Abstract: Embodiments of a memory are disclosed that may reduce the likelihood of a miss-read while reading a weak data storage cell. The memory may include a number of data storage cells, a column multiplexer, a first sense amplifier and a second sense amplifier, and an output circuit. The gain level of the first sense amplifier may be higher than the gain level of the second sense amplifier. The output circuit may include a multiplexer and the multiplexer may be operable to controllably select one of the outputs of the first and second sense amplifiers and pass the value of the selected sense amplifier. The output circuit may include a node that couples the outputs of the first and second sense amplifiers and the outputs of the first and second sense amplifiers may be able to be set to a high impedance state.

Abstract: A data input/output (I/O) device includes a plurality of data units and an I/O assembly. The plurality of data units is coupled to a global I/O (GIO) line through corresponding local I/O (LIO) lines and configured to receive or transmit a plurality of data groups through the corresponding LIO lines. At least one of the plurality of data units have a different operation speed. The I/O assembly performs serial/parallel conversion operations on the plurality of data groups including a high-speed data group and outputs results of the serial/parallel conversion operations. The high-speed data group is output from the at least one of the plurality of data units having the different operation speed.

Abstract: An SRAM includes a global bit line, an SRAM cell, precharge logic, discharge logic, and sense logic. The SRAM cell stores a first logical value or a second logic value and is coupled to the global bit line. The precharge logic may charge the global bit line to a precharge voltage for a non-read operation and a boosted voltage that is greater than a reference voltage for a read operation. The discharge logic may either maintain the global bit line at the boosted voltage for the first logical value or discharge the global bit line to a discharge voltage that is less than the reference voltage for the second logical value. The sense logic may output the first logical value when the global bit line has the boosted voltage or may output the second logical value when the global bit line has the discharge voltage.

Abstract: Systems and methods are disclosed for decoding solid-state memory cells. In certain embodiments, a data storage device includes a controller configured to decode a non-volatile memory array by performing a first read of a plurality of code words from the non-volatile memory array using a first reference voltage level and performing a second read of the plurality of code words using a second reference voltage level on a first side of the first reference voltage level. The controller is further configured to generate a soft-decision input value associated with a first code word of the plurality of code words based on the first and second reads and decode the first code word using the soft-decision input value.

Abstract: A memory system includes a memory controller that writes data to and reads data from a memory device. A write data strobe accompanying the write data indicates to the memory device when the write data is valid, whereas a read strobe accompanying data from the memory device indicates to the memory controller when the read data is valid. The memory controller adaptively controls the phase of the write data strobe to compensate for timing drift at the memory device. The memory controller uses read signals as a measure of the drift.

Abstract: It is an object to reduce power consumption of a 2Tr1C type semiconductor memory device. The absolute value of the threshold voltage of a reading transistor is made larger than a fluctuation range of a data potential of a bit line (or the fluctuation range of the data potential of the bit line is made smaller than the absolute value of the threshold voltage of the reading transistor), whereby the potential of a source line can be fixed, a fluctuation in a potential of a writing word line can be made smaller, and a potential of a reading word line is fluctuated only at the time of reading. Further, a gate of such a transistor the absolute value of the threshold voltage of which is large is formed using a material having a high work function, such as indium nitride.

Abstract: A semiconductor integrated circuit includes a write path coupled to a pad, a read path coupled to the pad, and a reference voltage output control block configured to apply a reference voltage to the pad through the write path in response to a reference voltage monitoring signal. The read path is electrically isolated from the pad in response to the reference voltage monitoring signal.

Abstract: Provided is a semiconductor memory device in which a plurality of first and second data lines coupled to a memory cell array are alternately arranged. The semiconductor memory device includes a first write driving circuit configured to load a plurality of first write data transmitted through a plurality of third data lines into the plurality of first data lines in response to a first write enable signal; a second write driving circuit configured to load a plurality of second write data transmitted through a plurality of fourth data lines into the plurality of second data lines in response to a second write enable signal; and a column control circuit configured to activate at least one of the first and second write enable signals during a given period, in response to a plurality of data width option modes, during a parallel test mode.

