Abstract: A device for fixing a camera module, includes a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

Abstract: A voltage regulator module includes a first circuit board assembly and a signal communication part. The first circuit board assembly includes a plurality of first conduction pads. The signal communication part is arranged on the first circuit board assembly. The signal communication part includes a conduction circuit board with a plurality of conduction fingers and a plurality of surface pins. The plurality of conduction fingers are formed on at least one lateral side of the conduction circuit board. The plurality of surface pins are electroplated on a top side and a bottom side of the conduction circuit board. A first end of each conduction finger is contacted with the corresponding surface pin on the top side. A second end of each conduction finger is contacted with the corresponding surface pin on the bottom side. The signal communication part is fixed on and electrically connected with the first circuit board assembly.

Abstract: A device for fixing a camera module, includes a base part; and a fixing unit including a first fixing part for supporting one side of each of a plurality of boards, and a second fixing part for supporting the other side facing one side of each of the plurality of boards, wherein a plurality of first fixing parts extends in a first direction from the base part, and includes a plurality of protruding parts protruding in the direction perpendicular to the first direction in order to support one side of each of the plurality of boards, and a plurality of second fixing parts extends in the first direction from the base part, and includes a plurality of protruding parts for supporting the other side of each of the plurality of boards.

Abstract: An embodiment display panel includes a housing comprising a recess and framing portions, a printed circuit board (PCB), a sealing material, and a plurality of light emitting diodes (LEDs). The PCB is attached to and overhangs the framing portions of the housing. The PCB includes a front side and an opposite back side. The recess overlies the opposite back side of the PCB. The sealing material is disposed between the opposite back side of the PCB and the framing portions of the housing. The plurality of LEDs is disposed at the front side of the PCB. The front side of the PCB forms an entirety of a front surface of the display panel.

Abstract: An embodiment display panel includes a printed circuit board (PCB) including a lower portion and an upper portion disposed over and overhanging the lower portion of the PCB. The display panel further includes a plurality of light emitting diodes (LEDs) disposed at a front side of the upper portion of the PCB, where the front side of the upper portion of the PCB forms an entirety of a front surface of the display panel. The display panel also includes a housing having a recess, where the lower portion of the PCB is at least partially disposed within the recess, where framing portions of the housing are laterally adjacent to the lower portion of the PCB, and where the upper portion of the PCB overhangs the framing portions of the housing.

Abstract: A contact element (1) for providing an electrical contact between a first electrical device (7) and a second electrical device, wherein the contact element (1) comprises a first contact portion (2) to be electrically connected to the first electrical device (7) and a second contact portion (4) to be connected to the second electrical device. The first contact portion (2) is arranged at a distance (D) to the second contact portion (4), whereby the contact element (1) comprises further an adjustment portion (3) connecting said first and second contact portion (2, 4), wherein with said adjustment portion (3) said distance (D) between the first contact portion (2) and the second contact portion (4) is adjustable.

Abstract: A manufacturing method of substrate structure is provided. A base material having a core layer, a first patterned copper layer, a second patterned copper layer and at least one conductive via is provided. The first and second patterned copper layers are respectively located on a first surface and a second surface of the core layer. The conductive via passes through the core layer and connects the first and second patterned copper layers. A first and a second solder mask layers are respectively formed on the first and second surfaces. Portions of the first and second patterned copper layers are exposed by the first and second solder mask layers, respectively. A first gold layer is formed on the first and second patterned copper layers exposed by the first and second solder mask layers. A nickel layer and a second gold layer are successively formed on the first gold layer.

Abstract: A server chassis bracket (SCB), including: a first set of holes configured to secure a first set of grommets gripping a first server component; a second set of holes configured to secure a second set of grommets gripping a second server component; a first shared guide configured to: guide a first grommet of the first set of grommets towards a first hole of the first set of holes; and guide a second grommet of the second set of grommets towards a second hole of the second set of holes; and a latch covering a portion of the first shared guide, including a tail, and configured to: generate a first audio verification of a successful installation of the first server component into the server chassis bracket; and generate a second audio verification of a successful installation of the second server component into the server chassis bracket.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to a thin interposer disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can insulate the components from one another and also couple signals between the components on the first and second layers. In one embodiment, the components in the first and second layers are passive components.

