Details Patents (Class 361/710)
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Patent number: 8199507Abstract: An electronic device includes a housing, a printed circuit board, a first heat sink and a second heat sink. The printed circuit board is disposed internal to the housing and supports at least one integrated circuit (IC) chip. The first heat sink is also disposed internal to the housing and is thermally connected to the at least one IC chip. The second heat sink is connected to the housing such that at least a portion thereof is externally disposed to the housing. The second heat sink is thermally connected to the first heat sink via an aperture in the housing.Type: GrantFiled: December 16, 2009Date of Patent: June 12, 2012Assignee: OpenPeak Inc.Inventors: Yuval Shohet, Teerapat Theerawong
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Publication number: 20120140418Abstract: An electronic device mounted on a circuit board and accommodated in a housing includes a heat source element accommodated in the housing and mounted on the circuit board, and a heat conducting member accommodated in the housing. The heat conducting member is movably mounted on the circuit board. An elastic member fixes the heat source element and the heat conducting member in abutment with each other. The elasticity of the elastic member permits variations in the relative positions of the heat source element and the heat conducting member while maintaining the abutment of the heat source element and the heat conducting member.Type: ApplicationFiled: November 17, 2011Publication date: June 7, 2012Applicant: AISIN AW CO., LTD.Inventors: Yoichiro TAKA, Masashi TAKANO, Tarou AIKAWA
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Patent number: 8191614Abstract: A heat radiating unit is provided on a front face with at least one raised strip having a curved head portion and a neck portion, the neck portion being located at a joint of the raised strip and the heat radiating unit and having a width smaller than that of the curved head portion; and on a reverse face with at least one receiving groove opposite to the raised strip, the receiving groove having a curved recess portion and an engaging shoulder portion, and the engaging shoulder portion being located at a joint of the receiving groove and the heat radiating unit. A plurality of the heat radiating units can be assembled to provide a heat sink by engaging the curved head portion and the neck portion of one heat radiating unit with the curved recess portion and the engaging shoulder portion, respectively, of another heat radiating unit.Type: GrantFiled: September 9, 2009Date of Patent: June 5, 2012Assignee: Asia Vital Components Co., Ltd.Inventor: Kuei-Feng Chiang
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Patent number: 8194407Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.Type: GrantFiled: November 6, 2009Date of Patent: June 5, 2012Assignee: Fujitsu LimitedInventors: Yoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita
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Structure of heat dissipation substrate for power light emitting diode (LED) and a device using same
Patent number: 8174832Abstract: A structure of a heat dissipation substrate of power LEDs and a device made by using the same overcomes drawbacks such as complex structure of power LEDs, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of the heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other. The through hole is smaller than the blind hole, and both of them share the same direction of axis. The heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit.Type: GrantFiled: October 15, 2008Date of Patent: May 8, 2012Assignee: Foshan Nationstar Optoelectronics Co., Ltd.Inventors: Binhai Yu, Junzheng Li, Xunli Xia -
Patent number: 8174833Abstract: A cooling device for cooling a plurality of switching elements included in each of a converter unit and an inverter unit includes a fin base that serves as a switching element attachment plane on which the switching elements are mounted and a plurality of fins arranged on a plane opposite to the switching element attachment plane. When an electric power converting circuit is a single- or multi-phase bridge circuit including a plurality of sets of legs each formed with a positive-side arm and a negative-side arm, the switching elements constituting the legs of different phases are arranged in a row on the fin base in a traveling direction of a railway electric car.Type: GrantFiled: June 11, 2007Date of Patent: May 8, 2012Assignee: Mitsubishi Electric CorporationInventors: Hidetoshi Kitanaka, Masataka Yabuuchi
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Patent number: 8169789Abstract: Apparatus and methods for mounting of a processor coupled to a circuit board include use of a frame disposed around the processor. The frame decreases flexibility of the circuit board around the processor. Further, the frame may act as a mechanical stop limiting tilting of a heat sink coupled to the processor.Type: GrantFiled: April 10, 2007Date of Patent: May 1, 2012
