Abstract: A method and apparatus for thermographically evaluating the bond integrity of a sputtering target assembly is described. The method includes applying a heating or cooling medium or energy to one surface of the assembly and acquiring a graphic recording of a corresponding temperature change on the opposing surface of the assembly using an imaging device. Also described is a method of mathematically analyzing the pixel data recorded in each frame to produce an integrated normalized temperature map that represents the bond integrity of the assembly.

Abstract: A thermal imaging system and method for quantitative thermal mapping of a scene. The system comprises a thermal imaging device, a heat source of known temperature and emissivity located within the scene viewed by the thermal imaging device and a processor adapted to generate a calibrated temperature map of the scene from the data supplied by the thermal imaging device, based on the known temperature of the heat source. This enables accurate temperature measurements to be made using inexpensive uncooled Focal Plane Array detectors.

Abstract: An inspection apparatus includes a light source positioned to direct light to a first surface of a workpiece. An infrared detector is positioned to receive radiation from the first surface. A data acquisition and processing computer is coupled to the light source and the infrared detector. The computer triggers the light source to emit the light a number of instances. The computer acquires thermal data from the infrared detector for a number of times after each of the instances. The computer is configured to process the data using a theoretical solution to analyze the thermal data based upon an average of the thermal data for a number of each of corresponding ones of the times from different ones of the instances.

Abstract: Embodiments may include a method and an apparatus for inducing degradation through temperature cycling of a solder joint or a component on a surface mount printed wiring board (SMPWB) coupon. The coupon may include alternating layers of dielectric material and conductive material stacked one upon another and a heating trace mounted on a surface of the SMPWB or between layers of dielectric material. A first value indicative of a temperature of the heating trace may be determined based on a measured electrical resistance of the heating trace. A difference between the first value and a second value indicative of a desired temperature of the heating trace may be determined. A particular current and a particular voltage may be applied to the heating trace based on the determined difference between the first value and the second value.

Abstract: A mechanism is provided for detecting a defect in a populated sample having a thickness dimension substantially smaller than the length and width dimensions thereof, the populated sample having a first side and an opposite second side, at least said first side of said populated sample having one or more Surface Mounted Components. The mechanism exploits a standard thermographic image which may be used in a detection method comprising 1) directing a thermal wave at said second side of said populated sample 2) recording a thermographic image of the first side of said populated sample once a surface thereof reaches a predetermined transit temperature or a predetermined transit time period has elapsed; and 3) analysing the obtained thermographic image by comparing the so obtained thermographic image with a standard thermographic image.

Abstract: An automated ball mounting process is disclosed in which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are standard solder balls. If they do not melt they are lead free solder balls. Solder balls that are input into the automated ball mounting process are automatically tested to determine solder ball type. When the test indicates that the wrong type of solder ball is being used an error message is indicated and the solder ball mounting process stops.

Abstract: A method is provided for measuring the cooling curve of melts and/or the heating curve of melt samples with an optical fiber, wherein an immersion end of the optical fiber having an at least partially free surface is surrounded with a spacing by a temperature-resistant sample-receiving chamber. The optical fiber is immersed with its immersion end in the melt, and a sample is thereby formed in the sample-receiving chamber. The sample-receiving chamber with the sample and the optical fiber are thereafter pulled out of the molten metal. The cooling curve of the sample and/or, after previous solidification of the sample, the temperature profile during heating is measured with reference to a signal obtained by the optical fiber and forwarded to a measurement device. In addition, a corresponding device is provided for the measuring method.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe needing to be tested. A movable portion is capable of moving relative to the immovable portion. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

Abstract: First and second thermal sensors measure the respective temperatures of portions of a surface of a structure such as an aircraft component. An alert signal is emitted if the temperatures of the surface portions are substantially different. An energy source causes heat flow within the structure. Subsurface flaws such as disbonded areas between composite layers and foreign materials obstruct heat flow within the structure and cause proximate surface portions to exhibit different temperatures. A non-alert signal may be emitted if the temperatures of proximate surface portions are essentially the same.

