With Spacer Patents (Class 361/742)
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Patent number: 6867984Abstract: A resilient contact element includes a unitary conductive contact strip that has a strip axis and that is configured with a mounting section, a curved section, a resilient section and a contact section. The mounting section is to be disposed on a mounting plane, and has opposite front and rear end portions along the strip axis. The curved section includes a first curved segment that curves rearwardly from the rear end portion away from the mounting plane, and a second curved segment that curves rearwardly from the first curved segment toward the mounting plane. The resilient section curves forwardly from the second curved segment away from the mounting plane, and has a first end connected to the second curved segment, and an opposite second end. The contact section extends forwardly from the second end of the resilient section, and is generally parallel to the mounting section.Type: GrantFiled: September 24, 2003Date of Patent: March 15, 2005Assignee: Emi Stop CorporationInventor: Wei-Chen Chen
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Patent number: 6864431Abstract: A method of supporting a fragile board by a plurality of supporting members formed of respective elastic materials. The method includes steps of: (a) preparing a plurality of first and second supporting members as the supporting members such that the second supporting members have higher compression modulus than the first supporting members; (b) arranging the first and second supporting members on a plane such that each of the first supporting members is adjacent to a corresponding one of the second supporting members and such that each of the first supporting members has a larger height from the plane than each of the second supporting members; and (c) positioning the first and second supporting members under the board, whereby the board is supported at a lower surface thereof by the supporting members.Type: GrantFiled: March 25, 2002Date of Patent: March 8, 2005Assignee: Fuji Machine Mfg. Co., Ltd.Inventor: Shinsuke Suhara
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Patent number: 6864433Abstract: A circuit board clip apparatus having a base wherein the base includes a first end and a second. The clip apparatus also includes a bore that extends between the first and second ends of the base. The clip apparatus additionally includes a first leg coupled to the base. The first leg extends along the base and has an indent wherein the indent comprises a first finger portion and a second finger portion.Type: GrantFiled: February 2, 2004Date of Patent: March 8, 2005Assignee: The Boeing CompanyInventors: Barry A. Fetzer, Mark A. Negley
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Patent number: 6865088Abstract: An electronic equipment contains a circuit board in a casing. The casing encloses a spacing and has a top panel covering the spacing. The circuit board has a pair of end portions and a major surface extending between the pair of the end portions for mounting electronic parts on the major surface. The circuit board is disposed in the spacing of the casing in opposed relation to the top panel. A stay member has an elongated shape extending between the pair of the end portions of the circuit board for reinforcing the major surface of the circuit board. The stay member has a bottom coupling portion disposed in contact with the major surface of the circuit board for coupling with the circuit board, and a top contact portion disposed in contact with a back surface of the top panel for engagement with the casing.Type: GrantFiled: September 30, 2003Date of Patent: March 8, 2005Assignee: Yamaha CorporationInventors: Tsutomu Watanabe, Takashi Fujita
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Patent number: 6842345Abstract: A circuit board support assembly includes a frame, an electronic component and a circuit board. The circuit board and the electronic component are each coupled to the frame along a common axis.Type: GrantFiled: August 29, 2002Date of Patent: January 11, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Stephan K. Barsun, Steven R. Hahn, Thomas J. Augustin
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Patent number: 6831839Abstract: An adjustable circuit sled module for a mass storage device has a housing, a mass storage device, a circuit board, a cover and spacers. The spacers position the mass storage device to align the power and data interface ports of the mass storage device with corresponding power and data interface connectors of the circuit board. The resulting sled module can be adjusted to accommodate a variety of brands and sizes of mass storage devices.Type: GrantFiled: February 28, 2002Date of Patent: December 14, 2004Assignee: Netezza CorporationInventor: Eric T. Bovell
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Patent number: 6791843Abstract: An electronic system includes a first system component having a first connector and a second system component having a second connector. One of the first system component having the second system component pivots between a first position in which the first connector and the second connector are disconnected and a second position in which the first connector and the second connector are connected.Type: GrantFiled: June 11, 2003Date of Patent: September 14, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Robert W. Dobbs, Stephan K. Barsun, Andrew H. Barr