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Publication number: 20120092833Abstract: An LED heat-conducting substrate and its thermal module wherein the composite heat-conducting substrate is incorporated by multiple heat-conducting wires or fibers and insulating material. Said wires or fibers are arranged at interval, and penetrate the front and rear faces. The wires or fibers are segregated by insulating material. An electrode pad is incorporated onto the front face of the composite heat-conducting substrate, and is electrically connected with the electrode pin of LED unit. A heat-conducting pad is incorporated and kept in contact with the heat sink of the LED component for heat conduction. An insulating layer is incorporated onto the rear face of the composite heat-conducting substrate, and located correspondingly to the electrode pad. The LED heat-conducting substrate and thermal module can be constructed easily for high heat conduction in the thickness direction and high electrical insulation in the direction of plane, enabling quick heat transfer to the heat-sinking component.Type: ApplicationFiled: October 13, 2010Publication date: April 19, 2012Applicant: HO CHENG INDUSTRIAL CO., LTD.Inventors: Yi-Shun Chang, Syh-Yuh Cheng
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Patent number: 8159849Abstract: A power inverter comprises at least a box-shaped housing; and a power module, a smoothing capacitor, a base plate made of a flat plate, and a rotating electric machine control circuit board arranged in order in the housing. The base plate is arranged with the fringes fixed to the inner wall surfaces of the housing, and the smoothing capacitor and rotating electric machine control circuit board are fixed.Type: GrantFiled: May 2, 2011Date of Patent: April 17, 2012Assignee: Hitachi, Ltd.Inventors: Kenichiro Nakajima, Haruki Hamada, Hideyo Suzuki
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Patent number: 8153900Abstract: A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to the electrode pad of a head part formed in one end of a shaft part. The lead pin is bonded to the electrode pad in a state in which the conductive material extends to the back surface side of a head part beyond a flange part of the head part and reaches the shaft part of the lead pin.Type: GrantFiled: August 28, 2008Date of Patent: April 10, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventors: Hirokazu Takeuchi, Kiyotaka Shimada, Masayoshi Ebe, Yoshinori Furihata
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Patent number: 8154873Abstract: A heat dissipation device removing heat from a memory module includes two conducting plate clipping the memory module and an elastic member. Each conducting plate includes a lower part and an upper part. The two lower parts of the two conducting plates abut against two opposite sides of the memory module, respectively. The two upper parts of the two conducting plates are pivotably connected together and located above the memory module. The elastic member is located between the two upper parts and urges the two lower parts towards the memory module. The upper part of each conducting plate is slantwise at an obtuse angle to the lower part to make the two upper parts of the two conducting plates splay upwardly.Type: GrantFiled: December 3, 2009Date of Patent: April 10, 2012Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Zhi-Sheng Lian, Gen-Ping Deng
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Patent number: 8149580Abstract: A heat dissipation device adapted for cooling an electronic device mounted on a printed circuit board comprises a base plate adapted for being thermally attached to the electronic device and a clip attached on a top face of the base plate. The base plate comprises two protruding poles protruding downwardly from a bottom face thereof. The protruding poles are capable of extending through the printed circuit board, thereby establishing a location for the heat dissipation device on the printed circuit board. The clip fastens the heat dissipation device on the printed circuit board after the location for the heat dissipation device on the printed circuit board has been established.Type: GrantFiled: April 7, 2010Date of Patent: April 3, 2012Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Jian-Ping Yu, Jian Zhang
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Patent number: 8144459Abstract: A heat dissipating system includes an enclosure, a first fan module, a second fan module of a computer power source. The enclosure has a front panel, a rear panel parallel to the front panel, a side panel, and a top panel. The rear panel defines an output vent therein. A disk drive module is disposed on the front panel and near the top panel. A motherboard with a CPU is disposed on the side panel. The first fan module is configured to dissipate heat generated by the CPU. The second fan module is placed on the rear panel and is aligned with the output vent of the rear panel. The top panel defines a plurality of airflow holes corresponding to the disk drive module. The plurality of the airflow holes is capable of allowing air to flow to the disk drive module for heat dissipating.Type: GrantFiled: December 30, 2009Date of Patent: March 27, 2012Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Jin-Biao Ji, Zhi-Guo Zhang, Li-Fu Xu
