With Spacer Patents (Class 361/758)
  • Patent number: 11528818
    Abstract: A mechanism for mounting an electronic device to a ceiling or a wall includes a fixing seat with a mounting hole, a trigger button in the mounting hole, two clamping members slidably connected to the fixing seat, and two first elastic members. The clamping members abut opposing ends of the first positioning portion when the trigger button is at a first position, and the clamping members move toward each other by a resilient force when the trigger button moves toward the second position. In a second position two ends of the fixing member are clamped, thereby the electronic device is mounted firmly and stably to the fixing member. An electronic device having the mounting mechanism is also disclosed.
    Type: Grant
    Filed: January 5, 2021
    Date of Patent: December 13, 2022
    Assignee: Nanning FuLian FuGui Precision Industrial Co., Ltd.
    Inventor: Feng-Ching Su
  • Patent number: 9350088
    Abstract: A swaging structure for metallic members includes a metallic plate having a hole portion, and a disc-shaped conductive member which is fitted in the hole portion and fixed to the metallic plate by swaging a circumference of the hole portion. The metallic plate includes a groove portion provided in at least one surface side of the metallic plate about the hole portion of the metallic plate, and the conductive member includes a vertical flange provided on an outer circumference of the conductive member and protruding from the at least one surface side. The conductive member is fitted in the hole portion of the metallic plate, and when the conductive member is swaged onto the metallic plate, the vertical flange of the conductive member is deformed, and the groove portion of the metallic plate is filled with the deformed vertical flange.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: May 24, 2016
    Assignee: SUNCALL CORPORATION
    Inventor: Takafumi Suzuki
  • Patent number: 9113554
    Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: August 18, 2015
    Assignee: Aviat U.S., Inc.
    Inventors: Youming Qin, Frank S. Matsumoto, Eric Tiongson
  • Patent number: 9042105
    Abstract: An electronic device may be provided with a printed circuit board having padded through-holes. The padded through-holes may be formed from openings in a printed circuit board substrate and elastomeric members in the openings. The elastomeric members may be conductive elastomeric members such as electrically or thermally conductive elastomeric members. The printed circuit board may be secured within a housing for the electronic device using engagement members that extend through padded through-holes. The engagement members may engage with the housing or with additional engagement members that are attached to the housing. The electronic device may include a cowling structure formed over electronic components on a surface of the printed circuit board. The cowling structure may be secured to the printed circuit board using attachment members that engage with the engagement members in the padded through-holes.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: May 26, 2015
    Assignee: Apple Inc.
    Inventors: Shayan Malek, Michael B. Wittenberg, John Ardisana
  • Patent number: 8995142
    Abstract: Provided is a power module invented for easy manufacturing and fatigue reduction at a soldered portion, and a method for manufacturing the same. The power module according to the present invention comprises a substrate where electronic parts are mounted by soldering, and a mold case housing the substrate and including bus bars for electrical connection with an external apparatus. The mold case comprises partition plates forming an electronic part mount area where electronic parts are mounted on the substrate, and a bonding area for bonding to the bus bars, a first resin cast to the electronic part mount area, and a second resin cast to the bonding area.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: March 31, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Masato Saito, Hiroyuki Abe
  • Publication number: 20150077955
    Abstract: A motor drive comprises a power sub-assembly and a control sub-assembly. The control sub-assembly includes components that may be accessed within the sub-assembly housing during installation and maintenance of the drive. A main circuit board is configured to define a high voltage region and a low voltage region. The high voltage region is isolated by an interior barrier of the housing so that the components can be conveniently accessed. An operator interface is provided in the control sub-assembly. An interface circuit board is also isolated by the barrier. Desired spacing between the interface circuit board and a surface of the interface is provided by integrally molded spring structures and plungers that interface with underlying switches.