Abstract: A computer-implemented method for automated thermal computed tomography includes providing an input of heat, for example, with a flash lamp, onto the surface of a sample. The amount of heat and the temperature rise necessary are dependent on the thermal conductivity and the thickness of the sample being inspected. An infrared camera takes a rapid series of thermal images of the surface of the article, at a selected rate, which can vary from 100 to 2000 frames per second. Each infrared frame tracks the thermal energy as it passes from the surface through the material. Once the infrared data is collected, a data acquisition and control computer processes the collected infrared data to form a three-dimensional (3D) thermal effusivity image.

Abstract: Provided is a method of identifying crystal defect regions of monocrystalline silicon using metal contamination and heat treatment. In the method, a sample in the shape of a silicon wafer or a slice of monocrystalline silicon ingot is prepared. At least one side of the sample is contaminated with metal at a contamination concentration of about 1×1014 to 5×1016 atoms/cm2. The contaminated sample is heat-treated. The contaminated side or the opposite side of the heat-treated sample is observed to identify a crystal defect region. The crystal defect region can be analyzed accurately, easily and quickly without the use of an additional check device, without depending on the concentration of oxygen in the monocrystalline silicon.

Abstract: Systems and methods for thermographically inspecting a composite material or honeycombed type structures are disclosed. In one embodiment, a system includes a thermal heat source configured to be either removably coupled to or positioned proximate to the composite material to generate a localized thermal field in a selected area of the composite material. A thermal imaging device generates a visible image of the generated thermal field.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion to detect the temperature of the evaporating section of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.

Abstract: An ambient temperature control apparatus used for measuring ambient temperature. The apparatus has a bottom plate, a panel fitting apparatus, an external mask, and a temperature control device. The panel fitting apparatus is disposed on the bottom plate and is suitable for use to fix a liquid crystal panel. The external mask is detachably mounted on the bottom plate to form a cavity, in which the panel fitting apparatus and the liquid crystal panel are enclosed. The external mask includes at least a window allowing the photometer to measure the liquid crystal panel therefrom. The temperature control device mounted to the external mask is suitable to control the temperature variation of the cavity.

Abstract: A method and equipment for checking a support device such as used in an elevator installation. The method and equipment detects reductions in cross-section of the tensile supports in the support device by heating the tensile supports with electrical current flow and determining the temperature at surface of surrounding sheathing. An increase in the temperature from an original measurement is an indicator of damage to the tensile supports.

Abstract: A leak detector for mixed heat exchangers. In mixed heat exchangers it is important to monitor leaks from the liquid flows to the gas flows since liquid can damage delicate machinery. A barrier is mounted on the gas side of the heat exchanger. The barrier contains at least two thermometers, one of which is thermally isolated from the gas flow inside of the barrier, and another which is in contact with the barrier. When cooler water droplets and vapor enter the gas flow they will come into contact with the barrier. This will lower the measured temperature dramatically in the thermometer which is in contact with the barrier, while the isolated thermometer will not have its measured temperature quickly lowered by the leak. Therefore a different in the measurement in the change in temperature of the thermometers will indicate a leak in the heat exchanger.

Abstract: In a method for detecting defects in sheet metal segments of electric generators and motors, wherein between the sheet metal pieces of the sheet metal segment an electric insulating layer is arranged, respectively, and wherein between the sheet metal segments a cooling channel is provided, respectively, magnetic induction is generated within the sheet metal segments by applying externally a magnetic field and the temperature of the heat generated within the sheet metal segment is measured in the cooling channel.

Abstract: A active thermographic method for detecting subsurface defects in a specimen, particularly kissing unbond defects, includes heating a specimen, applying a force to the surface of the specimen to shift and separate the walls of the defect, and obtaining thermographic images of the specimen over time to monitor the heat flow through the specimen and detect thermal discontinuities. Because kissing unbond defects normally have good physical contact, and therefore good thermal conductivity, between its walls, these defects can go undetected in conventional active thermographic methods. By distorting the surface of the specimen, the kissing unbond defect is enlarged enough to generate sufficient thermal contrast for the defect to appear in the thermographic images.