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Patent number: 8139360Abstract: A multi-specification fixing module used at a motherboard and a cooler. The multi-specification fixing module includes a plurality of the fixing sheet and a specification adjusting base plate. Each of the fixing sheets has a fixing hole. The specification adjusting base plate includes a plurality of adjusting portions at a periphery of the specification adjusting base plate. Each of the adjusting portions has an adjusting guiding rail group and an adjusting portion hole. The positions of the fixing sheets are adjusted according to the size of the cooler body to install the fixing sheets in the adjusting guiding rail groups, and the installing fixing accessories are connectedly fixed at the motherboard holes via the fixing holes and the adjusting portion holes to fix and install the cooler body above the socket.Type: GrantFiled: December 17, 2009Date of Patent: March 20, 2012Assignee: ASUSTeK Computer Inc.Inventor: Chao-Chung Wu
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Patent number: 8139361Abstract: Various embodiments of the present invention provide an anchor, circuit board assembly, and method for operably engaging an electronic component with a circuit board having a first side and a second side. Anchor embodiments include an anchor portion configured for receiving at least a portion of the electronic component and a pair of anchor legs flexibly extending from the ends of the anchor portion and configured for insertion into apertures defined in the circuit board. The anchor further includes a compression element slidably disposed about the anchor legs and movable between an unlocked position and a locked position. The compression element is configured for urging the anchor legs towards one another when moved from the unlocked position to the locked position such that the anchor is secured in the apertures when the compression element is in the locked position.Type: GrantFiled: December 16, 2009Date of Patent: March 20, 2012Assignee: International Business Machines CorporationInventors: David L. Hager, Paul A. Wormsbecher
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Patent number: 8139355Abstract: One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM connector. A pair of heat spreaders is secured to the base on opposing sides of the DIMM socket. Each heat spreader includes a DIMM-engagement portion spaced from the base. The heat spreaders are nondestructively moveable between an open position spaced apart for receiving the DIMM between the heat spreaders and a closed position for thermally engaging opposing faces of the DIMM. The heat spreaders provide a continuous thermally-conductive pathway between the DIMM-engagement portion and the base. Heatsink fins extend laterally from the base to provide cooling.Type: GrantFiled: May 24, 2010Date of Patent: March 20, 2012Assignee: International Business Machines CorporationInventors: David R. Motschman, Mark E. Steinke, Jr., Aparna Vallury
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Patent number: 8134836Abstract: A packaged heat dissipating assembly for an intermediate bus converter (IBC) has a frame being mounted on and around the IBC and a heat sink being mounted on the frame. The packaged heat dissipating assembly is easily detached from the IBC. Therefore, a broken bus converter module (BCM) or heat sink is easily replaced separately. Consequently, heat dissipating designs and maintenance of a server or communication equipment is facilitated and maintenance costs of the IBC and the server or communication equipment are lowered.Type: GrantFiled: July 29, 2009Date of Patent: March 13, 2012Assignee: ACBEL Polytech Inc.Inventors: Chung-Yu Tsai, Bo-Hao Lin, Yu-Kun Sun
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Patent number: 8134835Abstract: The present invention relates to a clamping device for compression clamping of one or more semiconductor devices and associated semiconductor components with a desired compression force equally distributed across the opposing surfaces of the devices and associated components. The semiconductor devices and components are located between opposing jaws that are joined together by at least two tie rods, which compressively load the opposing jaws to apply the desired compression force to the semiconductor devices and components. The desired compression force is first achieved in even distribution between independent clamp pressure set point assemblies and the first jaw, where each of the independent clamp pressure set point assemblies is associated with one of the tie rods.Type: GrantFiled: January 24, 2008Date of Patent: March 13, 2012Assignee: Inductotherm Corp.Inventors: Oleg S. Fishman, Satyen N. Prabhu
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Patent number: 8130500Abstract: A thermal conductive member includes linear high thermal conductivity materials; a first solder layer provided at first end sides of the linear high thermal conductivity materials; and a second solder layer provided at second end sides of the linear high thermal conductivity materials; wherein at least one of the first end sides and the second end sides of the linear high thermal conductivity materials are connected to the first solder layer or the second solder layer.Type: GrantFiled: September 28, 2010Date of Patent: March 6, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventor: Takuya Oda
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Patent number: 8130499Abstract: The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.Type: GrantFiled: November 28, 2008Date of Patent: March 6, 2012Assignee: Panasonic CorporationInventors: Tohru Ohnishi, Hitoshi Kouno, Toshiyuki Taniguchi, Koji Nakashima, Toshiyuki Nakata, Tsunetsugu Imanishi, Keiichi Nakao
