstract: An integrated circuit (IC) package includes a first substrate having a backside surface and a top surface with a cavity disposed therein. The cavity has a floor defining a front side surface. A plurality of first electroconductive contacts are disposed on the front side surface, and a plurality of second electroconductive contacts are disposed on the back side surface. A plurality of first electroconductive elements penetrate through the first substrate and couple selected ones of the first and second electroconductive contacts to each other. A first die containing an IC is electroconductively coupled to corresponding ones of the first electroconductive contacts. A second substrate has a bottom surface that is sealingly attached to the top surface of the first substrate, and a dielectric material is disposed in the cavity so as to encapsulate the first die.

Abstract: A power semiconductor device includes an insulating substrate, a semiconductor element, a case, and a wiring member. The case forms a container body having a bottom surface defined by a surface of the insulating substrate, to which said semiconductor element is bonded. The wiring member has a bonding portion positioned above an upper surface electrode of the semiconductor element. The bonding portion of the wiring member is provided with a projection portion projecting toward the upper surface electrode of the semiconductor element and bonded to the upper surface electrode with a solder, and a through hole passing through the bonding portion in a thickness direction through the projection portion.

Abstract: An apparatus includes a substrate and a pair of die that include electronic circuitry. The substrate includes a cavity. One of the die is disposed in the cavity formed in the substrate. The other die is disposed above the first die and is electrically coupled to the first die.

Abstract: A wireless charging device (100) includes a shell (1), a heat conduction plate (2), a charging assembly (4) and a connecting assembly (5). The heat conduction plate (2) includes a first portion (201), a second portion (202) parallel with the first portion (201) and contacted with an inner surface of the shell (1), and a third portion (203) connecting a lower edge of the first portion (201) to a lower edge of the second portion (202). The charging assembly (4) is disposed between the first and second portions (201,202) and includes a circuit board, a chip (401) disposed on the circuit board and contacted with the first portion (201), a charging coil and an exciting unit. The connecting assembly (5) defines a first end electrically connected with the circuit board. A method for charging an apparatus with the wireless charging device (100) is also provided.

Abstract: An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.

Abstract: Disclosed is an electronic control apparatus for a vehicle, comprising: a printed circuit board (PCB) configured to electrically control each part of the vehicle and have both sides provided with at least one fixed hole; a connector cover includes a connector part electrically connected and coupled with the PCB and a coupling part; a housing configured of a one-piece slot type and receiving the PCB inserted in a slide form; and at least one coupling member each fastened with at least one fixed hole of the PCB, wherein the PCB is inserted into the housing and the PCB adheres to a bottom side of the housing by the coupling member which is pressed by physically deforming each corresponding surface of the housing corresponding to at least one coupling member.

Abstract: A backing plate for joining a heat removal device to a heat source. The backing plate can include a planar plate region having a first face and a second face opposite the first face. The backing plate can also include at least one boss projecting from the first face and having an opening therein for receiving a fastener.

Abstract: A method for producing a low-induction busbar including providing a tray with a base and a border which projects peripherally from the base so as to form a frame and which is composed of an electrically insulating material, producing a busbar element by arranging a first busbar strips, applying a film with openings which provide access to the first busbar strips, arranging the second busbar strips, on the film, bending regions of the busbar strips forming connections making electrical contact with the capacitors through the openings, inserting the busbar element into the tray and pouring an encapsulation compound into the tray so as to surround the base of the capacitors, while leaving free the connections.

Abstract: A power conversion device is provided. The power conversion device includes a printed wiring board assembly, a grounding member, and a plurality of insulating struts. The printed wiring board assembly includes a printed circuit board and a plurality of electronic components. The printed circuit board has a plurality of through holes. The electronic components are disposed on the printed circuit board. The insulating struts correspond to the through holes and physically connect and electrically insulate the printed circuit board and the grounding member.

Abstract: A combined-type intelligent terminal wiring device and a plug device are provided. The wiring device includes a top wiring terminal board, a bottom wiring terminal board and a combined-type socket. An interior of each terminal of the combined-type socket has a spring-leaf structure, and each spring leaf includes an upper spring leaf and a lower spring leaf which are conductively connected via a contact surface. The top wiring terminal board has one end configured to connect the upper spring leaf, and the bottom wiring terminal board has one end configured to connect the lower spring leaf. The plug device includes a plug and a wiring terminal, the plug is located at a front end of the plug device and is a conductive metallic sheet, and the wiring terminal is located at a rear end of the plug device and has one end connected to the conductive metallic sheet.

Abstract: The electronic device with cable includes a circuit substrate provided with a heat generating element mounted thereon, an electrical connector connected to one end of the circuit substrate, a cable that is connected to the other end of the circuit substrate, heat conducting sheets and disposed in the circuit substrate, a first metal housing including an accommodation portion accommodating the electrical connector and a pair of wall portions communicating with the accommodation portion, a second metal housing fitted to the first metal housing so as to cover a one-side opening of the pair of wall portions, and a third metal housing fitted to the second metal housing so as to cover the other-side opening of the pair of wall portions. The cable and the first metal housing are thermally connected to each other.

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.

