Including Wafer Charging Or Discharging Means For Vacuum Chamber Patents (Class 414/939)
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Patent number: 8485771Abstract: In a load port apparatus, a door driving mechanism that supports a door through a communication opening portion leading to a mini-environment is housed in a housing chamber that is in communication with the mini-environment through the communication opening portion. Exhaust opening portions are provided in the upper portion of a wall of the housing chamber that is opposed to the communication opening portion and a bottom wall of the housing chamber. Thus, gas passages from the mini-environment to the housing chamber and then to the external space are formed. Thus, dust in the load port apparatus is removed.Type: GrantFiled: September 13, 2010Date of Patent: July 16, 2013Assignee: TDK CorporationInventors: Mutsuo Sasaki, Hitoshi Suzuki, Koichiro Oikawa
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Patent number: 8480346Abstract: The goal of the present invention is to provide an apparatus capable of cooperation with at least one piece of wafer processing equipment. The apparatus is connected to a first equipment via a first opening, to a wafer transport case via a second opening and to a second piece of equipment via a third opening. The apparatus is capable of removing a basket of parallel stacked trays of wafers from a wafer transport case. The apparatus is capable of placing and supporting the wafers in order to move them to the first equipment through the second opening and to the second piece of equipment through the third opening.Type: GrantFiled: July 7, 2009Date of Patent: July 9, 2013Assignee: Alcatel-LucentInventors: Erwan Godol, Emmanuelle Veran
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Patent number: 8462008Abstract: A system and method for introducing a substrate into a process chamber is provided. A presence or absence of a substrate on a stage in an apparatus for manufacturing a semiconductor or a flat panel display may be determined by lift pins used for loading and unloading a substrate, the introduction of another substrate may be prevented and a broken state or the erroneously loaded state of the substrate may be detected. An opening or closing of a gate valve may also be determined, and the introduction of a substrate into the process chamber may be prevented while the gate valve is closed.Type: GrantFiled: February 25, 2010Date of Patent: June 11, 2013Assignee: ADP Engineering Co., Ltd.Inventor: In Taek Lee
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Patent number: 8462009Abstract: A system and method for introducing a substrate into a process chamber is provided. A presence or absence of a substrate on a stage in an apparatus for manufacturing a semiconductor or a flat panel display may be determined by lift pins used for loading and unloading a substrate, the introduction of another substrate may be prevented and a broken state or the erroneously loaded state of the substrate may be detected. An opening or closing of a gate valve may also be determined, and the introduction of a substrate into the process chamber may be prevented while the gate valve is closed.Type: GrantFiled: February 25, 2010Date of Patent: June 11, 2013Assignee: ADP Engineering Co., Ltd.Inventor: In Taek Lee
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Patent number: 8459922Abstract: A substrate processing system including a housing for housing at least part of a processing device, at least one target affixed to the processing device, the processing device having a first processing device reference point in a known relationship with the at least one target, at least one transmitter located within the housing and configured to transmit an identification signal identifying the at least one transmitter to the at least one target and a controller operably connected to the at least one target and the at least one transmitter, the controller being configured to receive data signals, based on the identification signal, from one of the at least one target and the at least one transmitter and control an operational characteristic of the processing device, based on the data signals.Type: GrantFiled: December 31, 2009Date of Patent: June 11, 2013Assignee: Brooks Automation, Inc.Inventor: Martin Hosek
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Publication number: 20130142594Abstract: An apparatus comprises a process chamber, and a loadlock connected to the process chamber. The loadlock is configured to have a wafer holder disposed therein. The wafer holder is configured to store a plurality of wafers, and is configured to transport the plurality of wafers away from the loadlock.Type: ApplicationFiled: December 1, 2011Publication date: June 6, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shao-Yen Ku, Ming-Jung Chen, Tsu-Yang Chung, Chi-Yun Tseng, Jui-Ping Chuang
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Patent number: 8454293Abstract: A substrate processing apparatus having a station for loading and unloading substrates from the apparatus, includes an aperture closure for sealing a loading and unloading aperture of the station, a fluidic magazine door drive for removing a door of a substrate magazine and thus opening the substrate magazine and for operating the aperture closure to open the aperture, and sensor for mapping vertical locations of substrates mounted to the magazine door of the drive. The fluidic magazine door drive may include an encoder different from the sensor, the encoder being configured for determining the vertical location of the sensor.Type: GrantFiled: March 15, 2010Date of Patent: June 4, 2013Assignee: Brooks Automation, Inc.Inventors: Ulysses Gilchrist, David R. Beaulieu, Peter F. Van der Meulen
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Patent number: 8444364Abstract: An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.Type: GrantFiled: December 10, 2010Date of Patent: May 21, 2013Assignee: Orbotech LT Solar, LLC.Inventors: Wendell Thomas Blonigan, Masato Toshima, Kam S. Law, David Eric Berkstresser, Steve Kleinke, Craig Lyle Stevens