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Patent number: 6781845Abstract: A parallel printed circuit board assembly includes a main circuit board (1) and an auxiliary circuit board (2). The main circuit board has a surface (14) with a plug connector (32) and a receptacle connector (44) mounted thereon. The auxiliary circuit board has a surface (22) with a plug connector (42) and a receptacle connector (34) mounted thereon. The plug and receptacle connectors of the main circuit board respectively mate with the receptacle and plug connectors of the auxiliary circuit board. Because of the arrangement of the plug and receptacle connectors on the main and auxiliary circuit boards, the circuit boards can only connect with one another in one correct way.Type: GrantFiled: December 13, 2002Date of Patent: August 24, 2004Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Cheng Kuo Chang
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Patent number: 6778400Abstract: An electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board.Type: GrantFiled: May 13, 2002Date of Patent: August 17, 2004Assignee: Robert Bosch GmbHInventors: Juergen Kurle, Kurt Weiblen, Stefan Pinter, Frieder Haag
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Patent number: 6771517Abstract: Apparatus and methods for reducing circuit board flexing is presented. The apparatus is fastened to a printed circuit board to provide rigid support for reducing bending and flexing. In one embodiment, a rigid frame is provided that is adapted to be fastened to one or more components and to be fastened to a printed circuit board. The frame is adapted to elevate the attached component from the PCB surface allowing components to be mounted on the PCB therewith. The frame is adapted to occupy minimal printed circuit board surface area so as not to displace electronic components. In another embodiment, an elongated truss-like stiffener is provided that is adapted to be fastened to one side of the printed circuit board and adapted to span the printed circuit board. The elongated stiffener is adapted to have an open structure to minimize cooling flow disturbance and weight. The elongated stiffener includes a plurality of legs forming a truss-like structure.Type: GrantFiled: July 26, 2002Date of Patent: August 3, 2004Assignee: Silicon Graphics, Inc.Inventors: Thomas Alex Crapisi, Jeffrey Scott Cogner, Stephen Cermak, III, Stephen A. Bowen, Rodney Ruesch, David Paul Gruber, Bonnie Kay Dobbs
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Patent number: 6762944Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.Type: GrantFiled: October 3, 2002Date of Patent: July 13, 2004Assignee: NEC CorporationInventor: Manabu Mizusaki
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Patent number: 6760231Abstract: A fastening assembly, used for fixedly fastening a first and a second structure (1100, 1200) of a device together, comprises an anchoring block (1500), an insert plate (1400), and a screw (1300). The first structure is provided with a hole (1110). The anchoring block, fixedly arranged on the second structure, includes two parallel holding flanges (1510, 1512) and two parallel protruding ribs (1520), wherein the holding flange (1510) further includes a slot (15101). The protruding ribs extend approximately perpendicular to the two holding flanges on two sides thereof. The insert plate is held between the holding flanges, and is provided with a threaded hole (1410) and a pair of hooked clamping members (1420) that respectively tightly clamp the protruding ribs. The screw extends through the hole of the first structure and engages in the threaded hole of the insert plate to fixedly fasten the first and second structures of the device together.Type: GrantFiled: March 28, 2003Date of Patent: July 6, 2004Assignee: High Tech Computer, Corp.Inventors: Weicheng Hung, Sheng-Ming Lou, James Wu, Yente Chiang
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Patent number: 6751102Abstract: A mounting apparatus includes a plurality of standoffs (1) bent from a bottom plate (10) a computer enclosure (5). Each standoff includes a support body (12) bent perpendicularly from the bottom plate, and a mounting body (14) bent perpendicularly from a distal end of the support body. A rib (122) is formed by stamping the support body at a bottom portion thereof adjacent the bottom plate. The rib has a generally triangular pyramidal configuration. The mounting body includes a connection (16) bent perpendicularly from a distal end of the support body, a bent position (18) bent upwardly from a distal end of the connection portion, and fixing portion (20) bent horizontally from a distal end of the bent portion away from the connection portion. A mounting hole (22) is defined in the fixing portion. A circuit board (2) is fixed to the standoffs with screws.Type: GrantFiled: March 13, 2003Date of Patent: June 15, 2004Assignee: Hon Hai Precision Ind. Co., Ltd.Inventor: Yun-Lung Chen
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Patent number: 6693799Abstract: A circuit board mount is provided for mounting a circuit board in an electronic equipment housing. The mount is mountable on a surface within the housing and includes a slot for receiving and supporting the circuit board at a first height with respect to the housing surface. The mount further comprises at least one upstand of a second height higher than that of the circuit board, whereby a component can be supported on the upstand without contacting the circuit board. The mount is thus able to support the circuit board and to protect the circuit board during handling of other components within the housing.Type: GrantFiled: January 16, 2002Date of Patent: February 17, 2004Assignee: Sun Microsystems, Inc.Inventors: Gerald Ronald Gough, James Robert Kitchen
