Abstract: A memory cell for storing a charge that gives rise to a cell voltage representing a bit value, the memory cell being capable of having the cell voltage boosted to a boost value at a time following reading of the stored charge. The memory cell includes a first capacitor connected between a first node and ground. A second capacitor is connected between a second node and ground, and a first switch is connected between the first node and the second node. A second switch and a third capacitor are connected in series between the first node and the second node, with a terminal of the second switch being connected to the first node, the common connection node of the second switch and the third capacitor comprising a third node. A third switch is connected between the third node and ground. In operation, in a first storage phase the first and third switches are closed and the second switch is open.

Abstract: A semiconductor memory device that can achieve high-speed operation or that is highly integrated and simultaneously can achieve high-speed operation is provided. Transistors are disposed on both sides of diffusion layer regions to which capacitor for storing information is connected and other diffusion layer region of each transistor is connected to the same bit line. When access to a memory cell is made, two transistors are activated and the information is read. When writing operation to the memory cell is carried out, two transistors are used and electric charges are written to the capacitor.

Abstract: An improved memory system incorporates an array of memory cells that are subjected to minimal location dependent power variations and, optionally, allows for bi-directional random access of millions of bits. The system architecture provides a consistent amount of bit line resistance in the write and read paths to each memory cell in the array, independent of position, in order to minimize variations in power delivery to the cells and, thereby, allow for optimal cell distributions. The system architecture further allows current to pass in either direction through the cells in order to minimize element electro-migration and, thereby, extend memory cell life.

Abstract: A double-data-rate two synchronous dynamic random access (DDR2 ) memory circuit includes a low-speed input path and a high-speed input path coupled thereto by an input coupling and forming a common input, the common input coupled to a memory core, the memory core having a common output wherein a high-speed output path and a low-speed output path are coupled together by an output coupling and further coupled to the common output of the memory core.

Abstract: A search engine system (100) is disclosed that can include at least one content addressable memory (CAM) device (102) arranged in a cascade configuration with at least one memory device (104), such as a static random access memory (SRAM). A CAM device (102) and memory device (104) may be connected to one another by point-to-point unidirectional connections. Command data issued by a device, such as a network processing unit (NPU) (110), can flow through all devices beginning with a CAM device (102) and eventually to a memory device (104). A memory device (104) can compare its own current result data with that of a previous device in a flow (such as another RAM device), and generate an output response.

Abstract: An apparatus including a plurality of semiconductor devices coupled via a plurality of circuit paths to store information. Selected circuit paths of the plurality of circuit paths present increased resistance, the increased resistance being sufficient to cooperate with capacitance present in the apparatus to establish a resistive-capacitive (RC) time constant in the selected circuit paths. The RC time constant being appropriate to accommodate a noise signal having a predetermined duration without the apparatus losing stored information.

Abstract: A method for preventing a memory from generating a leakage current is disclosed. The memory includes a boundary memory cell and a neighboring memory cell. The neighboring memory cell is adjacent to the boundary memory cell. The method includes the following step. The first terminal of the neighboring memory cell is connected to the second terminal through a metal line.

Abstract: A phase change memory device includes a memory cell array and a write driver circuit, and a column selection circuit. The memory cell array includes a plurality of block units each connected between a corresponding pair of word line drivers. The write driver circuit includes a plurality of write driver units each comprising a plurality of write drivers adapted to provide respective programming currents to a corresponding block unit among the plurality of block units. The column selection circuit is connected between the memory cell array and the write driver circuit and is adapted to select at least one of the plurality of memory blocks in response to a column selection signal to provide corresponding programming currents to the at least one of the plurality of memory blocks.

