Abstract: Nondestructive examination is performed on a composite aircraft component including a composite body and a conductive medium. The conductive medium is substantially more conductive than the composite body. The nondestructive examination includes applying an electromagnetic field that penetrates the composite body and heats the conductive medium, and creating a thermal image of the conductive medium to reveal conductivity information about the conductive medium.

Abstract: A method of analyzing thermal stress includes calculating a distribution of the number of fillers in a composite integrally molded product by using physical property values of resin material containing fillers, and determining a coefficient of linear expansion of the resin material in the composite integrally molded product, that is used as an input condition of a thermal stress analysis, based on the distribution of the number of the fillers.

Abstract: A system and method are provided for detecting fluid invasion of an annular space in a pipe structure. The system includes a thermal element and a temperature sensing element placed in the vicinity of each other in the annular space of the pipe structure. A thermal signal is generated by the thermal element. The temperature sensing element is connected to a monitor that monitors and processes the thermal signal. As the thermal signal changes when conducted through different types of fluids, the invasion of an annular space by seawater that normally contains oil or gas may be reliably detected.

Abstract: An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.

Abstract: A method for determining parameters of a component using thermography, where at least one component is heated by a hot gas, is provided. Also provided is a device for determining component parameters using thermography, including a device for heating at least one component and a temperature sensor for detecting at least one temperature value of the component, wherein the device for heating the component is a hot gas emission device for the emission of a modulated, mostly pulsed, hot gas.

Abstract: A temperature sensor (10) includes: a temperature-sensing portion for measuring a temperature of an object (50) by contacting the object; and a supporting portion for supporting the temperature-sensing portion from a side opposite to a contact surface, the supporting portion having a space at a portion partially corresponding to the temperature-sensing portion. A temperature controller includes: a temperature control device; the temperature sensor (10) for measuring the temperature by contacting the object (50); and a controller for controlling the temperature control device. The controller includes: a mounting-state judging means for judging a mounting-state of the object (50); a switching means for switching a control gain and a target temperature of the temperature control device based on the judging result; and a control-command generating means for generating a control command based on the control gain, the target temperature and a measurement value of the temperature sensor (10).

Abstract: A system for detecting defects in a combustion duct of a combustion system of a combustion turbine engine while the combustion turbine engine operates, wherein the combustion duct comprises a hot side, which is exposed to combustion gases and, opposing the hot side, a cold side. In one embodiment, the system comprises: a photodetector aimed at the cold side of the combustion duct, the photodetector being configured to detect a visible change to the cold side of the combustion duct.

Abstract: Methods and apparatus for wafer temperature measurement and calibration of temperature measurement devices may be based on determining the absorption of a layer in a semiconductor wafer. The absorption may be determined by directing light towards the wafer and measuring light reflected from the wafer from below the surface upon which the incident light impinges. Calibration wafers and measurement systems may be arranged and configured so that light reflected at predetermined angles to the wafer surface is measured and other light is not. Measurements may also be based on evaluating the degree of contrast in an image of a pattern in or on the wafer. Other measurements may utilize a determination of an optical path length within the wafer alongside a temperature determination based on reflected or transmitted light.

Abstract: An internal combustion engine includes an exhaust gas feedstream flowing past a gas sensing device disposed therein. The gas sensor includes an integrated electrical heating element which provides a resistance indicative of its temperature. An unknown input observer is used to determine the exhaust gas feedstream temperature based on the heating element temperature.

Abstract: Apparatus and methods for testing the thermal endurance of a glass substrate of a photovoltaic module are provided. The apparatus generally includes, in one embodiment, a testing chamber defining an interior space having an interior atmosphere. A refrigeration unit is operably positioned with the testing chamber to control the interior atmosphere's temperature. A mounting system is positioned within the interior space of the testing chamber and configured to hold the photovoltaic module while exposing the glass substrate of the photovoltaic module. An edge cooling system is positioned in relation to the mounting system such that the photovoltaic module held by the mounting system has a first side edge in contact with the edge cooling system. A light system is also positioned within the interior space of the testing chamber to illuminate the glass substrate of the photovoltaic module.