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Patent number: 6633491Abstract: A method and apparatus to support varying sizes of memory cards against shock and vibration. One embodiment of the invention involves a method to assemble a support clip to one or more cards attached on a substrate by a connector. A second embodiment of the invention involves a method to fabricate a support clip. A third embodiment of the invention involves an assembled substrate with a plurality of cards secured by one or more support clips to the substrate.Type: GrantFiled: August 17, 2001Date of Patent: October 14, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Christopher Gregory Malone, Stephan Karl Barsun, Thomas J. Augustin
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Patent number: 6614661Abstract: The covering device covers a ceramic module with electronic components arranged between a ceramic substrate and an upper covering plate of the covering device. The covering device is spaced apart by spacers from the surface of the ceramic substrate fitted with components. The covering device is fixed on the ceramic module by snap-in elements which engage in lateral cutouts in the ceramic substrate.Type: GrantFiled: July 5, 2001Date of Patent: September 2, 2003Assignee: Infineon Technologies AGInventors: Christian Gottswinter, Bernd Stadler, Oskar Neuhoff
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Patent number: 6606250Abstract: A circuit board includes an antenna having an extension extended from one end and secured to the circuit board and having a free end. A supporting member may be secured on the circuit board and disposed below the antenna for supporting the free end of the antenna. The extension of the antenna is preferably higher than the supporting member, for supporting the antenna member in an inclined position relative to the circuit board. The antenna preferably includes two or more legs engaged into and secured to the circuit board for solidly securing to the circuit board.Type: GrantFiled: June 21, 2002Date of Patent: August 12, 2003Assignee: Global Sun Technology Inc.Inventor: Eric Shi
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Patent number: 6587351Abstract: A standoff for a printed circuit board assembly is described. The standoff comprises at least one surface configured for surface mounting to a printed circuit board.Type: GrantFiled: April 2, 2002Date of Patent: July 1, 2003Assignee: Cooper TechnologiesInventors: Jeffrey Lynn Hollinsworth, Randy John Bicknese, Varinder Kumar Kalra, Keith Allen Spalding
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Patent number: 6587352Abstract: A female screw device is constructed to include a female screw rod adapted for mounting in a mounting hole of a motherboard to support an object above the motherboard, the female screw rod having an axially extended screw hole for the installation of a screw, and a quick-release cap adapted for fastening to the female screw rod to close the screw hole for enabling the female screw rod to be installed in a mounting hole of a motherboard by a SMT automatic machine, the quick-release cap having a cap body and a plurality of springy retaining arms adapted for fastening to the screw hole of the female screw rod to secure the cap body to the female screw rod to block up the screw hole.Type: GrantFiled: June 21, 2002Date of Patent: July 1, 2003Inventor: Chiang Chun Lin
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Patent number: 6574111Abstract: This invention includes a spacer, preferably having a cross section resembling the letter “T”, that is positioned between the electrode assembly and the metal can in electrochemical battery cells. The spacer allows a void to exist between the corner of the metal can and the electrode assembly. This “crumple zone” prevents any external damage to the can from damaging the internal electrode assembly. The invention facilitates passage of common OEM drop testing without compromising cell performance. The invention increases the reliability of the cell by allowing the cell to resist external impacts.Type: GrantFiled: May 26, 2002Date of Patent: June 3, 2003Assignee: Motorola, Inc.Inventors: Russell Ernest Gyenes, Corina Stanescu
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Patent number: 6560119Abstract: Fastening parts suitable for recycling are disclosed. The fastening parts include a plastic main body with at least two engaging projections, and metal inserts having interior screw threads contained integrally inside the plastic main body. Designing electronic equipment using such fastening parts enable easy parts separation from the plastic main body at disassembly, and facilitate recycling of both fastening parts and the plastic main body.Type: GrantFiled: November 19, 1998Date of Patent: May 6, 2003Assignee: Fujitsu LimitedInventors: Koji Katsuyama, Mitsuo Tanikado