    Type: Application
    Filed: October 14, 2013
    Publication date: March 19, 2015
  • Publication number: 20150070859
    Abstract: In a housing 1 for receiving an electric circuit board 50 it is proposed to provide in a first housing half 2 of the housing 1 a plurality of bearing pads 20, 21 located at various levels. These bearing pads 20, 21 receive, together with counter bearing pads 30, 31 provided in a second housing half 30, the electric circuit board 50. A plurality of support points 55, 56 is provided on the electric circuit board 50, each of which support points 55, 56 is respectively associated with the bearing pads 20, 21 and counter bearing pads 30, 31. By removing individual support points 55, 56, the bearing pads 20, 21 and counter bearing pads 30, 31 are selected, on which the circuit board 50 is supposed to rest. By selecting the bearing pads 20, 21 and counter bearing pads 30, 31 lying at different levels, the level of the electric circuit board 50 in the housing 1 is determined.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 12, 2015
    Inventors: Marc Lindkamp, Rainer Bussmann
  • Patent number: 8976537
    Abstract: A spring washer sandwiched between flat washers is interposed between a land on one surface of a printed circuit board of a control board part and an attachment plate, and a screw is inserted from the other surface of the printed circuit board through a substrate through hole extending through the printed circuit board, one of the flat washers, the spring washer, and the other flat washer and is screwed into a screw hole formed in the attachment plate, thereby fixing the attachment plate to the printed circuit board.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: March 10, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventor: Takeshi Ito
  • Patent number: 8953331
    Abstract: A card key has a molded body and an upper and a lower housings. The molded body has a circuit board, to which electronic parts for communicating with an in-vehicle equipment are mounted and which is covered with resin. The molded body is formed in a plate shape. The upper and the lower housings are fixed to each other so that the molded body is arranged between them. An external appearance of the card key is defined by the upper and the lower housings.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: February 10, 2015
    Assignee: Denso Corporation
    Inventors: Keiichi Sugimoto, Mitsuru Nakagawa
  • Patent number: 8947884
    Abstract: A device includes a printed circuit assembly (PCA) including a printed circuit board and at least one electronic component integrated with the printed circuit board, and a support to which the PCA is securable. At least one of the PCA and the support includes engaging structure elements, and some engaging structure elements are configured to secure the PCA to the support while other engaging structure elements are configured to secure the support to a securing structure within a housing of an electronic device.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: February 3, 2015
    Assignee: Cisco Technology, Inc.
    Inventors: Matthew Don Grimm, Edward John Kliewer, Kwok Keung Lee, Sam David Blackwell
  • Patent number: 8923003
    Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Apple Inc.
    Inventors: Alexander D. Schlaupitz, Joshua G. Wurzel
  • Publication number: 20140362549
    Abstract: A cable backplane system includes a backplane having a plurality of openings therethrough and a plurality of mounting blocks. A cable rack is coupled to a rear of the backplane and includes a tray having a frame surrounding a raceway. Spacers are coupled to the tray that are secured to corresponding mounting blocks to position the spacers relative to the backplane. Cable connector assemblies are held by the tray. Each cable connector assembly has a plurality of cables extending between at least two cable connectors. The cables are routed in the raceway. Each cable connector assembly is positioned between and supported by corresponding spacers on opposite sides of the cable connector assemblies. The spacers allow limited movement of the cable connectors in at least two directions to allow alignment of the cable connectors within corresponding openings in the backplane.
    Type: Application
    Filed: June 6, 2013
    Publication date: December 11, 2014
    Inventors: Joshua Tyler Sechrist, Christopher David Ritter, Nathan Glenn Lehman, Brian Patrick Costello, Robert Paul Nichols
  • Patent number: 8897026
    Abstract: A locking assembly includes a guiding post and a hollow locking member. The guiding post includes a locking portion. A clamp hook is formed on a flange of the locking portion. The locking member includes an opening end. The locking member sleeves on the locking portion of the locking member, in which at least one clamping depression is formed on an inner wall of the locking member corresponding to the clamp hook, and the clamp hook is clamped in one clamping depression.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: November 25, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Ju-Ping Duan
  • Patent number: 8879254
    Abstract: Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components such as microprocessors. The present invention utilizes a cooling system constrained to a single circuit card assembly providing for a drop in replacement for current passively cooled circuit card assemblies.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: November 4, 2014
    Assignee: Raytheon Company
    Inventors: Brendon R. Holt, Reagan Branstetter, Chad E. Boyack, Kevin R. Hopkins
  • Patent number: 8854829
    Abstract: In certain embodiments, a mounting apparatus includes one or more standoffs adapted to maintain two panels at a spaced apart distance from one another. The standoff includes a first end having a first threaded fastening member and a second end having a cavity in which a torque restraining member is disposed. The torque restraining member is coupled to a second threaded fastening member. The relative sizes of the torque restraining member and the cavity allow movement of the torque restraining member within the cavity.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: October 7, 2014
    Assignee: Raytheon Company
    Inventors: Jayson K. Bopp, Martin G. Fix
  • Patent number: 8848396
    Abstract: An electronic device includes a metal shield, a housing, a circuit board, an engaging element, and a fixing element. The circuit board is located between the metal shield and the housing. The engaging element is disposed on the circuit board. The circuit board is fixed on the housing and connected to the metal shield via the engaging element.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: September 30, 2014
    Assignee: Wistron Corp.