Abstract: A non-destructive test using cryogenic temperatures is capable of detecting defects in materials that result from residual stress from manufacturing and from retained austenite. The subject materials or parts that are subjected to cryogenic temperatures approaching and below˜?300° F., ?184° C., 89° K, thereby causing permanent deformations or characteristic changes in the material if excessive residual stress, retained austenite or discontinuities exist. To determine the extent of changes, a first metric of the subject material is determined, the material is then subjected to cryogenic cooling thereby triggering any deformation or characteristic changes. Subsequent to the cryogenic cooling, the subject material may be returned to a second temperature whereby a second metric representing based on the same characteristic of the subject material is determined The comparison of the first and second metrics reveals the deformation or change resultant from the defect.

Abstract: Methods and apparatus for measuring substrate uniformity is provided. The invention includes placing a substrate in a thermal processing chamber, rotating the substrate while the substrate is heated, measuring a temperature of the substrate at a plurality of radial locations as the substrate rotates, correlating each temperature measurement with a location on the substrate, and generating a temperature contour map for the substrate based on the correlated temperature measurements. Numerous other aspects are provided.

Abstract: A method for predicting the drop impact resistance of a stretch-blow molded polypropylene container which comprises the steps of measuring the initial size of the container, placing it in an oven, remeasuring its size after removing it from the oven, calculating the percentage difference in size of the container and determining its drop impact resistance, which is proportional to said difference.

Abstract: An apparatus that allows for the testing of multiple wraps of cable in environments of varying temperature, pressure, and in different fluids in a single apparatus, and can be tested against the varying loads the cable may encounter is disclosed. In the illustrative embodiment of the present invention, the multiple wraps of cable are simulated by layering electrically-insulated portions of the cable on top of one another inside an environmentally controlled container. This container has two parts: a thermally-insulated container and a pressure container.

Abstract: A non-destructive evaluation system and method is provided for detecting flaws in an object. The system includes a lamp for impinging the object with optical pulses and a focal plane array camera configured to capture the images corresponding to evolution of heat due to an impact of the optical pulses in the object. The system also includes an image acquisition system for capturing data corresponding to the images from the focal plane array camera. Both transmission mode imaging and reflection mode imaging techniques are used in an exemplary embodiment. A time of flight analysis system is also provided for analyzing the data from both transmission mode imaging technique and reflection mode imaging technique. The data from transmission mode imaging is used to determine thickness values at different points in the data and for determining location of flaws using the thickness values. The data from reflection mode imaging is used for determining depth of these flaws.

Abstract: The disclosure generally relates to method and apparatus for predicting the steady state temperature of solid state devices, preferably under transient conditions. An apparatus according to one embodiment of the disclosure includes a thermocouple for detecting temperature of the solid state system; a processor in communication with the thermocouple and programmed with instructions to: construct an initial curve for the solid state system, the initial curve having a shape; obtain a plurality of theoretical temperature curves for the solid state system; select one of the plurality of theoretical temperature curves having a shape closest to the shape of the initial curve; and superimposing the selected theoretical temperature curve on the initial curve to predict the steady state temperature.

Abstract: A novel computer program product and method for thermally characterizing a device used for cooling an electronic device is disclosed. A cooling device, being operated, is thermally coupled to a heat pipe having a surface to receive a test chip. A heater is patterned on a circuitry side of the test chip. The heater is separate from operational circuitry of the test chip. A localized heat source is applied to at least one region on a test chip thermally coupled to the heat pipe to locally heat more than one region on a second surface of the test chip to test more than one hot spot. The second surface is the circuitry side of the test chip. The heater provides a bias heat to the test chip, independent of operating the test chip, while the localized heat source is selectively applied directly to the test chip. A temperature detector is used to measure a temperature distribution on the second surface of the test chip.

Abstract: What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.

Abstract: Method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.

Abstract: A method for optimizing direct wafer bond line width for reduction of parasitic capacitance in a MEMS device by reducing the width of a bond line between a first and a second wafer, exposing the MEMS device to a water vapor for a predetermined time period and at a first temperature capable of evaporating water, cooling the MEMS device at a second temperature capable of freezing the water, and operating the MEMS device at a third temperature capable of freezing the water to determine if there is discontinuity during operation.

Abstract: A method for the thermographic inspection of nonmetallic materials, particularly coated nonmetallic materials, is provided. The method includes heating at least one part of the surface of the nonmetallic material, preferably a part of the surface furnished with a nonmetallic coating, by a short energy pulse, preferably a light pulse, or by periodic input of heat, and recording the temporal and spatial temperature profile at least at a plurality of successive time points.

Abstract: A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform.

