Abstract: A master stage (502) of a master-slave flip-flop (500) includes an input terminal (504) for receiving the data-in signal, an output terminal, and terminals for receiving first clock signals, a transmission gate (522) coupled to the input terminal and having an output terminal, a storage element (520) coupled to the output terminal of the transmission gate, and a two-input logic gate (525) having a first input terminal (541) coupled to the storage element, a parallel input terminal (542) coupled to the input terminal of the master stage, and an output terminal (543) that provides an output terminal of the master stage. A slave stage (503) has terminals for receiving second clock signals, wherein first clock signals are delayed relative to second clock signals.

Abstract: A memory may include first to Nth cell arrays configured to include a plurality of memory cells and one or more first to Nth data input/output pads respectively corresponding to the first to Nth cell arrays, wherein the one or more first to Nth data input/output pads are configured to input/output data to/from the first to Nth cell arrays.

Abstract: A memory chip includes a data processing block suitable for serial-parallel converting data inputted and for parallel-serial converting data to be outputted, a write data transmitting unit suitable for transmitting the data serial-parallel converted by the data processing block to a write data interlayer channel, a write data receiving unit suitable for receiving data from the write data interlayer channel, the data to be written to a core area, a read data receiving unit suitable for receiving data from a read data interlayer channel, the data to be parallel-serial converted by the data processing block, and a read data transmitting unit suitable for transmitting data read from the core area to the read data interlayer channel.

Abstract: A method of testing a semiconductor memory device includes writing first data to a memory cell array in the semiconductor memory device, loading second data from the memory cell array onto a plurality of data pads of the semiconductor memory device, rewriting the second data to the memory cell array, and outputting test result data through one or more test pads. The first data is received from an external device through the one or more test pads, which correspond to one or more of the plurality of data pads. The test result data is based on the rewritten data in the memory cell array.

Abstract: A method for programming data is provided for a memory storage device having a rewritable non-volatile memory module and a buffer memory. The method includes receiving a plurality of data including a first-type data and at least one second-type data, and a size of the first-type data is smaller than a data size threshold. The method includes temporarily storing the plurality of data into the buffer memory, and programming the first-type data and at least one part of the at least one second-type data stored in the buffer memory into a physical program unit set if it is determined that the plurality of data are complied with a predetermined condition. The method includes obtaining writing statuses of the first-type data and the at least one part of the at least one second-type data at the same time.

Abstract: Various embodiments comprise apparatuses to assign unique device identifier values to addressable devices in a stacked package. In one embodiment, an apparatus is disclosed including a stacked package with at least two addressable devices. Each of the addressable devices includes data input and switch path circuitry, a shift register coupled to the data input and switch path circuitry, and a single through-substrate via (TSV) through which the unique device identifier values can be assigned. The single TSV is coupled to the data input and switch path circuitry and between adjacent ones of the at least two addressable devices. Additional apparatuses, systems, and methods are described.

Abstract: Systems and methods to set a voltage value associated with a memory controller coupled to a memory device are disclosed. A particular method includes comparing test data of a test path to functional data of a functional path. The functional data may be generated based on device data received at a memory controller from a memory device. The test data may be affected by a voltage value applied to a resistor arrangement in electronic communication with the test path. The voltage value may be applied to the resistor arrangement based on the comparison.

Abstract: A clock driver integrated circuit device and method is provided. The device can include a VTT regulator provided on a single integrated circuit (IC) chip. A first termination at an internal VDD/2 can be coupled to the VTT regulator. A VTT bus can be coupled to the first termination. A plurality of command control inputs can be coupled to the VTT bus. The plurality of command inputs can include A, BA, RAS, CAS, WE, CS, CKE, ODT, PARIN, and the like. A VDD termination can be coupled to a first end of the VTT bus and a ground can be coupled to a second end of the VTT bus. The method can include regulating or removing signal noise from a host controller via the clock driver IC device.