Abstract: A stress relief structure is provided. The stress relief structure includes a stress relief body, at least one first stress relief base and at least one second stress relief base. The stress relief body has an upper surface and a lower surface opposite to each other. The first stress relief base is disposed on the upper surface of the stress relief body. The second stress relief base is disposed on the lower surface of the stress relief body. The at least one first stress relief base and the at least one second stress relief base are interlaced to each other.

Abstract: A locking assembly includes a guiding post and a hollow locking member. The guiding post includes a locking portion. A clamp hook is formed on a flange of the locking portion. The locking member includes an opening end. The locking member sleeves on the locking portion of the locking member, in which at least one clamping depression is formed on an inner wall of the locking member corresponding to the clamp hook, and the clamp hook is clamped in one clamping depression.

Abstract: An isolated switching power converter includes a power isolation transformer having at least one primary winding, at least one secondary winding and a plurality of sides, a first power board mechanically coupled to a first side of the transformer, and a second power board mechanically coupled to a second side of the transformer. The first power board includes a primary side circuit electrically coupled to the at least one primary winding, and the second power board includes a secondary side circuit electrically coupled to the at least one secondary winding.

Abstract: There is disclosed a method of manufacturing an electrical component, involving bonding a thin metal foil to an insulating substrate and thereby forming a component blank, and laser machining at least the metal foil of said component blank to produce at least one trench for defining one or more foil tracks, said trench being at least equal in depth to the thickness of the foil so as to prevent current flow across the trench.

Abstract: A mounting apparatus for an expansion card includes a bottom plate, a circuit board, and mounting bracket. The bottom plate defines mounting hole. The circuit board is secured to the bottom plate, and a gap is defined between the bottom plate and the circuit board. The mounting bracket includes a base secured to the bottom plate. The base includes two positioning pieces and an elastically deformable mounting portion. The two positioning pieces are received in the gap, to prevent the mounting bracket from moving along a first direction substantially perpendicular to the bottom plate, and the elastically deformable mounting portion is engaged in the mounting hole, to prevent the mounting bracket from moving along a second direction substantially parallel to the bottom plate.

Abstract: A connecting member for a portable electronic device includes a central cylinder, a first flange portion, a second flange portion, a plurality of first clasps and a number of second clasps. The first flange portion and the second flange portion surround on the central cylinder. The first clasps extend from the first flange portion, and the second clasps extend from the second flange portion.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.

Abstract: A modular package may be utilized to mount an RF system-on-chip in one of plural configurations, such that the same modular package may be utilized to enable plural device formats, while reducing the amount of RF testing needed to change device formats. In one configuration, a surface mount device is mounted onto a first surface of a board, and the board is directly surface mounted onto a base board. Here, the base board includes a hole for accommodating the surface mount device, providing a thin device format. In a second configuration, a spacer is mounted onto the first surface of the board, such that a gap is provided between the board and the base board for accommodating the surface mount device, providing a relatively thicker device, but providing additional surface area where the hole otherwise would be, reducing the device size.

Abstract: A printed circuit board (PCB) secured to a carrier, the carrier comprising at least one hook for securing the PCB, the PCB includes a first surface and a second surface opposite to the first surface. At least one recessed portion in the rim of the first surface receives at least one hook so there are no protrusions above the upper surface of the PCB. A carrier for securing the PCB is also provided.

Abstract: The universal control module is designed for controlling the operation of a plurality of motors and/or configured for a plurality of different motor applications. In an example, the control module is configurable within a housing of a power tool. The control module includes a top cover, a bottom cover and a printed circuit board (PCB) with control components thereon. The control module includes a spacer configured between the top and bottom covers and attached to the PCB for providing tolerances for the control components during a soldering process to fixedly attach the control components to the PCB.

Abstract: A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.

Abstract: There is provided an interconnection structure. An interconnection structure according to an aspect of the invention may include: a plurality of side portions provided on one surface of a substrate part and a plurality of cavities located between the side portions and located further inward than the side portions; and electrode pattern portions provided on surfaces of the side portions and the cavities.

Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.

Abstract: A chassis includes a number of fixing apparatuses, which enables various motherboards with different mounting holes layouts to be selectively mounted in the chassis. Each of the fixing apparatuses includes a base member secured to the chassis, and a fastening member rotatably connected to the base. The fastening member defines a fastening hole extending through an end of the fastening member. Each of the fixing apparatuses is rotatable between a fastening position and an interference avoiding position. To mount one of the motherboards, some of the fastening members are rotated to the fastening-ready positions to align the fastening holes of the fastening members with the corresponding mounting holes of the motherboard, and other fastening members are rotated to the interference-avoiding position to avoid interfering with the motherboard.

Abstract: The invention specifies a holding apparatus comprising a support element and a circuit board. A trench for receiving the circuit board is embodied in the support element. At least one first clamping element is arranged on one or both longitudinal sides of the circuit board and/or at least one second clamping element is arranged in the trench. As a result, the circuit board received by the trench is fixed in the trench in a clearance-free fashion.

Abstract: The disclosure concerns an electrical connection assembly comprising: a conductive plate with a drillhole, a first column with a hole passing axially through it and comprising a shoulder to abut against one of the faces of the conductive plate, and a second column with a hole passing axially through it and comprising a shoulder to abut against the other face of the conductive plate, a first cylinder with a radius sized to enable it to enter the hole in the first column and a length sized such that, when the shoulder is in abutment, the free end of the first cylinder projects beyond the conductive plate, and a second cylinder with a radius sized to enable it to enter the drillhole, wherein the free end of the first cylinder is crimped by radial expansion and then by axial compression in the hole in the first column.

Abstract: A boss for securing a pair of mainboards includes a circular top and a plurality of first flexible legs. The first flexible legs are disposed on one side of the circular top and are separated from each other. Each of the first flexible legs includes a tilted wall and a pressing component. The tilted wall is formed on a surface of the first flexible leg that faces another first flexible leg. The pressing component is formed on one end of the first flexible leg away from the circular top. The tilted walls of all the first flexible legs cooperatively define a tapered channel. The tapered channel can be expanded.

Abstract: A magnetic component provides both electrical interconnectivity and mechanical support between stacked circuit boards. The magnetic component includes a bobbin structure and a magnetically permeable core. The bobbin structure includes an upper bobbin pin rail and a lower bobbin pin rail. The upper bobbin pin rail includes one or more upper bobbin pins extending from the upper bobbin pin rail. Each upper bobbin pin may be adapted for soldering onto a first circuit board. At least one lower bobbin pin extends from the lower bobbin pin rail. Each lower bobbin pin may also be adapted for soldering onto a second circuit board, forming a circuit board assembly. Each soldered connection between a bobbin pin and a circuit board may provide an electrical connection between the circuit board and the magnetic component. Each soldered connection may also provide a mechanical attachment between a printed circuit board and the magnetic component.

Abstract: A backplane electronic circuit board of an electronic apparatus (10) comprises an interface connector with an external system and two interface boards (22, 23) connected to one another, a first interface board (22) being connected to the said interface connector and a second interface board (23) being intended for the connection of a set of electronic circuit boards of the said electronic apparatus (10). The backplane electronic circuit board (20) comprises reinforcement means (30, 40) installed between the said two interface boards (22, 23). Use in particular in an electronic apparatus on board an aircraft.

Abstract: A blade for a chassis-based system includes a printed circuit board (PCB) mounted at a tilt angle within the blade. The tilt angle provides space above or below the PCB at the front end of the blade, such that media interface modules can be flexibly positioned within the blade. A tilt angle that positions the PCB higher near the front end of the blade may enable media interface modules mounted in a belly-to-belly configuration on the PCB to be fitted within the front end of the blade. A tilt angle that positions the PCB lower near the front end of the blade may enable media interface modules mounted on the upper surface of the PCB to be fitted within the first end of the blade. The tilt angle also positions a backplane connector mounted on the PCB to properly engage a backplane when the blade is inserted into a slot.

