Abstract: An electronic apparatus is provided to efficiently dissipate the heat generated by a heat generating electronic component. The electronic apparatus comprises a framework formed of a metal sheet to form an open end, a printed board disposed in the framework and having the heat generating component thereon, an inner cover disposed inside the framework by soldering and formed of a metal sheet having a tongue-shaped portion and an opening portion formed by being cut and hung, and an outer cover arranged so as to cover the open end of the framework and formed of a metal sheet having a tongue-shaped portion formed by being cut and hung, wherein the tongue-shaped portion of the inner cover is held in contact with the top of the heat generating component and, wherein the tongue-shaped portion of the outer cover is held in contact with the tongue-shaped portion of the inner cover through the opening portion of the inner cover.

Abstract: An integrated circuit package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is enclosed by a cover plate that is attached to the substrate. The cover plate is separated from the integrated circuit by a small space. The cover plate has a pair of ports which allow a thermal grease to be injected into the space between the integrated circuit and the cover plate. The package has a seal that extends around the integrated circuit between the cover plate and the substrate. The seal controls and confines the thermal grease to an area immediately adjacent to the integrated circuit.

Abstract: A three-dimensional multi-chip module is formed as a stack of two-dimensional multi-chip modules comprising substrates which have electrically signal paths connecting integrated circuit chips and has vertical interconnections of the signal paths, provided by interconnection or via chips. The individual chips or other inner components on a substrate are in mechanical contact with a surface of an adjacent substrate and constitute the distance device maintaining the substrates spaced from each other. Thus heat developed in components can be conducted essentially perpendicularly to the substrates. Thermally conducting chips can be used for improving the conducting of heat. Cooling devices are located only at the top and bottom surfaces of the stack.

Abstract: The present invention relates to a method and a device for protecting electronics which are cooled with exterior air. The device comprises an electronic circuit (8) arranged on an electronic support (1) with associated connector (7), which electronic circuit (8) consists of electronic components and/or subcircuits. The device is characterized in that it comprises on the one hand a first casing (2) which surrounds the electronic circuit (8) and towards and over the surface of which a cooling air current (30) is led, on the other hand a second casing (6) which is arranged to cooperate with the first casing (2) so that a connector (7) associated with the electronic circuit (8) is protected from the cooling air current (30) in a space (13, 16) separated from the cooling air current (30).

Abstract: An apparatus is provided for dissipating heat from a stacked circuit board assembly. The apparatus includes circuit boards that are oriented in spaced planes that extend substantially parallel to one another. A heat transfer means connected to the circuit boards transfers heat between the circuit boards. A heat dissipation means connected to at least one of the circuit boards dissipates at least a portion of the transferred heat.

Abstract: A core module assembly of a retail terminal includes a microprocessor which performs computing functions associated with operation of the retail terminal, whereby heat is generated by the microprocessor during performance of the computing functions. The core module assembly further includes a first heat transfer structure positioned in thermal communication with the microprocessor. The first heat transfer structure has a body portion and a key portion extending from the body portion. The core module assembly also includes a second heat transfer structure having a keying slot defined therein. Relative movement between the first heat transfer structure and the second heat transfer structure is limited when the key portion of the first heat transfer structure is positioned within the keying slot of the second heat transfer structure. The core module assembly includes a fastener for maintaining the key portion of the first heat transfer structure within the keying slot of the second heat transfer structure.

Abstract: A core module assembly of a retail terminal includes a microprocessor which performs computing functions associated with operation of the retail terminal, whereby heat is generated by the microprocessor during performance of the computing functions. The core module assembly also includes a housing for containing the microprocessor. The housing has a first fastening surface. The housing also includes a heat transfer structure positioned in thermal communication with the microprocessor. The heat transfer structure has an elongated channel defined therein. The core module assembly further includes a heat dissipating cover having an elongated tongue extending therefrom. The cover further has a second fastening surface. The cover is positionable between a non-biased position and a biased position.