Abstract: A semiconductor memory device includes a pad configured to receive a first write data from outside of the semiconductor memory device, and a write circuit configured to generate a plurality of second write data which are to be written in memory cells of all banks to be tested in response to a test mode signal, data strobe signals, a write enable signal, and the first write data transferred through the pad.

Abstract: A semiconductor memory device and system are disclosed. The memory device includes a memory, a plurality of inputs, and a device identification register for storing register bits that distinguish the memory device from other possible memory devices. Circuitry for comparing identification bits in the information signal with the register bits provides positive or negative indication as to whether the identification bits match the register bits. If the indication is positive, then the memory device is configured to respond as having been selected by a controller. If the indication is negative, then the memory device is configured to respond as having not been selected by the controller. A plurality of outputs release a set of output signals towards a next device.

Abstract: A semiconductor storage device 100 includes a controller package 110 having a BGA terminal on a bottom surface thereof; and one or a plurality of memory packages 120 each including a plurality of semiconductor storage elements and mounted on the controller package. The controller package includes a bottom substrate having the BGA terminal on a bottom surface thereof; a power supply IC, mounted on the bottom substrate, for supplying a plurality of power supplies; and a controller mounted on the bottom substrate and operable by the plurality of power supplies supplied from the power supply IC. The controller provides an interface with an external system via the BGA terminal and controls a read operation from the semiconductor storage elements and a write operation to the semiconductor storage elements.

Abstract: A mechanism is provided in a data processing system for enhancing wiring structure for a cache supporting an auxiliary data output. The mechanism splits the data cache into a first data portion and a second data portion. The first data portion provides a first set of data elements and the second data portion provides a second set of data elements. The mechanism connects a first data path to provide the first set of data elements to a primary output and connects a second data path to provide the second set of data elements to the primary output. The mechanism feeds the first data path back into the second data path and feeds the second data path back into the first data path. The mechanism connects a secondary output to the second data path.

Abstract: A semiconductor device includes: two level shift circuits having substantially the same circuit configuration; an input circuit that supplies complementary input signals to the level shift circuits, respectively; and an output circuit that converts complementary output signals output from the level shift circuits into in-phase signals and then short-circuits the in-phase signals. According to the present invention, the two level shift circuits having substantially the same circuit configuration are used, and the complementary output signals output from the level shift circuits are converted into in-phase signals before short-circuited. This avoids almost any occurrence of a through current due to a difference in operating speed between the level shift circuits.

Abstract: A hierarchical on-chip memory (400) includes an area distributed CMOS layer (310) comprising input/output functionality and volatile memory and via array (325, 330), the area distributed CMOS layer (310) configured to selectively address the via array (325, 330). A crossbar memory (305) overlies the area distributed CMOS layer (310) and includes programmable crosspoint devices (315) which are uniquely accessed through the via array (325, 330). A method for utilizing hierarchical on-chip memory (400) includes storing frequently rewritten data in a volatile memory and storing data which is not frequently rewritten in a non-volatile memory (305), where the volatile memory is contained within an area distributed CMOS layer (310) and the non-volatile memory (305) is formed over and accessed through the area distributed CMOS layer (310).

Abstract: A memory device has multiple bi-directional data paths. One of the multiple bi-directional data paths is configured to transfer data at one speed. Another one of the multiple bi-directional data paths is configured to transfer data at another speed.

Abstract: Power management of an embedded dynamic random access memory (eDRAM) by receiving an eDRAM power state transition event and determining both the current power state of the eDRAM and the next power state of the eDRAM from the power states of: a power-on state, a power-off state, and a self-refresh state. Using the current power state and the next power state to determine whether a power state transition is required, and, in the case that a power state transition is required, transition the eDRAM to the next power state. Power management is achieved because transitioning to a power-off state or self-refresh state reduces the amount of power consumed by the eDRAM as compared to the power-on state.