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Patent number: 6552914Abstract: A circuit board assembly mechanism for assembling a first circuit board in suspension in the circuit board assembly mechanism includes a base and connecting bracket. The base has a pillar extruding from a bottom plate of the base and a side plate bending from a wing of the bottom plate. The pillar is positioned corresponding to a first hole of first circuit board and houses it atop by inserting a fixer through the first hole into the pillar. The connecting bracket has a first end and a second end in opposition to each other for connecting the first circuit board with the side plate of the base by fixing the first end on the first circuit board and restricting the second end on the side plate, thereby assembling the first plate in suspension within the base by the pillar and the connecting bracket and reserving the space between the first circuit board and the bottom plate for assembling a second circuit board.Type: GrantFiled: March 27, 2000Date of Patent: April 22, 2003Assignee: Aten International Co., Ltd.Inventor: Chang-Yu Chang
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Patent number: 6535394Abstract: Electronic apparatus is described comprising a printed circuit board mounted on a support structure. The printed circuit board has at least one keyhole shaped fixing hole, the support structure being provided with at least one electrically conducting fixing post having an at least partially circumferential slot for engaging the fixing hole. The printed circuit board has a conducting surface adjacent said fixing hole that is disposed to provide an electrical contact with said post so as to establish an electrical circuit between at least one component mounted on the printed circuit board and the support structure. The arrangement is particularly suitable for securely coupling a computer's motherboard to its casing or chassis.Type: GrantFiled: September 22, 1999Date of Patent: March 18, 2003Assignee: Hewlett-Packard CompanyInventor: Claus Hirzmann
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Patent number: 6493233Abstract: A method and assembly for mounting printed circuit boards (PCBs) to a chassis. In one embodiment, a plurality of internally-threaded mounting posts are secured (e.g., press-fit) to the chassis and the PCB includes a plurality of holes into which the mounting posts extend. Each hole includes a pair of keepout pads to isolate internal PCB circuitry (other than ground planes) from electric contact with the assembly components. A threaded faster is used to secure the assembly. In another embodiment, a collar is added to the assembly and the extending portion of the post is elongated such that it extends into the collar, providing additional thread engagement for thinner PCBs. In a third embodiment, hat-section components are secured (e.g., via wave soldering) over respective holes in the PCB. The hat-section component includes a counterbore through which the threaded fastener passes and is sized to receive a portion of a threaded standoff.Type: GrantFiled: August 21, 2001Date of Patent: December 10, 2002Assignee: Intel CorporationInventors: David S. De Lorenzo, Casey R. Winkel
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Patent number: 6490165Abstract: Disclosed is a novel deformation-resistant structure of a portable device, capable of reducing an electric failure by decreasing a distortion which occurs in a soldered portion between a printed circuit board of the portable device and an electric part mounted on the board due to a mechanical stress such as drop or pressure. Through slits are formed in positions in a printed wiring plate, which correspond to bosses having prepared holes disposed at the corners of a casing. By inserting screws into the prepared holes through the through slits, the printed circuit board is mounted in the casing. Although the casing is deformed when an external mechanical stress is applied to the casing, the screw and the boss can slide along each of the through slits. Thus, a deformation amount of the printed circuit board is not caused or becomes smaller than that of the casing.Type: GrantFiled: November 14, 2001Date of Patent: December 3, 2002Assignee: NEC CorporationInventor: Manabu Mizusaki
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Patent number: 6490168Abstract: An electronic module (20) includes a first circuit substrate (40) and a second circuit substrate (44). The first circuit substrate (40) has a post surface (50) and a post (52) protruding from the post surface (50). The second circuit substrate (44) has an upper surface (46) opposed to a lower surface (48). The second circuit substrate (44) forms an opening (56). The first circuit substrate (40) may be manufactured using a Molded Interconnect Device substrate. The second circuit substrate (44) may be manufactured using a High Density Interconnect substrate. The second circuit substrate (44) is placed on top of the first circuit substrate (40) so that the post (52) of the first circuit substrate (40) is mated with the opening (56) of the second circuit substrate (44).Type: GrantFiled: September 27, 1999Date of Patent: December 3, 2002Assignee: Motorola, Inc.Inventors: William Rochowicz, Declan Killarney, Tom Gall, Chris Van Houten, Don Zito
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Patent number: 6421244Abstract: In a power module, an interconnection terminal (10) is inserted into a through hole (30) and a connector (16) of a control circuit substrate (12) from the side of a lower main surface of the control. circuit substrate (12). Then, the interconnection terminal (10) presses a terminal (17) to displace the terminal (17). Thus, electrical and physical connections are provided between the control circuit substrate (12) and the interconnection terminal (10) in such a manner that the interconnection terminal (10) is held between the terminal (17) and an inner peripheral side surface of the connector (16). The interconnection terminal and the control circuit substrate are fixed. to each other without using solder, whereby the power module which is easy to mount and remove is provided.Type: GrantFiled: May 4, 2000Date of Patent: July 16, 2002Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Toshiaki Shinohara, Takanobu Yoshida
