Abstract: A controller (100) for mounting onto a socket (20) of an outdoor device (10) is disclosed. The controller comprises an inner body (110) comprising a first bottom surface from which an annular arrangement of electrical connection pins (102) for engaging with said socket extends, said inner body further housing control circuitry (132) for said outdoor device, said control circuitry being electrically connected to at least some of said electrical connection pins; and an outer body (120) rotationally mounted around the inner body, the outer body comprising a further bottom surface (122) around the first bottom surface and an outer cover (105) extending from said further bottom plate covering the control circuitry, the further bottom surface carrying an annular compressible gasket (104) for providing a weatherproof seal between the further bottom surface and the socket by rotational displacement of the outer body relative to the inner body.

Abstract: There is provided an electric power steering apparatus in which at least one of a motor housing and a control unit has a respiratory apparatus that performs a respiratory action, based on an inner pressure change in at least one of the motor housing and the control unit.

Abstract: A carbon decorative panel includes a carbon-toned irregular surface. The carbon-toned irregular surface has a plurality of unit patterns that constitute a weave of pseudo carbon fiber bundles presenting carbon fiber bundles in a pseudo manner, as the protrusions and depressions that form the carbon-toned pattern. A plurality of unit patterns each have a top portion positioned at the center in the extending direction of the pseudo carbon fiber bundle and a pair of curved portions positioned on both sides of the top portion in the extending direction and formed in a curved shape. The curvature of a pair of curved portions in the section along the extending direction of a pair of curved portions is greater on the center portion side than on the end portion side in the crossing direction that crosses the extending direction.

Abstract: A variable holder module secures a variety of different expansion cards that may be installed within a computer or other information handling system. The holder module has a multi-sided component that is orientable according to which expansion card is to be secured within the computer. Each side of the component may thus correspond to a different one of the expansion cards. Once the expansion card is determined, a human or robotic picker need only orient component to the side that corresponds to the make/model of the expansion card. The holder module is thus adaptable to secure many different expansion cards that may be installed within the computer.

Abstract: Provided is an electrical junction box that has a novel structure capable of stably preventing water from intruding into a case while simplifying the operation for connecting the electrical junction box and an external apparatus. An electrical junction box includes a circuit structure that includes a connection terminal for connection to an external apparatus, a case that has an insertion hole and houses the circuit structure, a relay terminal that is connected to the connection terminal, and includes an external connection portion that is inserted into the insertion hole and is exposed to the outside of the case, and a sealing member that is compressed between opposing surfaces of the insertion hole and the relay terminal and seals the insertion hole.

Abstract: The present disclosure relates to individual parking units or connector holders that have an interlock interface on each side thereof that tallow the connector holders to be directly connected together in a ganged relationship. The connector holders can include a detachable connection at a front end thereof to removable mount over a post to form a frictional engagement therewith. The post can be configured to attach to another structure with the connector holders.

Abstract: In an optical network having a terrestrial terminal and an open cable interface (OCI) connecting a submarine cable to a terrestrial cable, the OCI may include a filter positioned on an optical path between the terrestrial cable and the submarine cable and configured to pass first communication signals of a first frequency band, and filter out secondary signals of a second frequency band that does not overlap with the first frequency band. The secondary signals may be looped back to the terrestrial terminal. The terrestrial terminal may detect the looped back secondary signals, and in response, determine the presence of the OCI and that the supervisory signals were rerouted by the OCI.

Abstract: A display device includes a display module, a back plate, and a bracket; a side face of the display module facing away from a display side is fixed on a first side face of the back plate, the bracket is fixed on a second side face of the back plate facing away from the first side face; the display module includes a display panel and a first frame, the first frame being disposed on a part of the display panel close to an edge, the bracket includes a second frame, and the display panel is positioned on an inner side of a frame body formed by the first frame and the second frame.

Abstract: Provided is a power conversion device capable of suppressing an increase in cost and an increase in size of the device. A control board 113 that includes a connection unit 140 to which a signal connector 114 which transmits a signal is connected, a base member 120 that supports the control board 113 and has conductivity, and a case 110 that accommodates the control board 113 and the base member 120 and is connected to a ground is provided. The base member 120 includes a supporting portion 141 that is connected to one surface of the control board 113, and a first extending portion 130 of which one end is connected to the supporting portion 141 and the other end extends to the case 110 to be connected to the case 110. An electronic component 113a that generates noise is mounted on the control board 113, and the first extending portion 130 and the supporting portion 141 form an electrical path.

