Abstract: Circuits, systems, and methods are described herein for generating a boost voltage for a write operation of a memory cell. In one embodiment, a boost circuit includes a first inverter and a second inverter, each configured to invert a write signal. The boost circuit also includes a transistor and a capacitor. The transistor is coupled to an output of the first inverter. The transistor is configured to charge a capacitor based on the write signal and provide a supply voltage to a write driver. The capacitor is coupled to an output of the second inverter. The capacitor is configured to generate and provide a delta voltage to the write driver.

Abstract: A single-rail memory circuit includes an array of memory cells arranged in rows and columns and peripheral circuitry connected to the array for facilitating read and write operations with respect to selected memory cells. The peripheral circuitry includes, but is not limited to, boost circuits for the rows. Each boost circuit is connected to a wordline for a row and to a discrete voltage supply line for the same row. Each boost circuit for a row is configured to increase the voltage levels on the wordline and the voltage supply line for the row during a read of any selected memory cell within the row. Increasing the voltage levels on the wordline and on the voltage supply line during the read operation effectively boosts the read current. A method of operating the memory circuit reduces the probability of a read fail.

Abstract: A memory cell of a 2-port static random access memory (SRAM) includes first and second p-type transistors and first to sixth n-type transistors. Gate interconnects extend in the X direction and are arranged in three rows in the Y direction. The gate interconnects in the first row form gates of the first n-type transistor, the first p-type transistor, and the fourth n-type transistor, the gate interconnect in the second row forms gates of the fifth and sixth n-type transistors, and the gate interconnects in the third row form gates of the third n-type transistor, the second n-type transistor, and the second p-type transistor.

Abstract: A semiconductor circuit includes a first circuit that applies an inverted voltage of a voltage at a first node to a second node, a second circuit that applies an inverted voltage of a voltage at the second node to the first node, a first transistor that couples the first node to a third node, and a first memory element having a first terminal coupled to the third node and a second terminal to which a control voltage is to be applied. The semiconductor circuit further includes a second transistor having a drain coupled to the third node and a gate coupled to one of the first node or the second node, a third transistor having a drain coupled to the third node and a gate coupled to the other of the first node or the second node, and a driver.

Abstract: It discloses a circuit for reducing a leakage current of a static random access memory (SRAM) memory array and a control method for the same. The circuit includes a memory array power supply voltage control module, a memory array ground terminal voltage control module and a memory array. The present invention controls the voltages on the power supply terminal and the ground terminal of the memory array through the memory array power supply voltage control module and the memory array ground terminal control module, and may reduce the actual data retention voltages of the bitcells, thereby reducing the leakage power of the SRAM in a data retention state. Meanwhile, the present invention implements the function of adjusting the data retention voltage values of the bitcells by controlling different adjustment signals to cope with different design requirements.

Abstract: Fuse programming circuits, devices and methods. In some embodiments, a fuse circuit can include a fuse pad configured to receive a voltage, a fuse having a first end coupled to the fuse pad and a second end coupled to a switching element configured to enable a current to pass from the fuse pad to a ground potential.

Abstract: According to various aspects, a memory cell is provided, the memory cell may include a field-effect transistor; a first control node and a second control node, a first capacitor structure including a first electrode connected to the first control node, a second electrode connected to a gate region of the field-effect transistor, and a remanent-polarizable region disposed between the first electrode and the second electrode of the first capacitor structure; and a second capacitor structure including a first electrode connected to the second control node, a second electrode connected to the gate region of the field-effect transistor. In some aspects, the first capacitor structure may have a first capacitance and the second capacitor structure may have a second capacitance different from the first capacitance.

Abstract: A memory and a signal processing method are provided. The memory includes a latch circuit, a decoding circuit, a storage array, a read circuit, and a write circuit. The storage array includes M rows and N columns of bitcells. The latch circuit is configured to receive a first address and a second address. The decoding circuit is configured to: determine a first bitcell based on the first address, and determine a second bitcell based on the second address. The write circuit is configured to: receive data, and write the data into the first bitcell through a first port of the first bitcell. The read circuit is configured to read, through the first port of the first bitcell, data stored in the first bitcell; and is further configured to read, through a second port of the second bitcell, data stored in the second bitcell. Implementing this application can implement 1R1RW.

