Abstract: A nonvolatile semiconductor memory device according to an embodiment includes: a memory cell array in which a plurality of NAND cell units are arranged, the NAND cell units including a plurality of memory cells, and select gate transistors, the memory cell including a semiconductor layer, a gate insulating film, a charge accumulation layer, and a control gate; and a control circuit. The control circuit adjusts a write condition of each of the memory cells in accordance with write data to each of the memory cells and memory cells adjacent to the memory cells within the data to be written.

Abstract: The described devices, systems and methods include an electro-static discharge clamp with a latch to prevent false triggering of an electro-static discharge protection circuit in response to fluctuations in a power supply rail.

Abstract: A fuse-based memory includes a plurality of bit lines. Each bit lines couples to a corresponding plurality of fuses. The fuses couple to ground through corresponding access transistors. The memory is configured to precharge an accessed one of the bit lines and a reference one of the bit lines using a low voltage supply. In contrast, a resulting voltage difference between the accessed bit line and the reference bit line is sensed using a sense amplifier powered by a high voltage supply, wherein a high voltage supplied by the high power supply is greater than a low voltage supplied by the low voltage supply.

Abstract: A circuit including a memory circuit, the memory circuit includes a first plurality of memory arrays and a first plurality of keepers, each keeper of the first plurality of keepers is electrically coupled with a corresponding one of the first plurality of memory arrays. The memory circuit further includes a first current limiter electrically coupled with and shared by the first plurality of keepers.

Abstract: The described devices, systems and methods include an electro-static discharge clamp with a latch to prevent false triggering of an electro-static discharge protection circuit in response to fluctuations in a power supply rail.

Abstract: A system on chip (SoC) provides a memory array of self referencing nonvolatile bitcells. Each bit cell includes two ferroelectric capacitors connected in series between a first plate line and a second plate line, such that a node Q is formed between the two ferroelectric capacitors. The first plate line and the second plate line are configured to provide a voltage approximately equal to first voltage while the bit cell is not being accessed. A clamping circuit coupled to the node Q. A first read capacitor is coupled to the bit line via a transfer device controlled by a first control signal. A second read capacitor coupled to the bit line via another transfer device controlled by a second control signal. A sense amp is coupled between the first read capacitor and the second read capacitor.

Abstract: A system on chip (SoC) provides a nonvolatile memory array that is configured as n rows by m columns of bit cells. Each of the bit cells is configured to store a bit of data. There are m bit lines each coupled to a corresponding one of the m columns of bit cells. There are m write drivers each coupled to a corresponding one of the m bit lines. An AND gate is coupled to the m bit lines and has an output line coupled to an input of a test controller on the SoC. An OR gate is coupled to the m bit lines and has an output line coupled to an input of the test controller.

Abstract: Systems and methods for auto-calibrating a storage memory controller are disclosed. In some embodiments, the systems and methods may be realized as a method for auto-calibrating a storage memory controller including instructing a controllable delay circuit to delay a read strobe signal at one of a plurality of delay settings, receiving data captured at a data latch using the delayed read strobe signal, selecting an adjustment factor from the plurality of delay settings using a multi-scale approach, based on an accuracy of the data captured at the data latch, and instructing the controllable delay circuit to delay the read strobe signal by the adjustment factor.

Abstract: A method of protecting software for embedded applications against unauthorized access. Software to be protected is loaded into a protected memory area. Access to the protected memory area is controlled by sentinel logic circuitry. The sentinel logic circuitry allows access to the protected memory area from only either within the protected memory area or from outside of the protected memory area but through a dedicated memory location within the protected memory area. The dedicated memory location then points to protected address locations within the protected memory area.

Abstract: A non-volatile memory array is partitioned along the column direction into first and second portions. The first portion has SLC memory cells and the second portion has MLC memory cells. The first portion acts as a fast cache memory for the second portion. The read/write operations of the first portion are further enhanced by coupling to a set of read/write circuits immediately adjacent to the first portion, while the column of each bit line is switchably cut off at the junction between the first and second portions. In this way, the RC constant of the cut off bit line is at a minimum, which translates to faster precharge of the bit line via the read/write circuits. When the second portion is operating, its access to the set of read/write circuits is accomplished by not cutting off each bit line at the junction between the first and second portions.