Abstract: There is provided an internal-combustion-engine ignition coil apparatus in which an igniter in a connector assembly is contained in the case of the ignition coil apparatus, in which an adhesive bonds the igniter to a heat sink inserted into the case through an opening window of the case and an adhesive bonds the heat sink to the inner circumferential surface of the opening window, and in which the exposed portion of the heat sink is exposed to the outside of the case through the opening window.

Abstract: A fluid distribution system is incorporated into a server chassis. Connector plates have fluid connectors designed to connect with fluid cooling receptacles on server boards. A linkage system can be manually manipulated to translate the connector plates so as to engage the electronics boards and connect the fluid connectors to the receptacle. A pair of main connectors connect to the rack's fluid manifold to circulate cooling fluid to cool devices mounted onto the server boards. A locking mechanism can be included to mechanically lock the chassis to the rack to prevent accidental dismount of the chassis from the rack. Also, an anchor mechanism may be provided to apply counter force when engaging the connector plates with the server boards so as to prevent accidental dismount of the server board by the moving connector plate.

Abstract: A vacuum cleaner of the present invention comprises: a main body having a suction motor for generating suction force; a main PCB capable of generating a control command for the suction motor; a handle part capable of accommodating the main body PCB; and a connector provided at the main body, and to which the main PCB is connected in a process of coupling the handle part to the main body. The main PCB includes a plurality of pads and a slit, and the connector includes: a plurality of connecting pins for making contact with the plurality of pads; and a slit insertion protrusion inserted into the slit.

Abstract: A laminate carrier-like module lid including multiple laminate layers of non-conductive materials stacked one atop another, sensor circuitry embedded within the laminate carrier-like module lid, the sensor circuitry providing a continuous electrical circuit surrounding the electronic components of the multi-chip module package, and thermal circuitry embedded within the laminate carrier-like module lid, the thermal circuitry comprising solid copper traces to thermally conduct heat from the electronic components of the multi-chip module package.

Abstract: The present application discloses an apparatus configured to measure characteristics of high power beams of laser energy used in material processing. In one embodiment, the apparatus includes a housing having a first compartment and a second compartment separated from each other to reduce the transfer of thermal energy between them. Optical modules having optical sensors configured to measure characteristics of the high power beam are mounted in the first compartment. An optical window operative to allow a significant portion of the beam to propagate therethrough is mounted in an intermediate housing member separating the first and second compartments. A removable and replaceable beam dump configured to absorb most of the high power beam is positioned in the second compartment. The removability/replaceability of the beam dump enables operation of the apparatus without active cooling of the beam dump assembly, simplifying the apparatus and protecting the optical sensors in the first compartment.

Abstract: According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.

Abstract: Apparatus and methods for aligning circuit boards (e.g., for LIDAR systems) are disclosed. According to one embodiment, an electronic device comprises a secondary device and a coupling device coupled to the secondary device. The coupling device comprises a plurality of conductive members, including a first conductive member and a second conductive member. Each of the conductive members comprises a first end configured to electrically and mechanically couple to a primary circuit board and a second end electrically and mechanically coupled to the secondary device. Each of the plurality of conductive members has an attribute adjustable in response to a condition being added to the respective conductive member, and is configured to maintain the adjusted attribute after the condition is removed.

Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.

Abstract: Systems involve implementations including an electronic hub device with electronic device interface ports and with protrusions for coupling with a base assembly of a stand system wherein the electronic hub device is positioned in an internal cavity of the base assembly when the electronic hub device is coupled to the base assembly. Other aspects are described in the claims, drawings, and text forming a part of the present disclosure.

Abstract: A flexible substrate has a first dynamic region separated from a second dynamic region along a central axis by a central region. One or both of the first dynamic region and/or the second dynamic region define at least one aperture having a major axis oriented substantially parallel with the central axis.

Abstract: The present disclosure relates to a power supply system (1) including a main unit (10) including a protective main housing (11) and a distribution circuit (20) disposed in the protective main housing (11); a first module unit (30a) including a first protective module housing (31a) and a first electric module (40a) disposed in the first protective module housing (31a). The system also includes a passive cooling system (70) for cooling of the main unit (10) and the first module unit (30a). A first protective connection system (CS1) and a second protective connection system (CS2) is also a part of the system, wherein the first protective connection system (CS1) is configured to provide a releasable electrical and mechanical connection between the main unit (10) and the first module unit (30a). The passive cooling system (70) includes cooling fins (71) disposed on an outer surface of the first protective module housing (31a).

