Abstract: A sensing circuit for serial dichotomic sensing of multiple-level memory cells which can take one programming level among a plurality of m=2.sup.n (n>=2) different programming levels, comprises biasing means for biasing a memory cell to be sensed in a predetermined condition, so that the memory cell sinks a cell current with a value belonging to a plurality of m distinct cell current values, each cell current value corresponding to one of the programming levels, a current comparator for comparing the cell current with a reference current generated by a variable reference current generator, and a successive approximation register supplied with an output signal of the current comparator and controlling the variable reference current generator.

Abstract: A memory contains a plurality of memory cells that are capable of storing one or more bits of data in each memory cell. The memory stores, in response to a write operation, data corresponding to the write operation in a first set of the memory cells such that each cell of the first set of the memory cells stores a single bit. Thereafter, data from the first set of memory cells are transferred to a second set of the memory cells such that each cell of the second set of the memory cells stores more than a single bit of data. The write operation to the first set of cells is executed in a foreground operation, and in a subsequent background operation, data from the first set of memory cells are transferred to the second set of memory cells. The memory cells are non-volatile flash electrically erasable programmable read only memory (EEPROM) cells, and therefore require erasure before programming. Typically, memory cells are reclaimed in a background operation.

Abstract: A data storage device consisting of at least two series connected resonant tunneling diodes (RTD1, RTD2) with capacitors (C1 ,C2) coupled thereacross. By coupling a time varying voltage V(t) across the series connected diodes, one the diodes can be selectively switched from a state below its peak current to a stable point above its peak current. The diode which switches state is controlled by the slope of the time varying voltage V(t). Cells consisting of at least two or more resonant tunneling diodes may be connected in series and can store up to 2.sup.N binary states where N is the number of resonant tunneling diodes in the cell.

Abstract: Provided between a control gate electrode and a channel region of the EEPROM memory cell is a capacitor. Formed on the channel region are a first gate dielectric layer of silicon oxide, a first carrier capture layer of silicon nitride, a carrier migration layer of n.sup.31 polysilicon, a second carrier capture layer of silicon nitride, and a second gate dielectric layer of silicon oxide. The carrier capture state of the carrier capture layer is changed to generate a polarization state in the capacitor, and the generated polarization state is held as data. The gate dielectric layer is not destroyed since the movement of carriers is limited to within the capacitor, and by adjusting the carrier bound energy, low-voltage drive can be accomplished.

Abstract: An improved multi-bit memory cell includes a storage capacitor and a switching element coupled to one of the terminals of the capacitor. The switching element includes a first switching component having a positive threshold, and a complementary switching component having a negative threshold. Because the switching element is constructed in this manner, noise generation caused by activation of the switching components is significantly reduced, and cut-off effects are eliminated. Both of these factors contribute to the memory cell's ability to store more bits of information than prior art memory cells.

Abstract: In a multi-level DRAM, one of multiple voltage levels may be stored in each memory cell. In a four-level system, each of a pair of bitlines is divided into two subbitlines which are connected to respective sense amplifiers. Dummy cells matching the storage cell are provided on each subbitline to balance the capacitances of the subbitlines. The stored voltage is dumped onto left and right subbitlines which are then isolated, and one of the voltages is then sensed to provide a sign bit. A second reference level is generated by dumping the charge associated with the sign bit over three subbitlines and the magnitude bit is sensed using that reference. The stored voltage is restored by charge sharing a sign bit charge on two bitlines with a magnitude bit charge on one bitline.

Abstract: An electrically alterable non-volatile memory having a memory cell array including a plurality of memory cells, each memory cell including a transistor having a selected one of a plurality of different threshold voltages; a reference cell array including at least one set of reference cells, each reference cell in the set being set to a different threshold voltage; selection circuitry for selecting one of the memory cells; and a comparing circuitry for comparing a memory current read out of the selected memory cell with each of reference currents read out of the reference cells, sequentially in an order of levels of the threshold voltages set for the reference cells, respectively, thereby outputting data according to such comparison.