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Patent number: 6399887Abstract: A stud assembly structure of a computer mother board capable of being assembled by an automatic machine includes a screw hole and a quick detaching cover. The stud is provided to be inserted in each assembling hole in a mother board and a penetrating hole is installed therein. A circular buckling trench is installed at an outer periphery of the stud. The quick detaching cover has a cover piece for covering an opening of the screw hole of the stud. The periphery of the cover piece being formed with elastic clamping pieces extending toward the stud for clamping the stud so that the quick detaching cover is detachably assembled to the stud temporarily. Therefore, the stud with quick detaching cover is provided to a SMT automatic machine for absorbing the cover piece by vacuum for picking the stud to a predetermined position. Then, the stud is inserted into the assembling hole. Then, the stud is released so as to complete the assembly work. Therefore, the whole assembly work is quick, accurate and quick.Type: GrantFiled: June 5, 2000Date of Patent: June 4, 2002Inventor: Chiang Chun Lin
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Publication number: 20020051344Abstract: The covering device covers a ceramic module with electronic components arranged between a ceramic substrate and an upper covering plate of the covering device. The covering device is spaced apart by spacers from the surface of the ceramic substrate fitted with components. The covering device is fixed on the ceramic module by snap-in elements which engage in lateral cutouts in the ceramic substrate.Type: ApplicationFiled: July 5, 2001Publication date: May 2, 2002Inventors: Christian Gottswinter, Bernd Stadler, Oskar Neuhoff
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Patent number: 6381128Abstract: A portable computer having a main computer body and a keyboard unit slidably attached to the main computer body and movable to various positions in front of the main computer body. A display unit is also slidably attached to the main computer body and movable to various positions up and away from the computer main body.Type: GrantFiled: July 17, 2000Date of Patent: April 30, 2002Inventor: Russel G. Kramer
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Patent number: 6347042Abstract: A printed circuit board top side mounting system is presented and includes a printed circuit board having a primary side and a secondary side. The printed circuit board top side mounting system also has a surface member that has a point with a generally constant distance in relation to the primary side. The printed circuit board top side mounting system further includes a standoff with a elongated shape which has a predetermined set dimension that includes the constant distance disposed in going through a slot in the printed circuit board. The standoff further includes a first end disposed to fixing the first end rigidly on the printed circuit board and a second end disposed in connecting rigidly to the surface member.Type: GrantFiled: October 26, 1999Date of Patent: February 12, 2002Assignee: International Business Machines CorporationInventor: Wade White
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Patent number: 6347044Abstract: A structure for mounting a printed circuit board (PCB) in an electronic apparatus housing is disclosed. The structure comprises a plurality of holes, a plurality of bosses, and a plurality of seat members. The holes are formed in the printed circuit board. The bosses are formed on the upper surface of the bottom of the electronic apparatus housing at positions corresponding to the positions of the holes. Each of the seat members consists of a seat portion, a vertical cylinder portion and a flange. The seat portion serves to support the bottom surface of the head of a screw while being positioned on the top surface of each of the bosses, and has a center hole through which the screw passes. The vertical cylinder portion is extended from the circumferential end portion of the seat portion, defines a hollow portion in which the head of the screw is positioned, and is inserted into each of the holes of the main board.Type: GrantFiled: June 9, 2000Date of Patent: February 12, 2002Assignee: Samsung Electronics Co., Ltd.Inventors: Bum-Young Won, Bum-Su Park
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Patent number: 6341068Abstract: A storage card module for supporting more than one SCSI storage device on a printed circuit board to be coupled to a CPCI backplane. The storage devices are positioned on the board with a predetermined spacing disposed therebetween. One or more low profile connectors are disposed in the predetermined spacing for each storage device depending on the number of pins needed. For an 8-bit fast tape drive, a 50-pin low profile connector is utilized. A pair of 34-pin low profile connectors are utilized for connecting to a 16-bit fast-wide SCSI disk drive. Electrical traces are buried in the board substrate which couple the low profile connectors to a card connector on the printed circuit board. The card connector is mated to the CPCI backplane via a backplane connector. A SCSI I/O interface is in an electrical conductive relationship with at least a portion of the backplane connector. Power is provided to the drives via a pair of 4-pin low profile power connectors disposed in the predetermined spacing.Type: GrantFiled: March 31, 2000Date of Patent: January 22, 2002Assignee: Alcatel USA Sourcing, L.P.Inventors: Ed Bradley, Melvin G. Peel, Jr., Hadi M. Hayek, Ignacio Linares