Abstract: A flaw inspection system (10) contains a substrate (12) to be inspected, such as a generator tube wall, a rotor of a generator, an aircraft skin, having or thought to have interior defects (24, 26) such as stress cracks, where the substrate (12) has attached reference blocks (14, 16) also containing defects (18, 20) of the type that might be found in the substrate, where an ultrasonic generator (28) emits sound waves (30) which contact all the defects, causing heat (32) which is sensed by a thermal camera (50) which, in association with a controller (54) causes images (60, 62) to appear on a monitor (52) from which the type and number of defects (24, 26) in the substrate (12) can be determined.

Abstract: A printer is provided with a buffer to receive document data. Document data is read from the buffer by a control system and information is printed by one or more printhead assemblies in accordance with document data read by the control system from the buffer. The printer operates to print a first set of document data whilst simultaneously receiving second document data. Thus different documents may be printed without pausing.

Abstract: An apparatus for non-destructively testing the response of a specimen to temperature change. An embodiment temperature cycles a specimen, such as a wet mortar beam, dynamically measuring change in dimension and the temperature of the specimen during the cycle. Among other elements, the apparatus employs an accelerometer, a thermistor, a thermocouple, a temperature controller, linear variable differential transducers (LVDTs), an FFT device, a data logger and a heat tape controller. A typical cycle involves using liquid nitrogen to reduce the temperature in an insulated test chamber from ambient to less than ?60° C. and returning to ambient by dispersing the nitrogen with a source of ambient air. Further, in select embodiments, the apparatus measures fundamental frequencies induced by a micro-hammer as measured transversely along a dimension of a specimen during the cooling-warming cycle. Also provided is a method for testing specimens using devices representative of embodiments of the present invention.

Abstract: A method for detecting leaks in a plugged honeycomb structure includes directing a gas at a first end face of the honeycomb structure at a temperature that is different from a temperature of the honeycomb structure and observing a temperature distribution at a second end face of the honeycomb substrate using an infrared detector, wherein the gas directed at the first end face of the honeycomb structure emerges preferentially at the second end face of the honeycomb structure at locations where the cells in the honeycomb structure are defective and appear as thermal spots in the temperature distribution.

Abstract: The invention relates to a method and to a device (1) for testing materials by determining and displaying as an image temperature differences above a threshold value on the surface of test objects (8). In a first step, a camera for determining and displaying as an image the temperature differences above a threshold value is used to determine the temperatures of object elements (22) within a test area (14) of the test object (8) facing the camera. The test area (14) is then provided with heat by beam (4) in such a manner that the temperature of the surface of the test object (8) rises in the test area (14) by at least of the threshold value. The object elements (22) are displayed as image elements in such a manner that the temperature differences above the threshold value between the object elements (22) are visible. The cool-down of the test area (14) is indicated by means of the image elements (20).

Abstract: A method of infrared thermography is described. The invention utilizes a high resolution infrared thermography system and associated computer in conjunction with a test chamber to determine heat transfer coefficients and film effectiveness values from a single test.

Abstract: An area of a substrate is imaged with and without heating, to obtain a hot image and a cold image respectively. The hot and cold images are compared with one another to identify one or more locations as being defective, e.g. if the result of comparison at one location differs significantly relative to other locations. The comparison results in all locations form a differential image, and in several embodiments a number of differential images are obtained by repeatedly heating, imaging and comparing. In such embodiments, multiple differential images are averaged at each location, to improve the signal to noise ratio. Pump and probe lasers may be used for heating and for illumination respectively, or alternatively a single laser may be employed to generate both pump and probe beams.

Abstract: An accelerated weathering apparatus of the type used to concentrate solar radiation upon test specimens includes a frame supporting a reflecting solar concentrator disposed in opposition to a target board. A channel is connected to the target board and includes a cover to define a chamber. A fluid source is in communication with the chamber, whereby a fluid introduced into the chamber reacts with the test specimens in order to accelerate degradation of the test specimens during exposure to concentrated solar radiation. Cooling apparatus contiguous with the test specimens may also be included.