Abstract: A memory includes a plurality of content-addressable memory (CAM) cells and a summary circuit associated with the plurality of CAM cells. The summary circuit includes a first level of logic gates and a second level of logic gates. The first level of logic gates have inputs each configured to receive an output of a corresponding one of the plurality of CAM cell. The second level of logic gates have inputs each configured to receive an output of a corresponding one of the first level of logic gates.

Abstract: A semiconductor memory device includes a memory cell connected to a read bit line and a pair of write bit lines, and a data amplifier connected to the read bit line. A precharge potential resetting circuit uses a function of generating precharge potentials to the pair of write bit lines based on data of the memory cell amplified by the data amplifier to set the precharge potentials of the non-selected pair of write bit lines to have a potential relationship corresponding to the data stored by the memory cell. As a result, data destruction of the non-selected memory cell during write operation is reduced or prevented, and the speed of operation is increased and the area is reduced.

Abstract: A sense amplifier control circuit according to the present invention is disposed in a bit line sense amplifier (BLSA) array region including a plurality of BLSAs and is configured to supply a precharge voltage to the plurality of BLSAs in response to a control signal.

Abstract: A semiconductor memory apparatus includes a plurality of memory banks, wherein each memory bank includes a bank control unit configured to reduce a voltage level of a first node to a ground voltage level when the memory bank is selected to perform a predetermined operation; an error control unit configured to supply an external voltage to the first node when the memory bank is not selected to perform the predetermined operation; and a signal generation unit configured to generate a bank operation signal in response to the voltage level of the first node.

Abstract: A bidirectional shift register includes a first register circuit and a second register circuit. The first register circuit includes a first register stage and a first output buffer stage with n numbers of scanning signal output ends. The first register stage is electrically coupled to a third voltage source. The first output buffer stage is electrically coupled to a second voltage source and a first voltage source. The second register circuit has a similar circuit structure to the first register circuit; wherein the first register circuit and the second register circuit each use n+1 numbers clock signal lines, and the n is a positive integer.

Abstract: A memory circuit may include a shift register ring including single-bit shift registers. The circuit may include a clock connected to the shift registers to shift bits within the shift register ring, and a counter connected to the clock and indicating positions of the bits in the shift register ring.

Abstract: A method of programming multi-level cells included in a spare region, the method including programming first page data and at least one first dummy data in a first multi-level cell; and programming second page data and at least one second dummy data in a second multi-level cell.

Abstract: In at least one embodiment, a sense amplifier circuit includes a pair of bit lines, a sense amplifier output, a keeper circuit, and a noise threshold control circuit. The keeper circuit is coupled to the pair of bit lines and includes an NMOS transistor coupled between a power node and a corresponding one of the pair of bit lines. The keeper circuit is sized to supply sufficient current to compensate a leakage current of the corresponding bit line and configured to maintain a voltage level of the corresponding bit line. The noise threshold control circuit is connected to the sense amplifier output and the pair of bit lines. The noise threshold control circuit comprises a half-Schmitt trigger circuit or a Schmitt trigger circuit.

Abstract: A semiconductor device is provided with: a delay circuit including a first delay unit that has a plurality of differential first delay elements which are respectively connected in series, a plurality pairs of first contacts which are respectively provided between the plurality of first delay elements, and a first output circuit that outputs a first delayed signal corresponding to a pair of first contacts selected from among the plurality pairs of first contacts, on receiving a first selection signal; a second delay unit that receives the first delayed signal, and that includes a plurality of single-ended second delay elements which are respectively connected in series, a plurality of second contacts which are respectively provided between the plurality of second delay elements, and a second output circuit that outputs a second delayed signal corresponding to a second contact selected from among the plurality of second contacts, on receiving a second selection signal; and a control circuit that outputs each of

Abstract: Systems and methods for reducing delays between successive write and read accesses in multi-bank memory devices are provided. Computer circuits modify the relative timing between addresses and data of write accesses, reducing delays between successive write and read accesses. Memory devices that interface with these computer circuits use posted write accesses to effectively return the modified relative timing to its original timing before processing the write access.