Abstract: A card assembly is disclosed comprising a carrier host card, an interposer printed wiring board (PWB) situated between the carrier host card and a hosted card, wherein the carrier host card and the interposer printed wiring board (PWB) are configured to have a space there-between. The card assembly further comprising a customized front panel including a first cutout for the carrier host card and a second cutout for said hosted card.

Abstract: Stacked microelectronic devices and methods for manufacturing such devices are disclosed herein. In one embodiment, a stacked microelectronic device assembly can include a first known good packaged microelectronic device including a first interposer substrate. A first die and a first through-casing interconnects are electrically coupled to the first interposer substrate. A first casing at least partially encapsulates the first device such that a portion of each first interconnect is accessible at a top portion of the first casing. A second known good packaged microelectronic device is coupled to the first device in a stacked configuration. The second device can include a second interposer substrate having a plurality of second interposer pads and a second die electrically coupled to the second interposer substrate. The exposed portions of the first interconnects are electrically coupled to corresponding second interposer pads.

Abstract: A laminate mount assembly includes a first member that includes an inter-member connection electrode that is provided on an end surface that forms a predetermined inter-member connection side surface; a second member that includes an inter-member connection electrode that is provided on an end surface that forms the inter-member connection side surface, the second member being arranged to be parallel with the first member; and a conductive film that electrically connects the inter-member connection electrodes to each other over a portion in which the first member and the second member are opposite to each other.

Abstract: An electronic apparatus includes a flexible printed circuit having a first surface on which a switch is mounted, a reinforcement plate having a first surface arranged to face a second surface of the flexible printed circuit opposite to the first surface of the flexible printed circuit on which the switch is mounted, and a spacer arranged to face a second surface of the reinforcement plate opposite to the first surface of the reinforcement plate that faces the second surface of the flexible printed circuit.

Abstract: An electronic device is provided, the electronic device includes a printed circuit board (PCB) having a mounting point. The computer system also includes a chassis having a mounting post. The mounting point and the mounting post are flexibly connected.

Abstract: A touch panel includes first and second substrates, and first insulating layer disposed therebetween. The first substrate has, on its bottom surface, a first conductive layer having opposing first and second sides; a first electrode along the first side; and a second electrode along the second side. The second substrate has, on its top surface, a second conductive layer facing the first conductive layer with a predetermined space and having third and fourth sides orthogonal to the first and second sides: a third electrode along the third side; and a fourth electrode along the fourth side. The first insulating layer is frame-like and coats at least part of the first and second electrodes. The first and second electrodes and the first insulating layer together form a decoration part having a color tone to prevent the third and fourth electrodes from being visible when viewed from the first substrate side.

Abstract: A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals. Of the lead terminals provided for the power semiconductor module and connected with the main circuit board, predetermined one or ones of the lead terminals is or are connected with the main circuit board in the vicinity of a main circuit terminal stage and at a position or positions lower than the main circuit terminal stage. Alternatively, predetermined one or ones of the lead terminals is or are connected with the main circuit board at a position or positions lower than a position at which the main circuit terminal stage is provided.

Abstract: A memory module with attached transposer and interposers to provide additional surface area for the placement of memory devices is disclosed. The memory module includes a memory board with a first surface, a second surface and an edge with a set of electrical contacts. A transposer is attached to each surface of the memory board, and an interposer is attached to each transposer on the opposite surface of the transposer from the memory board. The interposer has space to allow placement of memory devices on both a first surface between the interposer and the memory board, and on a second surface of the interposer away from the memory board.

Abstract: A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit.

Abstract: The present invention is directed to a printed circuit board assembly having a circuit board with opposing side edges and an open frame housing with parallel mounting frames extending along the side edges of the circuit board. Each mounting frame has a body portion having a support shelf and an overhang ledge forming a channel, the channel nesting an associated side edge of the circuit board. A mounting peg is supported to extend transversely to the entry of the channel, and temporary deforming of the ledge permits entry of the associated side edge into the channel, the circuit board having a complementary peg retention hole appropriately sized to receive the mounting peg.