Abstract: An integrated circuit includes a device, a first interconnect structure disposed above the device and a second interconnect structure positioned below the device. The first interconnect structure includes multiple frontside metal layers. The second interconnect structure includes multiple backside metal layers, where each backside metal layer includes metal conductors routed according to diagonal routing. In some embodiments, a backside interconnect structure can include another backside metal layer that includes metal conductors routed according to mixed-Manhattan-diagonal routing. A variety of techniques can be used to route signals between metal conductors in the backside interconnect structure and cells on one or more frontside metal layers.

Abstract: The embodiment of the application discloses a splicing assembly and a splicing display screen. The splicing assembly includes a first connecting member, a second connecting member, and a locking member. The first connecting member has a plug-in portion. The second connecting member has a coupling portion for mating with the plug-in portion. The locking member is used for locking the first connecting member and the second connecting member together.

Abstract: A display unit of the present disclosure includes: a first plate-like member including a display device; a second plate-like member including a drive circuit, the drive circuit configured to control the display device; and one or two or more wiring sections having flexibility, the wiring sections configured to connect the first plate-like member and the second plate-like member to each other, in which a curvature of the second plate-like member is larger than 0 and equal to or smaller than a curvature of the first plate-like member.

Abstract: Systems, methods, and devices relating to a wireless network device configured for adjustable positioning are described herein. In an example, a network device comprises a body and a bendable element configured to carry electrical power to the body and components therein. The body houses an antenna and transceiver configured for wireless communication. The bendable element, attached to the body of the network device, is configured for adjustable positioning such that a position of the bendable element is substantially maintained when the positioning force is removed. A facing of the antenna within the body may be based on the positioning of the bendable element.

Abstract: Locking structure includes a first connector, a second connector, a locking member, a sliding member, and a holding member. The first connector includes a first cavity and a first protrusion in the first cavity. The second connector includes a second cavity and a second protrusion in the second cavity. The locking member is slidably received in the second cavity and extends into the first cavity. A peripheral wall of the locking member defines a fastening groove. The sliding member extends into the second cavity and abuts the locking member to drive the locking member to move toward the first protrusion and the second protrusion so that two opposite side walls of the fastening groove press against opposite sides of the first protrusion and the second protrusion. The sliding member defines a latching slot. The holding member includes a latching member for latching in or disengaging from the latching slot.

Abstract: An electronic device may include: a housing; a speaker provided inside the housing; an interposer board provided inside the housing, the interposer board including a first board, a second board spaced apart from the first board, and a side wall surrounding an internal space between the first board and the second board; and a sealing member provided between the speaker and the first board, wherein the first board may include at least one first through hole configured to transmit at least a portion of sound generated by the speaker to the internal space.

Abstract: Terminal connection routing on top of a substrate surface connects to component terminals to and from PMIC devices and provides a novel structure to connect surface mount technology (SMT) passive device terminals on an SMT layer (such as a Cu bar mesh) that uses the 3D space available near to components to lower resistance/lower inductive path and provides a shorter path, SIP form factor reduction, a component placement density increase, creates an additional PDN layer for connectivity and, if the routing is encapsulated in a mold, protects the metal in the connection from oxidation. Methods are presented for providing a substrate, attaching a first device to a first surface of the substrate near a center of the substrate, attaching a second device to the first surface of the substrate near an edge of the substrate, and connecting a connection located on the first surface of the substrate between the first device and the second device.

Abstract: A support for at least one electrical component includes a heat sink having a heat sink surface and two opposing lateral walls protruding from the heat sink surface. The heat sink includes a base body made of aluminum and a copper layer as a heat spreading layer which forms the heat sink surface. The copper layer is produced together with the base body through continuous casting, or with the copper layer being applied additively through cold gas spraying to a surface of the base body. Two spaced-apart sealing blocks lie on the heat sink surface, with each of the two sealing blocks extending between the two lateral walls and contacting the two lateral walls. A support structure is arranged on the heat sink surface between the two sealing blocks.

Abstract: An IC package structure including an array of package units formed into a panel-shaped package units array. Each package unit has a continuous and closed metal wall surrounding the periphery of the package unit and at least one IC chip/IC die disposed in the package unit, and wherein each IC chip/IC die has a top surface and a back surface opposite to the top surface. A panel-shaped metal layer corresponding to the panel-shaped package units array can be formed on entire back side of the IC package structure and bonded to the metal wall of each package unit, wherein the back side of the IC package structure refers to the side to which the back surface of each IC chip/IC die is facing.