Abstract: In a flash memory two or more pages in a plane are read in rapid succession by maintaining global word line voltages throughout multiple page reads, and by simultaneously transitioning the old selected word line from a discrimination voltage to a read voltage and transitioning the new selected word line from the read voltage to a discrimination voltage.

Abstract: Integrated circuit memory devices include a memory cell configured to receive a power supply signal and a write assist circuit. The write assist circuit is configured to improve write margins by reducing a magnitude of the power supply signal supplied to the memory cell from a first voltage level to a lower second voltage level during an operation to write data into the memory cell. The memory device further includes at least one bit line electrically coupled to the memory cell and a read assist circuit. The read assist circuit may be configured to improve read reliability by partially discharging the at least one bit line from an already precharged voltage level to a lower third voltage level in preparation to read data from the memory cell.

Abstract: Memories and methods for providing and receiving non-data signals at a signal node are disclosed. One such memory includes first and second signal nodes, and first and second signal buffer. The first signal buffer is configured to be operative responsive to a first data strobe signal and further configured to be operative responsive to a non-data signal. The second signal buffer is configured to be operative responsive to a second data strobe signal. An example first data strobe signal is a read data strobe signal provided by the memory. In another example, the first data strobe signal is a write data strobe signal received by the memory. Examples of non-data signals include a data mask signal, data valid signal, error correction signal, as well as other signals.

Abstract: A memory device can include a plurality of memory elements programmable between different impedance states; and circuits configured to apply first electrical conditions to one group of memory elements and second electrical conditions, different from the first electrical conditions, to another group of memory elements to vary a speed of an access operation to the different groups of memory elements.

Abstract: A memory includes a first bit line, a memory cell coupled to the first bit line, and a read assist device coupled to the first bit line. The read assist device is configured to pull a first voltage on the first bit line toward a predetermined voltage in response to a first datum being read out from the memory cell. The read assist device includes a first circuit configured to establish a first current path between the first bit line and a node of the predetermined voltage during a first stage. The read assist device further includes a second circuit configured to establish a second current path between the first bit line and the node of the predetermined voltage during a second, subsequent stage.

Abstract: A memory comprises a memory cell, a sense amplifier, and a control unit. The memory cell stores a first bit and a second bit. The sense amplifier senses a first cell current and a second cell current corresponding to the first and the second bits respectively with a voltage applying on the memory cell. The control unit determines a digital state of the first bit by comparing a first reference current with the first cell current or by comparing a reference data with a first delta current between the first cell current and the second cell current.

Abstract: A semiconductor includes a memory cell array including a plurality of memory cells. A first amplifier produces, when activated, a first data signal related to data stored in a selected first one of the memory cells. A first transistor is between the output node of the first amplifier and a first data line and is turned ON in response to a first selection signal to convey the first data signal from the first amplifier onto the first data line. A second amplifier is coupled to the first data line and amplifies, when activated, the first data signal, and is further coupled to the first signal line and activated in response to a first activation signal that is transferred through a first signal line. A second transistor is coupled to the first signal line and is turned ON in response to the first selection signal to the first signal line.

Abstract: Providing for a two-terminal memory architecture that can mitigate sneak path current in conjunction with memory operations is described herein. By way of example, a voltage mimicking mechanism can be employed to dynamically drive un-selected bitlines of the memory architecture at a voltage observed by a selected bitline. According to these aspects, changes observed by the selected bitline can be applied to the un-selected bitlines as well. This can help reduce or avoid voltage differences between the selected bitline and the un-selected bitlines, thereby reducing or avoiding sneak path currents between respective bitlines of the memory architecture. Additionally, an input/output based configuration is provided to facilitate reduced sneak path current according to additional aspects of the subject disclosure.

Abstract: A semiconductor memory apparatus includes a boundary circuit unit positioned between a low voltage page buffer and a high voltage page buffer and having circuits configured to electrically couple the low voltage page buffer and the high voltage page buffer. The boundary circuit unit includes: a first boundary circuit unit having first and second transistors configured to receive data of a corresponding memory cell area through a signal transmission line selected from a plurality of signal transmission lines extended and arranged along a first direction for each column; a second boundary circuit unit disposed adjacent in the first direction from the first boundary circuit unit and having the plurality of signal transmission lines extended and arranged thereon; and an active region where the first transistor is formed and an active region where the second transistor is formed are isolated from each other.

