Abstract: A fuse circuit includes a fuse information signal generation unit and an output driving unit. The fuse information signal generation unit is configured to precharge a fuse information signal in response to a precharge signal and drive the fuse information signal in response to a selection signal capable of cutting a fuse. The output driving unit configured to equally maintain potentials at both terminals of the fuse in response to a control signal.

Abstract: A method of changing a parameter in a semiconductor device is provided. The method includes receiving and storing data in a storage region; and changing at least one between a DC characteristic and an AC timing characteristic of a parameter, used to access a non-volatile memory cell included in a memory core of the semiconductor device, according to the data stored in the storage.

Abstract: A system for correcting programming failures in an M-bit primary array of programmable fuses. The address of the failed fuse is stored in a secondary fuse array. Correction logic coupled to the primary and secondary arrays propagates the programming states of the good fuses, and corrects the programming state of the failed fuse, if any. The correction logic preferably comprises a decoder coupled to the secondary array which produces a one-hot M-bit word representing the failed fuse, and combinatorial logic arranged to receive the programming states of the primary array fuses and the one-hot M-bit word at respective inputs and to produce the correction logic output. Multiple failures can be accommodated using multiple secondary arrays, each storing the address of a respective failed fuse, or a tertiary array which stores the address of a failed fuse in either the primary or secondary arrays.

Abstract: A fuse circuit includes a plurality of fuse sets configured to perform fuse programming and generate fuse signals in response to fuse programming signals and a fuse control unit configured to generate the fuse programming signals depending upon a level of a programming voltage.

Abstract: A fuse device includes a fuse unit, which includes a cathode, an anode, and a fuse link coupling the cathode and the anode. A transistor includes at least a portion of the fuse unit to be used as an element of the transistor.

Abstract: A semiconductor device has an e-fuse module and a programming current generator. The e-fuse module includes an array of electrically programmable e-fuse elements. The programming current generator has a set of reference transistor elements, a selector for actuating the reference transistor elements to generate a selected reference current, and a current mirror for applying a programming current that is a function of the selected reference current to a selected e-fuse element of the array to program the resistance of the e-fuse element.

Abstract: A memory with disabling circuit includes a memory matrix and a disabling circuit. The memory matrix includes a data input/output end and an output enable end. The disabling circuit includes a fuse and an output end. When the fuse is not blown, the disabling circuit transmits the signal of the data input/output end to the output end according to the signal of the output enable end. When the fuse is blown, the disabling circuit generates a tri-state to the output end. Therefore, external circuits cannot perform actions of reading or writing to access the memory matrix.

Abstract: One embodiment provides an error detection method wherein single-bit errors in a memory module are detected and identified as being a random error or a repeat error. Each identified random error and each identified repeat error occurring in a time interval is counted. An alert is generated in response to a number of identified random errors reaching a random-error threshold or a number of identified repeat errors reaching a repeat-error threshold during the predefined interval. The repeat-error threshold is set lower than the random-error threshold. A hashing process may be applied to the memory address of each detected error to map the location of the error in the memory system to a corresponding location in an electronic table.

Abstract: A semiconductor memory device and method of operating same are described. The semiconductor memory device includes a first anti-fuse array having a plurality of first anti-fuse elements that store first fuse data, a second anti-fuse array having a plurality of second anti-fuse elements that store error correction code (ECC) data associated with the first fuse data, and an ECC decoder configured to generate second fuse data by correcting the first fuse data using the ECC data.

Abstract: According to one embodiment, a memory cell is configured using a field effect transistor and includes n anti-fuse elements, one ends of which are connected in common. A program voltage selection circuit selects, out of the n anti-fuse elements, an anti-fuse element to which a program voltage is applied. A sense amplifier is provided for the each memory cell and determines, based on data stored in the n anti-fuse elements, three or more values of readout levels.

Abstract: To include a memory cell array that stores therein data in a reversible manner, an antifuse circuit that stores therein data in a nonvolatile manner, a sense amplifier array that temporarily holds data that is read from the memory cell array of data to be written in the memory cell array, and a control circuit that performs a control for writing the data held in the sense amplifier array in the antifuse circuit. According to the present invention, it is not required to provide any dedicated latch circuit for each antifuse element. Therefore, a writing process of writing data in the antifuse circuit can be performed at high speed without causing an increase of the chip dimension due to a dedicated latch circuit.