Abstract: An electrical component, mounted for example to a printed circuit board, is enclosed in a sealed chamber with an inert gas that permits the electrical leads of the electrical component to be formed from a material having high heat and electrical conductivity, such as silver, that is protected from corrosion and/or oxidation by the inert gas. The housing is fabricated from a heat conductive material, and heat is thereby drawn from the electrical leads for dissipation by the outer surface of the housing.

Abstract: Since, due to heat flowing from the outside through central conductors of cables or connectors into an electronic circuit that is operated in a state of being cooled to a low temperature, a temperature distribution or local temperature rising occurs in the electronic circuit, a desired characteristic cannot be obtained for the electronic circuit. There is disclosed an electronic apparatus comprising an electronic device accommodated in a vacuum heat insulation housing, provided with an electronic circuit which is cooled to a temperature between 4 K. and 150 K. to operate, and an input/output coaxial connector of which central conductor is hold by a dielectric having a heat conductivity of 10 W/m.multidot.K. or more at the temperature between 4 K. and 150 K.; and cooling means accommodated in the vacuum heat insulation housing, for cooling the electronic device to the temperature between 4 K.

Abstract: A method and apparatus for making the weight load distribution more uniform over the surface of a processor die and improving the heat transfer between the processor die and a thermal spreader cap is provided. The apparatus includes generally a square-like box shaped thermal spreader cap having a cavity that conforms to the shape of the processor die. The thermal spreader cap fits over the processor die and has a cavity that is dome-like in shape. Additionally, the thermal spreader cap is attached to a thermal dissipative device which may in turn be connected to a heat sink. The apparatus provides a thinner and more uniform thermal interface layer between the processor die and the thermal spreader cap, thereby evening the weight load on the surface of the processor die and improving the heat flux between the processor die and the thermal spreader cap.

Abstract: The invention is a heat sink assembly for the removal of heat from semiconductor and power converter modules. The packaging design for semiconductor modules and power converter modules provides efficient heat removal and a tight Faraday Cage. There is a heat transfer layer sandwiched between a CPU module and a power converter module. The heat sink assembly includes a heat transfer layer, a fin stack, and a series of heat pipes. The heat transfer layer has a slot for passage of power cables and sense lines which connects both the CPU module and the power converter module, and the power converter module and the printed circuit board. The heat sink chamber also serves as a Faraday Cage and thus attenuates EMI from the semiconductor module, the power converter module, the power cables, and the sense lines.

Abstract: A method and apparatus for removing heat from an acoustically shielded electro-mechanical assembly without relying upon a convective air flow and without the provision of bulky external heat sinks provides an acoustically shielded electro-mechanical assembly, such as a hard disk drive, that may be used in a personal computer. The invention may be used successfully in any application where noise mitigation measures, such as encapsulation of an electro-mechanical assembly within an acoustic shield, otherwise cause undesirable overheating of the assembly.

Abstract: The environmentally protected module (16, 116, 216), which is qualifiable under military and space specifications, uses commercial and/or industrial grade electronic components (18, 20; 118, 120; 218, 220). The components are secured to and are electrically coupled together on a printed wiring board (24, 124, 224), through which thermally conductive vias (38, 138, 238) extend. The components are encapsulated in a thermally conductive and electrically insulative packaging material (25a, 25b; 125; 225, 229). Cooling or heating is provided by Peltier thermoelectric heat pump devices (32, 132, 232) coupled between an external heat sink/exchanger (35, 80; 135; 235) and the components.

Abstract: A radio frequency power amplification module includes: a radiation section; a printed circuit board attached to the radiation section; a semiconductor device for power amplification, mounted on the printed circuit board; and a cap. The radiation section includes a plurality of radiation boards, the plurality of radiation boards at least including a first radiation board as a lowermost layer, and a second radiation board attached onto the first radiation board, the first radiation board being coupled to the cap.

Abstract: An electronic assembly includes a flex-rigid circuit board having a flexible polyimide layer disposed on the upper side of a rigid substrate, conductive circuit paths formed within the substrate and on the polyimide layer, and a base for dissipating heat generated by electrical components mounted on the circuit board. The flex-rigid circuit board has a cavity therein extending from a lower electrical insulation layer through the rigid substrate to the upper polyimide layer. A heat-generating electrical component is mounted on the upper layer over the cavity in the circuit board. The base has a boss that protrudes into the cavity and contacts the upper polyimide layer such that heat from the electrical component is conducted through the upper polyimide layer and into the base. Cool electrical components requiring no heat sinking are mounted on the lower insulation layer and/or the upper polyimide layer.