Abstract: Methods, systems, and devices for memory array with multiplexed select lines are described. In some cases, a memory cell of the memory device may include a storage component, a first transistor coupled with a word line, and a second transistor coupled with a first select line to selectively couple the memory cell with a first digit line. A third transistor may be coupled with the first digit line and a sense component common to a set of digit lines and a set of select lines. A second select line may be coupled with the third transistor and configured to couple the sense component with the first digit line and to couple the sense component with a second digit line. The sense component may determine a logic state stored by the memory cell based on the signal from the first digit line and the signal from the second digit line.

Abstract: A dual-mode memory is provided that includes a self-timed clock circuit for asserting a sense enable signal for a sense amplifier. In a low-bandwidth read mode, the self-timed clock circuit asserts the sense enable signal only once during a memory clock cycle. The sense amplifier then senses only a single bit from a group of multiplexed columns. In a high-bandwidth read mode, the self-timed clock circuit successively asserts the sense enable signal so that the sense amplifier successively senses bits from the multiplexed columns.

Abstract: A memory is provided that is configured to practice both a normal read operation and also a burst mode read operation. A burst mode address comparator compares a current row address to a preceding row address from a preceding read operation to determine whether a read operation is a normal read operation or a burst mode read operation. The burst mode address comparator invokes the burst mode despite the presence of an intervening write operation to a row address not equal to the preceding row address.

Abstract: Systems and method are provided for a memory circuit. In embodiments, the circuit includes a plurality of memory cells corresponding to a word of data and a global write word line. A plurality of local write lines are connected to a subset of the plurality of memory cells of the word of data. Selection logic is configured to activate a particular subset of memory cells for writing via a particular local write line based on a signal on the global write line and a selection signal associated with the particular subset of memory cells.

Abstract: A semiconductor device includes a plurality of first memory cells in a memory region and a first cut-off transistor in a dummy region, the dummy region being adjacent to the memory region. Each of the plurality of the first memory cells includes a static random access memory (SRAM) cell. The static random access memory cell includes a first pull-down transistor and a second pull-down transistor. The plurality of the first memory cells includes a first memory cell. A first source/drain region of the first pull-down transistor in the first memory cell is electrically coupled to a first source/drain region of the first cut-off transistor and a second source/drain region of the first cut-off transistor is electrically coupled to a power supply voltage.

Abstract: A static random access memory (SRAM) cell has first to sixth transistors that are vertical nanowire (VNW) FETs. The second and fifth transistors are placed side by side sequentially on one side in the X direction of the first transistor. The fourth and sixth transistors are placed side by side sequentially on the other side in the X direction of the third transistor. The first and third transistors are placed side by side in the Y direction.

Abstract: A method for utilizing a plurality of physical unclonable function (PUF) cells to generate a signature key with a desired bit length is provided. The method includes setting a state of each of the plurality of PUF cells to a uniform level; obtaining an order of change in the state of at least a portion of the plurality of PUF cells; and generating the signature key at least based on the order.

Abstract: The present invention is directed to computer storage systems and methods thereof. In an embodiment, a memory system comprises a controller module, a nonvolatile memory, and a volatile memory. The controller module operates according to a command and operation table. The command and operation table can be updated to change the way controller module operates. When the command and operation table is updated, the updated table is stored at a predefined location of the nonvolatile memory. There are other embodiments as well.

Abstract: A memory device includes a cell array including cells, an address transition detector outputting a transition detection signal as to whether an address of a write command is changed, and a control logic circuit generating one of word-line-on signals for performing a write operation on the cell array in response to the write command, and terminating the write operation in accordance with the transition detection signal. The word-line-on signals include a long-kept word-line-on signal that stays active before the address is changed and a divided word-line-on signal that is, before the address is changed, divided into sub-word-line-on signals.

Abstract: In an MRAM, each unit cell includes two non-volatile storage units, three N-type transistors and three P-type transistors. Each N-type transistor is coupled in parallel with a corresponding P-type transistor for forming a transmission gate which provides bi-directional current, thereby preventing source degeneration.