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Patent number: 6327156Abstract: A modular housing for a substrate with electronic components, wherein the housing comprises at least a base part and a cover part. The parts of the housing consist of an electrically conductive material for electromagnetic shielding and form outer walls enclosing a space inside the housing which accommodates the substrate. Dividing walls extend in the space inside the housing and have free edges which support the substrate.Type: GrantFiled: December 2, 1999Date of Patent: December 4, 2001Assignee: AlcatelInventor: Olav Wangen
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Patent number: 6317330Abstract: An improved printed circuit board assembly is disclosed. The printed circuit board assembly comprises a first plate, a second plate attachably coupled to the first plate, and at least one printed circuit board sandwiched between the first plate and the second plate, the at least one printed circuit board extending over the entire area of the first and second plate. By utilizing an assembly in accordance with the present invention, the available space on each of the plurality of printed circuit boards is maximized. By maximizing the available space, more electronic circuitry can be incorporated onto the board. Furthermore, the exterior spacer design together with interior spacer elements firmly secures each printed circuit board while maintaining a constant separation between each board.Type: GrantFiled: February 15, 2000Date of Patent: November 13, 2001Assignee: BiTMICRO NETWORKS, Inc.Inventors: Roland F. Portman, Edgar Jhay Gregorios
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Patent number: 6259032Abstract: A circuit board grounding scheme has a series of slots that are self-aligning with a series of conductive standoffs. Each standoff has a tapered head supported by a neck and a base that is coupled to a conductive member. A narrow portion of the tapered head of each standoff penetrates a corresponding one of the slots in the circuit board, aligning the circuit board with the standoffs. Once aligned with the standoffs, the circuit board rests on the bases of the standoffs in a neutral position. The circuit board is then biased toward the necks of the standoffs, becoming wedged in a non-uniform gap that is formed between a wide end of the tapered head and the base of each standoff. One or more ground areas on the circuit board contacts the wide end of the tapered head or the base of the standoff. The standoffs are coupled to the conductive member using fasteners, or the standoffs are compression fit into the conductive member. Alternatively, the standoffs are formed to be continuous with the conductive member.Type: GrantFiled: May 28, 1999Date of Patent: July 10, 2001Assignee: Agilent Technologies Inc.Inventor: Luis Fernandez
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Patent number: 6225566Abstract: A screw retaining spacer includes an outer rigid plastic core and a softer elastic inner core defining a through-hole. The inner core has a plurality of ridges that resiliently grasp the shaft of a screw inserted into the through-hole. Accordingly, screws assembled with these spacers remain assembled. The spacer can be standardized and inventoried in large quantities to meet a variety of screw sizes and tolerance.Type: GrantFiled: February 22, 1999Date of Patent: May 1, 2001Assignee: BivarInventor: Richard L. Dienst
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Patent number: 6177635Abstract: A coating insulator layer has plural rows of through holes disposed longitudinally in the coating insulator layer. A plurality of conductors are disposed in parallel with one another longitudinally in the coating insulator layer. Each conductor does not interfere with the through holes. Plural rows of locking projections are longitudinally formed on a face of the coating insulator layer. The locking projection has a construction to engage with the through hole. Thus, when a couple of the wiring substrates are layered, some of the locking projections formed on one of the wiring substrates are aligned to be engaged with some relative through holes of the other wiring substrate, allowing a sure lamination of the wiring substrates. The locking projections are disposed in regular intervals and the through holes are spaced in the same regular intervals. Another wiring substrate is enough flexible to be arranged along a structural wall for wiring.Type: GrantFiled: December 14, 1999Date of Patent: January 23, 2001Assignee: Yazaki CorporationInventors: Masuo Sugiura, Hiroshi Watanabe, Mitsuji Kubota
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Patent number: 6147310Abstract: A holder (200) for holding an electronic component (100), which can be inserted into and removed from the holder (200), is formed to be both electrically and thermally insulative. The holder (200) is formed from an insulative body molded to form a cavity (205) into which the electronic component (100) can be inserted. The insulative body includes sidewalls (210) formed to partially enclose the electronic component (100) when it is inserted into the holder (200) and a bottom surface (250) formed perpendicularly with the sidewalls (210). The bottom surface (250) defines at least two apertures (225) through which terminals (110) of the electronic component (100) can extend.Type: GrantFiled: September 24, 1998Date of Patent: November 14, 2000Assignee: Scientific-Atlanta, Inc.Inventor: William G. Mahoney