    Inventor: Wei-Cheng Wang
  • Publication number: 20140268602
    Abstract: An electronic assembly may have a display, a display holder, and a printed circuit board (PCB). The display may have a front side for viewing the display, a back side, and side walls extending between the front side and the back side. The display holder may have a recess for receiving at least part of the display, where the display holder may extend adjacent part of the front side of the display and adjacent at least part of the side walls of the display. The PCB may be secured relative to the display holder and adjacent the back side of the display. The PCB may be in operative communication with the display. In some cases, a spacer may be situated between the back side of the display and the PCB.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Inventors: Petr Adamik, Tarik Khoury, Steven J. Mcpherson, Arnie Kalla, Eugene J. Takach, Mohammad Aljabari, Tracy Lentz, David Mulhouse
  • Patent number: 8824157
    Abstract: A mounting apparatus includes a chassis, an expansion piece attached to a first end of an expansion card, and a securing member. The chassis includes a bottom plate and a front plate substantially perpendicular to the bottom plate. The expansion piece is secured to the front plate. The securing member for securing a second opposite end of the expansion card and includes a first securing portion attached to the bottom plate and a second securing portion. The first securing portion includes a securing panel and a supporting tab extending from the securing panel for supporting the expansion card. The second securing portion includes a positioning post. The second securing portion is deformable in a direction away from the securing panel, and when the second securing portion is released, the positioning post is engaged in a retaining hole of the expansion card.
    Type: Grant
    Filed: May 11, 2012
    Date of Patent: September 2, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chen-Lu Fan
  • Patent number: 8797752
    Abstract: A connecting member for a portable electronic device includes a central cylinder, a first flange portion, a second flange portion, a plurality of first clasps and a number of second clasps. The first flange portion and the second flange portion surround on the central cylinder. The first clasps extend from the first flange portion, and the second clasps extend from the second flange portion.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: August 5, 2014
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventor: Jian-Hui Chen
  • Patent number: 8780575
    Abstract: A printed circuit board includes a board body having a routing-limited area. The routing-limited area is provided with at least one solder pad that is adapted for supporting a metal support thereon. Preferably, the printed circuit board further includes a protrusion block disposed on the solder pad, and having a height greater than that of a signal trace that passes the routing-limited area.
    Type: Grant
    Filed: April 7, 2011
    Date of Patent: July 15, 2014
    Assignee: Wistron Corporation
    Inventor: Chih-Yung Chia
  • Patent number: 8759677
    Abstract: Frames (3) applied on a wafer (1) are leveled and covered with a covering film, such that gas-tight housings are formed for component structures (5), in particular for filter or MEMS structures. Inner columns (4) can be provided for supporting the housing and for the ground connection; outer columns (4) can be provided for the electrical connection and are connected to the component structures by means of conductor tracks (6) that are electrically insulated from the frames (3).