Abstract: A semiconductor device comprises transmission lines, inverting circuits, first, second and third switches, global sense amplifiers, and a control circuit. The first switch switches between the transmission line and the input of the inverting circuit, the second switch switches between the transmission line and the output of the transmission line, and the third switch switches between the adjacent transmission lines. The control circuit turns off the first and second switches so that the transmission lines are brought into a floating state in a state where signals of the transmission lines are held in the inverting circuits by the global sense amplifiers. After charge sharing of the transmission lines occurs by turning on the third switches within a predetermined period, the control circuit turns off the second switches so that the transmission lines are inverted and driven via the inverting circuits and the second switches.

Abstract: A trimmable sense amplifier for use in a memory device is disclosed.

Abstract: A circuit includes a Static Random Access Memory (SRAM) array. An SRAM cell is in the SRAM array and includes a p-well region, a first and a second n-well region on opposite sides of the p-well region, and a first and a second pass-gate FinFET. The first pass-gate FinFET and the second pass-gate FinFET are p-type FinFETs. A CVss line is over the p-well region, wherein the CVss line is parallel to an interface between the p-well region and the first n-well region. A bit-line and a bit-line bar are on opposite sides of the CVss line. A CVdd line crosses over the SRAM cell. A CVss control circuit is connected to the CVss line. The CVss control circuit is configured to provide a first CVss voltage and a second CVss voltage to the CVss line, with the first and the second CVss voltage being different from each other.

Abstract: To control a read sequence of a nonvolatile memory device, a plurality of read sequences are set and the read sequences respectively correspond to operating conditions different from each other. The read sequences are performed selectively based on sequence selection rates respectively corresponding to the read sequences. Read latencies of the respective read sequences are monitored and the sequence selection rates are adjusted based on monitoring results of the read latencies.

Abstract: A memory assist apparatus includes a detection circuit and a compensation circuit. The detection circuit is configured to provide a detection signal indicating whether a bit line configured to provide read access to a data bit stored at a memory bit cell has a voltage below a predetermined threshold. The compensation circuit is configured to pull down the voltage of the bit line if the detection signal indicates that the voltage of the bit line is below the predetermined threshold.

Abstract: Embodiments of a memory are disclosed that may reduce the likelihood of a misread while reading a weak data storage cell. The memory column may include a number of data storage cells, a column multiplexer, and a sense amplifier. The sense amplifier may have two or more gain elements which can be individually selected to adjust the gain level of the sense amplifier.

Abstract: A latency control device and a semiconductor device including the same are disclosed. The latency control device includes: a code setting unit configured to output a plurality of coding signals by setting a code value having a specific delay amount in response to a code signal; a latch unit configured to latch a command signal for a predetermined time; a period control unit configured to control a delay amount of a period signal in response to an output signal of the latch unit; a selection unit configured to output an oscillation signal synchronized with the clock signal in response to the selection signal, or synchronize the oscillation signal with an output signal of the period control unit; a register unit configured to output a plurality of period signals by dividing the oscillation signal; and a comparator configured to compare the plurality of coding signals with the plurality of period signals so as to output the self-latency signal.

Abstract: A memory array assembly and a method for performing a write operation without disturbing data stored in other SRAM cells are provided. The memory array assembly comprises a plurality of SRAM cells, a plurality of avoid-disturb cells, a plurality of sense amplifiers and a plurality of write drivers. The SRAM cells are arranged in rows and columns, wherein each column is coupled to an avoid-disturb cell, a sense amplifier, and a write driver. The avoid-disturb cell receives a select signal capable of assuming first or second states. An output of the sense amplifier is coupled to an input of the write driver when the select signal is in the first state. A data-in bus is coupled to the input of the write driver if the select signal is in the second state. The write driver then sends the output signal to the SRAM cell.

