Abstract: A buffer control circuit of a memory device has an auto-refresh buffer controller configured to detect a data training operation in an auto-refresh mode and a controller configured to enable an input buffer in response to an enable signal generated in the data training operation by the auto-refresh buffer controller.

Abstract: The invention relates generally to a multi-chip package (MCP) memory device, and more particularly, but without limitation, to a MCP memory device having a reduced size. In one embodiment, the MCP memory device includes: a transfer memory chip; and a plurality of memory chips coupled to the transfer memory chip, each of the plurality of memory chips including an internal voltage generating circuit, the transfer memory chip configured to receive a plurality of command signals from outside the MCP memory device, the transfer memory chip further configured to output a plurality of control signals to the plurality of memory chips based on the plurality of command signals. Embodiments of the invention also relate to a method of controlling an internal voltage of the MCP memory device.

Abstract: In one embodiment, a programmable logic device includes a plurality of logic blocks; a plurality of input/output blocks; volatile configuration memory adapted to store configuration data for configuration of the logic blocks and input/output blocks; embedded block RAM adapted to store user data; flash memory having at least a first partition and a second partition; and a data port adapted to provide external device access to the first partition of the non-volatile memory. The flash memory is adapted to store within the first partition user data from the data port and is further adapted to store within the second partition user data from the embedded block RAM.

Abstract: There are provided methods and devices for providing overdrive voltages to address lines to help prevent leakage current in semiconductor memories, such as configuration memories used with programmable logic devices. Specifically, for example, there is provided a memory that includes an array of memory cells. Each memory cell includes a retainer circuit. An access transistor is coupled to the retainer circuit. An overdrive voltage level may be applied to the access transistor.

Abstract: A nonvolatile semiconductor memory device transmits/receives data to/from a data input/output terminal every j bits (e.g., eight bits). Each of memory cells in a memory cell array can hold data of n bits in correspondence to 2n threshold levels. A write data conversion circuit generates write data from bit data input from the same data input/output terminal in a set of a plurality of data of j bits input at different timings.

Abstract: A semiconductor memory device having a plurality of cell blocks includes: a block decoding unit configured to decode an input address for selecting a corresponding cell block to generate a block selection signal; a block information address generating unit configured to perform a logic operation on the block selection signal and an assignment address for selecting a word line to be activated within the corresponding cell block to generate a block information address activated only when the corresponding cell block is selected; and a word line driving unit configured to select a word line in response to the block information address.

Abstract: A dynamic random access memory (DRAM) device having memory cells is operated in a self-refresh mode and a normal mode. A mode detector provides a self-refresh mode signal in the self-refresh mode of operation. It includes a free-running oscillator for generating an oscillation signal independent of the self-refresh mode signal. In response to the oscillation signal, a self-request controller provides a self-refresh request signal in the self-refresh mode. The self-refresh signal is asynchoronized with the self-fresh mode signal and is provided to an address circuit to select a wordline for refreshing the memory cells thereof. The self-refresh request controller includes logic circuitry for arbitrating timing between initial active edges of the oscillation signal and the self-refresh mode signal and providing the self-refresh request and ceasing it, regardless of conflict between the self-refresh mode signal and the oscillation signal upon self-refresh mode entry and exit.

Abstract: A charge driving circuit and a discharge driving circuit occupy a relatively small area and maintain driving force in a semiconductor memory device having a plurality of banks. The semiconductor memory device includes multiple banks, a common discharge level detector configured to detect a voltage level of internal voltage terminals on the basis of a first target level in response to active signals corresponding to the respective banks, and a discharge drivers assigned to the respective banks. The discharge drivers are configured to drive the internal voltage terminals to be discharged in response to the respective active signals and respective discharge control signals outputted from the common discharge level detector.

Abstract: A clock-generating circuit for forming internal clock signals by comparing a signal obtained by delaying, through a variable delay circuit, an input clock signal input through an external terminal with the input clock signal through a phase comparator circuit, and so controlling the delay time of the variable delay circuit that they are brought into agreement with each other, wherein the clock-generating circuit and an internal circuit to be operated by the clock signals formed thereby are formed on a common semiconductor substrate, and an element-forming region in which the clock-generating circuit is formed is electrically isolated from an element-forming region in which the digital circuit is constituted on the semiconductor substrate relying upon the element-isolation technology. The power-source passages, too, are formed independently of other digital circuits.