Abstract: Multiple logic levels can be simultaneously programmed into any combination of memory cells in a column of an ETOX array by applying one of a corresponding number of programming voltages to the word lines that correspond with the cells to be programmed. In the present invention, the memory cells in the array form a punchthrough current during programming which, in turn, leads to the formation of an increased number of substrate hot electrons. By utilizing the substrate hot electrons formed from the punchthrough current in addition to the channel hot electrons, much lower control gate voltages can be utilized during programming.

Abstract: A multistate PROM and decompressor comprises a PROM array including a plurality of cells arranged to have a plurality of wordlines and a plurality of bitlines, where each cell is configured to have one of a plurality of threshold voltages (Vt0-Vtn). A Vt-detector is coupled to the PROM array and configured to receive a high voltage wordline (WLHV) signal that is ramped from a first voltage (e.g. 0V or ground) to a second voltage (e.g. Vtmax). The Vt-detector is configured to compare the WLHV signal to a plurality of predetermined thresholds and to output a detector word in response to the WLHV signal. An addressed memory cell is selected by a wordline select signal and a bitline select signal. A wordline selector is coupled to the PROM array and configured to receive the WLHV signal. The wordline selector communicates the WLHV signal to a selected wordline in response to the wordline select signal.

Abstract: A memory has a plurality of memory cells that each store a voltage signal indicative of a multiple bit signal. Each logic value of the multiple bit signal has a unique voltage range. The voltage ranges are unequal and are selected so that the decay of the voltage of the voltage signal in the range remains in the range for each level at a predetermined time. This memory provides logic levels so that the decay time of the voltage signal is greater for larger voltages of the voltage signal. The decay time in each logic level is almost equal. A voltage generator provides the voltage signal to the memory cells responsive to a multiple bit digital data signal. The voltage generator may include a digital-to-analog converter that provides the voltage signal and has at least one more bit than the multiple bit digital data signal. A memory stores a lookup table and provides another multiple bit data signal to the digital-to-analog converter responsive to the multiple bit digital data signal.

Abstract: Schemes for verifying the successful programming of a memory cell having more than two possible states are disclosed. Each program verify reference flash cell is set to have a V.sub.t that defines a boundary of a possible state for the selected flash cell. For a first embodiment, program verify reference flash cells are used in the place of read reference cells to perform a binary search read operation similar to a standard read operation for the memory device architecture. The data sensed by the write verify operation is compared to expected data. For a second embodiment, a single program verify reference flash cell is used to define a threshold voltage beyond which the floating gate of the selected flash cell must be programmed to pass the write verify operation. Thus, for the second embodiment, the program verify reference flash cell is used to verify the analog V.sub.

Abstract: In order to improve the degree of storage data integration, side walls (32) are selectively formed on side surfaces of word lines (22) to serve as masks for changing ON-state current values of memory cells by changing widths or lengths of active regions (24) of the memory cells, thereby forming several of types of memory cells having different electrical properties. Storage data per memory cell is therefore so multivalued that the number of memory cells is reduced.

Abstract: A data reading method in a semiconductor storage device capable of storing three- or multi-valued data in one memory cell, in which the state of each memory cell is classified into a plurality of sets to thereby detect what set the present storage state of the memory cell belongs to. That is, several kinds of voltage values are applied to each memory cell to detect whether a current flows in the memory cell or not in accordance with the magnitude of the voltage values to thereby judge the present storage state of each memory cell.

Abstract: Multiple logic levels can be programmed into a single EPROM or FLASH memory cell by applying one of a corresponding number of programming voltages to the control gate of a memory cell that has a forward-biased source-to-substrate junction and a reverse-biased drain-to-substrate junction. During programming, the bias conditions form substrate hot electrons which, in addition to the channel hot electrons, accumulate on the floating gate. By utilizing the substrate hot electrons, a much lower control gate voltage can be utilized during programming. More importantly, however, once the channel hot electrons cease to exist, the substrate hot electrons and holes converge to a stable charge that is related to the control gate voltage used during programming and the programmed threshold voltage of the cell.