Abstract: It is an object to provide a signal processing circuit for which a complex manufacturing process is not necessary and whose power consumption can be suppressed. In particular, it is an object to provide a signal processing circuit whose power consumption can be suppressed by stopping the power supply for a short time. The signal processing circuit includes a control circuit, an arithmetic unit, and a buffer memory device. The buffer memory device stores data sent from the main memory device or the arithmetic unit in accordance with an instruction from the control unit; the buffer memory device comprises a plurality of memory cells; and the memory cells each include a transistor including an oxide semiconductor in a channel formation region and a memory element to which charge whose amount depends on a value of the data is supplied via the transistor.

Abstract: Apparatus, systems, and methods are disclosed that operate to encode register bits to generate encoded bits such that, for pairs of addresses, an encoded it to be coupled to a first address in a memory device may be exchanged with an encoded bit to be coupled to a second address in the memory device. Apparatus, systems, and methods are disclosed that operate to invert encoded bits in logic circuits in the memory device if original bits were inverted. Additional apparatus, systems, and methods are disclosed.

Abstract: The apparatuses and methods described herein may comprise a memory array formed on a semiconductor substrate and including a plurality of cells associated with a plurality of word lines. The memory array may comprise a plurality of sub-blocks including a first sub-block and a second sub-block. Each sub-block may comprise a memory cell portion of the plurality of memory cells associated with a corresponding word line portion of the plurality of word lines. The memory cell portions in the first and second sub-blocks may be independently addressable with respect to each other such that a second operation can be performed on at least one memory cell of the memory cell portion of the second sub-block responsive to suspending a first operation directed to at least one memory cell of the memory cell portion of the first sub-block.

Abstract: Disclosed herein is a semiconductor device comprising a global bit line, a first local bit line coupled to normal memory cells, a second local bit line coupled to redundant memory cells first and second hierarchical switches, a precharge circuit precharging the global bit line, a redundancy determination circuit determining whether or not an accessed address matches a defective address, and a control circuit. In a standby state, the global bit line and the second local bit line are precharged through the second hierarchical switch. In an active state, the first local bit line is precharged through the first hierarchical switch, subsequently when the redundancy determination circuit determines that the addresses do not match, the second hierarchical switch is inactivated to access the normal memory cells, and when the redundancy determination circuit determines that the addresses match each other, the first hierarchical switch is inactivated to access the redundant memory cells.

Abstract: A non-volatile memory device is disclosed, which performs a sensing operation using a current. The non-volatile memory device includes a cell array including one or more unit cells, configured to read or write data, a current-voltage converter configured to convert a sensing current corresponding to data stored in the unit cell into a sensing voltage, and perform a precharge operation of the sensing voltage upon receiving the sensing current in response to a current driving signal at an activation time point of a word line of the cell array, and a sense-amp configured to compare the sensing voltage with a predetermined reference voltage, and amplify the compared result.

Abstract: A method of generating a voltage on an integrated circuit device comprising a memory cell array including (i) a plurality of memory cells, arranged in a matrix of rows and columns, and (ii) a plurality of bit lines, wherein each bit line includes a plurality of memory cells. The integrated circuit device further comprises voltage generation circuitry, coupled to a plurality of the bit lines, to (i) apply a first voltage to a first group of associated bit lines, (ii) apply a second voltage to a second group of associated bit lines, (iii) generate a third voltage by connecting the first group of associated bit lines and the second group of associated bit lines, and (iv) output the third voltage. Also, disclosed is a method of operation and/or control of such an integrated circuit device as well as such voltage generation circuitry.

