Abstract: In some embodiments, transpiration cooling and fuel cell for ultra mobile applications is presented. In this regard, an apparatus is introduced having an integrated circuit device, a fuel cell to power the integrated circuit device, wherein the fuel cell produces water as a byproduct, a chassis to house the integrated circuit device and the fuel cell, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device and a water absorbent layer of hydro gel configured to absorb water. Other embodiments are also disclosed and claimed.

Abstract: The present disclosure relates to thermal management apparatus for a circuit substrate having heat generating components mounted on one or both sides thereof. The apparatus and method includes a circuit assembly having a first thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to one or more heat generating components of the circuit substrate. The apparatus and method includes a second thermally conductive layer disposed on each side of the circuit substrate and being thermally coupled to the first thermally conductive layer. The first thermally conductive layer and the thermally conductive layer can be shaped, sized, and/or configured to provide cooling of the one or more heat generating components disposed on each side of the circuit substrate by transferring and spreading the heat to the outside of the circuit assembly.

Abstract: The present invention relates to an electronic device for providing improved heat transporting capability for protecting heat sensitive electronics and a method for producing the same. The present invention also relates to uses of the electronic device for various applications such as in LED lamps for signalizing, signage, automative and illumination applications or a display apparatus or any combinations thereof.

Abstract: A heat dissipation device for a hard disk drive includes a first heat sink and a control circuit. The first heat sink includes an input interface, a counter unit, a controller unit, and an output unit. The input interface is used for receiving an input signal, which is determined by a temperature of the computer system. The counter unit is used for generating a high level signal on counting to a predetermined value. The controller unit is used for generating a switch signal on receiving the high level signal, and sending a clear signal to the counter unit for clearing the counter unit. The output unit is used for being switched on or off according to the switch signal, and sending a control signal to the first heat sink. The control signal is able to drive the cooling end of the first heat sink to cool down.

Abstract: A portable electronic device includes a cover (10), a container (20) and a heater (40). The container is provided on the cover. The heater includes some exothermic materials. The heater is received in the container.

Abstract: The sheet structure includes a plurality of linear structures of carbon atoms, a filling layer filled in gaps between the linear structures for supporting the plurality of linear structures, and a coating film formed over at least one ends of the plurality of linear structures and having a thermal conductivity of not less than 1 W/m·K.

Abstract: A heat exchange structure includes elongated air ducts. Each air duct has a first opening and a second opening at two ends of the air duct to allow air to enter and exit the air duct, respectively. The heat exchange structure includes an exterior heat exchange surface and interior heat exchange surfaces, in which the exterior heat exchange surface is configured to receive thermal energy from heat generators that are mounted on the exterior heat exchange surface, and the exterior heat exchange surface dissipates a portion of the thermal energy received from the heat generators and transfers another portion of the thermal energy to the interior heat exchange surfaces. The interior heat exchange surfaces are in the elongated air ducts and configured to exchange thermal energy with air flowing in the air ducts, enhancing air flow in the air ducts by buoyancy of heated air.

Abstract: A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive metal foil having at least one patterned surface for facilitating heat dissipation from at least one integrated circuit device to at least one heat sink. The metal foil preferably has a characteristic formability and softness that may be exemplified by alloys of lead, indium, tin, and other malleable metals, and/or composites comprising layers of at least one malleable metal alloy.

Abstract: A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded dissipation element having a thermal conductivity of at least about 150 W/m-K; and a thermal connection material positioned between and in thermal contact with each of the base element and the dissipation element, wherein the thermal connection material having an in-plane thermal conductivity greater than the thermal conductivity of the dissipation element.

Abstract: A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.

Abstract: Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement (100) includes a substrate (110) with a carbon nanotube structure (120) therein. The carbon nanotube structure is arranged in one or more of a variety of manners to provide structural support and/or thermal conductivity. In some instances, the carbon nanotube structure is arranged to provide substantially all structural support for an integrated circuit arrangement. In other instances, the carbon nanotube structure is arranged to dissipate heat throughout the substrate. In still other instances, the carbon nanotube structure is arranged to remove heat from selected portions of the carbon nanotube substrate.

Abstract: An electronic device is described, which comprises an envelope comprising a closed chamber and a printed-circuit board. The printed-circuit board is positioned in the chamber and defines a dissipation chamber. The printed-circuit board comprises at least one electronic device positioned in the dissipation chamber. The dissipation chamber comprises a filler simultaneously in contact with the electronic component, the printed-circuit board and a dissipation film.