Abstract: Various embodiments are generally directed to a method and apparatus for carrying out a pipeline sensing operation. In some embodiments, a read voltage from a first memory cell is stored in a voltage storage element (VSE) and compared to a reference voltage to identify a corresponding memory state of the first memory cell while a second read voltage from a second memory cell is stored in a second VSE. In other embodiments, bias currents are simultaneously applied to a first set of memory cells from the array while read voltages generated thereby are stored in a corresponding first set of VSEs. The read voltages are sequentially compared with at least one reference value to serially output a logical sequence corresponding to the memory states of the first set of memory cells while read voltages are stored for a second set of memory cells in a second set of VSEs.

Abstract: The example embodiments provide a data output buffer circuit which includes a pre-driver configured to adjust a slew rate of an input signal, a main driver configured to output signal supplied from the pre-driver, and a ZQ calibration circuit configured to control the pre-driver so as to decrease the slew rate when an operation voltage increases, and increase the slew rate when the operation voltage is decreased.

Abstract: A fuse monitoring circuit for a semiconductor memory device includes a fuse repair unit including a plurality of fuses each programmed with at least one repair address, configured to receive a fuse reset signal and to output a plurality of fuse state signals each corresponding to a connection state of one of the fuses, a fuse monitoring unit configured to receive a monitoring enable signal and to output a plurality of fuse state monitoring signals each corresponding to a corresponding one of the fuse state signals, each of the fuse state signals corresponding to one of a plurality of addresses, and an output unit configured to receive an output control signal and to output the fuse state monitoring signals to an output pad.

Abstract: Apparatus, systems, and methods are disclosed that operate to encode register bits to generate encoded bits such that, for pairs of addresses, an encoded bit to be coupled to a first address in a memory device may be exchanged with an encoded bit to be coupled to a second address in the memory device. Apparatus, systems, and methods are disclosed that operate to invert encoded bits in logic circuits in the memory device if original bits were inverted. Additional apparatus, systems, and methods are disclosed.

Abstract: In an embodiment, an integrated circuit having a memory cell arrangement is provided. The memory cell arrangement may include a plurality of multiple bit information storing memory cells, a plurality of buffer circuits, each buffer circuit being coupled to at least one multiple bit information storing memory cell of the plurality of multiple bit information storing memory cells, and a controller configured to control an access operation to access at least one multiple bit information storing memory cell using the buffer circuit coupled to the at least one multiple bit information storing memory cell to be accessed, and a buffer circuit of at least one other multiple bit information storing memory cell being coupled to at least one other multiple bit information storing memory cell.

Abstract: A processor-based system includes a processor coupled to core logic through a processor bus. This includes a dynamic random access memory (“DRAM”) memory buffer controller. The DRAM memory buffer controller is coupled through a memory bus to a plurality of a dynamic random access memory (“DRAM”) modules and a flash memory module, which are at the same hierarchical level from the processor. Each of the DRAM modules includes a memory buffer to the memory bus and to a plurality of dynamic random access memory devices. The flash memory module includes a flash memory buffer coupled to the memory bus and to at least one flash memory device. The flash memory buffer includes a DRAM-to-flash memory converter operable to convert the DRAM memory requests to flash memory requests, which are then applied to the flash memory device.

Abstract: Systems and methods for reducing delays between successive write and read accesses in multi-bank memory devices are provided. Computer circuits modify the relative timing between addresses and data of write accesses, reducing delays between successive write and read accesses. Memory devices that interface with these computer circuits use posted write accesses to effectively return the modified relative timing to its original timing before processing the write access.

Abstract: A memory module having a high data processing rate and high capacity is provided. The memory module may include a memory chip, a controller controlling an operation of the memory chip, an optical detector converting an external input signal into an internal input signal to transmit the converted signal to the controller, and an optical generator converting an internal output signal received from the controller into an external output signal. The optical detector converts an external input optical signal into an internal input signal to transmit the converted signal to the controller. The optical generator converts an internal output signal received from the controller into an external output optical signal.

Abstract: An integrated circuit and a design structure are disclosed. An integrated circuit may comprise: a data retaining device; a charge storing device coupled to the data retaining device such that a use of the data retaining device triggers a charging of the charge storing device by a charge source; and means for measuring a potential of the charge storing device, the measuring means being communicatively coupled to a calculating mean which determines a relative amount of usage of the data retaining device based on the measured potential.