Abstract: A method and apparatus for measuring a substrate temperature during a thermal process are provided. In one embodiment, an apparatus for measuring a substrate temperature during a thermal process includes an evacutable chamber, a substrate heater positioned to heat a substrate disposed in the chamber, and a sensor positioned to receive energy transmitted through the substrate while the substrate is heated by the substrate heater, wherein the sensor is configured to detect a metric indicative of transmittance. In another embodiment, a method for measuring a substrate temperature includes heating a substrate disposed in a chamber, detecting a change in transmittance of the substrate while heating, and determining a temperature of the substrate based on the change in transmittance.

Abstract: A performance testing apparatus for a heat pipe includes a heating set, a cooling set, and a supporting set supporting the heating set and the cooling set thereon. Position and orientation of the heating and cooling sets on the supporting set are adjustable. The heating set includes a first immovable portion and a first movable portion cooperatively defining a first channel therebetween for receiving an evaporating section of the heat pipe. A temperature sensor is exposed to the first channel for detecting temperature of the evaporating section. A cooling set includes a second immovable portion and a second movable portion cooperatively defining a second channel therebetween for receiving a condensing section of the heat pipe. A temperature sensor is exposed to the second channel for detecting temperature of the condensing section of the heat pipe.

Abstract: Provided is a method of identifying crystal defect regions of monocrystalline silicon using metal contamination and heat treatment. In the method, a sample in the shape of a silicon wafer or a slice of monocrystalline silicon ingot is prepared. At least one side of the sample is contaminated with metal at a contamination concentration of about 1×1014 to 5×1016 atoms/cm2. The contaminated sample is heat-treated. The contaminated side or the opposite side of the heat-treated sample is observed to identify a crystal defect region. The crystal defect region can be analyzed accurately, easily and quickly without the use of an additional check device, without depending on the concentration of oxygen in the monocrystalline silicon.

Abstract: A heat control apparatus for a circuit includes: a heat detecting unit which acquires the heat generation condition of a semiconductor integrated circuit from an inspection image obtained by capturing an image of the semiconductor integrated circuit by an image capturing sensor; and a cooling control unit which controls a cooling means for cooling the semiconductor integrated circuit in accordance with the acquired heat generation condition.

Abstract: Method and apparatus are provided for detecting a defect in a cold plate, configured for cooling an electronics component. The method includes: establishing a first fluid flow through the cold plate, the first fluid flow being at a first temperature; impinging a second fluid flow onto the interface surface, the second fluid flow being at a second temperature, the first temperature and the second temperature being different temperatures; obtaining an isotherm mapping of the interface surface of the cold plate while the first fluid flow passes through the cold plate and the second fluid flow impinges onto the interface surface; and using the isotherm mapping to determine whether the cold plate has a defect. In one embodiment, an infrared-transparent manifold is employed in impinging the second fluid flow onto the interface surface, and the isotherm mapping of the interface surface is obtained through the infrared-transparent manifold.

Abstract: A method and a system of testing electronic components assemblies, each assembly comprising a multiplicity of tracks, each connecting a multiplicity of ports. The system may enable applying heat energy upon at least one part of the at least one track; measuring energy diffusion within a predefined time interval of the heated part of the track; calculating at least one distribution energy diffusion profile associated according to the measured diffusion, where the profile represents the diffusion of energy versus time; and identifying defects in the at least one track, according to the analysis of the diffusion profile.

Abstract: A method for detecting surface discontinuities in a test specimen. The method includes applying a one or more substances including a detection medium to the test specimen wherein the detection medium enters at least one surface discontinuity in the test specimen. The specimen surface is monitored for discontinuity signatures produced by the detection medium. The monitoring includes monitoring the detection medium to detect a temperature differential indicative of a surface discontinuity in the test specimen wherein the discontinuity signatures include a warm signature emitted by the detection medium that has entered the surface discontinuity.

Abstract: A pulse of heat or cold is applied and conducted transversely through a ball grid array device and a printed circuit board via a selected one of the solder joints between them. Heat diffused through the other solder joints is neutralized by a thermal bias shield. The shield is then removed and a thermographic image of the printed circuit board is taken. The process is repeated for each solder joint, and the images are compared to identify defective solder joints.