Abstract: The device includes a substrate (18). A first semiconductor die (12) is disposed on the substrate (18). The first semiconductor die (12) has a major surface (23) and at least a portion of the major surface (23) is positioned to receive a cooling medium. A signal input region (24), an active region (32) and a conductive region (34) are disposed on the major surface (23). The conductive region (34) is coplanar with, and electrically couples, the signal input region (24) and the active region (32). An electrically reactive metal region (42) is in communication with the signal input region (24). The electrically reactive metal region (42) is sized to allow real-time iterative tuning of the electronic device.

Abstract: An arrangement of a plurality of microcooling devices provided with electrical components, each microcooling device having a closed channel structure for a coolant to flow through, and being provided with electrical conductors for the electronic components and with externally carried fluid ducts for a coolant which flows through the channel structures. A covering layer which forms one of at least two flat sides of the microcooling device is made from an electrically insulating material with good heat conductivity. The electronic components are arrayed on this cover layer and on the opposite flat side of each microcooling device. Adjacent microcooling devices which are provided with electronic components on confronting flat sides are arranged with their components spaced apart or staggered with respect to one another, and the components of one microcooling device preferably are in contact with the cover layer of the adjacent microcooling device.

Abstract: A method and apparatus for attaching heatsinks having a disproportional size relative to the electronic component to which they are attached. In general, the apparatus comprises variable-length attaching means for attaching each corner of the heatsink to the circuit card while maintaining sufficient contact with the electronic component. The variable-length attaching means includes a post and a receiving well. Both the post and receiving well include attaching means, such as threads and nuts, for attachment to the heatsink and circuit board, respectively. The variable-length attaching means accommodates height variations between parts, establishes high structural integrity after assembly, controls static and dynamic loading of the solder columns, allows for module re-work while re-using the heatsink and card, and provides adequate protection from shock, vibration, and handling.

Abstract: This invention is discloses a packaged integrated circuit (IC) which includes an IC chip supported and securely attached to an adapter board. The package also includes a chip cap for covering and protecting the IC chip therein. The chip cap further forms a concave, step near a lower edge of the cap for wrapping around the edge of the adapter board for increasing the contact areas between the cap and the board and for securely attaching the cap to the board. The chip cap is composed of thermal conductive materials and the chip cap further includes a heat sink for dissipating heat generated from the IC chip. The adapter board further includes a plurality of connecting vias and a plurality of conductive metal balls forming a ball grid array (BGA) underneath the adapter board. The IC chip is in electrical and thermal contact with the BGA by filling the connection vias with conductive materials.

Abstract: A lead-on-chip integrated circuit assembly comprising at least one extremely thin adhesive layer transferred from a carrier onto the face of an integrated circuit chip, and a lead frame laminated to the last adhesive layer, with cured adhesive acting as an insulator, wherein said lead frame is aligned and connected to integrated circuit chip connection pads. This lead-on-chip integrated circuit assembly may be encapsulated. Thermally conductive and electrically insulating filling may be included with the adhesive to improve heat conduction from the integrated circuit ("IC"). Compliant adhesive reduces thermally induced stresses between the lead frame and IC chip. Both the improved thermal performance and reduced moisture absorption of the encapsulated assembly improves the reliability of the integrated circuit package.

Abstract: There is disclosed components for electronic packaging applications having integral bumps. A leadframe is formed by etching a metallic strip from one side to form outwardly extending, substantially perpendicular integral bumps. The metallic strip is then etched from the opposite side to form individual leads. When the integrally bumped component is an package base, fatigue of solder balls is reduced.

Abstract: A method of fabricating a metal matrix composite containing electrically isolated areas and the MMC formed from the method. The method comprises: (a) providing a liquid pool of unreinforced aluminum alloy; (b) infiltrating the unreinforced aluminum alloy into a stack comprising upper and lower porous preforms and an electrical insulator material placed between the preforms; (c) solidifying the liquid-phase metal to form a metal matrix composite product that completely surrounds the stack; and (d) forming at least one groove in the solidified metal, the groove extending downward to the insulating substrate so as to electrically isolate at least one region on the surface of the metal matrix composite.