Abstract: A nonvolatile memory device is provided relating to a test operation for a Low Power Double-Data-Rate (LPDDR) nonvolatile memory device. The nonvolatile memory device comprises a command decoder configured to decode a test mode signal in a test mode to output program and erasure signals into a memory, an address decoder configured to decode a command address inputted through an address pin in the test mode to output a cell array address into the memory, and an overlay window configured to store a data inputted through a data pin in the test mode.

Abstract: A circuit made on a semiconductor-on-insulator substrate. The circuit includes a first transistor having a first channel, a second transistor having a second channel, with the transistors provided in serial association between first and second terminals for applying a power supply potential, each of the transistors comprising a drain region and a source region in the thin layer, a channel extending between the source region and the drain region, and a front control gate located above the channel. Each transistor has a back control gate formed in the base substrate below the channel of the transistor and capable of being biased in order to modulate the threshold voltage of the transistor. At least one of the transistors is configured for operating in a depletion mode under the action of a back gate signal which will sufficiently modulate its threshold voltage.

Abstract: A power-up signal generation circuit includes a first driving section configured to generate a pre-power-up signal by driving a first node to a first pull-up drivability or driving the first node to a first pull-down drivability in response to an internal voltage when not in an active mode, and a second driving section configured to generate the pre-power-up signal by driving the first node to a second pull-up drivability or driving the first node to a second pull-down drivability in response to the internal voltage in the active mode. The first pull-up drivability is larger than the second pull-up drivability, and the first pull-down drivability is smaller than the second pull-down drivability.

Abstract: Embodiments of the present disclosure describe memory module bus termination voltage (VTT) regulation and management techniques and configurations. A method includes receiving, by a register, a signal that is driven over a bus to a memory device comprising a plurality of memory cells and setting, within the register, a termination voltage (VTT) for the bus based on the signal. Other embodiments may be described and/or claimed.

Abstract: An integrated circuit is formed having an array of memory cells located in the dielectric stack above a semiconductor substrate. Each memory cell has two adjustable resistors and two heating elements. A dielectric material separates the heating elements from the adjustable resistors. One heating element alters the resistance of one of the resistors by applying heat thereto to write data to the memory cell. The other heating element alters the resistance of the other resistor by applying heat thereto to erase data from the memory cell.

Abstract: A global to local bit line interface circuit for domino static random access memory (SRAM) devices includes a pair of complementary global write bit lines in selective communication with an array of SRAM cells through corresponding local write bit lines, the complementary global write bit lines configured to write a selected SRAM cell with write data presented on a pair of complementary write data input lines; a pair of complementary global read bit lines in selective communication with the array of SRAM cells through corresponding local read bit lines, the complementary global read bit lines configured to read data stored in a selected SRAM cell and present the read data on a pair of complementary read data output lines; and write-around logic configured to directly couple the write data presented on the complementary global write bit lines to read data output circuitry associated with the complementary global read bit lines.

Abstract: A memory chip includes a plurality of storage elements. A method of controlling the memory chip includes receiving a plurality of target values from a memory controller. Each target value of the plurality of target values received from the memory controller corresponds to a respective one of the plurality of storage elements. The method further includes, for each storage element of the plurality of storage elements, adjusting a measurable parameter of the storage element until the measurable parameter of the storage element reaches the target value corresponding to the storage element received from the memory controller.

Abstract: A semiconductor memory apparatus comprises first and second memory blocks each comprising semiconductor elements coupled to first and second local line groups, a first switching circuit configured to couple a first global line group to the first local line group of the first memory block in response to a block selection signal, a second switching circuit configured to couple a second global line group to the second local line groups of the first and second memory blocks in response to the block selection signal, and a third switching circuit configured to couple the first global line group to the first local line group of the second memory block in response to the block selection signal.

Abstract: A row decoder is disposed on a side of a memory cell array in a column direction and supplies one of word lines with a first drive signal for selecting one of memory cells. A dummy word line is formed extending in the column direction. A dummy bit line is formed extending in a row direction. At least one of the dummy word line and the dummy bit line is disposed outside of the memory cell array. The row decoder outputs a second drive signal toward a sense amplifier circuit via the dummy bit line and the dummy word line.