Abstract: The invention relates to a method for testing a rotor blade (13.1) of a wind power plant (1), which sweeps across a rotor blade surface to be covered during operation of the wind power plant, comprising the following steps: emitting a target light beam (20), in particular a target light beam having a power density, in a direction of the target light beam onto the rotor blade surface to be covered; detecting a possible reflection of the target light beam by a detection device at a point of incidence (16) on the rotor blade; electrically controlled emission of a measurement laser beam (21) which has a power density that is larger than the power density of the target light beam immediately after detection of the reflection at the point of incidence so that the rotor blade is heated at the point of incidence; measuring a temperature distribution at the point of incidence; and repeating the steps (a) to (d) for several points of incidence.

Abstract: Wafer temperature is measured as a function of time following removal of a heat source to which the wafer is exposed. During the wafer temperature measurements, a gas is supplied at a substantially constant pressure at an interface between the wafer and a chuck upon which the wafer is supported. A chuck thermal characterization parameter value corresponding to the applied gas pressure is determined from the measured wafer temperature as a function of time. Wafer temperatures are measured for a number of applied gas pressures to generate a set of chuck thermal characterization parameter values as a function of gas pressure. A thermal calibration curve for the chuck is generated from the set of measured chuck thermal characterization parameter values and the corresponding gas pressures. The thermal calibration curve for the chuck can be used to tune the gas pressure to obtain a particular wafer temperature during a fabrication process.

Abstract: A thermoacoustic tomographic method for imaging an object, wherein the object is thermally excited by a source and the acoustic waves from the object, which are caused by the thermal excitation, from different directions of the object are detected using at least one detector and an image of the object is reconstructed from the detected acoustic waves and the positional information, wherein the acoustic waves detected by the detector are integrated at least in one direction over a length of at least ?{square root over (8)}·d, where d denotes the maximum distance from a point of the object to be imaged to the detector.

Abstract: In one aspect of the invention a drywell includes a heated receiver for receiving a temperature probe. The receiver has upper and lower ends and an inner shield positioned around the receiver to define a first air channel extending between the upper and lower ends. A flow plate is positioned above the upper end of the receiver and extends outwardly from the receiver. The flow plate defines a plate opening positioned over the receiver opening and has a lower surface sloping away from the receiver with distance above the receiver. A blower positioned below the lower end of the receiver induces air flow through the air channel. The lower surface of the flow plate directs the air flow away from the temperature probe.

Abstract: The estimation method of the invention for estimating the deteriorations of a magneto-resistive effect device by heat shocks involves applying heat shocks by laser irradiation to a structure including a thin-film magnetic head comprising a magneto-resistive effect device to propagate them to the magneto-resistive effect device, thereby causing the deteriorations of the magneto-resistive effect device. Thus, (1) the deterioration mode phenomenon of “local overheating plus vibration” can be imitated in a simple yet very approximate state so that a device likely to undergo characteristics deteriorations due to the thermal asperity problem can be detected early at an initial fabrication process stage, and (2) what specifications a head device structure less likely to offer the thermal asperity problem is in can be judged at a product development stage.

Abstract: A method of sensing the temperature of a heated object includes obtaining past temperature data relating to the heated object, capturing a thermal image of the heated object, obtaining a reference temperature of the heated object, and calculating a normalized hotspot temperature.

Abstract: A thermal analysis equipment includes a thermal analysis data preservation function that preserves, as thermal analysis data, signals from a temperature sensor and a physical quantity sensor that detect a temperature and a change in physical quantity, respectively, of a sample. An electromagnetic-wave data acquisition control function controls acquisition of electromagnetic wave data in accordance with setting of a trigger to acquire the electromagnetic wave data. An electromagnetic-wave data preservation function preserves the electromagnetic wave data. An electromagnetic-wave data correlation function correlates the preserved electromagnetic wave data to a position on the thermal analysis data when the trigger is set.

Abstract: A thermal analysis apparatus possesses a temperature sensor measuring a temperature of a heating furnace inside, a temperature program setter which can set a temperature program and outputs a temperature program signal, a temperature control section adjusting a supply electric power to a heater in compliance with a difference between the temperature program signal and a detection signal of the temperature sensor, a processor section calculating an air flow rate corresponding to a program temperature, and a mass flow controller which adjusts an air flow rate supplied to the heating furnace inside in compliance with a signal of the air flow rate calculated by the processor section. In the processor section, operation expressions calculating the air flow rate are set so as to differ respectively in a higher temperature side and a lower temperature side than a predetermined boundary temperature.