Abstract: A hardware protection system is integrated into a circuit carrier. As a result, a sensor system, which is integrated into the circuit carrier in the form of printed circuit boards, which can be produced by means of the traditional high-tech printed circuit board technology and can be equipped with and processed on traditional insertion lines of electronic module installations, is obtained.

Abstract: A modular package may be utilized to mount an RF system-on-chip in one of plural configurations, such that the same modular package may be utilized to enable plural device formats, while reducing the amount of RF testing needed to change device formats. In one configuration, a surface mount device is mounted onto a first surface of a board, and the board is directly surface mounted onto a base board. Here, the base board includes a hole for accommodating the surface mount device, providing a thin device format. In a second configuration, a spacer is mounted onto the first surface of the board, such that a gap is provided between the board and the base board for accommodating the surface mount device, providing a relatively thicker device, but providing additional surface area where the hole otherwise would be, reducing the device size.

Abstract: A technique is provided for improvement in convenience and in cost reduction of a fixing part of a printed board unit. A printed board unit includes a plurality printed board including a first printed board and a second printed board; and at least one fixing part, interposed between the first printed board and the second printed board, fixing the first printed board and the second printed board such that the first printed board and the second printed board overlap and keep a predetermined space between the first printed board and the second printed board, and the fixing part variably determines the predetermined space.

Abstract: A fastener includes a cylinder and a draw hook. The cylinder includes a main body, two resilient arms extending from an end of the main body, and a flange extending from a circumference of an opposite end of the main body. A number of protrusions spaced in the axial direction of the main body extends from an inside surface of each of the resilient arms. The draw hook includes a post slidably received in the cylinder, a taper-shaped engaging portion extending from an end of the post and exposed out of distal ends of the resilient arms, and a handle extending from an opposite end of the post. A diameter of the engaging portion gradually grows larger along a direction away from the post.

Abstract: A method and apparatus for active line interface isolation have been described.

Abstract: A circuit board fixing element is provided. The circuit board fixing element is used for fixing a circuit board on a sheet, and includes a fixing portion, a buckling portion, and a connecting portion. The buckling portion is made of a resilient material. The connecting portion is connected between the fixing portion and the buckling portion, and has two opposite ends and a side surface connected to the ends. The fixing portion and the buckling portion are respectively located on the ends and protrude from the side surface.

Abstract: A mounting structure comprises at least one semiconductor device having solder bumps on a lower surface thereof as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is wrapped in a flexible wiring board; the mounting structure is provided with outer electrodes on both of a side on which the outer terminals of the semiconductor device are formed and an opposite side thereto; at least one wiring layer is formed on the flexible wiring board; and a supporting member is affixed between a lower surface of the semiconductor device on which the outer terminals are formed and the flexible wiring board.

Abstract: A wiring board 10 includes a wiring board main body 11 having a semiconductor device attaching pad 21 on which a semiconductor device 14 is attached, a dielectric layer 22 provided with the semiconductor device attaching pad 21, and a semiconductor device attaching area A in which the semiconductor device 14 is attached, and a stiffener bonded to a surface 22A of the dielectric layer 22 on the side where the semiconductor device attaching pad 21 is formed and having a semiconductor device attaching through portion 12A to expose the semiconductor device attaching area A, characterized in that a notch portion 41 for exposing the surface 22A of the dielectric layer 22 in a part located outside the semiconductor device attaching area A is provided on the outer periphery of the stiffener 12.

Abstract: An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.

Abstract: A meter spacer unit includes a dial spacer, a lateral spacer flexibly connected to the dial spacer by a joint, and a rear connecting member flexibly connected to the lateral spacer by a joint. The lateral spacer includes a connection member adapted to connect to a printed circuit board.

Abstract: A circuit board mounting system has a mounting plate and standoffs. The mounting plate has several parallel slits. The standoffs have a base with an elongated slot and an upright post. Fasteners through the slot mount the standoffs anywhere along the slits. The standoffs can rotate around the fasteners and translate relative to the fasteners before the fasteners are tightened, so that a post can be located anywhere on the mounting plate. Circuit boards are mounted to the tops of the standoff posts.