Abstract: A structure and a method provide an assembly for receiving an integrated circuit die. The assembly comprises a heat sink selectively coated with electrically insulative material. The heat sink is attached by one of various methods directly on to the integrated circuit die and a lead frame for external electrical connections. The heat sink is formed as a stepped structure to increase the path of moisture penetration so as to improve moisture resistance and reliability. In one embodiment of the present invention, the electrically insulative material comprises anodized aluminum, which is formed on the heat sink by a vapor deposition step, followed by a hard anodization step. Other electrical insulative material which can be thinly applied on the surface of the heat sink are non-conductive resins and polymers. The heat sink is formed out of copper or a copper alloy, selected for strength and electrical and thermal conductivities.

Abstract: The present invention relates to a semiconductor device which comprises a semiconductor chip mounting section having a through hole, a radiating plate attached to one surface of the semiconductor chip mounting section so as to cover the through hole of the semiconductor chip mounting section, a semiconductor chip mounting plate which is formed within the through hole and mounted on the radiating plate, a surface of the semiconductor chip mounting plate, which is opposite to another surface thereof mounted on the radiating plate, being plated with gold, and the semiconductor chip mounting plate having improved electrical insulation properties and high thermal conductivity, and a semiconductor chip formed within the through hole and attached to the semiconductor chip mounting plate by a conductive adhesive.

Abstract: A low profile heat dissipator for low power IC packages which is formed of a metal, thermally conductive layer, zero, one or two electrically insulative layers positioned on one or both major surfaces of the metal layer, and an adhesive pad which bonds the dissipator to the surface of the electronic component. The dissipator may have a series of score lines formed in its surfaces which allows portions of the dissipator to be bent or removed so as to conform to the available space.

Abstract: A flat circuit module assembly includes a circuit board and unpackaged, or housingless, chips mounted on its surface, with an elastic pressure pad between the circuit board and the chips. To achieve an adequate spring characteristic, the elastic pressure pad is dimensioned to be correspondingly thick, the consequence of which is that the Z bend of the terminal legs would be greater than would actually be needed for compensating for the thermal stress. To avoid this disadvantage, the invention provides depressions on the circuit board surface into which the pressure pads are placed. This reduces the tolerance range in the surface soldering area. The invention also provides that the circuit board is a multilayer board that has internal conductors, and further that the depression into with the pressure pad is placed extends to one of the internal conductive layers.

Abstract: Power semiconductor device structures and assemblies with improved heat dissipation characteristics and low impedance interconnections include a thermally-conductive dielectric layer, such as diamondlike carbon (DLC) overlying at least portions of the active major surface of a semiconductor chip, with vias formed in the dielectric layer in alignment with contact pads on the active major surface. A patterned metallization layer is formed over the thermally-conductive dielectric layer, with portions of the metallization layer extending through the vias into electrical contact with the chip contact pads. A metal structure is electrically and thermally coupled to selected areas of the patterned metallization, such as by solder bonding or by a eutectic bonding process. In different embodiments, the metal structure may comprise a metal conductor bonded to the opposite major surface of another power semiconductor device structure, a heat-dissipating device-mounting structure, or simply a low-impedance lead.

Abstract: A controlled oxygen content copper clad laminate product and process. In accordance with one aspect of the present invention, there is provided a laminate having a first layer of oxygen-free copper joined to a second layer of oxygen-rich copper by the steps of (i) cladding the first layer to the second layer at a relatively low speed to minimize rolling friction, (ii) finish rolling the laminate to substantially increase its thickness tolerance, (iii) slitting the laminate to increase its width tolerance, (iv) profiling a groove at a selected location in the laminate, (v) finish slitting a plurality of ribbons from the laminate, (vi) tension leveling the laminate to straighten and flatten its shape, (vii) stamping the laminate into sections each of a selected configuration, (viii) cleaning laminate surfaces, and (ix) direct bonding the laminate to a substrate material such that the first layer is annealed to the second.