Abstract: A logic chip and memory chip stacked over the logic chip, the logic chip having a first surface facing the memory chip and a second surface opposite to the first surface and including: first and second internal input/output circuit units for exchanging signals; first external input/output circuit unit for exchanging signals through first external input/output pads formed according to an external interface standard of a first memory over the second surface; and second external input/output circuit unit for exchanging signals through second external input/output pads formed according to an external interface standard of a second memory over the second surface, wherein semiconductor device operates in one of a first mode in which the first internal input/output circuit unit and the first external input/output circuit unit are enabled and a second mode in which the first and second internal input/output circuit units and the second external input/output circuit unit are enabled.

Abstract: An input-output line sense amplifier configured to drive input data signals over an input-output signal line to an output driver circuit, the input-output line sense amplifier having an output driver stage having a plurality of different programmable output drive capacities to tailor the output drive of the sense amplifier.

Abstract: A data readout circuit of phase change memory, relating to one or more phase change memory cells, wherein each phase change memory cell is connected to the control circuit by bit line and word line; said data readout circuit comprises: a clamp voltage generating circuit, used to generate a clamp voltage; a precharge circuit, used to fast charge bit line under the control of a clamp voltage; a clamped current generating circuit, used to generate a clamped current to keep bit line at clamped state under the control of a clamp voltage; a clamped current operation circuit, used to perform subtraction and multiplication on clamped current to increase the difference of clamped current between high resistance state and low resistance state; a sense amplifier circuit, used to compare the operated clamped current and the reference current and output the readout result.

Abstract: A read circuit for sensing a resistive state of a resistive switching device in a crosspoint array has an equipotential preamplifier connected to a selected column line of the resistive switching device in the array to deliver a read current while maintaining the selected column line at a reference voltage near a biasing voltage applied to unselected row lines of the array. The read circuit includes a reference voltage generation component for generating the reference voltage for the equipotential preamplifier. The reference voltage generation component samples the biasing voltage via the selected column line and adds a small increment to a sampled biasing voltage to form the reference voltage.

Abstract: A memory device that, in certain embodiments, includes a plurality of memory elements connected to a bit-line and a delta-sigma modulator with a digital output and an analog input, which may be connected to the bit-line. In some embodiments, the delta-sigma modulator includes a circuit with first and second inputs and an output. The circuit is configured to combine (add or subtract) input signals. The first input may be connected to the analog input. The delta-sigma modulator may also include an integrator connected to the output of the circuit, an analog-to-digital converter with an input connected to an output of the integrator and an output connected to the digital output, and a digital-to-analog converter with an input connected to the output of the analog-to-digital converter and an output connected to the second input of the circuit.

Abstract: An expected value associated with stored values in solid state storage, as well as a set of three or more points are obtained where the three or more points include a voltage and a value associated with stored values. Two points having ratios closest to the expected value are selected from the set. A voltage is determined based at least in part on the selected two points and the expected value.

Abstract: Disclosed are various apparatuses and methods for a memory with a multiple read word line design. A memory may include a plurality of bit cells arranged in a row, a first read word line connected to a first subset of the plurality of bit cells, and a second read word line connected to a second subset of the plurality of bit cells, wherein the first and second subsets are located in the same row of bit cells. A method may include asserting, during a first read operation, a first read word line connected to a first subset of a plurality of bit cells arranged in a row of bit cells, and asserting, during a second read operation, a second read word line connected to a second subset of the plurality of bit cells, wherein the first and second subsets are located in the same row of bit cells.

Abstract: A semiconductor memory device includes a write controller configured to transmit a first input data that is supplied through a first pad, to a first global I/O line and a second global I/O line when a write operation is executed in a test mode. The semiconductor memory device further includes a first write driver configured to store the first input data via the first global I/O line in a first cell block when the write operation is executed in the test mode. The semiconductor memory device further includes a first I/O line driver configured to supply signals to the first global I/O line and a first test I/O line in response to a first output data supplied from the first cell block when a read operation is executed in the test mode.

Abstract: A structure and method is described for an adaptive reference used in reading magnetic tunneling memory cells. A collection of magnetic tunneling memory cells are used to form a reference circuit and are coupled in parallel between circuit ground and a reference input to a sense amplifier. Each of the magnetic memory cells used to form the reference circuit are programmed to a magnetic parallel state or a magnetic anti-parallel state, wherein each different state produces a different resistance. By varying the number of parallel states in comparison to the anti-parallel states, where each of the two states produce a different resistance, the value of the reference circuit resistance can be adjusted to adapt to the resistance characteristics of a magnetic memory data cell to produce a more reliable read of the data programmed into the magnetic memory data cell.