Abstract: A method and apparatus for sensing the state of floating gate memory cells in a memory array. Because of its stability and accuracy, the sensing apparatus may be used for sensing the state of multi-bit floating gate memory cells. The state of a memory cell is sensed by applying a variable gate voltage to the top gate of the floating gate memory cell and comparing the cell current to a fixed reference current. A circuit detects when the cell current is equal to the reference current. When the currents are equal, the value of the variable gate voltage indicates the state of the memory cell. For one embodiment, an analog-to-digital converter converts the variable gate voltage to a digital value that is latched when the currents are equal. The latched digital value indicates the state of the memory cell. For this embodiment, a ramp voltage or other suitable variable voltage may be used as the variable gate voltage.

Abstract: A memory device is disclosed which includes memory cells having m possible states, where m is at least 2. The memory device includes a multiplexed pair of output paths, wherein each output path is coupled to sense the state of a memory cell and includes a read path circuit, a column load circuit, and a comparator. Provided between the pair of output paths is a switching circuit for coupling the comparators to one another in response to a control signal. For single-bit read operations, each output path senses and outputs the data of the associated memory cell, and the control signal is inactive. When the control signal is active, the read path circuit and column load circuit of one of the output paths is disabled and the switching circuit couples the other read path circuit to the second comparator such that the state of the memory cell is sensed by two comparators.

Abstract: Multiple logic levels can be programmed into a single EPROM or FLASH memory cell by applying one of a corresponding number of programming voltages to the control gate of a memory cell that is biased so that the source-to-substrate junction becomes forward-biased and the drain-to-substrate junction becomes reverse-biased. During programming, the bias conditions form substrate hot electrons which, in addition to the channel hot electrons, accumulate on the floating gate. By utilizing the substrate hot electrons, a much lower control gate voltage can be utilized during programming. More importantly, however, once the channel hot electrons cease to exist, the substrate hot electrons and holes converge to a stable charge that is related to the control gate voltage used during programming and the programmed threshold voltage of the cell.

Abstract: A read/write/restore circuit is disclosed for use in a memory array such as a static RAM array. The circuit employs data and data-complement signals having three states in combination with a two-state address signal to perform read, write and restore functions for the array, to reduce the number of components and control lines needed. The circuit is preferably implemented in BICMOS technology.

Abstract: A semiconductor memory device according to the present invention comprises a number of memory cells that store multiple voltage levels. Each voltage level is uniquely assigned to a different logic level. Multiple binary codes are converted to various analog voltage levels by a digital to analog converter. The memory cell of the invention comprises a storage capacitor and transfer gates, each terminal of which is connected to a bit line through the transfer gate for isolating the storage capacitor from the interference of other circuits while it is not accessed. In the writing cycle, analog voltage can be stored in the storage capacitor of each cell by applying the assigned analog voltage generated by the digital to analog converter through, bit lines and the transfer gates that control the conductivity between the bit lines and storage capacitor.

Abstract: A semiconductor memory includes memory cells, word lines, bit lines, a row decoder, column decoder, a voltage-changing circuit, a sense amplifier, and an output circuit. Each memory cell stores multi-level data. The row decoder selects one of the word lines in accordance with an address signal. The voltage-changing circuit generates different voltages, which are applied to the row decoder. The different voltages are sequentially applied from the voltage-changing circuit to the word line selected by the row decoder. The column decoder selects a bit line every time the potential of the word line changes. The sense amplifier detects the data read from the memory cell onto the bit line every time the potential of the word line changes. The output circuit converts the data to code data.

Abstract: A memory apparatus using conventional DRAMs which uses a ternary representation of stored data. Each DRAM memory cell can thus store three states. The ternary storage memory apparatus includes a binary to ternary converter which receives a first number of binary bits of data during a write operation and generates a second lesser number of data values or voltages using a ternary representation. A second number of memory storage elements are coupled to the binary to ternary converter and store the respective voltage using the above ternary representation. During reads, a ternary to binary converter reads the voltages stored in the memory elements and converts these voltages into the original first number of binary bits that were originally written into the memory storage elements. This allows the use of existing DRAM while considerably increasing the DRAM's memory storage density.