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Patent number: 8125776Abstract: A socket and heat sink unit includes a socket portion configured to releasably couple to a removable LED light module. The unit also includes a heat sink portion attached to the socket portion and extending about a central axis. The heat sink portion comprises a plurality of fins, as well as one or more apertures configured to receive fasteners therein to fix the unit to a light fixture housing. The socket and heat sink portions are monolithic.Type: GrantFiled: February 23, 2010Date of Patent: February 28, 2012Assignee: Journée Lighting, Inc.Inventors: Clayton Alexander, Robert Rippey, III, Brandon Mundell
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Patent number: 8111515Abstract: Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by the support member. The first external contacts are operatively coupled to the terminals on the support member. The assembly also includes a second microelectronic die having integrated circuitry and second external contacts electrically coupled to the first external contacts. The first die is between the support member and the second die. The assembly can further include a heat transfer unit between the first die and the second die. The heat transfer unit includes a first heat transfer portion, a second heat transfer portion, and a gap between the first and second heat transfer portions such that the first external contacts and the second external contacts are aligned with the gap.Type: GrantFiled: September 10, 2009Date of Patent: February 7, 2012Assignee: Micron Technology, Inc.Inventors: Salman Akram, David R. Hembree
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Patent number: 8089767Abstract: A cooling system comprising a heat sink having, a first contact zone and a second contact zone, which are configured to absorb, a first heat flow from a first component, a second heat flow from a second component, and a first transmission means for transmission of the first heat flow via the first contact zone into the heat sink. In addition, a first transmission means is arranged between the first component, and the heat sink and include a first plug means that is shaped such that the first plug means forms a first fit with a first bushing means that is arranged in the heat sink, where the first fit provides tolerance compensation between first and second contact zones.Type: GrantFiled: April 23, 2010Date of Patent: January 3, 2012Assignee: Siemens AGInventors: Klaus Busch, Günther Deinhardt, Alexander Reinhard, Christoph Wiesner
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Patent number: 8081467Abstract: An electronics package may include a housing and electronic circuitry carried thereby. The housing may include a first metallic material having a first coefficient of thermal expansion (CTE) and having an array of openings therein. The electronics package may also include a thermally conductive body within each of the openings in the array thereof to thereby define a heat sink for the electronic circuitry. Each of the thermally conductive bodies may include a second metallic material having a second CTE substantially different from the first CTE.Type: GrantFiled: August 20, 2008Date of Patent: December 20, 2011Assignees: SRI Hermetics Inc., H-Tech, LLCInventor: Edward Allen Taylor
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Patent number: 8081469Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.Type: GrantFiled: October 14, 2009Date of Patent: December 20, 2011Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
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Patent number: 8081468Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.Type: GrantFiled: June 17, 2009Date of Patent: December 20, 2011Assignee: Laird Technologies, Inc.Inventors: Richard F. Hill, Robert Michael Smythe
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Patent number: 8081463Abstract: A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at least one first water pipe system. The first water pipe system has a front part extended through the heat receiving portion and a rear part arranged on the heat dissipation portion, so that heat absorbed by the heat receiving portion is transferred via the first water pipe system to the heat dissipation portion and dissipated therefrom into ambient air. The water cooling unit communicates with the first water pipe system and drives a cooling fluid stored therein to circulate in between the first water pipe system and the water cooling unit, so that the heat absorbed by the heat receiving portion can be quickly and continuously carried away from the communication chassis by the circulating cooling fluid.Type: GrantFiled: June 16, 2009Date of Patent: December 20, 2011Assignee: Asia Vital Components Co., Ltd.Inventors: Huang Chiu-Mao, Huang Chang-Mou
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Patent number: 8081465Abstract: A cooling apparatus for semiconductor chips includes radiation fins formed on the opposite surface of metal base opposite to the surface of metal base, to which an insulator base board mounting semiconductor chips thereon, is disposed. The radiation fins, such as sheet-shaped fins having different lengths are arranged such that the surface area density of the fins becomes higher in the coolant flow direction, whereby the surface area density is the total surface area of radiation fins on a unit surface area of the metal base. As a result, the temperatures of semiconductor chips arranged along the coolant flow direction are closer to each other.Type: GrantFiled: November 27, 2009Date of Patent: December 20, 2011Assignee: Fuji Electric Systems Co., Ltd.Inventor: Akira Nishiura