Abstract: Fin-based well straps are disclosed for improving performance of memory arrays, such as static random access memory arrays. An exemplary integrated circuit (IC) device includes a FinFET disposed over a doped region of a first type dopant. The FinFET includes a first fin having a first width doped with the first type dopant and first source/drain features of a second type dopant. The IC device further includes a fin-based well strap disposed over the doped region of the first type dopant. The fin-based well strap connects the doped region to a voltage. The fin-based well strap includes a second fin having a second width doped with the first type dopant and second source/drain features of the first type dopant. The second width is greater than the first width. For example, a ratio of the second width to the first width is greater than about 1.1 and less than about 1.5.

Abstract: Provided is a transistor, the transistor being located on a base and having an active layer, and the active layer of the transistor comprising a plurality of semiconductor patterns which are stacked, wherein the plurality of semiconductor patterns are electrically connected; and orthographic projections of any two of the semiconductor patterns on the base are different in shape. A method of manufacturing a transistor, a transistor device, and a display substrate and apparatus are also provided.

Abstract: The present invention is directed to a nonvolatile memory device that includes a plurality of memory slices, each memory slice including one or more memory sectors and a read circuit for sensing the resistance state of a magnetic memory cell in the memory sectors. The read circuit includes first and second input nodes; a sense amplifier having first and second input terminals; a first target resistor and a balancing resistor connected in series between the first input node and the first input terminal; a multiplexer having a first input, a second input, and an output, with the first input being connected to the second input node and the output being connected to the second input terminal; a second target resistor and an offset resistor connected in series between the second input node and the second input; and first and second current sources connected to the first and second input terminals, respectively.

Abstract: One aspect of this description relates to a memory cell including a first layer including a first gate structure, a second gate structure, a third gate structure, and a fourth gate structure. The memory cell includes a second layer including a first active structure and a second active structure. The first gate structure overlaps the first active structure to form a first access transistor, the second gate structure overlaps the first active structure to form a first pull-down transistor, the third gate structure overlaps the first active structure to form a second pull-down transistor, and the fourth gate structure overlaps the first active structure to form a second access transistor. The second gate structure overlapping the second active structure to form a first pull-up transistor, the third gate structure overlapping the second active structure to form a second pull-up transistor.

Abstract: A static random access memory (SRAM) includes a first memory cell array, a second memory cell array, a first data line coupled to the first memory cell array and the second memory cell array, a second data line coupled to the first memory cell array and the second memory cell array, a primary driver circuit coupled to at least the first data line, and a supplementary driver circuit coupled to at least the first data line. The supplementary driver circuit is configured to receive a supplementary driver circuit enable signal, sense a voltage of a first signal of the first data line, and pull the voltage of the first signal to a first voltage level during a write operation of the SRAM in response to at least a first NOR output signal.

Abstract: A read register is provided that captures and stores the read result on a read bit line connected to a set of computational memory cells. The read register may be implemented in the set of computational memory cell to enable the logical XOR, logical AND, and/or logical OR accumulation of read results in the read register. The set of computational memory cells with the read register provides a mechanism for performing complex logical functions across multiple computational memory cells connected to the same read bit line.

Abstract: Embodiments of 3D memory devices with a static random-access memory (SRAM) and fabrication methods thereof are disclosed herein. In one example, the method for operating a 3D memory device having an input/output circuit, an array of SRAM cells, and an array of 3D NAND memory strings in a same chip. The method may include transferring data through the input/output circuit to the array of SRAM cells, storing the data in the array of SRAM cells, and programming the data into the array of 3D NAND memory strings from the array of SRAM cells.

Abstract: In an exemplary embodiment, the disclosure provides a memory circuit which includes a dual port memory cell for storing a binary value accessed through a first port and a second port, a first WL switch connected to the dual port memory cell and controlled by a first WL voltage, a second WL switch connected to the dual port memory cell and controlled by a second WL voltage, a BL connected to the first WL switch for accessing the memory cell through the first port and having a first BL voltage, a second BL connected to the second WL switch for accessing the memory cell through the second port and having a second BL voltage, a BL selection circuit connected to the second WL switch for selecting the second BL, and a BL voltage pull down circuit connected to the BL selection circuit and the second WL switch.

Abstract: A memory device includes a plurality of memory cells located in a first region of the memory device. The memory cells include a first signal line, a first circuit located in the first region of the memory device, and a plurality of logic circuits located in a second region of the memory device. The second region and the first region have different design rules. The first circuit is configured to be selectively enabled and disabled. When the first circuit is enabled, the first signal line is electrically coupled in parallel with a second signal line.