Abstract: Disclosed are a circuit and a method for controlling redundancy in a semiconductor memory apparatus. The circuit includes a peripheral circuit redundancy control block and a memory bank redundancy control block. The peripheral circuit redundancy control block buffers and latches an external command to generate an internal command. The peripheral circuit redundancy control block also buffers and latches an external address to generate a global address by comparing the external address with a predetermined output signal of a fuse circuit. The memory bank redundancy control block receives the global address corresponding to the internal command to selectively activate a redundancy word line or a main word line, such that the fuse circuit is provided in the peripheral circuit redundancy control block.

Abstract: A system with a memory device having programmable elements used to configure a memory system. More specifically, programmable elements, such as antifuses, located on a memory device are programmed during fabrication with measured operating parameters corresponding to the memory device. Operating parameters may include, for example, operating current values, operating voltages, or timing parameters. The memory device is incorporated into a system. Once the memory device is incorporated into a system, the programmable elements may be accessed by a processor such that the memory system can be configured to optimally operate in accordance with the operating parameters measured for the memory device in the system.

Abstract: A nonvolatile memory element includes a current controlling element having a non-linear current-voltage characteristic, a resistance variable element which changes reversibly between a low-resistance state and a high-resistance state in which a resistance value of the resistance variable element is higher than a resistance value of the resistance variable element in the low-resistance state, in response to voltage pulses applied, and a fuse. The current controlling element, the resistance variable element and the fuse are connected in series, and the fuse is configured to be blown when the current controlling element is substantially short-circuited.

Abstract: In fuse program circuits, fuse element FS is implemented using metal interconnect at third or higher layer of multilayer metal interconnect. In each fuse program circuit, program information and fuse select information are sequentially transferred using a scan flip-flops, and fuses are selectively and electrically blown one by one. The fuse program circuit provided with fuse elements that can be programmed even after packaging is implemented with low power consumption and a low occupation area.

Abstract: Read and write operations of a non-volatile memory (NVM) bitcell have different optimum parameters resulting in a conflict during design of the NVM bitcell. A single bitline in the NVM bitcell prevents optimum read performance. Read performance may be improved by splitting the read path and the write path in a NVM bitcell between two bitlines. A read bitline of the NVM bitcell has a low capacitance for improved read operation speed and decreased power consumption. A write bitline of the NVM bitcell has a low resistance to handle large currents present during write operations. A memory element of the NVM bitcell may be a fuse, anti-fuse, eFUSE, or magnetic tunnel junction. Read performance may be further enhanced with differential sensing read operations.

Abstract: A program circuit generates first and second currents to program the fuse. The second current is higher than the first current. A control circuit controls generating the first and second currents in succession.

Abstract: A method for programming a programmable block of a power IC device includes selecting an anti-fuse element of the programmable block to be programmed. The anti-fuse element includes first and second capacitive plates separated by a dielectric layer. A voltage pulse is then applied to a pin of the power IC device. The pin is connected to a drain of a high-voltage field-effect transistor (HVFET) that drives an external load via the pin during a normal operating mode of the power IC device. The voltage pulse, which is coupled to the first capacitive plate of the anti-fuse element, has a potential sufficiently high to cause a current to flow through the anti-fuse element that destroys at least a portion of the dielectric layer, thereby electrically shorting the first and second capacitive plates.

Abstract: A first terminal and a second terminal of a FinFET transistor are used as two terminals of an anti-fuse. To program the anti-fuse, a gate of the FinFET transistor is controlled, and a voltage having a predetermined amplitude and a predetermined duration is applied to the first terminal to cause the first terminal to be electrically shorted to the second terminal.

Abstract: The fuse circuit includes a first program unit, a second program unit and a sensing circuit. The first and second program units are programmed simultaneously. The first program unit is programmed in a program mode in response to a fuse program signal and outputs a first signal in a sensing mode, such that the first signal increases when the first program unit is programmed. The second program unit is programmed in the program mode in response to the program signal and outputs a second signal in the sensing mode, such that the second signal decreases when the second program unit is programmed. The sensing circuit generates a sensing output signal in response to the first and second signals, such that the sensing output signal indicates whether or not the program units are programmed.