Abstract: Cell power supply lines are arranged for memory cell columns, and adjust impedances or voltage levels of the cell power supply lines according to the voltage levels of bit lines in the corresponding columns, respectively. In the data write operation, the cell power supply line is forced into a floating state according to the bit line potential on a selected column and has the voltage level changed, and a latching capability of a selected memory cell is reduced to write data fast. Even with a low power supply voltage, a static semiconductor memory device that can stably perform write and read of data is implemented.

Abstract: A memory circuit includes a transistor having a channel in an oxide semiconductor layer, a capacitor, a first arithmetic circuit, a second arithmetic circuit, a third arithmetic circuit, and a switch. An output terminal of the first arithmetic circuit is electrically connected to an input terminal of the second arithmetic circuit. The input terminal of the second arithmetic circuit is electrically connected to an output terminal of the third arithmetic circuit via the switch. An output terminal of the second arithmetic circuit is electrically connected to an input terminal of the first arithmetic circuit. An input terminal of the first arithmetic circuit is electrically connected to one of a source and a drain of the transistor. The other of the source and the drain of the transistor is electrically connected to one of a pair of electrodes of the capacitor and to an input terminal of the third arithmetic circuit.

Abstract: A memory module having a high data processing rate and high capacity is provided. The memory module may include a memory chip, a controller controlling an operation of the memory chip, an optical detector converting an external input signal into an internal input signal to transmit the converted signal to the controller, and an optical generator converting an internal output signal received from the controller into an external output signal. The optical detector converts an external input optical signal into an internal input signal to transmit the converted signal to the controller. The optical generator converts an internal output signal received from the controller into an external output optical signal.

Abstract: A synchronous type semiconductor storage device includes an array unit which includes a cell array and sense amplifiers. The synchronous type semiconductor storage device includes a read/write pulse generator which generates a read pulse signal and a write pulse signal according to a clock signal, the clock signal defining one cycle time of a read operation and a write operation with respect to the array unit as one cycle. The synchronous type semiconductor storage device includes a secondary amplifier which is activated according to the read pulse signal to read out data stored in the sense amplifiers through the read/write line. The synchronous type semiconductor storage device includes a write driver which is activated according to the write pulse signal to write data in the sense amplifiers through the read/write line.

Abstract: An address decoding device may include a supply terminal for a supply voltage, a conductive path configured to provide an electric signal, associated with an address of at least one memory cell, and an address terminal connected to the conductive path and structured to receive the electric signal. An address decoder may be connected to the address terminal to receive the electric signal. The decoder may have a decoding operative voltage associated therewith. A switch circuit may be structured to electrically connect the address terminal to the supply terminal when the address terminal takes a threshold voltage imposed by the electric signal, and may bring the address terminal to the decoding operative voltage.

Abstract: A memory device providing signals indicating when refresh operations are complete. The signals from a number of memory devices can be combined, such as by Oring, to provide a refresh complete signal to a power management controller. Dynamic factors can affect the refresh operation and the memory may be refreshed without restoring the entire system to a high power state. The time required to perform a refresh operation can be determined dynamically, allowing the system to be returned to a low power state as soon as refresh is complete. Ambient temperatures can be monitored to dynamically determine when to perform a refresh operation.

Abstract: A method for calibration of a memory controller may include determining if an unused memory location exists in memory. The method may include writing a first pattern to the unused memory location in response to a determination that the unused memory location exists. The method may include determining if a second pattern exists in the memory in response to a determination that the unused memory location does not exist. The method may include iteratively modifying a first delay of a first delay control module among a plurality of delay values. The method may include reading from a memory location including the first pattern or the second pattern for each iteration of modification of the first delay. The method may include modifying one or more second delays, each second delay associated with one of one or more second delay control modules, based on the results of reading from the memory location.

Abstract: A memory apparatus includes a plurality of first bit columns for constructing a common memory space and at least one reserve second bit column. A column address of a damaged first bit column is recorded as a predetermined column address. When a byte column is accessed, data recorded in the first bit columns and the second bit columns are respectively latched in a first latching device and a second latching device. In the event that the latched access data is accessed, data is outputted by comparing the predetermined column address of each first bit column and an access column address, and when the access column address matches with the predetermined column address, data is outputted via the second latching device; otherwise, the data is outputted via the first latching device.