Abstract: A non-volatile semiconductor memory device capable of selectively storing one of at least three different data comprises a memory array including a plurality of memory cells, each having a control gate, a floating gate, a drain, and a source, a circuit for producing a stepped voltage whose level is varied stepwise to a number of different levels corresponding to a number of data to be stored, a circuit for producing a pulse voltage having a predetermined voltage level and a predetermined pulse width, and a circuit for selecting one of the plurality of memory cells, wherein during storing of the at least three different data the stepped voltage and the pulse voltage are applied to the control gate and the drain of the selected memory cell, respectively, while a timing of application of the pulse voltage to the drain is controlled relative to a timing of application of the stepped voltage to the control gate, depending on which of the at least three different data is to be stored into the selected memory cell.

Abstract: A method and circuit programs and automatically verifies the programming of selected EEPROM cells without alternating between programming and reading modes like prior art methods and circuitry. The circuitry includes a programming circuit and a bit line voltage regulation circuit. The programming circuit further includes a novel sense amplifier which unlike prior art sense amplifiers, is operable during both cell reading and programming modes. Included in the sense amplifier are two current providing circuits. A first circuit provides current to a selected EEPROM cell which is sufficient for reading the programmed state of the cell, and a second circuit which automatically provides additional current when required, for programming the cell. The sense amplifier detects when programming of a selected EEPROM cell has completed and causes programming of that cell to be terminated. The voltage regulation circuitry regulates the bit line voltage to the selected EEPROM cell's drain electrode.

Abstract: A method of using a non-volatile semiconductor memory comprising a plurality of row and column lines, a plurality of memory cells disposed at intersections of the row and column lines and a plurality of reference cells disposed on each of the row lines. Each memory cell includes an MOS transistor having a substrate, a spaced-apart drain and source formed on one surface of the substrate, a channel region between the drain and source and a lamination of a tunnel insulating film, a floating gate, an interlayer insulating film and a control gate formed in that order on the channel region.

Abstract: An electrically erasable non-volatile semiconductor memory device comprising a plurality of row lines and column lines, a plurality of memory cells connected in a matrix to the plurality of row lines and column lines, a selection circuit for selecting a desired one of the plurality of memory cells, and write-control circuit for writing data into the plurality of memory cells. The write-control circuit is adapted to preset at least four voltage signals having different voltage values, and to select one of four voltage signals according to a data signal externally applied thereto and applying the selected voltage signal to the selected memory cell. Also included is read-control circuit for reading out data written into the selected memory cell and converting the data read-out from the selected memory cell into a data signal corresponding to one of the four voltage signals.

Abstract: The bit storage density of an Electrically Alterable Non-Volatile Memory (EANVM) cell is improved by increasing the number of bits that are stored on an individual memory cell, without increasing the size and complexity of the memory cell, by allowing a non-volatile memory cell to assume 2 n discrete memory states. A multi-bit memory cell uses a floating gate FET which is electrically programmed to 2 n different thresholds. The 2 n different conductivity states of the FET are provided as information storage states for the cell.

Abstract: A static random access memory provides interconnection of local wordlines and bit lines to share charge during bulk write operations. Prior to a bulk write cycle, a bit line for each memory cell is driven to a first voltage level. Subsequently, the bit lines and the local wordlines are interconnected for sharing charge between the bit lines and the local wordlines. Next, the bit lines are disconnected from the local wordlines and the bit lines are driven to a second voltage level while the local wordlines are driven to the first voltage level to address the memory cells. Then the bit lines and local wordlines are reconnected to distribute charge from the local wordlines to the bit lines. Lastly, the bit lines are again disconnected from the local wordlines and driven to the first voltage level preparatory to resuming normal operation.

Abstract: A dynamic random access memory device is equipped with an output data buffer circuit for driving an output data pin, and the output data buffer circuit comprises an output inverter coupled with the data pin, a driving unit responsive to a data bit on a data line pair in the absence of a high-impedance control signal for controlling the output inverter, the driving unit being further operative to cause the output inverter to enter high-impedance state in the presence of the high-impedance control signal, and a switching transistor coupled between the data pin and a constant voltage source and responsive to a preceding signal for coupling the output data pin with the constant voltage source, wherein the high-impedance control signal and the preceding signal are supplied to the output data buffer circuit before reaching the data bit thereto so that power voltage lines are prevented from voltage fluctuation without sacrifice of switching speed.