    Type: Grant
    Filed: May 26, 2009
    Date of Patent: June 24, 2014
    Assignee: Epcos AG
    Inventors: Christian Bauer, Hans Krueger, Juergen Portmann, Alois Stelzl
  • Patent number: 8687372
    Abstract: A flexible circuit assembly that includes a flexible circuit substrate. A spacer is attached to a first side surface of the substrate, and a die carrier is attached to the opposite side surface of the substrate. The die carrier includes one or more photonic die mounted thereon that face an opening formed through the substrate so that the photonic die transmits and/or receives optical signals through the opening. Wire bonds electrically connect the photonic die to an electrical pad on the first side surface of the substrate. The spacer helps to space the wire bonds from an optical connector that connects to the flexible circuit assembly, so that the wire bonds do not interfere with the mechanical connection between the flexible circuit assembly and the optical connector.
    Type: Grant
    Filed: December 6, 2011
    Date of Patent: April 1, 2014
    Assignee: Lockheed Martin Corporation
    Inventors: Roger J. Karnopp, Gregory M. Drexler, Gregory J. Whaley
  • Patent number: 8644028
    Abstract: One design aspect in electronic systems, such as communication systems, is noise suppression. More particularly, this relates to microphonics suppression in high-speed communication systems, such as microwave wireless radio systems. The present invention contemplates system design for substantially eliminating microphonic behavior created by mechanical stimulus such as vibrations and the drum effect. A preferred approach includes isolating the motherboard from its mounting harnesses (mechanical interconnection) and adding an echo damping and shock absorption pad to the underside of the enclosure cover to stiffen the enclosure cover while maintaining its light weight. Preferably also, this approach isolates the entire motherboard rather than a particular component. A design using this approach is particularly useful in an outdoor unit (ODU) of a split-mount microwave radio system.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: February 4, 2014
    Assignee: Aviat U.S., Inc.
    Inventors: Youming Qin, Frank S. Matsumoto, Eric Tiongson
  • Patent number: 8619430
    Abstract: A switch/circuit board unit and a hand-held tool equipped with such a switch/circuit board unit are proposed. The switch/circuit board unit is adapted for installation in a handle of the tool and has a switch and a circuit board. The switch/circuit board unit also has a mechanical coupling element for producing a rigid mechanical coupling between the switch and circuit board. The rigid coupling that the coupling element produces between the switch and circuit board allows the arrangement of the switch and circuit board to be embodied as a unit, which can enable maneuvering before installation and permit a simplified installation, and in particular, it is possible to simplify a fastening of the switch and circuit board inside a housing of the tool, and in the accompanying installation of electrical connections, for example in the form of flexible cables, it is possible to avoid an incorrect placement or wedging of cables.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: December 31, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Andreas Kynast, Markus Schmid
  • Patent number: 8582310
    Abstract: An electronic apparatus includes: a circuit board that is disposed inside a case that is formed by coupling first and second case halves, the circuit board being interposed between first and second boss portions; first and second conductive members that are disposed between a gap formed between the first boss portion and the circuit board; a third conductive member that is disposed between the first boss portion and the first conductive member and between the first boss portion and the second conductive member to electrically connect the first conductive member to the second conductive member; and a measurement circuit that is electrically connected to a first wiring and a second wiring, which are respectively connected to the first conductive member and the second conductive member, and measures an electrical characteristic value of at least one of the first conductive member and the second conductive member.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: November 12, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tomoko Monda, Minoru Mukai
  • Patent number: 8582314
    Abstract: There is provided an interconnection structure. An interconnection structure according to an aspect of the invention may include: a plurality of side portions provided on one surface of a substrate part and a plurality of cavities located between the side portions and located further inward than the side portions; and electrode pattern portions provided on surfaces of the side portions and the cavities.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: November 12, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Wook Park, Young Do Kweon, Seung Wan Shin, Mi Jin Park, Kyung Seob Oh
  • Patent number: 8570756