Abstract: As memory geometries continue to scale down, current density of magnetic tunnel junctions (MTJs) make conventional low current reading scheme problematic with regard to performance and reliability. A body-voltage sense circuit (BVSC) short pulse reading (SPR) circuit is described using body connected load transistors and a novel sensing circuit with second stage amplifier which allows for very short read pulses providing much higher read margins, less sensing time, and shorter sensing current pulses. Simulation results (using 65-nm CMOS model SPICE simulations) show that our technique can achieve 550 mV of read margin at 1 ns performance under a 1 V supply voltage, which is greater than reference designs achieve at 5 ns performance.

Abstract: The storage layer such as a nitride layer of a nonvolatile memory cell has two storage parts storing separately addressable data, typically respectively proximate to the source terminal and the drain terminal. The applied drain voltage while sensing the data of one of the storage parts depends on the data stored at the other storage part. If the data stored at the other storage part is represented by a threshold voltage exceeding a minimum threshold voltage, then the applied drain voltage is raised. This technology is useful in read operations and program verify operations to widen the threshold voltage window.

Abstract: An electrically erasable and programmable non-volatile memory device includes memory cells arranged in rows and columns, and each column of memory cells is associated with a respective local bit line. The local bit lines are divided into packets of local bit lines, each packet of local bit lines associated with a respective main bit line. Each local bit line is selectively couplable to the respective main bit line by a corresponding selector. Each local bit line is selectively couplable to a reference terminal, for receiving a reference voltage, by a corresponding discharge selector. Each discharge selector is active when the memory device is in a standby state. The non-volatile memory device further includes biasing circuitry to bias each main bit line to a pre-charge voltage during operation, and reading circuitry to select and access a group of memory cells during reading operations.

Abstract: Handshaking sense amplifier. In accordance with a first embodiment, an electronic circuit includes a sense amplifier configured to differentially sense contents of a memory cell. The circuit also includes a self-timing circuit configured to detect a completion of evaluation by the sense amplifier; and to initiate a subsequent memory operation responsive to the completion. A completion of evaluation may not be aligned with a clock edge.

Abstract: A system for efficient execution of a read or a write is described. The system includes a memory array including a way. The system further includes a read and compare circuit. The read and compare circuit compares data stored within lower address memory cells of the way with information received from a storage device to generate a result of comparison. Moreover, the read and compare circuit compares data stored within higher address memory cells of the way with the information to generate a result of comparison. The system further includes a merge and multiplex circuit coupled to the read and compare circuit. The merge and multiplex circuit merges the result of comparison generated based on the comparison with the lower address memory cells and the result of comparison generated based on the comparison with the higher address memory cells to create a merged outcome of comparison.

Abstract: Pipelined one cycle throughput for single-port 6T RAM. In accordance with a first embodiment, an electronic circuit is configured to perform consecutive read accesses using one sense amplifier. The electronic circuit includes circuitry configured to precharge the sense amplifier, circuitry configured to precharge a sense node coupled to the sense amplifier, and circuitry configured to develop the sense node. The electronic circuit also includes circuitry configured to evaluate the sense node to read a first bit, and circuitry configured to detect a completion of an evaluate operation on the sense nodes. The consecutive read accesses may be conducted with single cycle throughput of a synchronizing clock signal. The circuitry configured to detect a completion of an evaluate operation on the sense nodes may include a three state latch.

Abstract: An integrated circuit device comprises a semiconductor substrate, a first memory block on the substrate comprising NAND memory cells, a second memory block on the substrate comprising NAND memory cells, and controller circuitry. The first and second memory blocks are configurable to store data for a first pattern of data usage in response to a first operation algorithm to read, program and erase data, and for a second pattern of data usage in response to a second operation algorithm to read, program and erase data, respectively. The controller circuitry is coupled to the first and second memory blocks, and is configured to execute the first and second operation algorithms, wherein a word line pass voltage for read operations applied in the first operation algorithm is at a lower voltage level than a second word line pass voltage for read operations applied in the second operation algorithm.

