Abstract: In an optical network having a terrestrial terminal and an open cable interface (OCI) connecting a submarine cable to a terrestrial cable, the OCI may include a filter positioned on an optical path between the terrestrial cable and the submarine cable and configured to pass first communication signals of a first frequency band, and filter out secondary signals of a second frequency band that does not overlap with the first frequency band. The secondary signals may be looped back to the terrestrial terminal. The terrestrial terminal may detect the looped back secondary signals, and in response, determine the presence of the OCI and that the supervisory signals were rerouted by the OCI.

Abstract: Provided are terminal-free connectors for flexible interconnect circuits. A connector comprises a housing chamber defined by at least a first side wall and a second side wall oppositely positioned about the base. An edge support is positioned at each of the first side wall and the second side wall. The edge supports allow for precise placement of the flexible interconnect circuit inside the housing chamber. A cover piece is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. The cover piece includes a clamp portion securing the flexible interconnect circuit against the edge supports in the clamped position. A slider may be configured to move between an extended position and an inserted position within the housing chamber, and may include a convex upper surface configured to urge the flexible interconnect circuit upwards in the inserted position.

Abstract: An electronic control module, particularly for a transmission, includes a first circuit board element and a sensor unit carrier fastened to the first circuit board element. The sensor unit carrier has a sensor unit receptacle configured to receive a sensor unit. The sensor unit has a sensor element fastened and electrically connected to a second circuit board element so as to detect at least one measured value. The sensor unit is fastened in the sensor unit receptacle. The second circuit board element has a flexible region that separates a first sub-region of the second circuit board element from a second sub-region of the second circuit board element. The first sub-region has a predetermined angle to the second sub-region. The sensor element is electrically connected to the first circuit board element by the second sub-region of the second circuit board element.

Abstract: Disclosed are pressure sensors including a die and an application-specific integrated circuit (ASIC) mounted on a top surface of a substrate. The pressure sensor can define an inner volume and a bottom opening configured to abut the substrate. The die and ASIC are mounted on the top surface of the substrate within the inner volume. The substrate defines a first aperture therethrough and the die defines a second aperture therethrough in a direction along an axis perpendicular to the substrate, the first aperture and the second aperture being aligned. Metallic barrier(s) disposed on a bottom surface of the substrate, circumferentially about the first aperture, can be at least partially coated with solder mask to reduce or prevent flow of unwanted materials past the metallic barriers and through the first aperture. The substrate can include electrical connection pads on the bottom surface configured to be in communication with a daughter board.

Abstract: A removal mechanism of the daughter board includes a fixed frame, a moving frame, a moved frame and a handle. The fixed frame has a pushed portion. The moving frame is movably coupled to the fixed frame and has an oblique tapered edge. The moved frame is fixed to the daughter board and has a corresponding oblique edge. The handle is rotatably connected to the moving frame and has a pushing portion, and the pushed portion is on a rotation path that the pushing portion rotates with the handle. When the handle is operated, the pushing portion pushes the pushed portion, the moving frame moves relative to the fixed frame to push the corresponding oblique edge by the oblique tapered edge. The moved frame drives the daughter board to be removed from the connector.

Abstract: A case includes a first member and a second member configured in such a way that a closed space is formed between the first and second members in a state where the first and second members abut against each other. The first member includes a shaft portion extending toward the second member. The second member includes a shaft support portion including a circumferential wall portion that surrounds one end portion of the shaft portion. The shaft portion includes an enlarged-diameter portion that is the one end portion melted in such a way as to be enlarged in diameter.

Abstract: An apparatus and system for flexibly mounting a power module to a photovoltaic (PV) module. In one embodiment, the apparatus comprises a plurality of distributed mounting points adapted to be adhered to a face of the PV module for mechanically coupling the power module to the PV module, wherein the plurality of distributed mounting points flexibly retain the power module such that the PV module is able to flex without subjecting the power module to stress from flexure of the PV module.

Abstract: A display device includes: a frame that includes a plurality of protrusions; a display panel disposed on the frame that includes a planar portion and a curved portion; a pressure sensing unit disposed between the frame and the display panel that overlaps the curved portion and that includes a plurality of first electrodes and a plurality of second electrodes disposed in a different layer; and a pressure sensing drive unit connected to the plurality of first electrodes and the plurality of second electrodes. Any one of the plurality of second electrodes at least partially overlaps any one of the plurality of first electrodes. At least one of the plurality of protrusions overlaps a region where one of the plurality of first electrodes and one of the plurality of second electrodes overlap each other.