Abstract: A drawn portion having a shape protruding from a side face to a space inside a housing is provided at an end to which a rear surface cover is fastened of the side face. On a side to which the rear surface cover is fastened of the drawn portion, a bent portion having a shape bent toward a space outside the housing is provided. A screw receiving portion including a screw hole includes a first receiving surface, which is a flat surface portion on an end of the bent portion, and a second receiving surface having a shape protruding from a base of the bent portion.

Abstract: A circuit board to be secured to a support member includes a first structure, a second structure, and a third structure. The first structure prevents the circuit board from moving in a horizontal direction with respect to the support member. The second structure prevents the circuit board from rotating around the first structure with respect to the support member. The third structure prevents the circuit board from moving in a vertical direction with respect to the support member. A distance between the first structure and the second structure is shorter than a distance between the first structure and the third structure.

Abstract: An electronic device includes: a substrate at which an electronic component is mounted; and a resin case configured to accommodate the substrate internally, in which: the case has an attachment portion configured to attach the case to a flat plate-shaped fixing portion of a fixture target by the fixing portion being inserted into the attachment portion and the attachment portion engaging with the fixing portion; the attachment portion has a first pressing portion having a convex portion that is inserted into a concave portion of the inserted fixing portion, and a pair of second pressing portions that hold between them respective side faces of the inserted fixing portion; and leading end sides of the pair of second pressing portions abut on the inserted fixing portion and are resiliently deformed in directions away from each other, holding between them the respective side faces of the fixing portion in a state in which the leading end sides have been resiliently deformed.

Abstract: A Baseboard Management Controller (BMC) that may configure itself is disclosed. The BMC may include an access logic to determine a configuration of a chassis that includes the BMC. The BMC may also include a built-in self-configuration logic to configure the BMC responsive to the configuration of the chassis. The BMC may self-configure without using any BIOS, device drivers, or operating systems.

Abstract: A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.

Abstract: In described examples, an enclosure for circuitry includes a platform, a charge source, a first capacitive plate, a second capacitive plate, and a capacitive sensor. The circuitry is fixedly coupled to the platform. The first capacitive plate is also fixedly coupled to the platform, and either alone, or together with the platform, surrounds a volume containing the circuitry and the charge source, the charge source electrically coupled to and configured to charge the first capacitive plate. The second capacitive plate is fixedly coupled to the platform without touching the first capacitive plate, and either alone, or together with the platform, surrounds the first capacitive plate. The second capacitive plate is configured so that there is an electric potential difference between the first capacitive plate and the second capacitive plate.

Abstract: A housing includes a body having an opening. The body includes a peripheral portion that abuts on the opening. A cover covers at least a part of the opening. A seal is sandwiched between the cover and the peripheral portion of the body. At least one of the cover and the peripheral portion of the body includes a corner portion and a linear portion. The corner portion has a first shape that defines one of a gap between the cover and the peripheral portion of the body and a width of the seal. The linear portion abuts on the corner portion. The linear portion has a second shape that defines the one of the gap between the cover and the peripheral portion of the body and the width of the seal. The second shape is different from the first shape of the corner portion.

Abstract: Methods and systems are provided for designing an optimized stack up of layers of a PCB (Printed Circuit Board). A set of constraints is determined for the PCB stack up, where the constraints limit a total number of layers, a number of signal layers, and a thickness of the PCB stack up. Each of the constraints on the PCB stack up is encoded as an equality or an inequality. The set of equalities and inequalities is solved using integer programming techniques to identify an optimal solution to the set of constraints on the PCB stack up, where the optimal solution specifies an arrangement of signaling layers for the PCB. An estimate is generated for impedances and losses for the optimal PCB stack up. The constraints on a PCB stack up are modified when the estimated impedances and losses for the optimal PCB stack up are above a target threshold.

Abstract: A case includes a header with a first isolation barrier, a cover with a second isolation barrier, and a printed circuit board (PCB) including a slot in which the first isolation barrier or the second isolation barrier is located and a primary-circuit side and a secondary-circuit side located on opposites sides of the slot.

Abstract: A system for measuring gas concentration includes a package having a cavity and a port, a photoacoustic gas sensor device within the package, and a Micro Electro Mechanical System (“MEMS”) valve separate from the photoacoustic gas sensor device placed over the port of the package and to allow ambient gas diffusion into the cavity in a first mode of operation, and to prevent ambient gas diffusion into the cavity and to acoustically isolate the cavity in a second mode of operation.

Abstract: A wiring member includes a wiring body and an attaching member attached to the wiring body to attach the wiring body to an attaching target. The wiring body includes a wire-like transmission member and a base member holding the wire-like transmission member. The attaching member includes a base material attachment part plastically deformed and sandwiching the base member from both sides of the base member in a front-back direction and an attaching target attachment part attached to an attaching target of the wiring body.