Abstract: A memory, a system and a method for controlling dynamic burst length control data can generate clocks for both an upstream counter and a downstream counter by using substantially the same latency delayed received command indications. A downstream clock generation circuit generates a clock signal from a received command indication delayed by both a delay locked loop and latency delays stored in latency control circuits. An upstream clock generation circuit generates a clock signal from the received command indication delayed by the delay locked loop and capture indications from the latency control circuits.

Abstract: A memory device includes a die package including a plurality of memory dies, an interface including an interface circuit, and a memory controller to control the interface with control data received from at least one die. The interface is to divide and multiplex an IO channel between the package and the controller into more than one channel using the data received from the at least one die. The interface includes a control input buffer to receive an enable signal through a control pad, a first input buffer to receive first data through a first IO pad in response to a first state of the enable signal, and a second input buffer to receive second data through a second IO pad in response to a second state of the enable signal. The interface further includes an input multiplexer to multiplex the first data and the second data to provide input data.

Abstract: A semiconductor memory apparatus including a test circuit configured for generating compressed data by comparing and compressing data stored in a plurality of memory cells inside a memory bank during a first test mode, and configured for outputting the compressed data as test data to an input/output pad through one selected global line during the first test mode, and the test circuit is configured for transmitting the compressed data to a plurality of global lines during a second test mode, combining the compressed data loaded in the respective global lines during the second test mode, and outputting the combination result as the test data to the input/output pad during the second test mode.

Abstract: A semiconductor memory device includes a plurality of repair fuse units configured to program repair target addresses respectively for repair target memory cells, wherein at least one of the repair fuse units is programmed with data information used for different purposes from the repair target addresses, a plurality of address comparison units each configured to compare an access target address with a corresponding address of the repair target addresses and determine whether to perform a repair operation or not, and a data transfer unit configured to transfer the data information to a corresponding circuit of the semiconductor memory device.

Abstract: A data alignment circuit includes: a select transmission unit configured to selectively transmit a first pulse or ground voltage as a first control pulse and selectively transmit a second pulse or ground voltage as a second control pulse, in response to a control signal; and a data latch unit configured to latch data in response to the first and second pulses and the first and second control pulses, and generate first to fourth data.

Abstract: Methods and apparatus for the encoding of an input sequence of digit data into a sequence of storage cells of a ROM device are disclosed. The input sequence is divided into a first kind of groups and a second kind of groups. A first kind of group comprises a plurality of consecutive first digits, two first kind of groups are separated by a second kind of group, the second kind of group comprises consecutive digits without any consecutive first digits, and the second kind of group has a starting digit which is the second digit. A starting storage cell is programmed to the active state to store the starting digit of the second kind of group. The rest digits of the second kind of group are programmed one digit at a time, based on a shared terminal which has been programmed for the proceeding storage cell.

Abstract: The present invention relates to a semiconductor device, and more particularly, to a semiconductor memory device capable of supplying and measuring an electric current through a pad. The semiconductor device includes a memory cell, a data pad configured to receive data to be programmed into the memory cell or a write current to be supplied to the memory cell from an external device, and output data read out from the memory cell or a cell current flowing from the memory cell to the external device, and a path switching unit configured to set up a path so that the memory cell and the data pad are directly coupled when a test operation is performed.

Abstract: A semiconductor memory storage device comprises an array of storage devices including a plurality of rows of the storage devices and a plurality of columns of the storage devices, a first plurality of write ports, a write select signal coupled to the write ports, a plurality of write port address lines coupled as input to each of the write ports, and a first plurality of word line select circuits coupled to receive an address signal and the write select signal for each of the write ports and to provide a single selected write word line signal to a respective one of the rows of the storage devices for one of the first plurality of write ports activated by the write select signal.