Abstract: A semiconductor integrated circuit includes: a fuse; a first driving unit configured to drive a sensing node in response to a first fuse sensing signal; a second driving unit configured to drive the sensing node in response to a second fuse sensing signal, wherein the second driving unit and the fuse form a driving path; a bypass resistor unit connected in parallel with the fuse; and a sensing unit configured to sense a programming state of the fuse in response to a voltage of the sensing node.

Abstract: A repair circuit having a repair controller which is capable of reducing unnecessary current dissipation by interrupting a control operation to redundant cells that are unused for replacement of defective cells is presented. The repair circuit includes a repair controller and a repair signal generator. The repair controller is configured to generate a first drive voltage, a second drive voltage and a repair control signal depending on whether or not a defective cell exists. The repair signal generator driven by the first and second drive voltages in which the repair signal generator is configured to generate a repair signal, for repairing the defective cell, in response to receiving the repair control signal and an external address.

Abstract: Architecture, system and method for providing compression of repair data in an IC design having a plurality of memory instances. In one embodiment, the repair data storage method includes determining repair data for each of the memory instances and compressing the repair data into a compressed format that is stored in a shared nonvolatile storage common to the memory instances.

Abstract: Memories, memory repair logic, and methods for repairing a memory having redundant memory are disclosed. One such memory includes programmable elements associated with respective redundant memory configured to have memory addresses mapped thereto, the programmable elements configured to be programmed with at least portions of the memory addresses. Such a memory further includes repair logic coupled to the programmable elements and configured to identify programmable elements available for programming to map memory addresses to respective redundant memory. One method for remapping a memory address of a memory to redundant memory includes receiving at least a portion of a memory address to be remapped to redundant memory, determining whether a programmable element associated with the redundant memory is available for programming, and when a programmable element is available, programming the programmable element such that the memory address will be mapped to the associated redundant memory.

Abstract: A microprocessor includes a first plurality of fuses, a predetermined number of which are selectively blown. Control values are provided from the fuses to circuits of the microprocessor to control operation thereof. A second plurality of fuses are blown with the predetermined number of the first plurality of fuses that are blown and a Boolean complement of the predetermined number. In response to being reset, the microprocessor: reads the predetermined number and the Boolean complement of the predetermined number from the second plurality of fuses, Boolean complements the predetermined number read from the second plurality of fuses to generate a result, compares the result with the Boolean complement of the predetermined number read from the second plurality of fuses, and prevent itself from fetching and executing user program instructions if the result does not equal the Boolean complement of the predetermined number read from the second plurality of fuses.

Abstract: A microprocessor includes a first plurality of fuses selectively blown with control values, a second plurality of fuses selectively blown collectively with an error correction value computed from the control values, control hardware that receives the control values and provides them to circuits of the microprocessor for controlling operation thereof. A state machine, serially coupled to the control hardware and to the fuses, serially scans the control values from the first fuses to the control hardware and serially scans the control values and the error correction value to a first register. The microprocessor reads the control values and error correction value from the first register, detects and corrects an error in the control values using the error correction value, writes the corrected control values to a second register, and causes the state machine to serially scan the corrected control values from the second register to the control hardware.

Abstract: An electric fuse cutoff control circuit controlling cutoff of a plurality of electric fuses including: a cutoff information storage circuit adapted to store cutoff information about whether or not each of the plurality of electric fuses is cut off; a cutoff information control circuit controlling the cutoff of the plurality of electric fuses based on an output signal of the cutoff information storage circuit; and a cutoff information renewal circuit receiving an output signal of the cutoff information control circuit and renewing the cutoff information set for the cutoff information storage circuit.

Abstract: A semiconductor device includes a first terminal, a second terminal, and a fuse link that connects between the first terminal and the second terminal. The first terminal and the fuse link have a polysilicon layer doped with an impurity ion and a layer containing a metal element laminated on the polysilicon layer. The second terminal has a polysilicon layer not doped with an impurity ion and a layer containing a metal element laminated on the polysilicon layer, in at least a part of an end side connected to the fuse link.

Abstract: A semiconductor device includes a fuse element, a read-out circuit that reads out a memory content of the fuse element in response to a first internal reset signal that is activated in response to transition of an external reset signal, and a latch circuit that holds therein the memory content read out by the read-out circuit and is reset by a second internal reset signal that is activated based on an activation period of the external reset signal. With this configuration, even when the activation period of the external reset signal is long, the time for which a current flows through the fuse element can be shortened, thereby making it possible to reduce a current consumption at the time of a reset operation.