Abstract: A heat transfer film includes a heat transfer layer formed of a first constituent material containing C (carbon) for transferring heat in an in-plane direction thereof and a layer thickness direction thereof; and a strain relaxation layer formed of a second constituent material and laminated on the heat transfer layer for relaxing a strain in the heat transfer layer. The first constituent material includes a graphite, and the second constituent material includes an amorphous material.

Abstract: A method comprises providing a layer of nano particles between a semiconductor die and a slug; and sintering the layer of nano particles to provide thermal interface material to bond the semiconductor die to a heat spreader formed by the slug. The sintering temperature of the nano particles is around 50° C. to around 200° C.

Abstract: A series of hierarchical channels are formed in a first member surface of a first member using a continuous-feed manufacturing process. The channels are configured to control particle stacking. The first member is pressed to a second member with a layer of particle-filled viscous material between the first member surface and a second member surface of the second member. An inventive assembly includes mating surfaces with at least one surface formed with a series of parallel hierarchical channels configured to control stacking of the particles during pressing together of the surfaces. The surface is substantially free of any other hierarchical channels formed thereon.

Abstract: A conformable paste comprising porous agglomerates of carbon black dispersed in a paste-forming vehicle is disclosed. The paste is useful as an interface material for improving the thermal contact between two proximate solid surfaces, such as the surfaces of a heat source and a heat sink. Upon compression between the two solid surfaces, the paste forms a material that enhances the thermal contact between said surfaces. This invention also discloses a conformable interface material which, upon compression between two proximate solid surfaces, forms a material that enhances the thermal contact between said surfaces. This interface material comprises (i) a sheet and (ii) a conformable, spreadable and thermally conductive paste on each of the two opposite sides of the sheet, said paste comprising porous agglomerates of carbon black dispersed in a paste-forming vehicle. In addition, a method of providing a thermal contact between two solid surfaces is disclosed.

Abstract: The present invention is a universal patterned metal thermal interface. The thermal interface eliminates the need for surface processing of one or both contact surfaces that are to accommodate the thermal interface. In one embodiment, a thermal interface for coupling a first solid to a second solid includes a patterned metal insert, a corrosion resistant layer coating at least one exterior side of the insert, for protecting the insert from corrosion, and an organic layer coating the corrosion resistant layer, for facilitating bonding of the insert to one of the first solid or the second solid.

Abstract: A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.

Abstract: A heat dissipating device includes a heat sink, and a block. The heat sink includes a base and a plurality of fins formed on the base. A bottom portion of the base defines a first groove. The block defines a second groove in one surface of the block. The block is received in the first groove, and an electronic component is received in the second groove.

Abstract: A heat spreader having at least two adjoining layers each having at least two pyrolytic graphite strips cut from a sheet of pyrolytic graphite along the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z direction cut provides strips which are each oriented 90 degrees such that the thickness direction of the original sheet becomes the width or length of the cut strip. A side of a first strip adjoins a side of a second strip in each layer. Because of the greater thermal conductivity in the xy plane of the strips as compared to the z direction heat transfers more rapidly in the length and thickness direction of the strips than across adjoining sides of the oriented strips in each layer. The first layer strips are oriented about 90 degrees from the orientation of the second layer strips.

Abstract: An apparatus for transferring heat between two corner surfaces is provided. In one embodiment, an apparatus for transferring heat between two corner surfaces is provided. The apparatus comprises a heat transfer body comprising: a first heat conducting side; a second heat conducting side intersecting with the first heat conducting side to form a corner; and a contact face oriented at an acute angle relative the first and second side. The apparatus further comprises at least one wedge having a slip face oriented at an angle configured to interface with the contact face; and at least one fastener configured to apply a force to the at least one wedge. The wedge is configured to translate the force applied by the fastener into a first component in a direction normal to the first heat conducting side and a second component in a direction normal to the second heat conducting side.

Abstract: A display module, used for, e.g., a plasma display panel, is disclosed. In one embodiment, the display module includes a display panel, a drive circuit board driving the display panel, and a chassis base supporting the display panel and the drive circuit board. A curved portion is formed on the chassis base with a predetermined width, a boss is installed on an upper surface of the curved portion, and the drive circuit board is installed on the top of the boss. According to embodiments of the present invention, the strength of the chassis base constituting the display module is reinforced, without requiring a separate reinforcement member, and simultaneously the heat and noise generated by the display panel and the drive circuit board during operation can be appropriately dissipated and prevented.