Abstract: A device for measuring the flux received by a specimen in fire test apparatuses has a copper disk or plate of the same dimensions and the same type of surface coating as a typical material specimen, an embedded heating coil and thermocouple, and an insulated sample holder similar to that used for a specimen. The transient response of the embedded thermocouple is measured for several different levels of imposed incident radiation without electrical heating and for several different known levels of electrical heating without any imposed radiation. The principle of Electrical Substitution Radiometry (ESR) is applied, and the transient responses to incident radiation and electrical heating under identical thermal conditions are compared to determine the amount of incident radiation that is actually absorbed by the device while it is being irradiated. The situations are kept thermally identical, thereby insuring that all effects due to heat losses (e.g. convection, radiation and conduction) are exactly the same.

Abstract: Heat is applied to a conductive structure that includes one or more vias, and the temperature at or near the point of heat application is measured. The measured temperature indicates the integrity or the defectiveness of various features (e.g. vias and/or traces) in the conductive structure, near the point of heat application. Specifically, a higher temperature measurement (as compared to a measurement in a reference structure) indicates a reduced heat transfer from the point of heat application, and therefore indicates a defect. The reference structure can be in the same die as the conductive structure (e.g. to provide a baseline) or outside the die but in the same wafer (e.g. in a test structure) or outside the wafer (e.g. in a reference wafer), depending on the embodiment.

Abstract: The present invention relates to processes and systems for locating coated cooling holes on parts such as turbine vanes. In a first embodiment of the present invention, a thermal imaging technique is utilized to obtain the locations of the cooling holes on a turbine vane. In a second embodiment of the present invention, a laser scanning technique is utilized to obtain the locations of the cooling holes on a turbine vane.

Abstract: The non-invasive corrosion sensor includes a heat sink, at least two peltiers, a reference standard and a data acquisition device. Each peltier has a negative side and a positive side, and each peltier communicates with the heat sink such that the negative side of each peltier is maintained at a common temperature. The reference standard communicates with the positive side of one of the peltiers while the test piece communicates with the positive side of the other peltier; and the data acquisition devise is able to record and compare the differences in temperatures between the test piece and the reference standard. A higher temperature in the test piece than in the reference standard indicates the presence of corrosion. The differences in temperatures of the test piece and the reference standard are obtained via electrical currents in the peltiers.

Abstract: A combined heater and heat sink assembly regulates the temperature of a device under test. The combined heating/cooling assembly includes a heater assembly inlay that is received within a heat sink. The heater assembly includes a heating surface that is coplanar with a cooling surface of the heat sink. In operation, the heating/cooling assembly provides concurrent hot and cold contact points for the device under test. The heater assembly is thermally insulated from the heat sink such that the majority of the heat generated by the heater assembly is directly applied to the device under test; very little of the generated heat is lost to the heat sink. On the other hand, the heat sink provides a relatively low thermal resistance between the device under test and a cold source such as a coolant. Accordingly, the combined heating/cooling assembly provides parallel thermal paths between the device under test and both a hot source and a cold source.

Abstract: The temperature of the tread surface part of a tire is increased by running the tire in contact with a drum. The increase in the temperature of the tread surface part is due to the heat of friction between the tread surface part and the drum. Because large increases in temperature indicate that the friction is causing a large amount of wear, it is possible to forecast with ease the amount of wear of the tire from the increase in temperature of the tread surface part. The temperature of the tread surface part can be measured using a thermography machine, and the wear in the tread can be determined by looking at an image that shows the temperature.

Abstract: An ambient temperature control apparatus used for measuring ambient temperature. The apparatus has a bottom plate, a panel fitting apparatus, an external mask, and a temperature control device. The panel fitting apparatus is disposed on the bottom plate and is suitable for use to fix a liquid crystal panel. The external mask is detachably mounted on the bottom plate to form a cavity, in which the panel fitting apparatus and the liquid crystal panel are enclosed. The external mask includes at least a window allowing the photometer to measure the liquid crystal panel therefrom. The temperature control device mounted to the external mask is suitable to control the temperature variation of the cavity.

Abstract: A method facilitates inspection of a component surface. The method comprises positioning a surface of the component to be inspected in an optical path of at least one infrared radiation detector, heating the component surface using electromagnetic radiation to cause an increase in radiance from a defect present at the component surface, and detecting temperature variations within the component surface using the at least one infrared radiation detector, such that the surface irradiance is measured at predetermined locations across the component surface. The method further comprises detecting cracks in the component by analyzing radiation transient response data received by the infrared radiation detector, and correlating the temperature variations to the radiation transient response data to determine a depth of the detected cracks.