Abstract: An input/output interface reads data from and writes data to a DDR memory. The interface includes data and strobe circuits. The strobe circuit includes preamble logic, a first counter operating with a strobe clock, a second counter operating with an ASIC-generated clock, a strobe park circuit and a first synchronizer. The preamble logic receives strobe signals from the DDR memory and generates a preamble signal. The first counter generates a first input of the strobe park circuit. The second counter generates a second input of the strobe park circuit. The strobe park circuit controllably replaces the strobe signals from the DDR memory with respective non-transitioning signals when data is not being read. The data circuit includes a FIFO buffer and a second synchronizer. The FIFO buffer receives data with the strobe clock. The second synchronizer generates a representation of the data in response to the ASIC-generated clock.

Abstract: A nonvolatile semiconductor storage device includes: a first wire and a second wire intersecting each other; a memory cell which is disposed at each intersection of the first wire and the second wire and electrically rewritable and in which a variable resistor for memorizing a resistance value as data in a nonvolatile manner and a rectifying device are connected in series; and a control circuit which applies a voltage necessary for writing of data to the first and second wires.

Abstract: A dynamic random access memory (DRAM) device having memory cells is operated in a self-refresh mode and a normal mode. A mode detector provides a self-refresh mode signal in the self-refresh mode of operation. It includes a free-running oscillator for generating an oscillation signal independent of the self-refresh mode signal. In response to the oscillation signal, a self-request controller provides a self-refresh request signal in the self-refresh mode. The self-refresh signal is asynchoronized with the self-fresh mode signal and is provided to an address circuit to select a wordline for refreshing the memory cells thereof. The self-refresh request controller includes logic circuitry for arbitrating timing between initial active edges of the oscillation signal and the self-refresh mode signal and providing the self-refresh request and ceasing it, regardless of conflict between the self-refresh mode signal and the oscillation signal upon self-refresh mode entry and exit.

Abstract: A nonvolatile memory device includes a first plane and a second plane, an address decoder configured to decode an externally input address and to output a first plane select signal and a second plane select signal for enabling any one of the first and second planes, a controller configured to output a first plane hold signal and a second plane hold signal for disabling any one of the first and second planes depending on program states of the first plane and the second plane, a first plane control unit configured to enable the first plane in response to a first plane select signal and the first plane hold signal, and a second plane control unit configured to enable the second plane in response to a second plane select signal and the second plane hold signal.

Abstract: A sense amplifier includes a first sensing element and a second sensing element redundant to the first sensing element. The sense amplifier further comprises a switch circuit configured to switch between the first and second sensing elements when an offset of the sense amplifier is greater than a prescribed amount.

Abstract: To provide a latency counter capable of increasing the signal quality of outputted internal commands. There is provided a point-shift FIFO circuit controlled by count values of a counter circuit. The point-shift FIFO circuit includes: a first wired-OR circuit that combines outputs of first latch circuits; a second wired-OR circuit that combines outputs of second latch circuits; a gate circuit that combines outputs of the first and second wired-OR circuits; and reset circuits that reset the first and second wired-OR circuits, respectively, based on the count value of the counter circuit. According to the present invention, as compared to a case that outputs of all the latch circuits are wired-OR connected, output loads are more reduced. Thus, a high signal quality can be obtained.

Abstract: In the storage device of the invention, latch control is performed on a series of signals in response to latch control signals. Latch control terminals are provided to which the latch control signals are input respectively and a plurality of signal terminals to which a series of signals are input. Herein, a plurality of latch circuits is provided so as to correspond to the plurality of signal terminals, respectively. The plurality of latch circuits are located within a specified distance from their associated signal terminals respectively and within a specified distance from the latch control terminals. The delays of signal transmission from the signal terminals to their associated latch circuits can be equalized and the delays of signal transmission from the latch control terminals to which the latch control signals for executing latch control are input to the latch circuits can be equalized. This contributes to a reduction in the skew of the latch characteristics of the signals.

Abstract: An apparatus for controlling an activation of semiconductor integrated circuit includes: an active control unit configured to generate active control signal for determining activation of banks; and a plurality of active signal generating units configured to input the active control signal commonly, and generate active signals for activating the banks to according to the active control signal. According to this structure, it is possible to reduce current consumption to a minimum in a refresh mode, to easily arrange signal lines, and thus to effectively use extra space.