Abstract: A semiconductor memory device having: a memory cell array with m memory cells arranged in a first direction and n memory cells arranged in a second direction in a grid, each memory cell having a capacitor part using a ferroelectric film, and also having a first terminal, a second terminal, and a third terminal; two or more first wirings connecting the first terminals of the m memory cells arranged in the first direction; two or more second wirings connecting the second terminals of the n memory cells arranged in the second direction; two or more third wirings connecting the third terminals of the m memory cells, and means for selecting a third wiring from among the third wirings, the third wiring being selected based on the result of calculation in an adder circuit and a subtractor circuit.

Abstract: A basic cell comprises a memory cell capable of retaining data having at least a binary value, a first selecting transistor connected between a first terminal of the memory cell and the Mth bit line, and a second selecting transistor connected between the first terminal of the memory cell and the M+1th bit line. Agate of the first selecting transistor is connected to the 2·N?1th selecting line, and a gate of the second selecting transistor is connected to the 2·Nth selecting line.

Abstract: A DRAM whose operation is sped up and power consumption is reduced is provided. A pair of precharge MOSFETs for supplying a precharge voltage to a pair of input/output nodes of a CMOS sense amplifier is provided; the pair of input/output nodes are connected to a complementary bit-line pair via a selection switch MOSFET; a first equalize MOSFET is provided between the complementary bit-line pair for equalizing them; a memory cell is provided between one of the complementary bit-line pair and a word line intersecting with it; gate insulators of the selection switch MOSFETs and first equalize MOSFET are formed by first film thickness; a gate insulator of the precharge MOSFET is formed by second film thickness thinner than the first film thickness; a precharge signal corresponding to a power supply voltage is supplied to the precharge MOSFET; and an equalize signal and a selection signal corresponding to a boost voltage are supplied to the first equalize MOSFET and the selection switch MOSFET, respectively.

Abstract: In a flat cell read only memory, two bit lines or two virtual ground lines share a common contact such that the contact is slightly adjustable in its location for inserting a local metal word line without increasing the layout area to improve the reading speed of the memory. Moreover, two adjacent banks of the memory share common bit lines or virtual ground lines, whereby reducing the contact density and height of the memory.

Abstract: A magnetic memory array. A first bit line provides a first writing magnetic field to a magnetic memory cell. A second bit line provides a second writing magnetic field to a reference magnetic memory cell. A word line provides a third writing magnetic field to the magnetic memory cell and a fourth writing magnetic field to the reference magnetic memory cell. The third writing magnetic field exceeds the fourth writing magnetic field.

Abstract: A tunnel magnetic resistive element forming a magnetic memory cell includes a fixed magnetic layer having a fixed magnetic field of a fixed direction, a free magnetic layer magnetized by an applied magnetic field, and a tunnel barrier that is an insulator film provided between the fixed and free magnetic layers in a tunnel junction region. In the free magnetic layer, a region corresponding to an easy axis region having characteristics desirable as a memory cell is used as the tunnel junction region. A hard axis region having characteristics undesirable as a memory cell is not used as a portion of the tunnel magnetic resistive element.

Abstract: A dummy SRAM cell for use in a dummy bit line circuit uses the same transistors as used in a standard SRAM cell, which includes first and second subsets of transistors configured as first and second bit line output circuits. The dummy SRAM cell includes the same first and second subsets of transistors, with the first transistors configured as a dummy bit line output circuit having substantially the same electrical characteristics as the first bit line output circuit of the standard SRAM cell. Further, the second transistors, which are not otherwise needed for the dummy SRAM cell function, are reconfigured as a voltage tie circuit for the dummy bit line output. Using the second transistors for this purpose obviates the need to add additional transistors to form a voltage tie circuit for configuring the dummy bit line output circuit as a load or driver for the dummy bit line.

Abstract: A device having an OTP memory is disclosed. A program state of the OTP device is stored at a fuse that is connected in series between a first node and a latch. During a program mode, the first node is electrically connected to a program voltage. During a read mode, the first node is electrically connected to ground, whereby a first divided voltage is generated at a first node of the latch.