Abstract: A heat spreader having at least two adjoining strips of pyrolytic graphite material is made by cutting a strip from a sheet of pyrolytic graphite in the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z direction cut provides strips which are then each individually oriented 90 degrees such that the thickness direction of the original pyrolytic graphite sheet becomes the width or length of the cut strip. A face on the side of a first strip adjoins a face on the side of a second strip. Due to the greater thermal conductivity in the xy plane of the strips as compared to in the z direction heat transfers more rapidly in the length and thickness direction of the strips than across adjoining sides of the oriented strips.

Abstract: The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing a carbohydrate endotherm in an amount sufficient to effect the required heat absorption. The carbohydrate endotherm operates in an environment substantially devoid of potential oxidizing reactants. A scavenger may be employed in combination with the carbohydrate endotherm to remove or neutralize potential oxidizing reactants. Alternatively (or in addition), a fluoro-inert material may be employed in combination with the carbohydrate endotherm to effect a desired non-oxidizing environment. The carbohydrate endotherm may be used to provide thermal control and/or thermal protection in a variety of applications and environments. The carbohydrate endotherm may also be employed in combination with previously disclosed endotherm materials to achieve synergistic benefits therewith.

Abstract: In some embodiments, a method, apparatus and system are described for enhancing an enclosure of a device, such as a computing device. The system may include a frame and an apparatus, wherein the apparatus includes the enclosure, which may form a cover of a computing device, and a base. In some embodiments, the enclosure may be composed of materials with different thermal properties when compared to the base. In some embodiments, the enclosure may include vents or openings of various configurations. In some embodiments, the base may be a heat spreader or a heat sink. Other embodiments may be described.

Abstract: A cooling structure for electrical circuit devices having a pair of cooling ducts, each having a coolant passageway therein, and an electrical circuit device housing formed by a pair of spaced apart heat transfer plates each joined to a housing side to provide a sealed housing space. An electrical circuit device is positioned in that sealed housing space and each of the pair of heat transfer plates is positioned adjacent to, and thermally coupled to, a corresponding one of the pair of cooling ducts. An electrically insulative heat transfer material is provided in the sealed housing space so as to be capable of being in contact with the electrical circuit device also therein.

Abstract: One embodiment of an cabinet according to the present invention comprises an inner cabinet having a plurality of inner walls that form an enclosure. A phase change material covers at least some of the plurality of inner walls. An outer cabinet is positioned around the inner cabinet and comprises a plurality of outer walls arranged such that there is a space between the inner and outer walls. A mechanism is included for drawing air from outside of the outer cabinet into the space between the inner and outer walls. The phase-change material is arranged to melt when exposed to heat energy to reduce heat transfer into the enclosure. The enclosure is particularly adapted for holding heat sensitive devices such as batteries with the cabinet controlling heat transfer during cyclic heat exposure.

Abstract: In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processability. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.

Abstract: A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an edge of the housing. Note that the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer. This second layer has a first anisotropic thermal conductivity. Furthermore, the plate includes a material having a second anisotropic thermal conductivity.

Abstract: In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circuit device(s) and the power supply, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device(s) and a water absorbent layer configured to absorb water. Other embodiments are also disclosed and claimed.

Abstract: Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-centered-cubic crystal structure. Furthermore, the allotrope of carbon has a thermal conductivity greater than a first pre-determined value and a specific heat greater than a second pre-determined value.

Abstract: A package assembly with a heat dissipating structure includes a thermal conductive lower metal layer, an electric insulating ceramic layer, a patterned upper metal layer and an electronic component. The electric insulating ceramic layer is disposed on and bonded to the thermal conductive lower metal layer. The patterned upper metal layer is disposed on and bonded to the electric insulating ceramic layer. The patterned upper metal layer has an opening from which the electric insulating ceramic layer is exposed. The electronic component is disposed in the opening of the patterned upper metal layer, mounted on the electric insulating ceramic layer through a thermally conductive adhesive or solder, and electrically connected to the patterned upper metal layer.

Abstract: Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component.

Abstract: A plasma display module with reduced driving noise and improved a heat dissipating performance. The plasma display module includes a chassis base, a plasma display panel arranged at a front portion of the chassis base, the plasma display panel being adapted to display images, a heat dissipation sheet arranged between the plasma display panel and the chassis base, the heat dissipation sheet including a plurality of pores, wherein a porosity of the heat dissipation sheet varies with distance from the plasma display panel, and a circuit unit arranged at a back portion of the chassis base to drive the plasma display. The heat dissipation sheet may be made out of three separate sheet materials, each sheet having a different porosity.