Abstract: A read operation method is provided for a flash memory array having a plurality of memory cells, wordlines, even bitlines, odd bitlines and a plurality of bitline transistors. The method includes pre-charging the plurality of even bitlines to about Vcc/n and pre-charging the plurality of odd bitlines to ground. The current flowing to/from a first bit location in each of the memory cells is selectively sensed. A logical state is determined from the sensed current for the first bit location in each of the memory cells. The method also includes pre-charging the plurality of odd bitlines to about Vcc/n and pre-charging the plurality of even bitlines to ground. The current flowing to/from a second bit location in each of the memory cells is selectively sensed. A logical state is determined from the sensed current for the second bit location in each of the memory cells.

Abstract: A semiconductor memory device includes a thermosensor that senses present temperatures of the device and confirms whether the temperature values are valid. The thermosensor includes a temperature sensing unit, a storage unit and an initializing unit. The temperature sensing unit senses temperatures in response to a driving signal. The storage unit stores output signals of the temperature sensing unit and outputs temperature values. The initializing unit initializes the storage unit after a predetermined time from an activation of the driving signal. A driving method includes driving the thermosensor in response to the driving signal, requesting a re-driving after a predetermined time from the activation of the driving signal, and re-driving the thermosensor in response to the driving signal input again.

Abstract: A semiconductor memory device performs a refresh operation stably even while a temperature continuously changes at near a specific temperature. The semiconductor memory device includes an on die thermal sensor (ODTS) and a control signal generator. The on die thermal sensor (ODTS) outputs a thermal code corresponding to a temperature of the semiconductor memory device. The control signal generator generates a self refresh control signal in response to the thermal code, wherein a state of the self refresh control signal does not change when the temperature variation is less than a predetermined value.

Abstract: An input buffer having a comparator that receives an input signal, a reference signal and a positive feedback. The comparator compares the input signal relative to the reference signal and generates an output signal transitioning between a first logic state and a second logic state responsive to the magnitude of the input signal transitioning through the magnitude of the reference signal. The comparator intensifies the output signal in response to the positive feedback from the output of the comparator while the output signal transitions from the first logic state to the second logic state.

Abstract: An integrated circuit includes a plurality of tiles. One tile is a master tile. Other tiles contain writable registers of memory structures. Information for configuring circuitry of the tile is stored in the register in the tile. An individual one of the registers can be written via the master tile. Each memory structure of a register includes a non-volatile floating gate cell (that stores the configuration information) as well as a volatile cell. All transistors have the same gate insulator thickness. Although a programming pulse signal is applied to all memory structures, the state of the non-volatile cell of a memory structure is only changed if the state stored by the associated non-volatile cell differs from the state stored by the volatile cell. Floating gates are automatically refreshed by the programming pulse signal. By storing configuration information in each tile, inefficiencies associated with using blocks of non-volatile memory are avoided.

Abstract: In a multi-bank memory system such as a synchronous dynamic random access memory (SDRAM), a method of writing data to the banks is provided. This method allows for writing to any number of banks. More particularly, this method allows for writing to a selected number of banks between one and all banks. In addition, the method retains the discrete nature of the selected banks by allowing any row in each bank to be accessed regardless of the rows activated in other banks. As a result, rows of different memory banks that are intended to store similar data may be accessed simultaneously for purposes of writing the data in test and non-test modes. This allows for quicker writing to the SDRAM without the errors that may be created by other fast writing modes, such as data compression.

Abstract: A semiconductor memory device includes a preliminary signal generator configured to output a preliminary pipe-in signal enabled when a read command is applied. A delay unit is configured to delay the preliminary pipe-in signal and output the delayed preliminary pipe-in signal to match the timing of output data. A pipe-in signal generator generates a pipe-in signals that are enabled between a predetermined enable point and a next enable point of the delayed preliminary pipe-in signal output.

Abstract: A memory includes a selection circuit and a write assist circuit. The selection circuit has a first input, a second input coupled to a first power supply voltage terminal, an output coupled to a power supply terminal of each of a plurality of memory cells, and a control input for receiving a write assist control signal. The write assist circuit is coupled to the first input of the selection circuit for reducing a voltage at the power supply terminal of each of the plurality of memory cells during a write operation and in response to an asserted write assist enable signal. The write assist circuit comprises a P-channel transistor and a bias voltage generator. The P-channel transistor is for reducing the voltage at the power supply terminal of each of the plurality of memory cells during the write operation. The bias voltage generator is for providing a variable bias voltage to the P-channel transistor.