Abstract: Techniques are disclosed relating to a locking pin used to secure components in an electronics module. For example, in some embodiments an electronics module includes a housing lower part that includes a lower receiving element and a housing upper part that includes an upper receiving element that is aligned with the lower receiving element. In various embodiments, a locking pin may be used to connect a circuit board in the electronics module. For example, in some embodiments the circuit board includes at least one lead-through opening and the circuit board is connected to the housing lower part via the locking pin that is inserted in a positive-locking manner through the lead-through opening into the lower receiving element. Further, in some embodiments, an upper pin section of the locking pin may be inserted into an upper receiving element of the housing upper part in a positive-locking manner.

Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a first die, a bumping structure, and a second die. The first die is on a carrier. The bumping structure is over the first die. The bumping structure includes a light-transmitting portion and a light-blocking portion embedded in the light-transmitting portion. The second die is electrically connected to the carrier. The light-blocking portion of the bumping structure is free from covering the second die.

Abstract: An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the bracket. The secondary substrate has a termination of the first communication port.

Abstract: An electronic device includes: a display panel including a first area, a second area, and a third area bendable and between the first area and the second area a first support part under the display panel; a recognition member including a first recognition member under the first area, and a second recognition member spaced apart from the first recognition member and under the second area, where the recognition member is under the first support part and recognizes a signal of a pen input device; a second support part including a first portion under the first recognition member, and a second portion spaced apart from the first portion and under the second recognition member; a first printed circuit board electrically connected to the first portion; and a second printed circuit board spaced apart from the first printed circuit board and electrically connected to the second portion.

Abstract: A power supply device (104-1) includes a substrate (20) on which an electric component (25) is mounted, a chassis (10) having a chassis surface (11) and a threaded part (10a), a chassis-side resin part (91) connected to a back surface (20a) and the chassis surface (11), a fixation screw (29), and an insulating member (60). The fixation screw (29) fixes both the electric component (25) and the substrate (20) to the chassis (10) by screw-coupling an end part (29c) of the fixation screw (29), exposed in a direction toward the chassis (10) from an open hole formed through the insulating member (60), to the threaded part (10a) of the chassis (10). In addition, the fixation screw (29) brings the electric component (25) and the chassis (10) into electrical noncontact with each other by being placed in an open hole of the insulating member (60).

Abstract: A receptacle assembly is configured to be disposed on a circuit board and to receive a pluggable module and includes a cage member and a connector. The cage member includes a housing portion and at least one fin portion. The housing portion defines an accommodation space and an insertion hole in fluid communication with the accommodation space. The insertion hole is located at one end of the accommodation space. The fin portion is integrally formed with the housing portion and extends outwardly from an outer surface of the housing portion. The connector is located at another end of the accommodation space. The insertion hole is configured for an insertion of the pluggable module into the accommodation space and the connector is configured to be electrically connected to the pluggable module.

Abstract: The present disclosure provides a chip packaging structure including at least one chip packaging unit. The chip packaging unit includes a flexible substrate and a rigid substrate. The flexible substrate includes a first flexible substrate body, and a plurality of input pads and a plurality of output pads arranged on the first flexible substrate body, wherein the input pads and the output pads are connected in one-to-one correspondence. The rigid substrate includes a rigid substrate body and a chip arranged on the rigid substrate body, wherein the rigid substrate is bonded to a drive printed circuit board of a display device. Two opposite sides of the flexible substrate are respectively bonded to the rigid substrate and a display panel of the display device. The plurality of input pads are electrically connected to the chip, and the plurality of output pads are configured to transmit signals to the display panel.

Abstract: An electronic device is provided in the present disclosure. The electronic device includes a first main body having a first metal shell and a second main body having a second metal shell, where the first metal shell has a first slot; and the second metal shell has a second slot; and further includes an antenna circuit disposed in the first metal shell, where the antenna circuit has a radiator; and the radiator and the first slot satisfy a coupling condition. In response to being in a first state, the radiator and the second slot satisfy the coupling condition, and the radiator radiates a signal through the first slot and the second slot, simultaneously; and in response to being in a second state, the first slot and the second slot do not satisfy the coupling condition, and the radiator radiates the signal through the first slot.

Abstract: A display device according to an embodiment of the present invention includes: a base material including a display region and a curved region; a wiring line disposed on the base material and disposed from the display region over the curved region; and a heat dissipating layer formed corresponding to a position at which the wiring line is disposed in the curved region.