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Patent number: 8081476Abstract: An electromagnetic shielding device with a heat dissipating function for shielding at least one electronic element on a circuit board is provided. The electromagnetic shielding device includes a frame, a cover, and a heat dissipating element. The frame is disposed on the circuit board and surrounds the electronic element, and the frame is one-piece and seamless. The cover has a top portion and a side portion bent from borders of the top portion. The heat dissipating element is disposed on the top portion. The top portion of the cover is connected to borders of the frame, and the side portion is tightly combined with the frame so that the cover, the frame and the circuit board form a shielding space to surround the electronic element.Type: GrantFiled: December 9, 2009Date of Patent: December 20, 2011Assignee: Unihan CorporationInventors: Wei-Chun Tsao, Chien-Ru Lin
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Patent number: 8081475Abstract: To prevent water intrusion, trolling motor heads cannot utilize ventilation methods of removing heat from power electronics. The assembly and method of the present application utilizes the existing metal column of a trolling motor to remove heat from the power electronics by utilizing a metal adapter that has flat outside surfaces for the power electronics and a round inside surface for the metal column.Type: GrantFiled: May 29, 2009Date of Patent: December 20, 2011Assignee: Brunswick CorporationInventor: Steven E. Holley
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Patent number: 8077465Abstract: A heat sink includes a cooling member to dissipate heat, and a fixing member for mounting fasteners. The cooling member includes a base and a number of fins extending from the base. The cooling member and the fixing member are independently formed, and the fixing member is fixed to a bottom of the base of the cooling member via fixing means.Type: GrantFiled: August 24, 2009Date of Patent: December 13, 2011Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Yao-Ting Chang, Meng-Hsien Lin, Yu-Chia Lai
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Patent number: 8072762Abstract: A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating module is disposed on the first heat generating element. The first heat dissipating module includes a heat sink and a first heat pipe. The first heat pipe includes a pipe body and an extending portion extending from the pipe body. The second heat dissipating module is disposed on the second heat generating element. The pipe body is connected to the heat sink and the extending portion is connected to the second heat dissipating module.Type: GrantFiled: January 28, 2010Date of Patent: December 6, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Yang Li, Shuang Fu
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Publication number: 20110292610Abstract: A heat sink includes a bottom plate, a plurality of fins, an extending member, and a heat conduction member. The plurality of fins is fixed on the bottom plate. The extending member extends outward from an end of the bottom plate. The heat conduction member depends from an end of the extending member.Type: ApplicationFiled: July 8, 2010Publication date: December 1, 2011Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: ZEU-CHIA TAN
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Publication number: 20110286185Abstract: In two systems of three-phase alternating-current inverter devices that drive a motor, power elements on power supply sides of bridge circuits are mounted on unit bases to constitute upper arm units. Power elements on ground sides of the bridge circuits are mounted on unit bases to constitute lower arm units. The upper arm units and the lower arm units are arranged separately on upper surfaces and outside surfaces of heat dissipation blocks of a heat sink. Heats generated by the power elements do not interfere with each other and are emitted to the heat sink, whereby heat dissipation performance of the power elements constituting the bridge circuits is improved.Type: ApplicationFiled: April 27, 2011Publication date: November 24, 2011Applicant: DENSO CORPORATIONInventors: Tatsuya Abe, Masashi Yamasaki
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Publication number: 20110279980Abstract: A heat dissipation structure for a liquid crystal television is disclosed. The liquid crystal television includes a front plate and a rear plate. The front plate has a screen and a metal backboard. The heat dissipation structure includes a printed circuit board (PCB) mounted to the metal backboard; a television integrated circuit (IC) chip for controlling operations of the liquid crystal television being attached on the PCB; and one or more heat dissipating posts provided between the PCB and the metal backboard. The heat generated by the television IC chip is dispersed to the metal backboard via the heat dissipating post or posts.Type: ApplicationFiled: May 11, 2010Publication date: November 17, 2011Applicant: Silicon Integrated Systems Corp.Inventors: Tsai-Chih Tsai, Jhih-Jhong Jian, Yin-Chieh Hsueh