Abstract: A method and apparatus for detecting contaminants in an ion-implanted wafer by annealing and activating the ion-implanted wafer by heating or charging or both, and measuring the thermal wave absorbance generated from the activated wafer.

Abstract: An apparatus for measuring the temperature of workpieces transported on a conveyor is disclosed. In one broad aspect of the invention, the apparatus includes a translatable assembly which has a pick-up tool for picking up workpieces and a temperature-sensing device which is in proximity to the pick-up tool for measuring the temperature of the workpiece. Other embodiments are disclosed, including eliminating the pick-up tool, provided the temperature sensing device travels with the workpiece. Scanners can be utilized to designate the largest of the workpieces to be measured or for detecting overlapping workpieces. Feedback temperature control is achieved by varying a parameter, such as conveyor speed or a heat engine temperature. Also, a modeling module can be incorporated to assist with temperature control of the workpieces.

Abstract: A combined laser and infra red sensing camera is located beneath the reactor head in the vicinity of the closure head tube welds by manipulating known robotic device handling the laser which is used to heat a line along the surface thereby generating a thermal wave that propagates over the one to two square inch test area where the increased thermal resistance of cracks and anomalies makes the surface temperature profile gradient greater at a crack or anomaly. An IR camera captures the test area image of interest as the thermal wave propagates across the target inspection area and the image is processed and enhanced to show cracks and other anomalies as a sharp drop in the thermal scan at the point of the crack using known Photo Thermal NDE technology to convert the scan into a pictorial representation of the scanned surface clearly showing any cracks therein. This process is repeated sequentially until the entire circumference of the weld is scanned.

Abstract: A method is provided, the method comprising measuring at least one parameter characteristic of processing performed on a workpiece in a processing step, and modeling the at least one characteristic parameter measured using a correlation model. The method also comprises applying the correlation model to modify the processing performed in the processing step.

Abstract: A need exists in the art for a method of generating junction temperatures for multiple-chip packages that takes into account the non-linearity of thermal systems, improves accuracy, and allows more than one multiple-chip package to be measured without again determining the power distribution ratio of each device. To meet this need, the invention includes a method of generating junction temperatures in a multiple-chip package by heating a single chip in the multiple-chip package, measuring the change in temperature of each chip in the multiple-chip package, storing the measured temperature change of each chip, and repeating the heating, measuring, and storing steps for each chip in the multiple-chip package.

Abstract: A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a thermal stimulation on the object; capturing a sequence of consecutive infrared images of the object to record heat diffusion resulting from the heat pulse; comparing the heat diffusion on said object to a reference; and determining whether the object comprises any defects. Also described is a system comprising a mounting for mounting the object; a thermal stimulation module for applying a thermal stimulation to the bottom surface of the object; an infrared camera for capturing infrared images of the object on the top surface of the object to record a change in infrared radiation from the top surface resulting from the thermal stimulation; and a computer for comparing the change in infrared radiation within a region on the top surface to a reference and determining whether the object comprises any defects.

Abstract: Described are methods and systems for providing improved defect detection and analysis using infrared thermography. Test vectors heat features of a device under test to produce thermal characteristics useful in identifying defects. The test vectors are timed to enhance the thermal contrast between defects and the surrounding features, enabling IR imaging equipment to acquire improved thermographic images. In some embodiments, a combination of AC and DC test vectors maximize power transfer to expedite heating, and therefore testing. Mathematical transformations applied to the improved images further enhance defect detection and analysis. Some defects produce image artifacts, or “defect artifacts,” that obscure the defects, rendering difficult the task of defect location. Some embodiments employ defect-location algorithms that analyze defect artifacts to precisely locate corresponding defects.

Abstract: In accordance with one aspect of the disclosure, a method of sensing the temperature of a molten metal vehicle is provided. In one exemplary embodiment, the method includes utilizing at least one thermal imager located to the side of the molten metal during the dispensing of the molten metal and capturing at least one thermal image for determining the rotational position of the molten metal vehicle by calculating an area of the molten metal.