Abstract: A composite, hybrid memory device including a first storage die having an array of volatile storage cells and a second storage die having an array of non-volatile storage cells disposed within an integrated circuit package. The hybrid memory device includes a shared interface circuit to receive memory access commands directed to the first storage die and the second storage die and to convey read and write data between an external data path and the first and second storage dice.

Abstract: A data storage circuit for receiving and holding a data value includes an input stage configured to receive a data value in response to the precharge phase changing to an evaluation phase and to hold the data value during the evaluation phase. An output stage has an output latching element for holding the value, two switching devices for updating the output latching element and an output. The switching devices each being controlled by respective signals from dual data lines, wherein, in response to the data value held in the input stage being a logical one, the first switching device updates the output latching element with a value indicative of the logical one and in response to the data value held in the input stage being a logical zero, the second switching device updates the output latching element with a value indicative of the logical zero.

Abstract: A semiconductor memory device includes: a data transfer line coupled with a plurality of memory cell arrays corresponding to an address; an enable signal delayer configured to generate an enable signal by reflecting a delay amount corresponding to the address into an internal command signal corresponding to a column command; and a data exchange block configured to exchange data with the data transfer line in response to the enable signal.

Abstract: Each of m word lines is connected to n memory cells in a corresponding one of rows of m×n memory cells. Each of n bit lines is connected to m memory cells in a corresponding one of columns of m×n memory cells, and each of n source lines is connected to m memory cells in a corresponding one of columns of m×n memory cells. N first switching elements switch connection states between a reference node and the n bit lines, and n second switching elements switch connection states between the reference node and the n source lines. N third switching elements switch connection states between the write driver and the n bit lines, and n fourth switching elements switch connection states between the write driver and the n source lines.

Abstract: Disclosed is a non-volatile memory data protecting device and method. The non-volatile memory data protecting device that is used for protecting non-volatile memory data when a power is shut down in a system, may include a signal delay unit to delay a drop in voltage of an input/output line, a power shutdown sensor to sense power shutdown of a system, and a controller to control the signal delay unit in response to whether the system is shut down.

Abstract: Memory devices and bulk storage devices configured to program a memory cell to a target threshold voltage representing a data pattern of more than one bit and read the data pattern of more than one bit of the memory cell in a single read operation by generating a signal that is representative of an actual threshold voltage of the memory cell.

Abstract: The present disclosure includes apparatuses and methods related to a data interleaving module. A number of methods can include interleaving data received from a bus among modules according to a selected one of a plurality of data densities per memory cell supported by an apparatus and transferring the interleaved data from the modules to a register.

Abstract: A semiconductor device includes: a non-volatile memory unit; a data bus configured to transfer data outputted from the non-volatile memory unit; a selection signal generation unit configured to generate a plurality of selection signals based on a clock; and a plurality of latch sets configured to each be enabled in response to a selection signal that corresponds to the latch set among the selection signals and store the data transferred through the data bus.

Abstract: An apparatus includes a terminal, a first plurality of driver lines, and a first phase mixer. The driver lines drive the terminal to a first logic state responsive to a first enable signal. The first phase mixer is coupled to a first one of the first plurality of driver lines. The first phase mixer is operable to receive the first enable signal and a first delayed enable signal derived from the first enable signal and generate a first signal on the first driver line having a first configurable delay with respect to the first enable signal by mixing the first enable signal and the first delayed enable signal.

Abstract: A circuit includes a failure address register configured to store a first row address, a row address modifier coupled to the failure address register, wherein the row address modifier is configured to modify the first row address received from the failure address register to generate a second row address. A first comparator is configured to receive and compare the first row address and a third row address. A second comparator is configured to receive and compare the second row address and the third row address. The first and the second row addresses are failed row addresses in a memory.

Abstract: Various embodiments include apparatus, systems, and methods having multiple dice arranged in a stack in which a defective cell may be replaced by a spare cell on the same die or a different die. Other embodiments are described.