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Patent number: 8059409Abstract: An avionics chassis comprises a carbon fiber reinforced housing, a card rail for holding an electronic circuit board mounted to an interior surface of the housing, at least one heat-dissipating fin composed of carbon fiber and extending from the outer surface of the housing, a plurality of isotropic carbon fibers extending from an interior of the fin through the housing and in abutting contact with the card rail. The plurality of isotropic fibers form a direct conductive path from the card rail to the heat-dissipating fin.Type: GrantFiled: June 19, 2009Date of Patent: November 15, 2011Assignee: General Electric CompanyInventors: Meredith Marie Steenwyk, Danny Weldon Coxon, John Jay Streyle, Benjamin Jon Vander Ploeg
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Patent number: 8053876Abstract: According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.Type: GrantFiled: October 5, 2009Date of Patent: November 8, 2011Assignee: Texas Instruments IncorporatedInventors: Steven A Kummerl, Bernhard P Lange, Anthony L Coyle
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Patent number: 8050035Abstract: A heat dissipation device includes a heat sink and a cooling fan arranged thereon. The cooling fan includes a motor-stator and an impeller mounted around the motor-stator. The motor-stator is arranged on a middle of the heat sink. The heat sink includes a base and a plurality of fins extending upwardly from the base. The heat sink defines a plurality of notches incising the fins. The notches are angled towards the middle of the heat sink immediately under the motor-stator of the cooling fan.Type: GrantFiled: March 24, 2009Date of Patent: November 1, 2011Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Ye-Fei Yu, Shu-Yuan Xu, Xin-Xiang Zha, Lin Yang, Jun Ding, Jer-Haur Kuo
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Patent number: 8035973Abstract: A floating heat sink device is provided that attaches to a cage in a floating configuration that enables the heat sink device to move, or “float”, as the parallel optical communications device secured to the cage moves relative to the cage. Because the heat sink device floats with movement of the parallel optical communications device, at least one surface of the parallel optical communications device maintains continuous contact with at least one surface of the heat sink device at all times. Ensuring that these surfaces are maintained in continuous contact at all times ensures that heat produced by the parallel optical communications device will be transferred into and absorbed by the floating heat sink device.Type: GrantFiled: August 31, 2009Date of Patent: October 11, 2011Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd.Inventor: Laurence R. McColloch
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Patent number: 8031464Abstract: Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment.Type: GrantFiled: September 8, 2009Date of Patent: October 4, 2011Assignee: Intergraph Technologies CorporationInventors: Casey R. Adkins, Charles A. Abare, Andrew J. Ornatowski
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Patent number: 8027160Abstract: A system for removing heat from an electronic component associated with an information handling system is disclosed. The system may comprise a mass providing a heat sink to the electronic component and a set of extended surfaces for transferring heat from the mass. The set of extended surfaces may define a primary flow direction for a cooling fluid. A first subset of the set of extended surfaces may have a first length measured in the primary flow direction. A second subset of the set of extended surfaces may have a second length measured in the primary flow direction. Each of the first and second subsets of extended surfaces may include one or more extended surfaces. The second subset of extended surfaces may be generally proximate the hotspot of the electronic component. The second length may be less than the first length such that the flow rate of the cooling fluid through the second subset of extended surfaces is greater than a flow rate of the cooling fluid through the first subset of extended surfaces.Type: GrantFiled: January 22, 2009Date of Patent: September 27, 2011Assignee: Dell Products L.P.Inventors: Thoong Hung Seow, Sanjoy Kumar Saha
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Patent number: 8018720Abstract: Vapor condensers and cooling apparatuses are provided which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device. The vapor condenser includes a thermally conductive base structure with a plurality of condenser fins extending from the base structure. The condenser fins have a proximal end coupled to the base structure and a remote end remote from the base structure. At least one exposed cavity is provided within each condenser fin extending from the remote end towards the proximal end. The exposed cavities are sized to provide greater condenser fin surface area for facilitating vapor condensate formation, and thereby facilitate cooling of an electronic device using a two-phase coolant.Type: GrantFiled: June 25, 2009Date of Patent: September 13, 2011Assignee: International Business Machines CorporationInventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