Abstract: A double-data-rate two synchronous dynamic random access (DDR2) memory circuit includes a low-speed input path and a high-speed input path coupled thereto by an input coupling and forming a common input, the common input coupled to a memory core, the memory core having a common output wherein a high-speed output path and a low-speed output path are coupled together by an output coupling and further coupled to the common output of the memory core.

Abstract: This invention relates to memory technology and new variations on memory array architecture to incorporate certain advantages from both cross-point and 1T-1Cell architectures. The fast read-time and higher signal-to-noise ratio of the 1T-1Cell architecture and the higher packing density of the cross-point architecture are both exploited by combining certain characteristics of these layouts. A single access transistor 16 is used to read multiple memory cells, which can be stacked vertically above one another in a plurality of memory array layers arranged in a “Z” axis direction.

Abstract: A magnetic memory is disclosed. In one embodiment, the magnetic memory array includes a plurality of cell columns and a pair of reference cell columns, including a first reference cell column and a second reference cell column. A comparator is provided with a first and a second input terminal. A switching circuit is configured to connect each of the cell columns to the first input terminal and the pair of reference cell columns coupled in parallel to the second input terminal, and configured to connect the first reference cell column to the first input terminal and the second reference cell column to the second input terminal.

Abstract: A semiconductor memory device includes at least one data transmission block including data I/O pads arranged in a major-axis side of the semiconductor memory device; a command and address transmission block including address and command input pads arranged in at least one minor-axis side of the semiconductor memory device; a global line block, arranged in a center of the semiconductor memory device, for transmitting inputted command and address; and at least one bank area, arranged between the global line block and the data transmission block, each bank area containing plural data I/O blocks located in a side of the data transmission block and plural control blocks located in a side of the global line block.

Abstract: A semiconductor device includes signal lines over which signals are transferred, and a drive circuit driving the signal lines in operating modes. The operating modes include a dynamic operation mode in which the signal lines are precharged, and a static operation mode in which the signal lines are not precharged.

Abstract: In a multi-port register file of a storage unit within a processor, an improved bitcell design for storing a data bit is disclosed. The bitcell comprises a first set of read bitlines having a first load and a second set of read bitlines having a second load, in which the second load is substantially equal to the first load. The bitcell also comprises a signal driving circuit having a first node and a second node. The first node is connected to the first set of read bitlines and the second node is connected to the second set of read bitlines.

Abstract: A semiconductor memory according to an example of the present invention comprises first and second bit lines having a twisted bit-line architecture in which the first and second bit lines are alternately twisted at a constant period in first and second columns, a first cell block which is disposed in the first column, a first block select transistor which is connected between the first or second bit line and one end of the first cell block, a second cell block which is disposed in the second column, and a second block select transistor which is connected between the second or first bit line and one end of the second cell block.

Abstract: According to one exemplary embodiment, a semiconductor die includes a memory core array situated over a substrate, where the memory core array includes a number of bitlines, where the bitlines can be situated in a first interconnect metal layer in the semiconductor die. The semiconductor die further includes an interconnect structure situated over the memory core array, where the interconnect structure is situated in a second interconnect metal layer in the semiconductor die and situated over each of the bitlines. The interconnect structure can include at least one interconnect line, which can form an angle with respect to the bitlines that can be greater than 0.0 degrees and less than or equal to 90.0 degrees. The interconnect structure can form one of a number of capacitances with each of the bitlines, where each of the capacitances can be substantially equal in value to each other of the capacitances.

Abstract: As part of anti-fuse circuitry for a memory device, a preferred exemplary embodiment of the current invention provides a direct connection between an anti-fuse and a contact pad used to provide voltage to that anti-fuse. The contact pad also serves as a voltage source for at least one other part of the memory device. At least one circuit coupled to the anti-fuse is temporarily isolated from it in the event that a voltage present at the pad would damage the circuit or cause the circuit to improperly read the status of the anti-fuse. The contact pad is available during a probe stage of the in-process memory device, but once the device is packaged, access to that contact pad is prevented. At the back end of the production process, the anti-fuse may be accessed through a second pad, whose electrical communication with the anti-fuse is regulated.