Abstract: An optical transceiver includes a circuit board having a first side and a first edge; a thermal conductive member configured to be attached on the first side of the circuit board; the thermal conductive member having a first thermal conductive face inclined with respect to the first side of the circuit board and parallel to the first direction; a filling material having a thermal conductivity; and a housing having an inner face and an inner space, the housing being configured to house the circuit board, the circuit component, the thermal conductive member, and the filling material, and configured to hold the electrical connector at an end thereof in the first direction, the housing having a second thermal conductive face facing the first thermal conductive face with a spacing. The filling material adheres to the first thermal conductive face and the second thermal conductive face.

Abstract: An air cooling structure of computer chassis includes: a first chassis, a second chassis, a third chassis, a computer motherboard, and a cooling fan; wherein, the first chassis, the second chassis, and the third chassis are provided in turn; the computer motherboard is provided in the first chassis, a CPU is provided on the side surface of the computer motherboard towards the second chassis, a peripheral interface is provided on the side surface of the computer motherboard far away from the second chassis, a cooling hole is provided on the second chassis, the cooling fan is provided in the second chassis, a graphics card is provided in the third chassis. Because of the openness and specific function of the middle-zone cooling system, the disclosure, the cooling becomes more efficient.

Abstract: An information handling system may include a battery, a circuit board, an enclosure, and a control circuit. The circuit board may include at least one electric component, a first electrically conductive pad, and a second electrically conductive pad in proximity to the first electrically conductive pad. The enclosure may be configured to house components of the information handling system including the battery and the circuit board, and the enclosure may include a first member, a second member configured to be mechanically coupled to the first member, and a mechanical component comprising conductive material and configured to electrically short the first electrically conductive pad to the second electrically conductive pad when the first member is mechanically coupled to the second member, and cause electrical isolation of the first electrically conductive pad from the second electrically conductive pad when the first member is mechanically decoupled from the second member.

Abstract: A semiconductor package includes an interposer chip having a frontside, a backside, and a corner area on the backside defined by a first corner edge and a second corner edge of the interposer chip. A die is bonded to the frontside of the interposer chip. At least one dam structure is formed on the corner area of the backside of the interposer chip. The dam structure includes an edge aligned to at least one the first corner edge and the second corner edge of the interposer chip.

Abstract: A sheet feeding apparatus includes an upper support portion formed integrally with a side plate and configured to support an electric circuit board; an upper opening portion formed in the side plate near the upper support portion; a lower support portion provided at a separate part mounted to the side plate and configured to support the electric circuit board; and a lower opening portion provided between the side plate and the separate part. All line segments having a length of 50 mm or less, among line segments extending from arbitrary points in a main body portion of a sheet cassette, through arbitrary points in the upper opening portion, to the electric circuit board, form an angle of 45° or more with respect to a vertical line, and the lower opening portion has a dimension of 5 mm or less or a width of 1 mm or less.

Abstract: An electronic device and a framework assembly for the same are provided. The electronic device includes a base structure, an antenna module and a first decorative board. The base structure has a first surface and a second surface corresponding in position to the first surface. The base structure includes a base body, a receiving slot disposed on the base body, and a first positioning portion disposed on the receiving slot. The antenna module is disposed in the receiving slot of the base structure and includes a mount element and an antenna disposed on the mount element. The mount element includes a second positioning portion corresponding in position to the first positioning portion. The first decorative board is disposed on the first surface of the base structure.

Abstract: An object monitoring system including a plurality of location beacons, each location beacon being configured to generate a location broadcast message indicative of a beacon location and a tag associated with a respective object in use. The includes a tag memory configured to store object rules, a tag transceiver configured to transmit or receive messages and a tag processing device configured to determine context data at least partially indicative of a tag context by at least one of determining a tag location in accordance with at least one location broadcast message received via the tag transceiver from at least one of a plurality of location beacons and using stored context data, use the object rules and the context data to identify a trigger event, determine an action associated with the trigger event and cause the action to be performed.