    Abstract: A sliding electronic apparatus that prevents foreign matter from entering a housing is provided. In the apparatus, upper housing 1 and lower housing 2 are slidably coupled, and it is switched by sliding one of upper housing 1 and lower housing 2 with respect to the other, a closed state in which operation section 2b provided on lower housing 2 is covered by upper housing 1 and an open state in which operation section 2b is exposed. The apparatus includes opening 1c formed in a lower surface of upper housing 1, opening 2c formed in an upper surface of lower housing 2, and FPC 3 for electrically connecting wiring board 9 and wiring board 10. FPC 3 includes cover portion 3a mounted on the lower surface of upper housing 1 so as to cover opening 1c and cover portion 3b mounted on the upper surface of lower housing 2 so as to cover opening 2c. Cover portion 3a is electrically connected to wiring board 9 in upper housing 1, and cover portion 3b is electrically connected to wiring board 10 in lower housing 2.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: October 29, 2013
    Assignee: NEC Corporation
    Inventors: Takahiro Sakai, Toshiki Yamanaka, Hiroshi Yamada
  • Patent number: 8552298
    Abstract: A chassis includes a number of fixing apparatuses, which enables various motherboards with different mounting holes layouts to be selectively mounted in the chassis. Each of the fixing apparatuses includes a base member secured to the chassis, and a fastening member rotatably connected to the base. The fastening member defines a fastening hole extending through an end of the fastening member. Each of the fixing apparatuses is rotatable between a fastening position and an interference avoiding position. To mount one of the motherboards, some of the fastening members are rotated to the fastening-ready positions to align the fastening holes of the fastening members with the corresponding mounting holes of the motherboard, and other fastening members are rotated to the interference-avoiding position to avoid interfering with the motherboard.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: October 8, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yang Liu, Lei Liu, Cheng-Fei Weng
  • Patent number: 8537556
    Abstract: The invention specifies a holding apparatus comprising a support element and a circuit board. A trench for receiving the circuit board is embodied in the support element. At least one first clamping element is arranged on one or both longitudinal sides of the circuit board and/or at least one second clamping element is arranged in the trench. As a result, the circuit board received by the trench is fixed in the trench in a clearance-free fashion.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: September 17, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventors: Bernd Beyer, Horst Friesner, Markus Hemmerlein, Florian Hofmann, Helmut Repp, Wolfgang Schnitzerlein, Markus Stark, Peter Tichy
  • Patent number: 8531837
    Abstract: A pad mechanism includes a step fixing structure having a plurality of step platforms. A height difference is formed between the two step platforms. A first engaging portion is formed on each step platform. The pad mechanism further includes a pad component having a pad body, a sleeve and a constraining portion. A second engaging portion is formed on the pad body for selectively engaging with the corresponding first engaging portion so as to adjust a height of the pad body protruding from the step fixing structure. The pad mechanism further includes a resilient component sheathing with the sleeve for driving the sleeve, and a constraining component installed on a side of the resilient component and connected to the constraining portion so as to prevent the resilient component from separating from the sleeve.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: September 10, 2013
    Assignee: Wistron Corporation
    Inventors: Jia-Hung Lee, Chien-Heng Kuo, Yen-Chang Lai
  • Patent number: 8526195
    Abstract: The disclosure concerns an electrical connection assembly comprising: a conductive plate with a drillhole, a first column with a hole passing axially through it and comprising a shoulder to abut against one of the faces of the conductive plate, and a second column with a hole passing axially through it and comprising a shoulder to abut against the other face of the conductive plate, a first cylinder with a radius sized to enable it to enter the hole in the first column and a length sized such that, when the shoulder is in abutment, the free end of the first cylinder projects beyond the conductive plate, and a second cylinder with a radius sized to enable it to enter the drillhole, wherein the free end of the first cylinder is crimped by radial expansion and then by axial compression in the hole in the first column.
    Type: Grant
    Filed: October 14, 2008
    Date of Patent: September 3, 2013
    Assignee: ELDRE
    Inventors: Philippe Hublier, Fabrice Hamon
  • Patent number: 8526192
    Abstract: A boss for securing a pair of mainboards includes a circular top and a plurality of first flexible legs. The first flexible legs are disposed on one side of the circular top and are separated from each other. Each of the first flexible legs includes a tilted wall and a pressing component. The tilted wall is formed on a surface of the first flexible leg that faces another first flexible leg. The pressing component is formed on one end of the first flexible leg away from the circular top. The tilted walls of all the first flexible legs cooperatively define a tapered channel. The tapered channel can be expanded.