Abstract: The invention includes a stacked magnetic memory structure. The magnetic memory structure includes a stacked magnetic memory structure. The first layer includes a first plurality of magnetic tunnel junctions. A second layer is formed adjacent to the first layer. The second layer includes a second plurality of magnetic tunnel junctions. The stacked magnetic memory structure further includes a common first group conductor connected to each of the first plurality of magnetic tunnel junctions and the second plurality of magnetic tunnel junctions.

Abstract: When a command is input to a semiconductor memory device, a sub-threshold current is reduced to a predetermined value corresponding to the command. After the reduction of the sub-threshold current is completed, the semiconductor memory device starts to operate corresponding to the command.

Abstract: Memory devices configured to reduce coupling noise between adjacent wordlines in a memory array. More specifically, wordline drivers are interleaved such that adjacent wordlines are driven by wordline drivers enabled by different row decoders. Each wordline driver includes a weak transistor to ground and a strong transistor to ground. By disabling the wordline driver on the wordlines directly adjacent to the active wordlines, a path is provided to drive the coupling noise from the active wordline to ground through the strong transistor.

Abstract: A semiconductor device includes signal lines over which signals are transferred, and a drive circuit driving the signal lines in operating modes. The operating modes include a dynamic operation mode in which the signal lines are precharged, and a static operation mode in which the signal lines are not precharged.

Abstract: A quad flat no-lead (QFN) grid array semiconductor package and method for making the same is disclosed. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on the semiconductor die is coupled to the plurality of conductive elements, such as by wire bonding. The semiconductor die and at least a portion of the lead frame are encapsulated in an insulative material, leaving the conductive elements exposed along a bottom major surface of the package for subsequent electrical connection with higher-level packaging. Individual conductive lead elements, as well as the grid array pattern, are formed by wire bonding multiple bond pads to a single lead at different locations and subsequently severing the leads between the bonding locations to form multiple conductive elements from each individual lead.

Abstract: In a SRAM structure, power consumption is reduced by providing a structure which allows specific memory cells to be selected using word lines and column select lines, and reducing the load on the column address lines by dividing the load into sectors. The dividing into sectors is achieved by making use of sector select lines for selecting two or more rows of cells, and logically ANDing the sector select lines with the column select lines.

Abstract: This invention relates to memory technology and new variations on memory array architecture to incorporate certain advantages from both cross-point and 1T-1Cell architectures. The fast read-time and higher signal-to-noise ratio of the 1T-1Cell architecture and the higher packing density of the cross-point architecture are both exploited by combining certain characteristics of these layouts. A single access transistor 16 is used to read multiple memory cells, which can be stacked vertically above one another in a plurality of memory array layers arranged in a “Z” axis direction.

Abstract: An I/O interface circuit immediately close to a bank having a plurality of memory cells and an I/O circuit is directly connected to data line pairs via a switching circuit. Another I/O interface circuit is connected to other data line pairs via switching circuits and data bus pairs. Consequently the number of lines of the data bus pairs provided within the chip of the semiconductor integrated circuit is half of the number in the prior art, and the chip area can be reduced.

Abstract: Disclosed is a bit line precharge signal generator for a memory device, which reduces a resistance component of a signal line by shortening the length of a signal line transferring bit line signals, and reduces an RC time delay. Control signal generator generates a first control signal. A plurality of bit line precharge signal drivers are controlled by first control signal from control signal generator. Each of the bit line precharge signal drivers applies a second signal to the bit line sense amplifier array which is adjacent to bit line precharge signal driver. By using bit line precharge signal generator, a necessary operation is performed within a short time, and unneccessary signal lines are reduced. As a result, a total layout area is reduced.