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Patent number: 8018722Abstract: Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.Type: GrantFiled: April 2, 2010Date of Patent: September 13, 2011Assignee: Tanima Holdings, LLCInventor: Thomas W. Lynch
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Patent number: 8018723Abstract: A heat dissipation system for use with an electronic module is provided. The electronic module includes a first side with a first plurality of electronic components mounted thereon and a second side with a second plurality of electronic components mounted thereon. The heat dissipation system includes a first segment mountable on the module to be in thermal communication with at least one electronic component of the first plurality of electronic components. The system further includes a second segment mountable on the module to be in thermal communication with at least one electronic component of the second plurality of electronic components. The system includes a third segment mountable on the module to be in thermal communication with the first segment and with the second segment, the third segment providing a path through which heat flows from the first segment to the second segment.Type: GrantFiled: April 29, 2009Date of Patent: September 13, 2011Assignee: Netlist, Inc.Inventors: Enchao Yu, Zhiyong An
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Patent number: 8009428Abstract: A guiding apparatus for guiding a heat sink easily to be attached to a circuit board to cool an electronic element mounted on the circuit board and includes a seat, and a pair of guiding members. The heat sink includes a pair of fasteners movably attached thereto. A number of flexible barbs are formed at an end of each fastener. The seat is elongated and includes a sliding groove defined therein along a length thereof. Each guiding member includes a post, a first block, a second block, and a resilient member. The first and second blocks surround the post. The first block is received in the sliding groove. The resilient member slidably surrounds the post and sandwiched between the second block and the seat. A locating hole is defined in the post adjacent to the second block to receive the barbs of the fastener.Type: GrantFiled: August 31, 2010Date of Patent: August 30, 2011Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventor: Zhen-Xing Ye
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Patent number: 8004846Abstract: A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates; and a radiation fin arranged between the pair of heat conducting plates, having elastic characteristics between the pair of heat conducting plates, and radiating heat from the heat conducting plate to the space.Type: GrantFiled: March 24, 2009Date of Patent: August 23, 2011Assignee: Fujitsu LimitedInventors: Akira Okada, Hirofumi Imabayashi, Hideaki Yajima, Katsumi Kanasaki, Takehide Miyazaki, Kazuya Nishida
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Patent number: 7995344Abstract: A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil construction as a result of contact with a top surface of an electronic component mounted opposite the foil construction.Type: GrantFiled: January 9, 2007Date of Patent: August 9, 2011Assignee: Lockheed Martin CorporationInventors: Charles H. Dando, III, Jon Larcheveque, David L. Vos
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Patent number: 7990722Abstract: A fastener comprises a fastener post, a clasping element and an elastic element. The fastener post comprises a head, a post body and a threaded portion. The post body has a first extension section connecting with the head, a second extension section connecting with the threaded portion and a recess section connected between the first and second extension sections. The clasping element comprises an annular clasping body, a first clasping portion axially extending from the clasping body and a second clasping portion extending outwardly and then downwardly from the clasping body. The clasping body encloses the post body, the first clasping portion engages with the recess section of the post body, and the second clasping portion engages with the heat sink. The elastic element is set around the post body and located between the head and the clasping body.Type: GrantFiled: October 19, 2009Date of Patent: August 2, 2011Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Lei Cao, Min Li
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Patent number: 7990716Abstract: A heat sink structure having an improved heat radiation efficiency is disclosed. The heat sink structure comprises a plate-shaped heat sink having a top surface and a bottom surface, wherein through holes along a planar direction of a board are formed between the top surface and the bottom surface of the heat sink.Type: GrantFiled: December 12, 2008Date of Patent: August 2, 2011Assignee: Advantest CorporationInventor: Koei Nishiura
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Patent number: RE42785Abstract: A semiconductor module is provided which includes a beat heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.Type: GrantFiled: May 28, 2010Date of Patent: October 4, 2011Assignee: Rambus Inc.Inventor: Belgacem Haba