Abstract: At least one example embodiment discloses a stacked memory device including a plurality of stacked memory chips, each of the memory chips including a memory array, a plurality of through silicon vias (TSVs) operatively connected to the plurality of stacked memory chips, micro channels configured to access the memory arrays and at least one circuit in each memory chip, the at least one circuit configured to vary a number of the micro channels accessing the memory array.

Abstract: A method of copying a page in a memory device having a plurality of memory blocks and a plurality of sets of bit lines is disclosed, wherein each of the plurality of memory blocks includes a plurality of pages, and each set of bit lines corresponds to a respective memory block, wherein first bit lines of a source memory block that includes a source page are respectively coupled to second bit lines of a target memory block that includes a target page. The method includes disconnecting between the first bit lines of thea source memory block including a source page and from the second bit lines of a the target memory block including a target page; transferring data stored in the source page to the first bit lines of the source memory block; transferring the data from the first bit lines of the source memory block to the second bit lines of the target memory block; and writing the data transferred to the second bit lines of the target memory block into the target page.

Abstract: A semiconductor memory device using a termination scheme in a global data line includes a global data line and a data line drive unit. The global data line transfers data between an interface region and a plurality of core regions each having a memory bank. The data line drive unit is disposed in each of the core regions, and drives the data global line in response to data in a data transfer operation. The data line drive unit sets the global data line to a termination voltage level in a termination operation.

Abstract: A semiconductor apparatus includes a first memory die; a second memory die; and a processor configured to provide an external command, an external start address and an external end address which are associated with a read operation, to the first memory die, and provide an external command, an external start address and an external end address, which are associated with a write operation, to the second memory die, in the case where data stored in the first memory die is to be transferred to and stored in the second memory die.

Abstract: A semiconductor apparatus according to an aspect of the present invention includes first and second bus-interface circuits, a first memory core connected to the first bus-interface circuit through a first data bus, the first memory core being connected to a first access control signal output from the first bus-interface circuit, a second memory core connected to the second bus-interface circuit through a second data bus, and a select circuit that selectively connects one of the first access control signal and a second access control signal output from the second bus-interface circuit to the second memory core.

Abstract: An integrated semiconductor device including: a first semiconductor device having a clock generation section, first data storage sections storing input data as transfer data, data output terminals provided, one for each of the first data storage sections, and a clock output terminal adapted to output a transfer clock; and a second semiconductor device having data input terminals which receive the transfer data, a clock input terminal adapted to receive the transfer clock, second data storage sections associated with the data input terminals respectively to store input data, and selection sections associated with the second data storage sections respectively to select either the transfer data or data shifted and output to the associated second data storage section in a first series circuit which is formed by connecting the second data storage sections in series, the selection sections supplying the selected data to the associated second data storage section.

Abstract: Memory systems include at least one nonvolatile memory array having a plurality of rows of nonvolatile multi-bit (e.g., N-bit, where N>2) memory cells therein. A control circuit is also provided, which is electrically coupled to the nonvolatile memory array. The control circuit is configured to program at least two pages of data into a first row of nonvolatile multi-bit memory cells in the nonvolatile memory array using a first sequence of read voltages to verify accuracy of the data stored within the first row. The control circuit is also configured to read the at least two pages of data from the first row using a second sequence of read voltages that is different from the first sequence of read voltages. Each of the read voltages in the first sequence of read voltages may be equivalent in magnitude to a corresponding read voltage in the second sequence of read voltages.

Abstract: A Random Access Memory (RAM) and method of using the same are disclosed. The RAM includes a plurality of memory cells arranged in columns and in rows with each memory cell coupled to at least one word line and at least one bit line. The RAM includes a plurality of switches with at least one of the switches coupled between two of the memory cells to allow data to be copied from one of the two memory cells to the other of the two memory cells. In another aspect, the two memory cells can be considered a dual bit cell that contains a copying mechanism. There are two interleaved memory planes, assembled from bit cells that contain two bits of information. One bit is the primary bit that corresponds to the normal RAM bit. The second bit is able to receive a copy and hold the primary value. When the copying mechanism is over, the two memory planes may act as two completely independent structures.