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Patent number: 6124552Abstract: Disclosed is a device for mounting a planar electrical component, such as a computer motherboard, to a chassis. In one embodiment, the device includes a spacer including a coiled wall configured to be positioned between the board and the chassis, and an elongated clip coupled to the spacer. The elongated clip including an upper fastener extending in a first direction from the spacer. The upper fastener is configured to removably clamp onto the board and secure the board to the spacer. The elongated clip further comprises a lower fastener extending in a second direction from the spacer. The lower fastener is configured to removably clamp onto the chassis and secure the chassis to the spacer.Type: GrantFiled: December 11, 1997Date of Patent: September 26, 2000Assignee: Micron Electronics, Inc.Inventor: Craig L. Boe
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Patent number: 6104614Abstract: A fastening device (10) includes a locking pin (12) and an associated pressing clip (14). The locking pin (12) includes a flat head (16) with ring-like shallow (18) therein for easy operational installation of the fastening device (12) unto the heat sink (100) and the PC board (200). A leg section (20) is provided below the head (16), including four locking legs (22) separated from one another by the slots (24) therebetween and extending downward from the head (16). Each leg (22) defines an enlarged tapered section (26) at the distal end with a shoulder section (28) thereabouts for latchable engagement with the back surface (201) of the PC board (200) around the corresponding hole (202) through which the locking pin (12) extends. A ring-like recess (30) is provided on the middle portions of the legs (22) for lowering the insertion force or preventing unnecessary excessive friction during insertion of the locking pin (12) into the corresponding holes (102, 202) of the heat sink (100) and of the PC board (200).Type: GrantFiled: April 7, 1999Date of Patent: August 15, 2000Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Min-Chan John Chou, Chin-Fa Huang
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Patent number: 6084768Abstract: A hot-pluggable hard disk drive is supported on a carrier structure for removable insertion into a sheet metal cage structure in a manner such that an SCA connector on the rear end of the drive is releasably mateable with a corresponding backplane connector within the cage. The carrier has a bottom side with opposite side edge portions from which resilient shock-absorbing foot members downwardly project to protect the carrier-supported disk drive from non-operational shock when the bottom of the carrier is inadvertently permitted to downwardly strike a horizontal support surface such as a table or workbench. Upwardly projecting side wall portions of the carrier are positioned generally over the protective feet, on opposite sides of the supported disk drive, and have top side edges downwardly offset from the top side of the disk drive.Type: GrantFiled: June 15, 1998Date of Patent: July 4, 2000Assignee: Compaq Computer CorporationInventor: David F. Bolognia
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Patent number: 6067234Abstract: An apparatus and method, for use with a data processing system having an architecture, which provide for the possibility of smart card use without unduly impacting the data processing system's architecture. An enclosure, having at least one PC card acceptor and at least one smart card acceptor, is created. A suspension mechanism is operably connected to enclosure in a fashion such that suspension mechanism is capable of physically connecting enclosure to a motherboard such that enclosure is suspended above a component of motherboard. The method and system give rise to several advantages. One advantage is that board space is saved in that the enclosure is suspended over existing board components. A second advantage is that the method and system allow original equipment manufactures to make the provision of smart card usage optional, in that smart card usage can be provided by a simple add-on to lower-end systems.Type: GrantFiled: December 22, 1997Date of Patent: May 23, 2000Assignee: International Business Machines CorporationInventors: Roy Moonseuk Kim, Sanjay Gupta
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Patent number: 6055160Abstract: An electrical feed through for use in a high temperature oven such as the oven in a gas chromatograph. The feed through includes printed circuit boards which are maintained in compression to prevent the boards from physically separating at the elevated temperatures used in the oven. The structure that provides the compression also does not allow any flexure, torsional or longitudinal stress on the boards. The boards include an enhanced connector pad which is made from a continuous annular copper ring which is connected to all of the conductive layers of the board.Type: GrantFiled: January 9, 1998Date of Patent: April 25, 2000Assignee: Siemens Applied Automation, Inc.Inventors: Glen Eugene Schmidt, Eugene Lee Kesselhuth, Jeffrey John Bolduc, Ray Dean Dorris, Albert Eugene Waldorf