    Type: Grant
    Filed: January 16, 2012
    Date of Patent: September 3, 2013
    Assignee: Inventec Corporation
    Inventors: Pin-Cheng Chen, Te-Cheng Lee, Hung-Pin Lin, Yao-Yu Lai, Cheng-Hsin Chen
  • Patent number: 8514581
    Abstract: According to one embodiment, a flexible printed wiring board includes a component mounting portion to which a component is mounted and to which a reinforcing sheet is bonded. The component mounting portion includes an inner layer comprising a wiring pattern, and an outermost film layer disposed to cover the wiring pattern. The outermost film layer, to which the reinforcing sheet is bonded, is formed with a groove such that, when the reinforcing sheet is bonded, the groove extends in a region between the outermost film layer and the reinforcing sheet and communicates with an outside of the region.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: August 20, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kenji Hasegawa
  • Patent number: 8493722
    Abstract: A vibratile display device includes a back plate, a panel assembly and at least one flexible pin. The back plate has a plurality of first fixing holes. The panel assembly is fixed to the back plate and includes a base and a display panel. The base has a carrier portion and a plurality of lugs extending outward from the carrier portion. Each lug has at least one second fixing hole corresponding to the first fixing holes. The display panel is disposed on the carrier portion of the base. An insert portion of the flexible pin is inserted into the first fixing hole of the back plate, and a neck portion of the flexible pin is inserted into the corresponding second fixing hole. A lean portion of the flexible pin is located between the base and the back plate. A top portion of the flexible pin protrudes a surface of the lugs.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: July 23, 2013
    Assignee: Au Optronics Corp.
    Inventors: Yuan-Yu Chien, Kuan-Fu Huang
  • Patent number: 8482927
    Abstract: A backplane electronic circuit board of an electronic apparatus (10) comprises an interface connector with an external system and two interface boards (22, 23) connected to one another, a first interface board (22) being connected to the said interface connector and a second interface board (23) being intended for the connection of a set of electronic circuit boards of the said electronic apparatus (10). The backplane electronic circuit board (20) comprises reinforcement means (30, 40) installed between the said two interface boards (22, 23). Use in particular in an electronic apparatus on board an aircraft.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: July 9, 2013
    Assignee: Airbus Operations S.A.S.
    Inventors: Jean-Christophe Caron, Vincent Rebeyrotte
  • Patent number: 8477508
    Abstract: A blade for a chassis-based system includes a printed circuit board (PCB) mounted at a tilt angle within the blade. The tilt angle provides space above or below the PCB at the front end of the blade, such that media interface modules can be flexibly positioned within the blade. A tilt angle that positions the PCB higher near the front end of the blade may enable media interface modules mounted in a belly-to-belly configuration on the PCB to be fitted within the front end of the blade. A tilt angle that positions the PCB lower near the front end of the blade may enable media interface modules mounted on the upper surface of the PCB to be fitted within the first end of the blade. The tilt angle also positions a backplane connector mounted on the PCB to properly engage a backplane when the blade is inserted into a slot.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: July 2, 2013
    Assignee: Brocade Communications Systems, Inc.
    Inventors: David A. Skirmont, Daniel K. Kilkenny
  • Patent number: 8472204
    Abstract: A card assembly is disclosed comprising a carrier host card, an interposer printed wiring board (PWB) situated between the carrier host card and a hosted card, wherein the carrier host card and the interposer printed wiring board (PWB) are configured to have a space there-between. The card assembly further comprising a customized front panel including a first cutout for the carrier host card and a second cutout for said hosted card.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: June 25, 2013
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Mark E. Leibowitz, Michael M. Borthwick, Saeed Karamooz
  • Patent number: 8450839
    Abstract: Stacked microelectronic devices and methods for manufacturing such devices are disclosed herein. In one embodiment, a stacked microelectronic device assembly can include a first known good packaged microelectronic device including a first interposer substrate. A first die and a first through-casing interconnects are electrically coupled to the first interposer substrate. A first casing at least partially encapsulates the first device such that a portion of each first interconnect is accessible at a top portion of the first casing. A second known good packaged microelectronic device is coupled to the first device in a stacked configuration. The second device can include a second interposer substrate having a plurality of second interposer pads and a second die electrically coupled to the second interposer substrate. The exposed portions of the first interconnects are electrically coupled to corresponding second interposer pads.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: May 28, 2013
    Assignee: Micron Technology, Inc.