Abstract: Robust microelectromechanical systems (MEMS) sensors and related manufacturing techniques are described. Disclosed MEMS membranes and backplate structures facilitate manufacturing robust MEMS microphones. Exemplary MEMS membranes and backplate structures can comprise edge pattern holes having a length to width ratio greater than one and/or configured in a radial arrangement. Disclosed implementations can facilitate providing robust MEMS membranes and backplate structures, having edge pattern holes with a profile resembling at least one of an oval, an egg, an ellipse, a droplet, a cone, or a capsule or similar suitable configurations according to disclosed embodiments.

Abstract: A drive device includes a drive unit having an annular shaped adhesion recess portion, a cover including an annular shaped adhesion protrusion portion that faces the adhesion recess portion, an adhesive sealant that adheres the adhesion recess portion to the adhesion protrusion portion, and a spacer that maintains a distance between the adhesion recess portion and the adhesion protrusion portion. Therefore, it is possible to ensure that a space is formed between the adhesion recess portion and the adhesion protrusion portion, and adhesive sealant is able to enter this space. As a result, it is easier to ensure that the adhesion recess portion and the adhesion protrusion portion are bonded in a stable manner by the adhesive sealant. Therefore, it is possible to provide a drive device in which components are appropriately adhered and fixed to each other.

Abstract: A computing device, comprising: a chassis; an optical base layer, including optical connectors; a power base layer, including power connectors; a thermal base layer, including a cold supply line with liquid disconnects, hot return lines with liquid disconnects, and thermal infrastructure interfaces; a radio frequency base layer, including radio frequency connectors; a power interface, wherein the power interface connects to the power base layer; a power supply to connect to the power interface and provide power to the power base layer through the power interface; and bays defined by bay divider walls, wherein each bay divider wall is removable and each bay comprises one of the optical connectors, one of the power connectors, one liquid disconnect for the supply line, one of the liquid disconnects for a hot return line, and one of the radio frequency connectors.

Abstract: A DC power attachment device provides a convenient solution in adapting DC powers from AC sockets connected to an existing power distribution circuit. It enables multitude DC devices to concurrently access multiple DC powers at the same or at different voltages on the same power attachment device, which may be coupled to a DC power source, an existing socket, or directly connected to a DC power distribution circuit. The method on the assembly of a DC power attachment device is also addressed.

Abstract: Systems, apparatuses, and methods are described for a privacy blocking device configured to prevent receipt, by a listening device, of video and/or audio data until a trigger occurs. A blocker may be configured to prevent receipt of video and/or audio data by one or more microphones and/or one or more cameras of a listening device. The blocker may use the one or more microphones, the one or more cameras, and/or one or more second microphones and/or one or more second cameras to monitor for a trigger. The blocker may process the data. Upon detecting the trigger, the blocker may transmit data to the listening device. For example, the blocker may transmit all or a part of a spoken phrase to the listening device.

Abstract: A Baseboard Management Controller (BMC) (125) that may configure itself is disclosed. The BMC (125) may include an access logic (415) to determine a configuration of a chassis (105) that includes the BMC (125). The BMC (125) may also include a built-in self-configuration logic (420) to configure the BMC (125) responsive to the configuration of the chassis (105). The BMC (125) may self-configure without using any BIOS, device drivers, or operating systems.

Abstract: According to an embodiment, disclosed is an electronic device that includes an external interface module including a printed circuit board and at least one part disposed on the printed circuit board, a protective structure including at least one hole area that isolates at least a portion of the at least one part, and a housing that provides at least a bottom portion on which the protective structure is seated. Besides, it may be permissible to prepare various other embodiments speculated through the specification.

Abstract: Example implementations relate to an electronic device packaged on a wing board. For example, an implementation includes a base board having a planar signal interface to couple parallelly to a signal interface segment of a system board. The example implementation also includes a plurality of wing boards to scale in a direction perpendicular to a plane of the base board. An electronic device is packaged on each of the wing boards. A flexible circuit flexibly links at least one of the wing boards to the base board and has a signal path to communicatively couple the planar signal interface and an electronic device packaged the wing board.