Abstract: A method and arrangement for determining the capacity of a heat exchanger is provided. The effective heat transfer coefficient for the heat exchanger is calculated from the measured inlet and outlet temperatures of the product and the measured inlet and outlet temperatures of the auxiliary medium. By means of the value, the outlet temperature of the product set for maximum flow of the auxiliary medium is determined as that at which the change in the heat content of the product is at least approximately the same as the change in the heat content of the auxiliary medium and the amount of heat transmitted by the heat exchanger for the product flow. The value is displayed to the user and permits a decision as to how much longer the heat exchanger can reliably be operated.

Abstract: A method of measuring the coefficient of thermal expansion of a ceramic material, including the steps of applying a glaze to a substantially densified refractory body, wherein the coefficient of thermal expansion of either the glaze or the body is known, bonding the glaze to the body, putting the glaze insufficient tension to induce crazing, measuring the average distance between cracks in the crazed glaze; and determining the unknown coefficient of thermal expansion of the glaze or body.

Abstract: A method of finding defects in sealing material formed as a frame line on a glass plate includes irradiating the frame line of sealing material. A temperature of the irradiated sealing material is measured and a change of the temperature caused by a nonuniformity in sealing material is detected. Another aspect features a method of hermetically sealing a thin film device between glass plates. Sealing material is dispensed on a cover glass plate in the form of a frame line cell. The sealing material is pre-sintered onto the cover glass plate and cooled. A laser beam is moved around the frame line on the sealing material. A temperature of the sealing material contacted with the laser beam is measured. A change in the temperature (?T) caused by a nonuniformity in the sealing material is measured. Further aspects include a feedback process, infrared imaging and use of delta temperature data to increase sensitivity of temperature measurement data.

Abstract: A method for processing thermographic data is disclosed including thermally disturbing a sample collecting, as a function of time, thermal data from said sample, converting the collected data using a 2nd derivative function, and transforming the converted data using at least one Boolean operation.

Abstract: A method for detecting defect in a weld seam during laser welding. The method includes performing a two-dimensionally locally resolved detection of radiation that is emitted by a solidified molten mass that is adjacent to a liquid melting bath. The method also includes determining at least one characteristic value for heat dissipation in the solidified molten mass by evaluating the detected radiation along at least one profile-section of the solidified molten mass, and detecting a defect in the weld seam by comparing the at least one characteristic value with at least one reference value.

Abstract: A thermal testing apparatuses for a server system (22) includes a heating module (16), at least one temperature sensor (191), a micro control unit (MCU) (192), a trigger controlling circuit (193) and a display module (20). The heating module heats airflow at an entry of the server system. The temperature sensor senses temperature at the entry of the server system, and outputs temperature signals. The MCU receives temperature signals and converts them to temperatures in degrees. The trigger controlling circuit is electrically connected to the MCU to receive a controlling signal, and controls turning the heating module on or off. The display module is electrically connected to the MCU for showing the temperatures in degrees.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a heating member therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

Abstract: A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.

Abstract: A method for evaluating the thermal exposure of a selected metal component which has been exposed to changing temperature conditions is described. The voltage distribution on a surface of the metal component, or on a metallic layer which lies over the component, is first obtained. The voltage distribution usually results from a compositional change in the metal component. The voltage distribution is then compared to a thermal exposure-voltage model which expresses voltage distribution as a function of exposure time and exposure temperature for a reference standard corresponding to the metal component. In this manner, the thermal exposure of the selected component can be obtained. A related device for evaluating the thermal exposure of a selected metal component is also described.

Abstract: The object is to provide a laser processing apparatus, a laser processing temperature measuring apparatus, a laser processing method, and a laser processing temperature measuring method which can highly accurately detect the processing temperature when carrying out processing such as welding with laser light. A laser processing apparatus 1A for processing members. DR, UR to be processed by irradiating the members with laser light LB comprises a laser (semiconductor laser unit 20A) for generating the laser light LB; optical means for converging the laser light LB generated by the laser onto processing areas DA, UA; and a filter 30, disposed between the members DR, UR to be processed and the optical means, for blocking a wavelength of fluorescence generated by the optical means upon pumping with the laser light LB; wherein light having the wavelength blocked by the filter 30 is used for measuring a temperature of the processing areas DA, UA.

Abstract: What is disclosed is an apparatus for determining the cooling characteristics of a cooling device used for transferring heat from an electronic device. The apparatus comprising a cooling device thermally coupled to a heat pipe. The heat pipe having an exposed surface for the selective application of heat thereon. A localized heat source is selectively applied to at least one region of the exposed surface. The heat source preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the cooling device.