    Inventors: David J. Corisis, Chin Hui Chong, Choon Kuan Lee
  • Patent number: 8422241
    Abstract: Provided is a small resin-sealed electronic control device with a reduced plane area and volume, which can provide an enlarged area on which circuit components are mounted without increasing a plane area of electronic boards. In the resin-sealed electronic control device, a support member (20A) includes a first support plate (21a), a second support plate (22a), and a pair of rising portions (23a) which form a space portion with a first electronic board (30A) and a second electronic board (40A). An exterior covering material (11) is formed by injecting a melted synthetic resin into the space portion and spaces outside the space portion along the pair of rising portions (23a). Inner circuit components (33) are situated inside window holes formed through the support plate (20A) and face one of the first electronic board (30A) and the second electronic board (40A) opposed to each other with a gap interposed therebetween.
    Type: Grant
    Filed: December 16, 2010
    Date of Patent: April 16, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shinji Higashibata, Shozo Kanzaki, Hiroyoshi Nishizaki, Fumiaki Arimai
  • Patent number: 8422240
    Abstract: An electronic apparatus includes a flexible printed circuit having a first surface on which a switch is mounted, a reinforcement plate having a first surface arranged to face a second surface of the flexible printed circuit opposite to the first surface of the flexible printed circuit on which the switch is mounted, and a spacer arranged to face a second surface of the reinforcement plate opposite to the first surface of the reinforcement plate that faces the second surface of the flexible printed circuit.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: April 16, 2013
    Assignee: Panasonic Corporation
    Inventor: Jun Saiki
  • Patent number: 8406009
    Abstract: An electronic device is provided, the electronic device includes a printed circuit board (PCB) having a mounting point. The computer system also includes a chassis having a mounting post. The mounting point and the mounting post are flexibly connected.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: March 26, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeffrey A. Lev, Steven S. Homer, Earl W. Moore, Mark H. Ruch
  • Patent number: 8331099
    Abstract: In a method for fixing an electrical or an electronic component, particularly a printed-circuit board, in a housing used to accommodate the component, and a fixing element for fixing the component by clamping it in place, the component is fitted with at least one fixing element, which includes an elastically yielding press-on part which, during the clamping in place of the component in the housing, is brought to lie against a part of the housing and is pressed against it while being deformed.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: December 11, 2012
    Assignee: Robert Bosch GmbH
    Inventors: Alexander Geissler, Udo Hennel
  • Patent number: 8238095
    Abstract: A secure circuit board assembly is provided. The secure circuit board assembly comprises: a control board including a cryptographic processor; a spacer portion mounted on the control board; and a lid mounted on the spacer portion. The control board, the spacer portion, and the lid collectively provide a secure enclosed chamber in which the cryptographic processor is mounted. The spacer portion provides protection against side-on attacks against the cryptographic processor.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: August 7, 2012
    Assignee: NCR Corporation
    Inventors: Grant A. McNicoll, Charles Harrow, Ian J. Walker
  • Publication number: 20120119757
    Abstract: A noise current passing through a substrate on which an electronic component is mounted is suppressed in a housing, to provide a malfunction of an electronic device. A substrate (103) on which an electronic component is mounted is secured to a housing (102) by a metal spacer (108) and a screw (104). A noise control member (100) mainly composed of an insulation substance is disposed between the metal spacer (108) and the substrate (103). A first conductive film is formed on the metal spacer-side of the noise control member (100), and a second conductive film is formed on the substrate-side of the noise control member (100). A resistance member (101) is disposed between the first conductive film and the second conductive film. A noise current introduced from the housing to the substrate can be suppressed by the resistance member.
    Type: Application
    Filed: May 26, 2010
    Publication date: May 17, 2012
    Applicant: Hitachi, Ltd.