Abstract: The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. The semiconductor modules constituting a main circuit for power conversion; a capacitor electrically connected to the main circuit; drive circuits that provide the main circuit with a drive signal used in power conversion operation; a control circuit that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within a casing, a cooling chamber including a coolant passage is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules are housed inside the cooling chamber, and at least the capacitor and the control circuit are disposed outside the cooling chamber.

Abstract: An electronic device may be provided with metal coated dielectric structures that serve as electromagnetic interference shielding, antenna structures, or other metal structures. The metal coated dielectric structures may be formed form a sheet of polymer. Metal may be deposited on the sheet of polymer using a deposition tool and patterned following deposition or may be patterned during deposition. A dielectric sheet having patterned metal may be shaped into a desired shape using molding equipment or other equipment that applies heat and pressure to the dielectric sheet and patterned metal. Metal on a dielectric sheet may also be patterned after the dielectric sheet is formed into a desired shape. Metal may be formed on opposing sides of the dielectric sheet.

Abstract: Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.

Abstract: A chip package structure including a leadframe, a chip, at least one heat dissipation pillar, and a molding compound is provided. The leadframe includes a die pad and a plurality of leads. The die pad has at least one through hole. The leads surround the die pad. The chip is located on the die pad and electronically connected to the leads. The chip includes an active surface and a back surface opposite to the active surface. The back surface of the chip is adhered to the die pad. The heat dissipation pillar is located on the back surface and passes through the through hole. The molding compound encapsulates the chip, at least parts of the leads, and the die pad. The molding compound includes at least one opening to expose the heat dissipation pillar. A manufacturing method of the chip package structure is also provided.

Abstract: A semiconductor device includes a semiconductor element, a base plate having an upper surface on which the semiconductor element is mounted, a cooling fin disposed on a lower surface of the base plate, a jacket disposed in a sealing manner on the lower surface of the base plate, the jacket surrounding the cooling fin, and a header partition wall formed separately from the jacket and fixed to the jacket on the lower side of the cooling fin in the jacket, the header partition wall forming a header and a flow path for causing a refrigerant flow to the cooling fin.

Abstract: A rack system and method are provided for processing manufactured products prior to shipment. To simulate reality, the design of such rack system and method contemplates replicating field conditions for use of the manufactured products. A rack system for processing units of manufactured products may comprise one or more plates coupled to a frame. A preferred approach includes designing the rack for use by an operator without specialized skills. This approach includes verifying that there is a match between the configuration of the unit mounted on the plate and the operating mode of the plate before processing can commence. The rack may include a detector for obtaining data from the plate and unit and a processor for comparing the obtained data to determine whether there is a match. A rack system designed using this approach can be useful in processing outdoor units of a split-mount system such as a microwave radio system.

Abstract: A ruggedized computer assembly that includes a liquids proof case made of thermally conductive material and having an exterior surface and an interior surface. Also, an electrically-powered cooling assembly is supported on the exterior surface and draws heat from the exterior surface. Moreover, a plurality of computers is housed in the case, and supported by and thermally connected to the interior surface of the case, so that heat is transferred from the computer assembly, through the liquids proof case, to the cooling assembly.

Abstract: A method for assembling a power conversion device is provided. The method includes mounting an electronic component on a heat-dissipating base, and electrically connecting a printed wiring board with the electronic component mounted on the heat-dissipating base.

Abstract: A circuit board includes a plurality of conductive track levels disposed one above the other and insulation layers arranged between each of two adjacent conductive track levels. The circuit board includes a thermally conductive element, which includes ceramic, disposed between a first external insulation layer and a second external insulation layer.

Abstract: A heat-dissipating base is provided. The heat-dissipating base includes a main body and at least one first protrusion. The first protrusion is disposed on the main body. The first protrusion has at least one first protrusion top surface for thermally contacting at least one first component above the main body.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: A cooling device for an electric energy supply (2) has at least one first heat-dissipating part (3). The power components (4) of the first heat-dissipating part are connected to the cooling device (1) in a thermally conductive manner. A fluid-conducting connection (5) conducts liquid coolant (6) from a pump (7) to a cooler (8) over the first heat-dissipating part (3). One shut-off unit (9?, 9) each is arranged in the fluid-conducting connection (5) at least between the first heat-dissipating part (3) and the cooler (8) and between the pump (7) and the first heat-dissipating part (3). To avoid an overpressure in at least one part (3, 14) to be cooled, at least one pressure-limiting valve (17, 28) is provided.

Abstract: There are provided an electronic component module allowing for a circuit wiring to be disposed outside of a molded part by a plating process, and a manufacturing method thereof, the electronic component module including a substrate; at least one electronic component mounted on the substrate; a molded part sealing the electronic component; a plurality of conductive connectors having one ends bonded to the substrate or one surface of the electronic component and formed in the molded part to penetrate through the molded part; and at least one plane pattern formed on an outer surface of the molded part and electrically connected to at least one of the conductive connectors.