Abstract: An enclosure for a computer proofed against being accidentally opened includes a cabinet and a cover plate, the cabinet defines a first chute, the cover plate includes a first hook structure, the first hook structure cooperates with the first chute to cover the cover plate on the cabinet. The cabinet defines a groove in the first chute, the first hook structure comprises a locking portion, and the locking portion is used to engage with the groove.

Abstract: A network-attachable rack-mountable computing device is housed within a shippable enclosure and is configured to mount in a rack. The device may be initialized (e.g., prepared to receive data, and an updateable electronic shipping display set to a shipping destination) by a service provider and shipped, in accordance with a displayed destination address, as a self-contained shipping unit. The device may be coupled with other devices via coupling mechanisms included in an enclosure of the device and may be mounted in a rack at a destination via mounting brackets included in the enclosure of the device. The device may be installed onto a network at the destination and loaded with data. When the device is received back at the service provider, the data is transferred from the device to a service provider storage facility, wiped of data, and prepared to be sent out again.

Abstract: According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies including detachable or severable pickup members. Also disclosed are exemplary embodiments of shielding assemblies (e.g., board level shields, etc.) including the same.

Abstract: A vehicle control apparatus is disposed inside a housing for accommodating a transmission. The vehicle control apparatus includes a metal base, a resin case, a printed circuit board on which an electronic component mounts, an oil-tight seal member, and a breathable filter. The metal base is made of metal. The resin case is attached to the metal base to form an interior space. The resin case includes a part having a connector penetrating inside and outside of the housing. The printed circuit board is disposed in the interior space. The oil-tight seal member is placed between the metal base and the resin case to surround the printed circuit board. The connector has a ventilation hole. The breathable filter is disposed at a location where the ventilation hole faces outside.

Abstract: An electronic device and a wearable device are disclosed. The electronic device includes: a casing; a main board; and at least one fixing member fixing the main board to the casing, having a first end connected to the main board and a second end exposed from the casing, and configured to charge the electronic device or transmit data of the electronic device. The wearable device includes the electronic device and a strap connected to a middle frame of the electronic device.

Abstract: An electromagnetic compatability (EMC) shield and a method of producing the same are disclosed. The EMC shield is for mounting to a substrate having a plurality of holes formed therein, such as a printed circuit board. The EMC shield is formed from a sheet of conductive metal and includes a top wall having opposing side portions. A pair of opposing first side walls are joined to the top wall at first bends, respectively. Each first side wall has a bottom portion with a plurality of mounting contacts extending therefrom. The mounting contacts may have a press-fit construction and are adapted for receipt in the holes of the substrate. The EMC shield further includes a pair of opposing second side walls, each of which is joined by a second bend to one of the first side walls. Each second side wall has a top portion that at least partially adjoins one of the side portions of the top wall.

Abstract: A display device is disclosed. The display device includes: a display panel; a frame disposed at a rear of the display panel; a light source disposed between the display panel and the frame, and configured to provide light to the display panel; a guide panel disposed adjacent to an edge of the display panel and coupled to the frame, and configured to support the display panel; and a front sheet including a light transmitting portion covering a front surface of the display panel, and a light shielding portion extending from the light transmitting portion and covering the guide panel, wherein the guide panel includes: an inner part disposed between the frame and the display panel and configured to support a rear surface of the display panel adjacent to the edge of the display panel; and an outer part disposed toward an outer side of the frame and configured to cover a side surface of the edge of the display panel.

Abstract: According to an exemplary embodiment, a display device comprises: a display panel configured to include a plurality of pixels; a printed circuit board connected to the display panel; a connector mounted in the printed circuit board; and a cable fastened to the connector, wherein the connector comprises: a first connector mounted in the printed circuit board to include a first voltage pad, a second voltage pad, and a plurality of signal pads disposed between the first voltage pad and the second voltage pad; a hinge engaged with the first connector; and a second connector for rotation with respect to a hinge shaft, the second connector includes a third voltage pad and a fourth voltage pad, wherein the cable is inserted between the first connector and the second connector.

Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission input terminal; a first transmission amplifier disposed on the first principal surface that amplifies a transmission signal input through the transmission input terminal; and a first switch disposed on the second principal surface that connects and disconnects the transmission input terminal and the first transmission amplifier.