Abstract: A memory device comprises a memory cell array including a plurality of memory cells for storing n-valued data, an unit for converting a binary logic data applied thereto into an n-valued logic data when the binary logic data is written into the memory cell array, and an unit for converting an n-valued logic data into a binary logic data when the n-valued logic data is read out from the memory cell array.

Abstract: A method of processing data having one of four voltage levels stored in a DRAM cell is comprised of sensing whether or not the data voltage is above or below a voltage level midway between a highest and a lowest of the four levels, setting the voltage on a reference line higher than the lowest and lower than the next highest of the four levels in the event the data voltage is below the midway voltage level, and setting the voltage on the reference line higher than the second highest and lower than the highest of the four levels in the event the data voltage is above the midway point, and sensing whether the data voltage is higher or lower than the reference line, whereby which of the four levels the data occupies is read.

Abstract: A number of resonant tunneling diodes are connected in series with a resistor, a current source or a load device. A bit line is connected to every joint between any two devices through a switch. When properly biased, there can be (N+1).sup.m number of stable quantized operating points which are represented by a combination of m variables (of either voltage or current, where N is the number of peaks of the folding I-V characteristic and m is the number of bit lines. The m bit lines can write in (N+1).sup.m different combinations of inputs. During reading, the quantized voltage (or current) at each bit line is sensed. The number of stable states can be doubled by changing the polarity of the power supply.

Abstract: A method of driving a device having a pair of electrodes and organic insulating layer sandwiched therebetween. The device exhibits at least three states of different electroconductivities in response to an applied voltage. A transition from the first state to the second state is achieved by applying a voltage within a first predetermined range to the device in the first state, and a transition from the second state to the third state is achieved by applying a voltage within a second predetermined range to the device in the second state.

Abstract: A memory cell for multi-valued logic utilizing bidirectional folding V-I characteristics. Two devices with bidirectional multiple folding characteristics, such as the V-I characteristics of resonant tunneling diodes, are connected in series across a power supply. Multiple stable operating points are established where the positive resistance portions the folding characteristics interesect and can be used to store multiple levels of signal. With bidirectional folding characteristics, the number of operating points can be doubled by using both a positive power supply and a negative power supply. The signal can be written in and read out at the connecting point of the two devices.

Abstract: The input data comprising binary data to be stored are converted into multi-state data. A voltage of a level based on the converted multi-state data is applied to a source region to perform write operation to a memory transistor. As a result, the threshold voltage of the transistor is set to a value corresponding to the potential of the source region. In read operation a drain current generated in the memory transistor is detected and the multi-state data corresponding to the current are obtained. These multi-state data are converted into binary data to be outputted as output data.

Abstract: A multivalued Arithmetic Logic Unit (ALU) is composed of a multivalued signal source, a memory array, a selection array, an AND array and an output circuit. The multivalued signal source generates signals each of which represents a logic value of multivalued logic. The memory array is provided with an address line group for each and every function to be inplemented, each address line group comprising a number of address lines. Which multivalued logic signals will appear on the address lines of each address line group depends upon a program based on the truth table of the corresponding function. Any one of the plural address line groups is selected by the selection array, to which a signal designating the function to be implemented is applied. One address line in the selected address line group is selected by the AND array, which has an input signal applied thereto, and the logic value signal on the selected line is delivered via the output circuit.

Abstract: Source follower storage cell and improved method and apparatus for iterative write for integrated circuit analog recording and playback which provides increased resolution in the stored signal and increased accuracy and stability of the storage and readout capabilities of the device. The storage cell is configured wherein the electrically alterable MOS storage device is connected in a source follower configuration, which provides a one to one relationship between the variation in the floating gate storage charge and the variation in the output voltage, and for high load resistance, relative insensitivity to load characteristics. The write process and circuitry provides a multi iterative programming technique wherein a series of coarse pulses program a cell to the approximate desired value, with a series of fine pulses referenced to the last coarse pulse being used for programming the respective cell in fine increments to a desired final programming level. Still finer levels of programming can be used.