Abstract: A medical device includes a housing, a power supply, a thermally conductive mounting clamp, a heat shield, and at least one fastener. The housing includes a handle. The power supply is disposed within the housing. The thermally conductive mounting clamp is attached to an outer surface of the housing. The heat shield is disposed within the housing adjacent to the power supply. The heat shield is disposed against at least one interior surface of the handle. The at least one fastener passes through at least one opening in the housing and is in thermally conductive contact with the thermally conductive mounting clamp. Heat generated by the power supply is configured to dissipate from the power supply, through the heat shield, through the at least one fastener, and into the thermally conductive mounting clamp.

Abstract: In a semiconductor device, heat radiation plates are respectively disposed on a front surface side and a rear surface side of semiconductor chips in an upper arm and a lower arm. A lead-out conductor part includes a parallel conductor that includes a positive electrode terminal, a negative electrode terminal, and an insulating film disposed between the positive electrode terminal and the negative electrode terminal, and the positive electrode terminal and the negative electrode terminal are disposed oppositely while sandwiching the insulation film. The semiconductor chips are covered by a resin mold part, surfaces of the heat radiation plates opposite to the semiconductor chips, a part of the positive electrode terminal, and a part of the negative electrode terminal are exposed from the resin mold part, and at least a part of the parallel conductor in the lead-out conductor part enters the resin mold part.

Abstract: A module IC package structure for increasing heat-dissipating efficiency includes a substrate unit, an electronic unit, a package unit, a first heat-dissipating unit and a second heat-dissipating unit. The substrate unit includes a circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate for enclosing the electronic components. The first heat-dissipating unit includes a heat-dissipating base layer disposed on the top surface of the package gel body. The second heat-dissipating unit includes a plurality of heat-dissipating auxiliary layers disposed on the top surface of the heat-dissipating base layer. Whereby, the heat-dissipating efficiency of the module IC package structure can be increased by matching the heat-dissipating base layer and the heat-dissipating auxiliary layers.

Abstract: Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes an activity monitor configured to infer a user touch to the shell in response to a detected activity of the portable electronic device. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the inferred user touch.

Abstract: A new multifunctional, thermoelastic cellular structure is described. The new structure provides tunable thermal transport behaviors particularly important for thermal switching. In its simplest example embodiment of a single or unit cell, opposing bimetallic elements bend in response to temperature changes and, below a tunable switching temperature, are separated in an open or insulating position and, at and above the switching temperature, bend to come into contact in a closed or conducting position. Multiple cells are combined in different lattice arrays to create structures that are both switchable and load bearing. The cells can be switched by both temperature and other external fields.

Abstract: An electric part fixing structure for a motor-driven compressor includes an electric part having a plurality of leads and a guide member for positioning the leads. The guide member is made of a plastic and has a guide hole through which the lead is passed.

Abstract: A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.

Abstract: Systems and methods are described that provide multilevel inverters having a plurality of levels using a simplified topology. For single phase systems, embodiments provide a full-bridge topology using bidirectional switching interconnections.

Abstract: In one embodiment, an apparatus for cooling an electrical component in a vehicle is provided. The apparatus comprises a power module including the electrical component for converting energy. The power module includes a first printed circuit board (PCB) including a first ceramic substrate for receiving the electrical component. The power module further includes a plurality of thermoelectric cells being coupled to the first PCB for discharging heat away from the electrical component. The power module further includes a second PCB including a second ceramic substrate being coupled to the plurality of thermoelectric cells, the first ceramic substrate and the second ceramic substrate for electrically isolating the electrical component from the first PCB and the second PCB and for providing thermal conductance from the electrical component through the plurality of thermoelectric cells.

Abstract: A heat transfer system is provided by the present disclosure that includes, in one form, a structural member having an upper skin, a lower skin, and a foam core disposed between the upper skin and the lower skin. At least one heat conducting array extends through the foam core and between the upper skin and the lower skin, the heat conducting array defining at least one upper cap, at least one lower cap, and a wall portion extending between the upper cap and the lower cap, the upper cap being disposed proximate a heat source. A heat conducting spreader is disposed between the lower cap of the heat conducting array and the lower skin of the structural member.

Abstract: Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

Abstract: The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.

Abstract: In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.

Abstract: Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes an activity monitor configured to infer a user touch to the shell in response to a detected activity of the portable electronic device. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the inferred user touch.

Abstract: A module is electrically connectable to a computer system. The module includes an edge connector with a plurality of electrical contacts electrically connectable to the computer system, at least one layer of thermally conductive material thermally coupled to the edge connector, and first and second printed circuit boards each having a plurality of integrated circuit components that are electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material. The at least one layer of thermally conductive material are disposed between the first and second printed circuit boards.

Abstract: A filter for reducing radiated emissions in switching power converters such as a motor drive is disclosed. The switching power converter modulates a DC voltage input to generate a desired AC voltage output. Capacitors are connected in parallel between each output phase and a common connection, which may be a ground connection. The magnitude and layout of the capacitors are selected to minimize current conducted by the capacitors. The capacitors may be surface mount technology located proximate to the switching devices or the capacitors may be incorporated in the circuit board on which the switching devices are mounted. The filter may be applied to any of the switching elements in a motor drive, such as the inverter section, an active rectifier section, or a switched mode power supply.