Abstract: A fuse circuit includes a control signal generation unit configured to generate a control signal that is enabled after a moment when a power-up signal is enabled, a potential control unit configured to control potentials of both ends of a fuse in response to the control signal, and a fuse output unit configured to be initialized in response to the power-up signal and output a fuse signal in response to whether the fuse is cut or not.

Abstract: To provided a relief-address generating circuit that generates relief address information based on plural data bits supplied in time sequence via a first terminal from outside and a programming circuit that writes into any one of fuse sets the relief address information generated by the relief-address generating circuit. With this configuration, repetition of a programming operation by the total number of the fuse sets at the maximum completes a series of write processing on relief address information. Therefore, it is possible to reduce the time required for a series of write processing on relief address information.

Abstract: A semiconductor memory device includes a first anti-fuse element and a second anti-fuse element, respectively composed of a transistor, wherein the first anti-fuse element and the second anti-fuse element are configured so as to be concomitantly programmable, respectively formed in P-wells on a substrate, and the adjacent P-wells are isolated by N-wells of an opposite conductivity type, formed therebetween.

Abstract: Programmable anti-fuse circuitry including at least one anti-fuse cell having a first anti-fuse device coupled between a supply voltage and a first node and a second anti-fuse device coupled between the first node and a ground voltage, and control logic coupled to the first node and arranged to generate a programming voltage having one of at least a first voltage level for breaking-down the first anti-fuse device but not the second anti-fuse device and coupling the first node to the supply voltage; and a second voltage level for breaking-down the second anti-fuse device but not the first anti-fuse device and coupling the first node to the ground voltage.

Abstract: A memory system including a one time programmable (OTP) memory is provided. The memory system further includes a write enable verification circuit including an asymmetric inverter stage and a symmetric inverter stage coupled at a node. The write enable verification circuit is configured to receive a write enable signal. When the write enable signal changes from a first voltage level to a second voltage level, a voltage at the node changes at a first rate and wherein when the write enable signal changes from the second voltage level to the first voltage level, the voltage at the node changes at a second rate higher than the first rate. The write enable verification circuit is further configured to generate a verified write enable signal for enabling programming of the OTP memory.

Abstract: A redundancy circuit includes at least one fuse set circuit and a fuse control circuit. The at least one fuse set circuit includes a plurality of fuse cells, each of the plurality of fuse cells having a first transistor and a second transistor having same sizes. The first transistor has a first contact resistance and the second transistor has a second contact resistance different from the first contact resistance. Each of the plurality of fuse cells stores a fuse address indicating a defective cell in a repair operation and outputs a repair address corresponding to the stored fuse address. The fuse control circuit, connected to the plurality of fuse cells, controls the plurality of fuse cells in response to a program signal and a precharge signal such that the corresponding fuse address is stored in each of the fuse cells.

Abstract: A semiconductor memory device includes a repair control signal generation unit configured to compare a repair target address programmed corresponding to a repair target memory cell with an external address, and generate a repair control signal. an address decoding unit configured to control a normal memory cell or a redundancy memory cell corresponding to the external address to be accessed in response to the repair control signal and an internal active signal, and an activation interval detection unit configured to generate an interval detection signal by detecting a time interval between an activation timing of the repair control signal and an activation timing of the internal active signal in a test operation mode.

Abstract: The number of fusible links and other circuit components required to provide memory cell redundancy are reduced by sharing physical memory locations among address banks that store memory addresses. Non-trial and error algorithms and techniques determine the number of addresses and the number of identical least significant bit (LSB) values that can share the same physical memory location. By sharing physical locations for identical LSB values, circuit hardware on a memory device (including fusible links and compare circuitry) is reduced. Thus, less die area is needed to provide the same degree of redundancy.

Abstract: Provided is an integrated circuit including: multiple memory cells; a redundant memory having a function of repairing a defective cell included in the multiple memory cells by placing a corresponding fuse among multiple fuses into a first state; a fuse data conversion circuit that generates first information of a first defective cell based on position information of the fuse placed into the first state corresponding to the first defective cell having been repaired; a repair data generation circuit that generates, upon detection of a second defective cell as a result of a test for the multiple memory cells, repair information for repairing the second defective cell according to the first information and second information of the second defective cell; and a fuse state change circuit that places a predetermined fuse among the multiple fuses into the first state according to the repair information generated by the repair data generation circuit.