Abstract: Provided is a flexible display device including a back cover supporting a rear surface of a display panel, a bending member bent with a slow curvature and supporting a rear surface of the back cover, a sliding member supporting the bending member to be rotatable, mounted on the rear surface of the back cover, and rotating the bending member, while sliding up and down on the back cover, and a rotation support member having one end portion slidably and rotatably engaged with an end portion of the bending member and the other end portion rotatably engaged with the back cover.

Abstract: The invention relates to a module configured to reduce or eliminate NVH problems and electrical equipment provided with the module. Electrical equipment includes a housing; the housing includes a cover panel, a peripheral wall, and a chamber defined by the peripheral wall and the cover panel; a part of the cover panel is fastened to upper edges of the peripheral wall; and the electrical equipment further includes at least one support element which is installed inside the chamber at a distance from the peripheral wall, and is configured to support the cover panel.

Abstract: A radio-frequency module includes a module substrate having a first principal surface and a second principal surface on opposite sides of the module substrate, a power amplifier capable of amplifying a transmission signal, a low-noise amplifier capable of amplifying a reception signal, a first switch connected to an input terminal of the power amplifier and disposed on the second principal surface, a second switch connected to an output terminal of the low-noise amplifier and disposed on the second principal surface, and a first ground terminal disposed in a region that is on the second principal surface and that is between the first switch and the second switch in plan view of the module substrate.

Abstract: A driving unit has an adhered recess that is in a loop shape. A cover has an adhered protrusion that is in a loop shape and is opposed to the adhered recess. An adhesive sealing compound adheres the adhered recess and the adhered protrusion to each other continually in a loop shape. A positioning part is configured to position the adhered protrusion relative to the adhered recess.

Abstract: A battery with a plurality of battery cells disposed on a plurality of cell holders. Each battery cell holder holds two battery cells. The plurality of cell holders with the battery cells are enclosed in a battery case and placed inside an external case with a top cover.

Abstract: According to an embodiment, a microelectromechanical systems MEMS device includes a first membrane attached to a support structure that a first plurality of acoustic vents; a second membrane attached to the support structure that includes a second plurality of acoustic vents, where the first plurality of acoustic vents and the second plurality of acoustic vents do not overlap; and a closing mechanism coupled to the first membrane and the second membrane.

Abstract: Systems for converting a standard direct current (DC) power from solar panels into a rectified DC power signal for further conversion into alternating current (AC) power are described herein. In some example embodiments, the systems may include distributed power converters and a grid interface unit connected by a trunk cable. In some example embodiments, the power converters may be embedded in the trunk cable.

Abstract: An apparatus which includes: a circuit board having a radiofrequency (RF) structure at a first location thereof, the RF structure formed from a conductive trace of the circuit board; a heat carrier; and a multi-stack cooling structure coupling the circuit board and the heat carrier to each other. The multi-stack cooling structure including a first stack adjacent the RF structure at the first location and a second stack at a second location. The first stack including a dielectric layer adjacent the heat carrier, and a thermal interface material (TIM) that couples the dielectric layer and the circuit board to each other, the dielectric layer having higher thermal conductivity and higher rigidity than the TIM. The second stack including a metal layer adjacent the heat carrier, and the TIM that couples the metal layer and the circuit board to each other.

Abstract: An electronic device includes a circuit board, an electronic component, and an insulating member. The electronic component includes: a component main body that faces the circuit board; and a first lead terminal that is connected to the circuit board. The insulating member includes a base portion, a mounting portion, and an insulating wall. The mounting portion is disposed on the base portion, and is mounted to the circuit board. The insulating wall protrudes from the base portion, and is disposed between the first lead terminal and a conductive member that is positioned so as to be adjacent to the first lead terminal.

Abstract: A display panel includes: a flexible substrate, and the flexible substrate includes an intermediate region and a preset bending region located at at least one side of a periphery of the intermediate region; a display layer located at a side of the flexible substrate; and a transparent cover film layer located at a side of the display layer away from the flexible substrate, and the transparent cover film layer includes a first portion located at a side of the display layer away from the intermediate region, and a second portion located at a side of the display layer away from the preset bending region. The first portion is connected to the second portion, and the thickness of at least partial region of the second portion progressively decreases in a direction away from the first portion.