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Patent number: 6038140Abstract: A circuit board standoff including a body for disposition between first and second boards so as to maintain a predetermined minimum spacing between substantially parallel facing inner surfaces thereof; the body having at one end a first abutment surface for engaging an inner surface portion of the first board and at an opposite end a second abutment surface for engaging an inner surface portion of the second board. A longitudinal axis of the body is aligned with the first abutment surface and the second abutment surface. Extending from the first abutment surface is a first latch shaped and arranged to project through an opening in the first board and into latching engagement therewith and extending from the second abutment surface is a second latch shaped and arranged to project through an opening in the second board and into latching engagement therewith.Type: GrantFiled: December 31, 1998Date of Patent: March 14, 2000Inventor: Hector D. Petri
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Patent number: 5991159Abstract: A chip card has flexible housing parts which are secured on one another. When the housing parts are secured to one another, support elements of the housing parts form voids, in which a flexible printed circuit board is disposed along with its components. In order to ensure that the components will not be mechanically stressed, one lubricant film is disposed between each of the housing parts and the printed circuit board and the components. The printed circuit board or components slide on the film when the card is bent.Type: GrantFiled: September 23, 1996Date of Patent: November 23, 1999Assignee: Siemens AktiengesellschaftInventor: Josef Kraiczyk
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Patent number: 5973926Abstract: A method and apparatus for mounting a motherboard to a chassis of a personal computer using only a single screw. A number of standoffs snap into the base of the chassis, electrically contacting the chassis. Each standoff includes a projection. The motherboard includes apertures for accepting the projections such that when an ramp and shelf of each projection is aligned with the motherboard, the motherboard is positioned a fixed distance from the chassis. A mounting bracket also includes a number of projections. Apertures provided in the motherboard correspond to the projections of the mounting bracket. The surface of each side of the motherboard surrounding each aperture is plated with an electrically conductive material to form a conductive path between the motherboard and the standoffs and the bracket. The projections of the bracket are inserted into the corresponding apertures in the motherboard. A screw is inserted through a wall of the chassis and into a threaded hole in the bracket.Type: GrantFiled: February 29, 1996Date of Patent: October 26, 1999Assignee: Palo Alto Design Group, Inc.Inventors: Jim Sacherman, John Toor
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Patent number: 5962925Abstract: The mounting structure of an electronic component having bumps includes a multi-layer substrate provided with an outermost layer substrate having electrode on the top thereof and a lower layer substrate comprising at least one layer substrate joining the bottom of the outermost layer substrate, an electronic component having bumps bonded with the electrodes formed on the top of the outermost layer substrate for connecting the electronic component and the substrate, and under-fill resin formed between the electronic component and the outermost layer substrate, in which the coefficient of linear thermal expansion of the under-fill resin is larger than that of the electronic component, but smaller than that of the outermost layer substrate.Type: GrantFiled: November 10, 1998Date of Patent: October 5, 1999Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideki Eifuku, Tadahiko Sakai
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Patent number: 5940275Abstract: A PCMCIA card structure includes a front connector, a frame, a substrate, and a sheet metal cover having a top cover panel. A ground plate having rearwardly extending ground contacts is carried on the upper surface of the connector. The frame includes an insulative cross beam disposed adjacent to the rear of the connector, the cross beam serving to support the top cover panel of the card, to prevent the top cover panel from contacting the connector ground plate or the contacts extending from the ground plate, and, along with portions of the ground plate, to close off the space between the connector and the front edge of the top cover panel. The ground plate has a transverse length shorter than that of the connector, defining end shoulder surfaces along the upper surface of the connector. The top cover panel includes a pair of laterally spaced, forwardly extending tabs, each tab overlying an end shoulder surface on the connector.Type: GrantFiled: August 8, 1997Date of Patent: August 17, 1999Assignee: Xircom, Inc.Inventor: Ian A. Laity
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Patent number: 5936840Abstract: The invention is component module (20) for combining a plurality of components (21, 23, 25, 27 and 29)into a single module (20) for use with a printed wiring board. A plurality of components, each component having a pair of contacts (21a,21b), are formed into the module with a plurality of insulating spacers (2,24,26 and 28). There is one spacer between adjacent components, said spacers serving to insulate adjacent components from each other and to secure the components together to form the module.Type: GrantFiled: November 3, 1997Date of Patent: August 10, 1999Assignee: Texas Instruments IncorporatedInventor: Malhi Satwinder