Abstract: In the first read operation, a read current is supplied to TMR elements connected in parallel in one column or one block to detect initial data. Trial data is then written in a selected memory cell. At the same time of or in parallel with writing of the trial data, the second read operation is performed. In the second read operation, a read current is supplied to the TMR elements connected in parallel in one column or one block to read comparison data. Subsequently, the initial data is compared with the comparison data to determine the data value in the selected memory cell. Finally, rewrite operation is performed for the selected memory cell.

Abstract: A semiconductor memory device that reduces the probability of the penalties of wirings arising. An address input circuit receives an address signal input. A drive circuit drives a memory array in compliance with the address signal. A signal line connects the address input circuit and the drive circuit. A redundant circuit is located near the drive circuit and substitutes other lines including a redundant line for a defective line in the memory array. A defective line information store circuit stores information showing the defective line. A supply circuit supplies information stored in the defective line information store circuit to the redundant circuit via the signal line. This structure enables to transmit an address signal and information regarding a defective line by a common signal line and to reduce the number of wirings and the probability of the penalties of wirings arising.

Abstract: Apparatus and method for data sensing circuitry that uses averaging to sense small differences in signal levels representing data states. The apparatus periodically switches the coupling of input terminals and output terminals of an integrator circuit from a first configuration to a second configuration, where the second configuration changes the polarity of the integrator circuit from the first configuration. The output signals of the integrator circuit are periodically compared, and based on the comparison, output signals having a voltage representative of a value are generated. The values of the output signals are then averaged over time to determine the data state.

Abstract: Apparatus and method for data sensing circuitry that uses averaging to sense small differences in signal levels representing data states. The apparatus periodically switches the coupling of input terminals and output terminals of an integrator circuit from a first configuration to a second configuration, where the second configuration changes the polarity of the integrator circuit from the first configuration. The output signals of the integrator circuit are periodically compared, and based on the comparison, output signals having a voltage representative of a value are generated. The values of the output signals are then averaged over time to determine the data state.

Abstract: A dynamic RAM comprising a plurality of word lines respectively connected to address select terminals of a plurality of dynamic memory cells, a plurality of complementary bit line pairs respectively connected to input/output terminals of the plurality of dynamic memory cells and placed in directions opposite to one another, and a sense amplifier array which is supplied with an operating voltage according to an operation timing signal and comprises a plurality of latch circuits for respectively amplifying the differences in voltage between the complementary bit line pairs. In the dynamic RAM, common electrodes provided in opposing relationship to storage nodes corresponding to connecting points between address select MOSFETs and information storage capacitors of the plurality of dynamic memory cells, on both sides with the sense amplifier array as the center are connected to one another while circuit connections in the sense amplifier array are being ensured by wiring using the common electrodes.

Abstract: A memory array includes a sensing circuit for sensing bit line current while keeping the voltage of the selected bit line substantially unchanged. The word lines and bit lines are biased so that essentially no bias voltage is impressed across half-selected memory cells, which substantially eliminates leakage current through half-selected memory cells. The bit line current which is sensed arises largely from only the current through the selected memory cell. A noise detection line in the memory array reduces the effect of coupling from unselected word lines to the selected bit line. In a preferred embodiment, a three-dimensional memory array having a plurality of rail-stacks forming bit lines on more than one layer, includes at least one noise detection line associated with each layer of bit lines. A sensing circuit is connected to a selected bit line and to its associated noise detection line.

Abstract: The write disturb that occurs in polymer memories may be reduced by writing back data after a read in a fashion which offsets any effect on the polarity of bits in bit lines associated with the addressed bit. For example, each time the data is written back, its polarity may be alternately changed. In another embodiment, the polarity may be randomly changed.