Abstract: A semiconductor memory device having read and write operations includes a discrimination signal generating unit for generating a discrimination signal during the write operation; and a selective delay unit for receiving and selectively delaying a command-group signal in response to the discrimination signal.

Abstract: A static CAM includes a plurality of entries E each including a number of CAM cells B and a summary S. Each CAM cell B is associated with a memory cell M and a comparator C. Generally, the CAM receives as input i number of lookup data lines. When data is received, memory cells M provide compared data for corresponding comparators C in CAM cells B to compare the compared data to the received data. If all compared data match all received data lines for an entry, then there is a hit for that entry. But if any compared data does not match the corresponding data line, then there is a miss for that line and therefore a miss for that entry. Depending on applications, the CAM returns an address if there is a hit for one or a plurality of entries.

Abstract: Systems and methods, including computer software for writing to a memory device include applying charge to each of multiple memory cells for storage of a selected data value in each memory cell. The memory cells include a first reference memory cell, and each data value is selected from a group of possible data values. Each possible data value has a corresponding target voltage level, and the first reference memory cell has a corresponding predetermined first reference target voltage level. The voltage level in the first reference memory cell is detected. A determination is made whether the voltage level in the first reference memory cell is less than the first reference target voltage level. Additional charge is applied to the memory cells upon the determination that the voltage level in the first reference memory cell is less than the first reference target voltage.

Abstract: A method and apparatus involving a circuit is disclosed. The circuit has separate first and second portions, where the first portion includes a first memory device such as a flip-flop, and the second portion includes a second memory device such as a latch. The first portion is selectively operated in first and second operational modes, the first portion consuming less power in the second operational mode than in the first operational mode. During the first operational mode a logical value is maintained in the flip-flop and can vary dynamically. During the second operational mode, the state that the logical value had at a point in time just before the first portion entered the second operational mode is maintained in the latch. Then, after the first portion switches from the second operational mode back to the first operational mode, the state of the logical value in the latch is restored to the flip-flop.

Abstract: A memory circuit includes a memory cell, a pair of conducting lines operable to signal the logic state of the memory cell and read circuitry operable to perform a read operation by detecting a voltage level of at least one of the pair of conducting lines. The memory circuit includes a pull-down circuit having an on configuration in which it is operable to pull-down a voltage level of at least one of the pair of conducting lines so as to affect the read operation and an off-configuration in which the pull-down circuit cannot affect the read operation. Control circuitry is configured to control whether the pull-down circuit is in the on configuration or the off configuration. The memory circuit can be incorporated in a data processing apparatus and a method of operating a memory circuit is provided in which a pull-down circuit is controlled to be in an on configuration or in an off configuration.

Abstract: A power-on management circuit for a memory device is provided. The power-on management circuit comprises a first external power-on voltage detector, a second external power-on voltage detector, a delay unit, a logic circuit, an internal power-on voltage detector, a voltage control circuit, a plurality of first electric pumps and a second electric pump. The first external power-on voltage detector has a first voltage threshold, receives a first external voltage, and generates a first control signal when the first external voltage is higher than the first voltage threshold. The second external power-on voltage detector has a second voltage threshold, receives a second external voltage, and generates a second control signal when the second external voltage is higher than the second voltage threshold.

Abstract: A semiconductor memory device comprises a first exclusive-OR circuit which compares mth N-bit first data with (m+1)th N-bit second data, a majority circuit which generates flag data to invert the second data if a comparison result of the first exclusive-OR circuit indicates that the number of mismatch bits between the first data and the second data is not less than N/2, and generates flag data to noninvert the second data if the number of mismatch bits between the first data and the second data is less than N/2, a second exclusive-OR circuit which inverts or noninverts the second data based on the flag data, a shift register which stores the flag data generated by the majority circuit, and a pad to serially output both the inverted or noninverted second data and the flag data.