Abstract: A CMOS off-chip driver circuit is provided which includes a P-channel pull up transistor and an N-channel pull down transistor serially arranged between a first voltage source having a supply voltage of a given magnitude and ground with the common point between the transistors forming an output terminal to which is connected a circuit including a second voltage source having a supply voltage of a magnitude significantly greater than that of the given magnitude. A first P-channel field effect transistor is connected between the output terminal and the gate electrode of the pull up transistor.

Abstract: A memory cell for multi-value logic. Two devices with multiple peak folding characteristics, such as the V-I characteristics of resonant tunneling diodes, are connected in series across a power supply. Multiple stable operating points are established where the positive resistance portions of the respective folding voltage-current characteristics intersect and correspond to multiple quantized levels for storing information, creating a multi-valued memory cell.

Abstract: A method and apparatus for performing data error detection and correction is disclosed for multi-level logic and in particular, three-level trinary logic of levels 0, 1, 2. A source of trinary data supplies individual pieces of data (trits of 0, or 1, or 2) in multiple trit groups (trytes) to two separate check trit generators which generate unique check trits for each tryte input. The check trits from the two check trit generators are compared to form syndrome trits which are used to control an error detection function. For single errors per tryte a data correction function is activated to increment or decrement the incorrect data through a multiplexer. Multiple errors or no error conditions are indicated, but do not gate the data correction function.

Abstract: A nonvolatile memory system for one of a multiple of values includes a memory cell having an input terminal, an output terminal, and a control terminal. The memory cell, which may be an EEPROM, stores nonvolatile electric charge, and establishes a voltage threshold between the input terminal and the output terminal which influences a current therebetween, the threshold having a level which is dependent upon the amount of the electric charge stored by the storing means. A writing circuit is connected to the input terminal and is responsive to an input data signal having a value selected from among at least three values for applying electric charge, in an amount corresponding to the value of the selected data signal, to the input terminal for storage in the memory cell. A reading circuit is provided to measure the value of the voltage threshold between the input and output terminals and to output a data signal having a value which corresponds to the measured value of the threshold voltage.

Abstract: An associative memory system and system comprising an M by N array of memory cells forming M words of N trit length are disclosed having single word alterability. Each memory cell further comprises first and second nonvolatile storage devices without the need for additional switching devices. Generally, complementary data is stored in the two storage devices and the cell is interrogated by applying complementary data to the storage devices. A match or mismatch is achieved by looking for current through either of the storage devices. Preferably, the storage devices are one of two types of flash EEPROM transistors, or a SONOS transistor. Each transistor has a gate, drain and source and has write and rewrite capabilities that allows single word alterability in the memory array to be accomplished by applying a high voltage to the transistor drain, or by applying a combination of voltages to the drain and gate.

Abstract: A memory system made up of electrically programmable read only memory (EPROM) or flash electrically erasable and programmable read only memory (EEPROM) cells. An intelligent programming technique allows each memory cell to store more than the usual one bit of information. An intelligent erase algorithm prolongs the useful life of the memory cells. Use of these various features provides a memory having a very high storage density and a long life, making it particularly useful as a solid state memory in place of magnetic disk storage devices in computer systems.

Abstract: A non-volatile memory cell includes a MOS transistor of double gate construction. The MOS memory transistor includes a floating gate structure which includes electrically separated first and second segmented floating gates (4a; 4b). For the purpose of writing data, electrons are independently injected into the first and second segmented floating gates. Data are stored in the MOS memory transistor in three different non-volatile storage levels; one with electron accumulated either one of the two segmented floating gates; another with electrons injected into both of the segmented floating gates; and still another with no electrons accumulated on both of the segmented floating gates.