Abstract: A compact and versatile sense amp is presented. Among its other features this sense amp arrangement provides a way to pre-charge bit lines while doing data scanning. Another feature is that the sense amp circuit can provide a way to set three different bit line levels used in the quick pass write (QPW) technique using dynamic latch, where quick pass write is a technique where cells along a given word line selected for programming can be enabled, inhibited, or partially inhibited for programming. Also, it can provide a convenient way to measure the cell current.

Abstract: A data transfer device that transfers data to a memory according to an instruction from a processor via a bus through which a response indicating completion of data writing in the memory is not sent back, comprises an inter-memory data transfer control unit including an operation start trigger receiving unit, a parameter acquiring unit, a read unit, and a write unit. When the write unit detects switching of a write destination memory, the write unit confirms write completion as to the memory by a procedure different from writing. When a data transfer instructed by the processor is completed, the write unit confirms write completion as to the write destination memory at the end of the data transfer by the procedure different from writing. The inter-memory data transfer control unit notifies the processor of completion of an inter-memory data transfer based on the confirmation of the write completion.

Abstract: A semiconductor apparatus includes a normal data line, an auxiliary data line and a data line selection unit. The normal data line is connected with a data selection unit. The auxiliary data line is connected with the data selection unit. The data line selection unit outputs data to one of the normal data line and the auxiliary data line in response to a command signal.

Abstract: Embodiments of a memory controller are described. This memory controller communicates signals to a memory device via a signal line, which can be a data signal line or a command/address signal line. Termination of the signal line is divided between an external impedance outside of the memory controller and an internal impedance within the memory controller. The memory controller does not activate the external impedance prior to communicating the signals and, therefore, does not deactivate the external impedance after communicating the signals. The internal impedance of the memory controller can be enabled or disabled in order to reduce interface power consumption. Moreover, the internal impedance may be implemented using a passive component, an active component or both. For example, the internal impedance may include either or both an on-die termination and at least one driver.

Abstract: Methods, memory devices and systems are disclosed. In one embodiment, a non-volatile memory device receives command signals through the same input/output terminals that receive address signals and write data signals and transmit read data signals. The input/output terminals are connected to a multiplexer, which is responsive to a received mode control signal to couple the input/output terminals to either a command bus or an input/output bus. A latch in the memory device latches the command signals when the mode control signal causes the input/output terminals to be coupled to the input/output bus. As a result, the command signals continue to be applied to the command bus. When the mode control signal causes the input/output terminals to be coupled to the input/output bus, write data signals are clocked into the memory device and read data signals are clocked out of the memory device responsive to a received clock signal.

Abstract: A non-volatile semiconductor memory device according to an embodiment includes: a p-type semiconductor substrate; a p-type first p well which is formed in the semiconductor substrate and in which a bit line connecting transistor configured to connect a bit line of a memory cell and a sense amplifier unit is formed; and an n-type first N well which surrounds the first P well and which is configured to electrically isolate the first P well from the semiconductor substrate.

Abstract: A page buffer circuit of a memory device including a plurality of Multi-Level Cells (MLCs) connected to at least a pair of bit lines includes a Most Significant Bit (MSB) latch, a Least Significant Bit (LSB) latch, a data I/O circuit, an inverted output circuit, a MSB verification circuit, and a LSB verification circuit. The MSB latch is configured to sense a voltage of a sensing node in response to a control signal and store an upper sensing data, and output an inverted upper sensing data, or store an input data and output an inverted input data. The LSB latch is configured to sense a voltage of the sensing node in response to the control signal, and store and output a lower sensing data, or store and output an input data received through the MSB latch. The data I/O circuit is connected to the MSB latch and a data I/O line, and is configured to perform the input and output of a sensing data or the input and output of a program data.