Abstract: An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the electrical device below its thermal limit. The apparatus comprises a thermally conductive member mountable on an opposite face of a circuit board from a face of the circuit board on which an electrical component is mounted, the thermally conductive member operable to conduct heat generated by the electrical component away from the electrical component.

Abstract: A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes a plurality of heat generators that are distributed on the exterior heat exchange surface along an elongated direction of the air ducts, in which air flowing in the air duct is heated successively by heat from the heat generators, and air flow in the air duct is enhanced by buoyancy of heated air.

Abstract: A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can dissipate heat to a surrounding environment. A soft and bendable material capable of transmitting electrical signals or a fiber glass material capable of transmitting signals can be affixed on an upper and lower surface of the aforementioned super conduction diffusion plate. A micro-porous air-permeable ceramic plate having a high thermal conductivity, which is provided with irregularly arranged air-permeable holes can also be affixed to the aforementioned super conduction diffusion plate, so as to allow air to quickly conduct heat energy to the surrounding environment.

Abstract: A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 ?m when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 ?g/cm2.

Abstract: Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pressing or squeezing of excess material from the interface. Nested channels are used to efficiently decrease the thermal resistance in the interface, by both allowing for the thermally conductive material with a higher particle volumetric fill to be used and by creating localized regions of densely packed particles between two surfaces.

Abstract: Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shield and the external wall. Other embodiments are described.

Abstract: A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal transfer shells partially surround the set of thermal transfer media. The heat source connection means are left exposed and utilized for connection to the electronic system. The heat source, the set of thermal transfer media configured to partially surround the heat source, and the thermal transfer shell partially surrounding the set of thermal transfer media form a thermal transfer module. Thermal transfer modules may be placed in thermally conductive cells. A set of thermal transfer sheets are placed in contact with both or either of the thermal transfer module and the thermally conductive cell, facilitating a heat exchange with an environment external to the thermal transfer module.

Abstract: A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.

Abstract: A plasma display apparatus includes a Plasma Display Panel (PDP). A thermal conductive sheet is attached to one side of the PDP, and a chassis base is connected to the side of the PDP on which the thermal conductive sheet has been attached. The chassis base can be a planar plate having edge portions. At least one reinforcing unit is extends along and is attached to at least one of the edge portions of the chassis base.

Abstract: A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in2/W comprising interposing a thermal interface assembly between an microelectronic component package and heat sink with the thermal interface assembly comprising a thermal interface material having phase change properties and a sealing member selected from the group consisting of an o-ring and/or shim in an arrangement such that the thermal interface material is shielded from the atmosphere when the microelectronic component package is operational.

Abstract: A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an edge of the housing. Note that the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer. This second layer has a first anisotropic thermal conductivity. Furthermore, the plate includes a material having a second anisotropic thermal conductivity.

Abstract: A graphite heat spreader is provided for use with a flash LED light source for a camera of a handheld device such as a cell phone. Dramatically reduced operating temperatures are provided at substantially increased power levels thus providing both improved lighting and improved operating life of the electronic components.

Abstract: A grease protecting apparatus (10) includes a heat sink (12) defining a plurality of receiving cavities (124) therein, a layer of grease (16) spread on a surface (122) of the heat sink, and a grease cover (14) attached to the surface of the heat sink for protecting the grease from contamination. The cover includes a main body (142) defining a protecting space (143) therein for covering the grease, two wings (144) extending from two opposite sides of the main body, and a plurality of projections (148) extending from the wings for being snapped in the receiving cavities of the heat sink. The projection has a trapezium-shaped cross section.

Abstract: A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member and a part of the recessed metallic member into a solid solution.

Abstract: In a flying capacitor type battery voltage detector on a circuit substrate, a large number of photo MOS switches having performance highly depending from temperature are dividedly disposed on front and back surfaces of the circuit substrate such that the photo MOS switches of the back surface are lying over the photo MOS switches of the front surface. Each of pairs of photo MOS switches connects a pair of surface lines with first and second floating lines to transmit an output voltage of each cell of a battery pack connected with the surface lines to a differential amplifier through a flying capacitor connected with the floating lines. Because of the division of the photo MOS switches on the surfaces of the circuit substrate, temperatures of the photo MOS switches have less dispersion, and an S/N ratio of each signal indicating the output voltage can be improved.

Abstract: The present invention relates to a chassis structure for an electronic system containing a plurality of electronic components therein. The present invention provides a composite chassis structure comprising a nonmetal mesh cover formed on one or more surfaces of the metal chassis to obtain additional thermal budget and human-friendly chassis surface.