Abstract: A plurality of decoding circuits 1a to 1f are arranged near a plurality of circuit blocks 2 to 7, which are arranged on the semiconductor chip 10 in a scattered manner, and the signal lines 8 prior to decoding, including the address lines and the data lines, are wired to each decoding circuit 1a to 1f. Through these wirings, the number of wirings routed over on the semiconductor chip 10 can be made in accordance with the number of bits of the signal lines 8 alone. So, compared with the past where the signal lines 20, which were great in number after decoding, were routed over to each circuit block 2 to 7, the wiring area as a whole can be greatly reduced. This can lead to miniaturization of chip size, reduction of crosstalk noise, and facilitation of layout.

Abstract: The invention includes a stacked magnetic memory structure. The magnetic memory structure includes a stacked magnetic memory structure. The first layer includes a first plurality of magnetic tunnel junctions. A second layer is formed adjacent to the first layer. The second layer includes a second plurality of magnetic tunnel junctions. The stacked magnetic memory structure further includes a common first group conductor connected to each of the first plurality of magnetic tunnel junctions and the second plurality of magnetic tunnel junctions.

Abstract: A novel bi-level DRAM architecture is described which achieves significant reductions in die size while maintaining the noise performance of traditional folded architectures. Die size reduction results primarily by building the memory arrays with 6F2 or smaller memory cells in a type of cross-point memory cell layout. The memory arrays utilize stacked digitlines and vertical digitline twisting to achieve folded architecture operation and noise performance.

Abstract: A field region forming a transistor is provided in a direction crossing a word line and a bit line. A bit line contact is provided corresponding to each bit line in a row direction. Storage node contacts are provided in alignment corresponding to respective columns in the row direction. The size of a basic cell region for forming a single memory cell can be set to 2·F·3·F. Here, F represents a minimum design size. Accordingly, memory cells in a twin cell mode DRAM storing one bit of data with two memory cells can be reduced in size.

Abstract: A semiconductor memory device includes a data line shift circuit, a plurality of data mask lines connected to the plurality of sense amplifier write circuits, respectively, and a plurality of mask circuits. The plurality of mask circuits each include at least one shift switch circuit and supply a mask signal to a sense amplifier write circuit, which is connected to a mask circuit different from that before a data line is shifted by the data line shift circuit, through the shift switch circuit and supply the mask signal to a sense amplifier write circuit, which is connected to the same mask circuit as that before the data line is shifted, not through the shift switch circuit.

Abstract: A differential amplifier circuit includes a pair of first and second P-type transistors and a pair of first and second enhancement-mode N-type transistors. The first and second P-type transistors have respective gates each connected to the drain of the other P-type transistor, i.e., the first and second P-type transistors are cross-coupled. To respective gates of the first and second N-type transistors, a constant voltage VG (Vth?VG?Vdd) is applied. Currents of different magnitudes respectively are applied to first and second input terminals and the first and second N-type transistors generate voltages on first and second output terminals respectively, according to respective currents flowing through the first and second N-type transistors. The differential amplifier circuit is employed as a sense amplifier of a semiconductor memory device for use in reading data.

Abstract: Apparatus and methods are provided for providing reference voltages during read operations in ferroelectric memories, in which a bitline of a reference array substantially similar or identical to a portion of a ferroelectric data array is precharged and then coupled with a bitline in the data array to provide a reference voltage according to a ratio of a number of reference memory cells along the coupled reference bitline to the number of reference memory cells along the coupled reference bitline plus a number of data memory cells along the coupled data bitline.

Abstract: A circuit for non-destructive sensing of polarized materials includes a signal generator to generate a periodic, alternating voltage signal. The alternating voltage signal is applied to at least one cell of polarized material, such that the cell produces a cell output signal. A synchronous rectifier then rectifies the cell output waveform into positive and negative rectified signals. A differentiating amplifier receives the positive and negative rectified signals and produces an output signal wherein the output signal represents a data state of the cell.

Abstract: A semiconductor memory device having a burn-in test capability. The semiconductor memory device includes a detection circuit, which is connected to the plurality of word lines. The detection circuit detects whether a stress voltage for a burn-in test has been applied to all of the word lines along their entire lengths in the burn-in test.