Abstract: The disclosure concerns electrically programmable memories and, notably, the memories known as EPROMs, EEPROMs, FLASH-EEPROMs. To increase the information storage capacity of a memory, it is proposed to define at least three (instead of two) sections of current coming from a cell to which reading voltages are applied. These sections correspond to n possible programmed states of the cell. Comparators define a piece of information stored, for example, in two-bit form on the outputs S1, S2. However, to ensure safety during the reading despite programming uncertainties, the cell is tested by means of additional comparators and, if the cell current measured for a programming level defined among n levels is too close to the current threshold that defines the programming threshold at this level, an operation for complementary programming of the cell is triggered.

Abstract: A logic gate including a resonant-tunneling transistor and a resistor connected in series thereto. The resonant-tunneling transistor has a superlattice structure. The resonant-tunneling transistor may be a resonant-tunneling hot electron transistor or a resonant-tunneling bipolar transistor. The resonant-tunneling transistor conducts a current between a collector and an emitter. The current has one of at least three different current values in response to a base voltage of one of three different voltage values. The third current value is between the first and second current values, and a second voltage value is between the first and third voltage values. The logic gate outputs one of at least three states, a high state, a low state and a state approximately between the high and low states in response to a signal applied to the logic gate. The signal has an amplitude of one of the first to third voltage values. A logic circuit includes at least three connected resonant-tunneling transistors.

Abstract: A multivalued ALU is composed of a multivalued signal source, a memory array, a selection array, an AND array and an output circuit. The multivalued signal source generates signals each of which represents a logic value of multivalued logic. The memory array is provided with an address line group for each and every function to be implemented, each address line group comprising a number of address lines. Which multivalued logic signals will appear on the address lines of each address line group depends upon a program based on the truth table of the corresponding function. Any one of the plural address line groups is selected by the selection array, to which a signal designating the function to be implemented is applied. One address line in the selected address line group is selected by the AND array, which has an input signal applied thereto, and the logic value signal on the selected line is delivered via the output circuit.

Abstract: A semiconductor memory device includes an input circuit and an output circuit. To prevent the erroneous operation of the input circuit by the noise which develops at the time of the change of the output signal of the output circuit, the threshold voltage of the input circuit is changed, or an internal signal generated by the internal circuit is fixed to a predetermined level. In an output circuit having a tri-state output function, the threshold voltage of the input circuit is changed when the output is brought into the high impedance state, or the internal signal generated by the input circuit is fixed to a predetermined state. Using these arrangements it is possible to prevent the erroneous operation of the input circuit by the noise occurring when the output is brought into the high impedance state.

Abstract: For precise read-out operation at an improved speed, there is disclosed a semiconductor memory device fabricated on a semiconductor substrate of a first conductivity type and including a plurality of memory cells, each memory cell comprising (a) an insulating film covering a surface portion of the semiconductor substrate, (b) a gate electrode formed on the insulating film and located over a channel forming region in the surface portion of the semiconductor substrate, a channel being produced in the channel forming region when the memory cell is selected, (c) a first impurity region having a second conductivity type opposite to the first conductivity type and formed in the surface portion of the semiconductor substrate, the first impurity region being contiguous to the channel forming region or spaced apart from the channel forming region depending upon a bit of information stored therein, and (d) a second impurity region of the second conductivity type formed in the surface portion of the semiconductor substr

Abstract: A ROM device includes a plurality of memory cells each storing one of three states, a cell voltage generating circuit for providing a cell voltage corresponding to the state stored in a selected one of the memory cells, and a reference cell for providing a reference voltage which is substantially the same as the cell voltage provided by a memory cell storing an intermediate state of the three states. The ROM also includes a comparator circuit for generating a logical output signal based on the result of a comparison between the cell voltage and the reference voltage.

Abstract: A read only memory device including: a memory cell array having a plurality of memory cells each storing one of three states; selection means, connected to the memory cell array, for selecting a pair of the memory cells from the memory cell array simultaneously in accordance with an address signal; a first sense amplifier, operatively connected to one of the pair of the memory cells, for producing a three bit output corresponding to the state stored in the one of the pair of the memory cells selected by the selection means; and a second sense amplifier, operatively connected another of the pair of memory cells, for producing a three bit output corresponding to the state stored in the another of the pair of the memory cells selected by the selection means.