Abstract: A combined laser and infra red sensing camera is located beneath the reactor head in the vicinity of the closure head tube welds by manipulating known robotic device handling the laser which is used to heat a line along the surface thereby generating a thermal wave that propagates over the one to two square inch test area where the increased thermal resistance of cracks and anomalies makes the surface temperature profile gradient greater at a crack or anomaly. An IR camera captures the test area image of interest as the thermal wave propagates across the target inspection area and the image is processed and enhanced to show cracks and other anomalies as a sharp drop in the thermal scan at the point of the crack using known Photo Thermal NDE technology to convert the scan into a pictorial representation of the scanned surface clearly showing any cracks therein. This process is repeated sequentially until the entire circumference of the weld is scanned.

Abstract: This invention provides an apparatus for nondestructive residential inspection and various methods for using a thermal imaging apparatus coupled to inspect exterior residential components, interior residential components, a pitched roof and basement of a residential building and the electrical system of a residential building.

Abstract: A system and a method are provided for detecting fiber damage in a dialyzer. The system may have a device which may transmit a gas into an interior of a fiber within a dialyzer. The temperature of the gas may be different than a temperature of the dialyzer. A thermal imaging camera may detect a temperature difference at a surface of the fiber where the gas may be escaping. The thermal imaging camera may be connected to a monitor which enables a user to view a location of the difference in temperature. As a result, the user may locate the damaged area of the fiber. The user may then repair the damaged area.

Abstract: A method and device for photothermal imaging tiny metal particles which are immersed in a given medium like a living cell deposited onto a transparent glass slide. The given medium and immersed tiny metal particles are illuminated through separate phase reference laser beam and sensitive probe laser beam, with the sensitive probe laser beam including a heating laser beam undergoing through impingement on the given medium slight phase changes induced by photothermal effect due to a local heating, in the absence of any substantial phase changes to the phase reference laser beam. Illuminating is performed by focusing the separate phase reference and sensitive probe laser beam through the transparent glass slide at a given depth within the given medium and a transmitted phase reference laser beam and a transmitted sensitive probe laser beam undergoing the slight phase changes are generated.

Abstract: The invention is a synchronized electronic shutter system (SESS) and method for same side and through transmission thermal analysis and inspection of a material for finding defects, corrosion, disbond defects, integrity of a weld and determination of paint thickness. The system comprises an infrared detector that acquires background images of the sample. A shutter then covers the detector and lamps rapidly heat the sample above ambient temperature. Shutters cover all lamps at the same time the shutter over the infrared detector is opened. The infrared detector acquires a series of temperature images over time radiated from the sample as the sample cools down. After collecting a series of temperature images taken by the SESS, a processed image is developed using one of the group comprising time derivative calculation, temperature normalization data reduction routine, thermal diffusivity curve fitting and averaging the series of temperature images.

Abstract: A method and apparatus for detecting, locating, isolating and controlling variations in the manufacturing process by transient thermography. A heat source (200) imparts heat to a surface which is radiated in the infrared region. Infrared sensors (204, 206, 208, 210) are coupled to a processor which tracks the physical characteristics of the sample, and provides feedback to a central process controller to make adjustments to the manufacturing process. The sample can be a continuous product such as a green powder metal sheet or tobacco product.

Abstract: An accelerated weathering test apparatus for concentrating solar radiation upon at least one test specimen including a target board, a reflector device, an air circulation device, a feedback device, an input device and a controller. Ambient air is circulated over the target board to cool the test specimens. The controller continuously sets a dynamic set point based on the reference signal from the input device which is representative of a complex temperature cycle of a material end-use application and adjusts the rate of air circulation based on a test signal from the feedback device.

Abstract: A system employing thermographic techniques is provided for inspecting materials and detecting defects therein such as void, inclusions, interlaminar disbonds, or porosity. The system utilizes a composite material and a source of pulsed current which is delivered to conductive elements within the composite material which, in turn, heats the material being inspected allowing thermographic techniques to be employed to measure the temperature distributions related to the application of the heat source and indicative of the defects of the material being measured.