Abstract: A page buffer circuit of a memory device including a plurality of Multi-Level Cells (MLCs) connected to at least a pair of bit lines includes a Most Significant Bit (MSB) latch, a Least Significant Bit (LSB) latch, a data I/O circuit, an inverted output circuit, a MSB verification circuit, and a LSB verification circuit. The MSB latch is configured to sense a voltage of a sensing node in response to a control signal and store an upper sensing data, and output an inverted upper sensing data, or store an input data and output an inverted input data. The LSB latch is configured to sense a voltage of the sensing node in response to the control signal, and store and output a lower sensing data, or store and output an input data received through the MSB latch. The data I/O circuit is connected to the MSB latch and a data I/O line, and is configured to perform the input and output of a sensing data or the input and output of a program data.

Abstract: Selection circuitry for use in register files, multiplexers, and so forth is disclosed. The selection circuitry includes a plurality of local bit lines coupled to global bit line circuitry. Groups of cells or data inputs are coupled to each of the local bit lines. When a cell or data input of a given group is selected, a group select signal is provided to the global bit line circuitry. The global bit line circuitry drives a global bit line responsive to the group select signal and the data driven on (or provided to) the local bit line associated with the selected cell/input, thus providing a data output. When no cell of a given group is selected, the group select signal is de-asserted, causing the respective global bit line to be held in a predetermined state.

Abstract: A nonvolatile semiconductor memory has a first memory chip set so as to be operated by specifying the chip address upon reset; and a second memory chip set so as not to be specified by the chip address and not to be operated upon reset, the first memory chip and the second memory chip each comprising a power-on reset circuit which detects a power supply voltage after power-on and outputs a reset signal for resetting an operation when the power supply voltage is equal to or higher than a predetermined value.

Abstract: An address decoder includes N predecoders that receive and logically combine a clock signal and respective address signals to periodically provide respective addresses and complementary addresses. N is an integer greater than one. A first decoder receives the respective addresses and complementary addresses and generates a decoder output based on the received respective addresses and complementary addresses.

Abstract: A page buffer circuit of a memory device including a plurality of Multi-Level Cells (MLCs) connected to at least a pair of bit lines includes a Most Significant Bit (MSB) latch, a Least Significant Bit (LSB) latch, a data I/O circuit, an inverted output circuit, a MSB verification circuit, and a LSB verification circuit. The MSB latch is configured to sense a voltage of a sensing node in response to a control signal and store an upper sensing data, and output an inverted upper sensing data, or store an input data and output an inverted input data. The LSB latch is configured to sense a voltage of the sensing node in response to the control signal, and store and output a lower sensing data, or store and output an input data received through the MSB latch. The data I/O circuit is connected to the MSB latch and a data I/O line, and is configured to perform the input and output of a sensing data or the input and output of a program data.

Abstract: A semiconductor memory device that generates a data strobe reset signal for preventing ring-back of a data strobe signal, and an operation method thereof. The semiconductor memory device includes a pulse signal generating unit for generating first and second pulse signals by synchronizing a write instruction with first and second internal clock signals, a reset signal generating unit for generating a reset signal having an activation width setup in response to the first and second pulse signals, and a data strobe reset signal generating unit for generating a data strobe reset signal by shifting the second pulse signal as much as a predetermined burst length and limiting an activation period of the data strobe reset signal in response to the reset signal.

Abstract: A non-volatile register includes a memory element. The memory element comprises a first end and a second end. The non-volatile register includes a register logic connected with the first and second ends of the memory element. The register logic is positioned below the memory element. The memory element may be a two-terminal memory element configured to store data as a plurality of conductivity profiles that can be non-destructively determined by applying a read voltage across the two terminals. New data can be written to the two-terminal memory element by applying a write voltage of a predetermined magnitude and/or polarity across the two terminals. The two-terminal memory element retains stored data in the absence of power. A reference element including a structure that is identical or substantially identical to the two-terminal memory element may be used to generate a reference signal for comparisons during read operations.

Abstract: A semiconductor memory device includes a cell core storing data, a plurality of peripheral circuit components, collectively driving data to/from the cell core and providing a default state at an output signal state during an initialization process upon power-up, and an initialization circuit detecting a standby mode of operation for the semiconductor memory device, and upon detecting the standby mode controlling operation of the plurality of peripheral circuit components to provide the default state as the signal state during standby mode.

Abstract: A F-RAM memory device containing a current mirror sense amp. A F-RAM memory device containing a current mirror sense amp coupled to a negative voltage generator. A method of reading data from and restoring data back into F-RAM cells in a 2T2C F-RAM device containing a current mirror sense amp. A method of reading data from and restoring data back into F-RAM cells in a 1T1C F-RAM device.