Abstract: A method for reading the state of a memory element within a crossbar memory array includes storing a first electric current sensed from a half-selected target memory element within the crossbar memory array; and outputting a final electric current based on the stored first electric current and a second electric current sensed from the target memory element when the target memory element is fully selected.

Abstract: A semiconductor memory device includes a pad configured to receive a first write data from outside of the semiconductor memory device, and a write circuit configured to generate a plurality of second write data which are to be written in memory cells of all banks to be tested in response to a test mode signal, data strobe signals, a write enable signal, and the first write data transferred through the pad.

Abstract: The data transmission circuit includes: a plurality of local bit line pairs through which data is read simultaneously; a plurality of voltage change detection circuits provided for the plurality of local bit line pairs; a global bit line pair; a plurality of column selection circuits configured to select one of the local bit line pairs and connect the selected local bit line pair to the global bit line pair; and a sense amplifier connected to the global bit line pair. The sense amplifier is controlled by a sense amplifier activation signal to which the outputs of the plurality of voltage change detection circuits are connected, whereby the voltage of a selected read data line pair is amplified using discharge of a non-selected read data line pair, to achieve high-speed read.

Abstract: Embodiments disclosed herein may relate to applying verify or read pulses for phase change memory and switch (PCMS) devices. The read pulses may be applied at a first voltage for a first period of time. A threshold event for the phase change memory cell may be detected during a sense window. The sense window may close after the expiration of the first period of time for which the read pulses are applied.

Abstract: A method of writing to a magneto tunnel junction (MTJ) includes writing data to the MTJ, reading the written data using a first reference MTJ and reading the written data using a second reference MTJ. Based on the reading steps and the result of the comparing step, setting a select bit to select the proper reference for future reads.

Abstract: A volatile memory including volatile memory cells adapted to the performing of data write and read operations. The memory cells are arranged in rows and in columns and, further, are distributed in separate groups of memory cells for each row. The memory includes a first memory cell selection circuit configured to perform write operations and a second memory cell selection circuit, different from the first circuit, configured to perform read operations. The first circuit is capable of selecting, for each row, memory cells from one of the group of memory cells for a write operation. The second circuit is capable of selecting, for each row, memory cells from one of the groups of memory cells for a read operation.

Abstract: A method of operation within a memory device is disclosed. The method comprises receiving address information and corresponding enable information in association with a memory access request. The address information includes a row address that specifies a row of storage cells within a storage array of the memory device, and the enable information includes first and second enable values that correspond respectively to first and second storage locations within the row of storage cells. The method involves selectively transferring data between the first and second storage locations and sense amplifier circuitry according to states of the first and second enable values. This includes transferring data between the first storage location and the sense amplifier circuitry if the first enable value is in an enable state and transferring data between the second storage location and the sense amplifier circuitry if the second enable value is in the enable state.

Abstract: Methods for reducing variability in bias voltages applied to a plurality of memory cells during a sensing operation caused by IR drops along a word line shared by the plurality of memory cells are described. In some embodiments, IR drops along a shared word line may be reduced by reducing sensing currents associated with memory cells whose state has already been determined during a sensing operation. In one example, once a sense amplifier detects that a memory cell being sensed is in a particular state, then the sense amplifier may disable sensing of the memory cell and discharge a corresponding bit line associated with the memory cell. In some cases, a bit line voltage associated with a memory cell whose state has not already been determined during a first phase of a sensing operation may be increased during a second phase of the sensing operation.

Abstract: A system including a read module to perform a first read operation to determine a state of a memory cell, and in response to a first failure to decode data read from the memory cell, perform second and third read operations to determine the state of the memory cell. The memory cell has first and second threshold voltages when programmed to first and second states, respectively. A shift detection module detects, in response to a second failure to decode data read from the memory cell in the second and third read operations, a shift in a distribution of at least one of the first and second threshold voltages. A binning module divides the distribution into a plurality of bins. A log-likelihood ratio (LLR) module generates LLRs for the plurality of bins based on a variance of the distribution and adjusts the LLRs based on an amount of the shift.