Abstract: The present disclosure is directed to a circuit layout of a dual port static random-access-memory (SRAM) cell. The memory cell includes active regions in a substrate, with polysilicon gate electrodes on the active regions to define transistors of the memory cell. The eight transistor (8T) memory cell layout includes a reduced aspect ratio and non-polysilicon bit line discharge path routing by positioning an active region for the first port opposite an active region for the second port and consolidating power line nodes at a central portion of the memory cell.

Abstract: Briefly, embodiments of claimed subject matter relate to devices and methods for modifying, such as decreasing rise time and/or fall time, of a driver signal output. To achieve such modifications in driver output signals, additional gates may be positioned at PMOS and/or NMOS regions of a semiconductor film. In addition, at least in particular embodiments, etching of portions of one or more semiconductor regions may increase compressive or tensile stress, which may further operate to modify driver output signals.

Abstract: A dual-port SRAM includes a substrate, first and second active regions over the substrate and oriented lengthwise generally along a first direction; first and second gate electrodes oriented lengthwise generally along a second direction perpendicular to the first direction. The first and second gate electrodes engage the first and second active regions to form first and second pass gate transistors, respectively. The dual-port SRAM further includes a first gate contact disposed over the first gate electrode and electrically connected to the first gate electrode and a first source/drain contact oriented lengthwise generally along the second direction. The first source/drain contact directly contacts source/drain features of the first and second pass gate transistors. A portion of the first gate contact and a portion of the first source/drain contact are at a same vertical level from a top surface of the substrate and are aligned along the first direction.

Abstract: The disclosure provides a dual-port static random access memory cell layout structure, including a pull-down transistor layout structure, a first and a second pass transistor layout structure. Each of them includes an active region pattern and a polysilicon pattern; and contact hole patterns. The active region pattern of the pull-down transistor layout structure and the first pass transistor layout structure are connected together, and share the contact hole pattern at one end. The active region pattern of the pull-down transistor layout structure and the second pass transistor layout structure are connected together, and share the contact hole pattern at the other end. The disclosure optimizes the dual-port static random access memory cell layout structure, improves the influence of the optical fillet effect on device matching, strengthens the performance including read-write crosstalk of the pull-down transistor under the situation of the same area, and increases the read current.

Abstract: A semiconductor device including a FIFO circuit in which a data capacity can be increased while minimizing an increase in a circuit scale is provided. The semiconductor device includes a single-port type storage unit (11) which stores data, a flip-flop (12) which temporarily stores write data (FIFO input) or read data (FIFO output) of the storage unit (11), and a control unit (14, 40) which controls a write timing of a data signal, which is stored in the flip-flop (12), to the storage unit (11) or a read timing of the data signal from the storage unit to avoid an overlap between a write operation and a read operation in the storage unit (11).

Abstract: A low-power SRAM memory cell includes five word lines and four bit lines. The five word lines are a first word line, a second word line, a third word line, a fourth word line and a fifth word line. The four bit lines are a first bit line, a second bit line, a third bit line, and a fourth bit line. During the operation process of calculating a binary 10×11, the first word line is 1, the second word line is 0, the third word line is 0, the fourth word line is 1, the high bit stored in the bit cell is 1, and the low bit is 1. The voltage value of the fifth word line is 0.73 volt. At this time, the first bit line, the second bit line, and the third bit line do not discharge, while the fourth bit line discharges.

Abstract: A circuit cell for a memory device or a logic device comprises: (i) first and a second logic gates having respective output nodes; and (ii) first and second memory units, each comprising (a) first and second terminals and (b) a resistive memory element and a bipolar selector connected in series between the first and second terminals, wherein the first terminals of the first and second memory units are connected to the output nodes of the first and second logic gates, respectively, wherein the resistive memory elements are configured to be switchable between first and second resistance states, and wherein in response to a switching current and the bipolar selectors are configured to be conducting in response to an absolute value of a voltage difference across the bipolar selectors exceeding a threshold voltage of the bipolar selectors and non-conducting in response to the absolute value being lower than the threshold.