Abstract: The semiconductor chip module according to the present invention comprises a semiconductor substrate on which a wiring portion is formed, a semiconductor chip 4 mounted so as to face a circuit side up to the wiring portion, a heat sink 3, 3a, 13 with one end contacted to the central portion of an upper surface of the semiconductor chip 4, 4a; and a cap which has an opening 2a for exposing the other end of the heat sink 3, 3a, 13 to the outside, the cap 2 enclosing all of the semiconductor chips 4, 4a. Accordingly, the heat generated from the semiconductor chips 4, 4a can be dissipated through the heat sink 3, 3a, 13 to the outside. It results in providing a semiconductor chip module without inconvenience for operation with high speed.

Abstract: A package for one or a plurality of semiconductor elements comprises a package substrate, at least one semiconductor element mounted on the package substrate having an active layer in a surface which faces away from the package substrate, a thin pliable electrically insulating resin layer applied to the surface of each semiconductor element, a metal cap which cooperates with the package substrate to hermetically enclose the space containing one or more semiconductor elements, and a heat diffusing plate of high thermal conductivity provided between the electrically insulating resin layer of each semiconductor element and the metal cap. A part of heat generated in the active layer is conducted through the heat diffusing plate to the metal cap and is released there, thereby shortening the heat path and reducing the heat-releasing surface of the package substrate.

Abstract: A lead-on-chip integrated circuit package comprising at least one extremely thin adhesive layer transferred from a carrier onto the face of integrated circuit chips, and a lead frame laminated to the last adhesive layer, with cured adhesive acting as an insulator, integrated circuit chip connection pads bonded to and encapsulating the chip and lead frame. Thermally conductive and electrically insulating filling may be included with the adhesive to improve heat conduction from the IC. Compliant adhesive reduces thermally induced stresses between the lead frame and IC chip. Both the improved thermal performance and reduced moisture absorption of the encapsulated package improves the reliability of the integrated circuit package.

Abstract: A high-frequency semiconductor hybrid integrated circuit device with desirable high-frequency properties and reduced floating capacitance that is easily manufactured at lower cost with reduced labor. A coupling dielectric substrate bearing conducting films as a circuit pattern is joined to a main dielectric substrate mounted on a heat radiating plate and bearing elements for high frequency amplification to a heat sink. The coupling dielectric substrate should have the same circuit constants at the high-frequency circuit as the main dielectric substrate.

Abstract: An electronic circuit assembly with improved heatsinking is provided. The assembly includes a component carrying board (56) which has an opening (62) through it. The opening is sized to receive a heat generating electronic component (64). A diamond layer (50) is attached as a heat sink to the bottom (58) of the component carrying board. The heat generating component (64) is attached directly to the diamond layer (50), through the opening (62) in the component carrying board (56). The diamond layer provides electrical insulation as well as superior heat dissipation.

Abstract: Disclosed is an arrangement for connecting a plurality of transistors to a heat sink surrounding one end of a control motor for a mailing machine. The motor is a conventional bi-directional stepping motor which controls various operational functions of the mailing machine. The direction, speed and continuity of the rotation of the motor rotor are controlled by a plurality of transistors which receive appropriate signals from a microprocessor. The transistors generate a substantial amount of heat during operation of the motor and are mounted on a heat sink connected to the motor in order to dissipate this heat.

Abstract: An improved encapsulant and method of application for rework of a modular electronic assembly. A housing is provided with a structure that permits deformation with thermal expansion of the encapsulant and reduces stresses applied to the electronic components therewithin. The selected encapsulant provides mechanical stability from shock and vibration, thermal conductivity to the surroundings, and freedom from deterioration of electrical performance. Critically, the encapsulant is readily excised for repair and replacement of defective components, thus allowing rework and salvage of the assembly. A potting tool is adapted for selectively refilling the housing to replace the excised portions.