Abstract: Various embodiments of the present invention relate to a method for accurately detecting, by an electronic device, that a tray for loading a SIM card is detached. An electronic device according to various embodiments of the present invention may comprise: a tray for loading a SIM card; a first processor electrically connected to the tray; and a second processor electrically connected to the first processor, wherein the first processor is configured to transfer a pre-event to the second processor when a detachment event for the tray is detected, and the second processor is configured to identify, in each designated period, whether the SIM card is erroneous; and delay identification of whether the SIM card is erroneous, in response to reception of the pre-event. The present invention may further include various other embodiments.

Abstract: A terminal, an input/output assembly and a bracket are provided. The bracket includes a body. The body includes a first face and a second face facing away from each other. The second face is provided with a plurality of accommodating chambers. The first face is provided with a plurality of through holes corresponding to the plurality of accommodating chambers. The plurality of accommodating chambers is configured to accommodate an input/output module fixedly mounted therein and to expose the input/output module from the second face. The plurality of through holes is configured to expose the input/output module from the first face.

Abstract: An electronic device for minimizing parasitic emission is provided. The electronic device includes a housing including a front cover, a rear cover located on the opposite side of the front cover, and a lateral member surrounding a space between the front cover and the rear cover, the lateral member having a first conductive portion formed on at least a portion thereof, a support member disposed in the space of the housing and including a second conductive portion having therein at least one opening, a display including a conductive sheet that is disposed between the front cover and the support member so as to be visible from an outside through at least a part of the front cover and is disposed to face the support member, and a wireless communication circuit electrically connected to the first conductive portion. The conductive sheet includes a first portion, a second portion disposed adjacent to the first portion, and a coupling that is partly connected between the first portion and the second portion.

Abstract: Power module includes transformer unit including primary and secondary windings and magnetic core; first and second capacitor units coupled to first terminal of primary winding of transformer unit through first node; first and second external pins respectively coupled to first terminal of first capacitor unit and second terminal of second capacitor unit; first and second switch units coupled to second terminal of primary winding of transformer unit thorough second node; third and fourth external pins respectively coupled to first terminal of first switch unit and second terminal of second switch unit; secondary-side circuit coupled to secondary winding; and fifth and sixth external pins electrically coupled to first and second output terminals of secondary-side circuit, respectively. First external pin is coupled to one of third and fourth external pins selectively.

Abstract: A protective enclosure for electrical components includes a body having front and end openings, the body further including front, rear, and two side panels. A door selectively closes the front opening. An end cap closes the end opening. A ledge surrounds the end opening, the ledge lying perpendicular to the front, rear, and side panels, and a plurality of apertures are provided along the ledge. A gasket provides a seal between the end cap and ledge. A plurality of fasteners embedded into the end cap engage with a plurality of clips assembled onto the ledge at the plurality of apertures so as to form a permanent, one-time-use closure that compresses the gasket and maintains compression thereof in response to nothing more than movement of the end cap toward the ledge in a single installation direction perpendicular to the ledge.

Abstract: A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.

Abstract: An electrical junction box includes a conductive input busbar, a conductive output busbar electrically connectable to the input busbar, a semiconductor relay electrically connected to the input busbar and the output busbar and configured to switch a connected state and a disconnected state of the input busbar and the output busbar, a substrate having mounted thereon a control circuit configured to output a control signal for controlling the semiconductor relay, and a control terminal electrically connecting the control circuit and the semiconductor relay to each other to output the control signal to the semiconductor relay. The semiconductor relay is mounted on at least one of the input busbar and the output busbar. The input busbar, the output busbar, and the semiconductor relay are disposed away from the substrate.

Abstract: This disclosure provides a switch assembly structure and a display device. The switch assembly structure comprises: a switch assembly (100); an assembly housing (400) provided with a first groove (410); a first clamping member (500) provided with a second groove (510), wherein the first clamping member (500) has a first state of being securely connected with the assembly housing (400) and a second state of being separate from the assembly housing (400); wherein, in the second state, the switch assembly (100) is able to mate with the first groove (410) or the second groove (510); and in the first state, the first groove (410) and the second groove (510) combine to form a switch mounting hole (10), and the switch assembly (100) is secured in the switch mounting hole (10) by a securable connection of the first clamping member (500) with the assembly housing (400).