Abstract: Static Random Access Memory (SRAM) cells and memory structures are provided. An SRAM cell according to the present disclosure includes a first pull-up gate-all-around (GAA) transistor and a first pull-down GAA transistor coupled to form a first inverter, a second pull-up GAA transistor and a second pull-down GAA transistor coupled to form a second inverter, a first pass-gate GAA transistor coupled to an output of the first inverter and an input of the second inverter, a second pass-gate GAA transistor coupled to an output of the second inverter and an input of the first inverter; a first dielectric fin disposed between the first pull-up GAA transistor and the first pull-down GAA transistor, and a second dielectric fin disposed between the second pull-up GAA transistor and the second pull-down GAA transistor.

Abstract: In some embodiments, the present application provides a memory device. The memory device includes a chip that includes a magnetic random access memory (MRAM) cell. A magnetic-field-shielding structure at least partially surrounding the chip including a multilayer stack. The multilayer stack includes a magnetic layer and a dielectric layer. A first magnetic region is located inside an inner surface of the magnetic field shielding structure and a second magnetic region is located immediately outside an outer surface of the magnetic field shielding structure. A magnetic field in the first magnetic region is less than a magnetic field in the second magnetic region.

Abstract: Broadly speaking, embodiments of the present techniques provide apparatus and methods for generating a reference current for a memory array sensing scheme, and for using the generated reference current to sense the state of memory cells within the memory array. The generated reference current is particularly suitable for distinguishing between a high resistance state and a low resistance state.

Abstract: A storage system comprises a plurality of storage devices, with the storage devices comprising a first set of storage devices each having a first capacity and a second set of storage devices each having a second capacity higher than the first capacity. The storage system is further configured to establish an extended redundant array of independent disks (RAID) group to extend existing RAID stripes of the storage devices of the first set into the storage devices of the second set, and to establish an additional RAID group for the storage devices of the second set, the additional RAID group comprising one or more additional RAID stripes for the storage devices of the second set. The storage devices of the second set are illustratively added to the storage system to expand its capacity beyond that provided by the storage devices of the first set. Other embodiments include methods and computer program products.

Abstract: A method of operating an IC manufacturing system includes determining whether an n-type active region of a cell or a p-type active region of the cell is a first active region based on a timing critical path of the cell, positioning the first active region along a cell height direction in an IC layout diagram of a cell, the first active region having a first total number of fins extending in a direction perpendicular to the cell height direction. The method also includes positioning a second active region in the cell along the cell height direction, the second active region being the n-type or p-type opposite the n-type or p-type of the first active region and having a second total number of fins less than the first total number of fins and extending in the direction, and storing the IC layout diagram of the cell in a cell library.

Abstract: An integrated circuit is fabricated using a semiconductor fabrication process. One or more uncontrollable random physical processes in the semiconductor fabrication process can cause small differences between the integrated circuit and other similarly designed integrated circuit. These small differences can cause transistors of the integrated circuit to have different threshold voltages. The integrated circuit can use these different threshold voltages to quantify its physical uniqueness to differentiate itself from other integrated circuits similarly designed and fabricated by the semiconductor fabrication process.

Abstract: An integrated circuit includes a logic circuit and an amplifying circuit, in particular a low-noise amplifying circuit. The amplifying circuit includes at least one first transistor. The gate of the first transistor is coupled to a signal input terminal, the source region and the drain region of the first transistor are formed respectively in the well region of the first transistor on both sides of the gate, wherein the source region is coupled to a reference voltage terminal, and the sheet resistance of the source region is lower than that of the drain region. The logic circuit includes at least one second transistor. The sheet resistances of the source region and the drain region of the second transistor are equal.

Abstract: In an SRAM cell using vertical nanowire (VNW) FETs, transistors (PD1, PD2) constituting a drive transistor are placed on both sides of a transistor (PU1) in an X direction, and transistors (PD3, PD4) constituting a drive transistor are placed on both sides of a transistor (PU2) in the X direction. An access transistor (PG1) is placed on one-hand side in the X direction of the transistor (PU1), and an access transistor (PG2) is placed on the other-hand side in the X direction of the transistor (PU1).

Abstract: A server includes a data cache for storing data objects requested by mobile devices, desktop devices, and server devices, each of which may execute a different configuration of an application. When a cache miss occurs, the cache may begin loading portions of a requested data object from various data sources. Instead of waiting for the entire object to load to change the object state to “valid,” the cache may incrementally update the state through various levels of validity based on the calling application configurations. When a portion of the data object used by a mobile configuration is received, the object state can be upgraded to be valid for mobile devices while data for desktop and other devices continues to load, etc. The mobile portion of the data object can then be sent to the mobile devices without waiting for the rest of the data object to load.