Abstract: This disclosure describes techniques for reducing the number of data transmissions required to read an amount of data from multi-level-cell (MLC) flash memory. These techniques effectively increase the speed at which MLC flash memory can be read. This disclosure also describes techniques for reducing the amount of hardware and processing resources of a flash controller to read an amount of data. These techniques effectively increase the speed at which flash memory can be read by the flash controller without modifying conventional flash memories.

Abstract: A memory write interface in an integrated circuit (IC) and method of providing the same are described. An aspect relates to an apparatus for providing an input/output (IO) interface in a programmable device. The apparatus can include: a memory write interface configured to drive a memory having a daisy-chained clock, a first interface configured to receive output data from the programmable device and a second interface configured to control transmission of the output data to the memory by an IO element of the programmable device, the first interface operating according to a global clock of the programmable device and the second interface operating according to a local clock used only by the IO interface; a delay circuit configured to add a delay to the local clock with respect to the global clock; and a configuration circuit configured to adjust the delay added to the local clock to implement write-leveling at the memory.

Abstract: The logic circuit includes at least one variable resistance device configured such that a resistance value of the at least one variable resistance device varies according to at least one selected value. The selected value is selected from among a voltage and a current of an input signal, and the at least one variable resistance device is configured to memorize the resistance value. The logic circuit is configured to store multi-level data by setting the memorized resistance value.

Abstract: A method and apparatus to provide random access to a programmable logic register. A processing device in a programmable logic system retrieves data from a memory of the programmable logic system. The data is loaded into a configuration register configured to store configuration data for a programmable logic function over a system bus. The processing device programs a programmable logic block to implement the programmable logic function based on the configuration data, where the processing device is configured to access a first configuration register in the configuration register set, the first configuration register corresponding to a first programmable logic block in the programmable logic system, without affecting a second configuration register corresponding to a second programmable logic block.

Abstract: A sectioned bit line of an SRAM memory device, an SRAM memory device having a sectioned bit line, and associated systems and methods are described. In one illustrative implementation, the sectioned bit line may comprise a local bit line, a memory cell connected to the local bit line, and a pass gate coupled to the local bit line, wherein the pass gate is configured to be coupled to a global bit line. In other implementations, an SRAM memory device may be configured involving sectioned bit lines and a global bit line wherein the pass gates are configured to connect and isolate the sectioned bit line and the global bit line.

Abstract: Methods and apparatus for providing finFET SRAM cells. An SRAM cell structure is provided including a central N-well region and a first and a second P-well region on opposing sides of the central N-well region, having an area ratio of the N-well region to the P-well regions between 80-120%, the SRAM cell structure further includes at least one p-type transistor formed in the N-well region and having a gate electrode comprising a gate and a gate dielectric over a p-type transistor active area in the N-well region; and at least one n-type transistor formed in each of the first and second P-well regions and each n-type transistor having a gate electrode comprising a gate and a gate dielectric over an n-type transistor active area in the respective P-well region. Methods for operating the SRAM cell structures are disclosed.

Abstract: A page buffer circuit of a memory device including a plurality of Multi-Level Cells (MLCs) connected to at least a pair of bit lines includes a Most Significant Bit (MSB) latch, a Least Significant Bit (LSB) latch, a data I/O circuit, an inverted output circuit, a MSB verification circuit, and a LSB verification circuit. The MSB latch is configured to sense a voltage of a sensing node in response to a control signal and store an upper sensing data, and output an inverted upper sensing data, or store an input data and output an inverted input data. The LSB latch is configured to sense a voltage of the sensing node in response to the control signal, and store and output a lower sensing data, or store and output an input data received through the MSB latch. The data I/O circuit is connected to the MSB latch and a data I/O line, and is configured to perform the input and output of a sensing data or the input and output of a program data.