    Inventors: Satoshi Nakamura, Takashi Suga, Yutaka Uetmatsu
  • Publication number: 20120120622
    Abstract: An airtight assembly of two components including a first component with a support having at its surface: at least one spacer composed of a ductile material, arranged at the periphery of the component, and at least one bead composed of a ductile material; a second component with a support having at its surface: at least one insert inserted over the whole or part of its surface in the spacer on the first component, and at least one bead insert inserted over all or part of the surface thereof in the bead on the first component, defining an airtight central cavity.
    Type: Application
    Filed: July 23, 2010
    Publication date: May 17, 2012
    Applicant: Commissariat L'Energie Atomique Et Aux Energies Alternatives
    Inventors: François Marion, Agnés Arnaud, Geoffroy Dumont, Pierre Imperinetti
  • Patent number: 8164913
    Abstract: A fastener includes a cylinder and a draw hook. The cylinder includes a main body, two resilient arms extending from an end of the main body, and a flange extending from a circumference of an opposite end of the main body. A number of protrusions spaced in the axial direction of the main body extends from an inside surface of each of the resilient arms. The draw hook includes a post slidably received in the cylinder, a taper-shaped engaging portion extending from an end of the post and exposed out of distal ends of the resilient arms, and a handle extending from an opposite end of the post. A diameter of the engaging portion gradually grows larger along a direction away from the post.
    Type: Grant
    Filed: April 15, 2010
    Date of Patent: April 24, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Ming-Chih Hsieh, Tsung-Hsi Li
  • Patent number: 8164904
    Abstract: An electronic component module includes at least one first multi-layer circuit board module (21, 22; 31, 32; 41, 42) and a cooling arrangement (23, 33, 43), the cooling arrangement (23, 33, 43) being in contact with an upper side of the circuit board module (21, 22; 31, 32; 41, 42). The cooling arrangement (23, 33, 43) is designed such that waste heat generated during operation of the electronic component module (2, 3, 4) is extracted in a lateral direction with relation to the arrangement of the circuit board module (21,22; 31, 32; 41, 42) by the cooling arrangement (23, 33, 43).
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: April 24, 2012
    Assignee: OSRAM AG
    Inventors: Richard Matz, Bernhard Siessegger, Steffen Walter
  • Patent number: 8153903
    Abstract: In a circuit board disposed in parallel to a fixing plane, a guard spacer (abutting member) is disposed on a multi-layer printed circuit board on the side of the fixing plane to suppress deformation of the multi-layer printed circuit board to prevent short circuit if an impact is applied to the circuit board. The guard spacer may be a dummy electronic component or a plate member. An image display using the circuit board is also disclosed.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: April 10, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Akihiko Kanouda, Ryuji Kurihara, Fusao Sakuramori, Takeshi Mochizuki, Yoshihiko Sugawara, Masami Joraku
  • Patent number: 8153232
    Abstract: A method is provided for producing a laminated substrate for mounting semiconductor chips. At least respective metal and plastic structure films having respective different recurrent contours are laminated together in such a way that a material strip is obtained. The lamination is followed by perforations or cuttings, and the method includes at least one of the following steps: A. the films are structured in such a way that superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total width thereof; B. the films are not laminated through the total width of the laminate in partly recurrent areas; and C. recurrent segments of the recurrent contours are bent out of the surface of the laminated strip starting from the laminate.
    Type: Grant
    Filed: March 13, 2008
    Date of Patent: April 10, 2012
    Assignee: W.C. Heraeus GmbH
    Inventors: Eckhard Ditzel, Siegfried Walter, Manfred Gresch
  • Patent number: 8149590
    Abstract: A circuit board fixing element is provided. The circuit board fixing element is used for fixing a circuit board on a sheet, and includes a fixing portion, a buckling portion, and a connecting portion. The buckling portion is made of a resilient material. The connecting portion is connected between the fixing portion and the buckling portion, and has two opposite ends and a side surface connected to the ends. The fixing portion and the buckling portion are respectively located on the ends and protrude from the side surface.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: April 3, 2012
    Assignee: Chunghwa Picture Tubes, Ltd.
    Inventors: Chin-Hsing Cho, Simon Pan, Tsao-Yuan Fu