Abstract: According to an aspect, a display device includes a plurality of sub-pixels arranged in a row direction and a column direction, and each including a memory block that has at least one memory configured to store sub-pixel data. The at least one memory includes: a first transistor including a first floating gate and configured to store the sub-pixel data based on an electric charge in the first floating gate; and a second transistor including a second floating gate electrically coupled to the first floating gate of the first transistor, one of a drain and a source of the second transistor being coupled to a power supply potential, the other of the drain and the source being coupled to a node. Each of the sub-pixels is configured to display an image based on a potential of the node.

Abstract: Apparatuses and techniques are described for periodically refreshing word line voltages in a group of blocks in a memory device. In one aspect, each group of blocks stores the same number of bits per cell. For example, one group of blocks can be reserved for single level cell (SLC) data and another group of blocks can be reserved for multi-level cell (MLC) data. A common refresh voltage signal can be applied to the blocks in a group, where the voltage signal is optimized based on the number of bits per cell stored by the memory cells of the group. For an SLC block, the refresh voltage signal can decrease a floating voltage of the word lines. For an MLC block, the refresh voltage signal can increase a floating voltage of the word lines.

Abstract: A network switch device is described. The network switch device includes a plurality of processor devices configured to perform different respective functions of the network switch device, a block of shared memory having a plurality of single port memory banks, and a memory controller configured to allocate respective sets of banks among the single port memory banks to processor devices among the plurality of processor devices, and determine respective configurations of the sets of memory banks as one of i) a single port configuration in which respective single port memory banks support a single read or write memory operation to a memory location in a memory access cycle, and ii) a virtual multi-port configuration in which respective single port memory banks support two or more concurrent read or write memory operations to a same memory location, based on memory access requirements of the corresponding processor device.

Abstract: A testing circuit for testing a multi-port random access memory includes an input circuit, a first port testing circuit and a second port testing circuit. The input circuit receives a testing clock signal and a test mode enable signal and is configured to provide the testing clock signal according to the test mode enable signal. The first port testing circuit is coupled to the input circuit, and is configured to output a first word line enable signal for a first port of the multi-port random access memory according to the testing clock signal and a first delay signal. The second port testing circuit is coupled to the input circuit, and is configured to output a second word line enable signal for a second port of the multi-port random access memory according to the testing clock signal and a second delay signal. The first word line enable signal and the second word line enable signal are asserted at the same time, and the first word line enable signal is de-asserted before the second word line enable signal.

Abstract: To improve a reliability of a semiconductor device, a memory cell array is formed in a product region of an SOI substrate, and a test cell array is formed in a scribe region of the SOI substrate. A plurality of regions is formed in each of the memory cell array and the test cell array. The plurality of regions formed in the test cell array is the same configuration as the plurality of regions formed in the memory cell array. A plurality of plugs is formed in the plurality of regions, respectively. Also, it can determine whether or not a leak path is occurred in the memory cell array, by inspecting whether or not a conduction between the plurality of plugs is confirmed.

Abstract: A semiconductor circuit according to the disclosure includes a first circuit that can generate an inverted voltage of a voltage at a first-node and apply the inverted voltage to a second-node, a second circuit that can generate an inverted voltage of the voltage at the second-node and apply the inverted voltage to the first-node, a first transistor coupling the first-node to the third-node by turning on, a first storage element having a first terminal coupled to the third-node and a second terminal supplied with a control voltage and being able to take a first or second resistance state, a first voltage setting circuit that is coupled to the third-node and can set a voltage at the third-node to a voltage corresponding to a voltage at a predetermined node out of the first and second nodes, and a driver controlling an operation of the first transistor and setting the control voltage.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate and a plurality of memory cells arranged in a cell array over the substrate. Each of the memory cells includes a latch circuit, a pass-gate transistor, and an isolation transistor. The latch circuit is formed by two cross-coupled inverters. The pass-gate transistor is coupled between an output terminal of the latch circuit and a bit line. The isolation transistor includes a drain and a gate, both coupled to the output terminal of the latch circuit, and a source that is floating. A first gate length of the isolation transistor is greater than a second gate length of the pass-gate transistor and a plurality of transistors within the latch circuit.