Abstract: A memory device includes an antifuse. The antifuse is configured to program a bit cell of the memory device.

Abstract: A semiconductor memory device includes a reference voltage generator for generating a plurality of reference voltages each having different voltage levels in response to a self refresh enable control signal, and a voltage comparator for generating a result signal that controls a self refresh operation cycle by comparing each of the plurality of reference voltages with a temperature information voltage that represents an internal temperature of an integrated circuit.

Abstract: Described are embodiments of an invention for blocking write access to memory modules of a solid state drive. The solid state drive includes a controller access module or a memory access module that controls write access to the solid state drive and the memory modules of the solid state drive. Upon determining that a memory module has failed, the failed memory module or the entire solid state memory device is configured to be read only to prevent an errant write of data over critical data. Further, a failed memory module, or solid state device memory having a failed memory module, may be replaced upon failure.

Abstract: An integrated circuit containing memory includes IEEE 1149.1 (JTAG) controlled self-repair system that permits permanent repair of the memory after the integrated circuit has been packaged. The JTAG controlled self-repair system allows a user to direct circuitry to blow fuses using an externally supplied voltage to electrically couple or isolate components to permanently repair a memory location with JTAG standard TMS and TCK signals. The system may optionally sequentially repair more than one memory location using a repair sequencer.

Abstract: A multi-level electrical fuse system comprises at least one fuse box having at least one electrical fuse, a programming device serially coupled to the electrical fuse, and a variable power supply coupled to the fuse box and configured to generate two or more voltage levels.

Abstract: In a method of manufacturing a semiconductor device, element properties of an element property extraction pattern formed on a semiconductor wafer is extracted as element properties of a current control element corresponding to the element property extraction pattern. A supply energy to the current control element is set which is formed between nodes on the semiconductor wafer, based on the extracted element properties. The set supply energy is supplied to the current control element to irreversible control an electrical connection between the nodes through the device breakdown by the current control element.

Abstract: An anti-fuse circuit includes an anti-fuse coupled to a sensing node, a driving unit configured to rupture the anti-fuse in response to a rupture enable signal, an anti-fuse status detecting unit configured to output an anti-fuse status detecting signal in response to a voltage at the sensing node corresponding to a rupture status of the anti-fuse, and a sensing current supplying unit configured to supply sensing current to the sensing node in response to a rupture sensing signal.

Abstract: Semiconductor devices include a plurality of fuses and a plurality of program circuits, respective ones of which are configured to program respective ones of the plurality of fuses. The devices further include a shift register configured to activate at least two of the program circuits. In some embodiments, the shift register includes a first shift register configured to generate first select signals and a second shift register configured to generate second select signals corresponding to data to be programmed to the plurality of fuses. Respective ones of the program circuits may be configured to program respective ones of the fuses responsive to respective pairs of the first select signals and the second select signals.

Abstract: A non-volatile memory cell and associated programming methods that allow for integration of non-volatile memory with other CMOS integrated circuitry utilizing standard CMOS processing. The non-volatile memory cell includes an antifuse element having a programming node and a capacitor element coupled to the antifuse element and configured to provide one or more voltage pulses to the programming node. The antifuse element is configured to have a changed resistivity after the programming node is subjected to the one or more voltage pulses, the change in resistivity representing a change in logic state. The antifuse element comprises a MOS transistor, its gate being coupled to one of the programming node and a control node, and its source and drain being coupled to the other one of the programming node and the control node. The MOS transistor is formed in a well and the source, drain and well are coupled to the same voltage level.

Abstract: A sense margin is improved for a read path in a memory array. Embodiments improve the sense margin by using gates with a lower threshold voltage in a read column multiplexer. A cross coupled keeper can further improve the sense margin by increasing a voltage level on a bit line storing a high value, thereby counteracting leakage on the “high” bit line.

Abstract: A fuse circuit includes a fuse unit configured to drive an output terminal via a current path including a fuse in response to a fuse enable signal; and a comparison unit configured to be activated in response to an activation signal for comparing a reference voltage having a predetermined level with a voltage level of the output terminal to generate a fuse state signal.

Abstract: A skew signal generator is provided which comprises a fuse signal generating unit for generating a plurality of fuse signals, and an encoder for generating skew signals including skew information of a wafer by encoding the fuse signals.