Abstract: An improved packaging technique for packaging a thermally-enhanced, molded-plastic quad flat package (TE-QFP). An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate having a stepped area formed into the outer margins thereof. A lead frame has inwardly-extending fingers, which are attached to the stepped areas in the outer margins of the thermally conductive, electrically-insulated substrate. The stepped area centers the thermally conductive, electrically-insulated substrate and attached integrated-circuit die within the mold cavity so that the flow of plastic material is balanced over the top and bottom of the substrate to provide a molded package body substantially free of voids.

Abstract: An apparatus and a method of mounting a power semiconductor (10) to an external heat sink (18) when both fastening faces (11, 13) of the semiconductor are inaccessible during the assembly process. The apparatus comprises a nut plate (20) that mates with the semiconductor (10) and a thermally conductive layer (28) that engages the nut plate (20) and wraps around the semiconductor (10) in a captive manner. The external heat sink (18) threadably engages the nut plate (20) without the need to access either fastening face (11, 13) of the semiconductor (10).

Abstract: The present invention relates to an electrical device such as a resistor or silicon controlled rectifier that is provided with an improved heat transfer medium for transferring heat from the device to an adjacent structure such as a mounting panel. The improved heat transfer medium includes a bonded series of laminates including a layer of nickel-plated copper sandwiched between two layers of ceramic, such as aluminum oxide.

Abstract: An encapsulated electrically and thermally enhanced integrated circuit is disclosed. An integrated-circuit die is attached to a thermally conductive, electrically-insulated substrate. A lead frame having inwardly-extending bonding fingers has the bottom sides thereof attached to the top of the substrate. A contiguous layer of insulating material is bonded to the top sides of the bonding fingers, such that the layer of insulating material peripherally surrounds the integrated-circuit die. A conductive layer of material is then bonded to the top of the insulating layer. A second layer of insulating material followed by a second conductive layer may be bonded on top of the first conductive layer. Electrical connections are made from the integrated-circuit die to the conductive layers surrounding the die. The device is then encapsulated in a plastic material.

Abstract: A thermal attachment assembly for heat generating electronic devices which includes a multi-element spring having low force, high deflection, spring fingers, and which is adjustable and attached by screws to a cover to apply pressure directly against electronic components arranged generally perpendicular to at least one edge of a printed wired board (PWB). The attachment assembly includes a heat sink housing in which the electronic components are pressed against an electrically insulating, thermally conductive film positioned against one wall of the heat sink housing. The PWB is snapped to a carrier and both are placed into the housing so that the electronic devices are positioned within spaces of the carrier. The carrier includes sloping surfaces, so that the spring fingers are deflected downward when the cover is attached to the housing, thereby insuring that the spring fingers are properly positioned onto the electronic devices, between the spaces of the carrier.

Abstract: Gas derived graphite fibers generated by the decomposition of an organic gas are joined with a suitable binder. This produces a high thermal conductivity composite material which passively conducts heat from a source, such as a semiconductor, to a heat sink.The fibers may be intercalated. The intercalate can be halogen or halide salt, alkaline metal, or any other species which contributes to the electrical conductivity improvement of the graphite fiber.The fibers are bundled and joined with a suitable binder to form a high thermal conductivity composite material device. The heat transfer device may also be made of intercalated highly oriented pyrolytic graphite and machined, rather than made of fibers.

Abstract: A printed wiring board carries electronic components. A castable body is of thermally conductive dielectric material and is molded from the printed wiring board to the exact configuration of the electronic devices. A metal plate completes the conductive converter, which includes the castable body. The conductive converter can be clamped to a cold plate and a card box to conductively remove heat from the electronic components. The molding process may be direct molding of the castable body onto the electronic device side of the printed wiring board or may include indirect steps. Protection of the electronic devices and printed wiring board and filling of the undercuts may be accomplished by vacuum-forming an electrically conductive polymer sheet over the devices during molding followed by removing of the sheet when the thermal mounting plate is attached.

Abstract: A microelectronic package comprising a circuit carrier having a power chip, an integrated circuit means, and thermal conduction means for carrying heat from the microelectronic package is provided. The thermal conduction means includes a first heat dissipation back plate means associated with the power chip and a second heat dissipation back plate means associated with the integrated circuit means. The heat dissipation back plate means are electrically isolated from each other and have different heat dissipation capacity.