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Patent number: 8439623Abstract: Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include linear semiconductor processing facilities for vacuum-based semiconductor processing and handling, as well as linkable or extensible semiconductor processing facilities that can be flexibly configured to meet a variety of constraints.Type: GrantFiled: May 10, 2006Date of Patent: May 14, 2013Assignee: Brooks Automation, Inc.Inventor: Peter van der Meulen
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Patent number: 8425172Abstract: A reticle manipulating device comprising a housing capable of having a controlled environment wherein at least one processing module is connected to the housing and capable of processing a reticle. A transport apparatus is connected to the housing for transporting the reticle between the at least one module to another portion of the housing. At least one module is removably connectable to the housing and at least one module has an interface adapted for removably coupling the module to the housing. One module being selectable for connection to the housing from a number of different interchangeable module each having a different predetermined characteristic and being capable of connection to the housing.Type: GrantFiled: April 16, 2010Date of Patent: April 23, 2013Assignee: Brooks Automation, Inc.Inventors: Jakob Blattner, Rudy Federici, William Fosnight, Clint Harris
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Patent number: 8419341Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers. A four-axis robot arm is disclosed, capable of linear translation, rotation and articulation, and z-motion.Type: GrantFiled: September 3, 2010Date of Patent: April 16, 2013Assignee: Brooks Automation, Inc.Inventors: Gee Sun Hoey, Terry Bluck, Hoang Huy Vu, Jimin Ryu
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Patent number: 8408158Abstract: A coating/developing device includes a processing block having a plurality of coating unit blocks stacked and a developing unit block stacked on the coating unit blocks. Each of the unit blocks is provided with a liquid processing unit for coating a liquid chemical on a substrate, a heating unit for heating the substrate, a cooling unit for cooling the substrate and a transfer unit for transferring the substrate between the units. The liquid processing unit is provided with a coating unit for coating a resist liquid on the substrate, a first bottom antireflection coating (BARC) forming unit for coating a liquid chemical for a BARC on the substrate before the resist liquid is coated thereon, and a second BARC forming unit for coating a liquid chemical for the BARC on the substrate after the resist liquid is coated thereon.Type: GrantFiled: March 9, 2006Date of Patent: April 2, 2013Assignee: Tokyo Electron LimitedInventors: Masami Akimoto, Shinichi Hayashi, Yasushi Hayashida, Nobuaki Matsuoka, Yoshio Kimura, Issei Ueda, Hikaru Ito
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Patent number: 8403613Abstract: A bypass thermal adjuster, which may be placed between two robots, provides a chamber for isolation and thermal control of wafers while permitting other wafers to be passed through the adjuster by the robots.Type: GrantFiled: March 5, 2007Date of Patent: March 26, 2013Assignee: Brooks Automation, Inc.Inventor: Peter van der Meulen
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Patent number: 8398355Abstract: A substrate processing apparatus includes a transport chamber capable of holding an isolated atmosphere therein and communicably connected to a charging station for loading and unloading a substrate into the apparatus, a transport system inside the transport chamber for transporting the substrate and an array of processing chamber modules distributed alongside the transport chamber and communicably connected to the transport chamber to allow the substrate to be transferred therebetween.Type: GrantFiled: May 26, 2006Date of Patent: March 19, 2013Assignee: Brooks Automation, Inc.Inventors: William Holtkamp, Izya Kremerman, Christopher Hofmeister, Richard Pickreign
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Patent number: 8371792Abstract: A substrate processing apparatus including a transport chamber having an end and defining more than one substantially linear substrate transport zone where each transport zone extends longitudinally along the transport chamber between opposing walls of the transport chamber and at least one of the more than one substantially linear substrate transport zones is configured as a supply zone for enabling transport of substrates from the end and at least one of the more than one substantially linear substrate transport zones is configured as a return zone for enabling transport of substrates to the end, and at least one substrate transport located in and movably mounted to the transport chamber for transporting substrates along the more than one substantially linear substrate transport zone, where each substrate transport zone is configured to allow the at least one substrate transport to move from one transport zone to another transport zone.Type: GrantFiled: August 1, 2011Date of Patent: February 12, 2013Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Robert T. Caveney
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Patent number: 8366370Abstract: A vacuum processing apparatus includes a transfer container for transferring a wafer in the internal space thereof reduced in pressure, a vacuum vessel coupled to the side wall of the vacuum vessel and including a processing chamber having a sample stage therein on which a wafer to be processed is mounted, a lid member opened or closed by rotation above the vacuum vessel, an inner chamber member arranged in the vacuum vessel and making up the inner wall of the processing chamber, and a jig coupled to the side wall of the vacuum vessel to lift and hold the inner chamber member by being coupled thereto. The jig includes a first joint portion having vertical and horizontal shafts, an extensible arm portion rotatable around each shaft of the first joint portion, and a second joint portion with the inner chamber member adapted to rotate around the horizontal axis thereof.Type: GrantFiled: February 25, 2010Date of Patent: February 5, 2013Assignee: Hitachi High-Technologies CorporationInventors: Tsutomu Nakamura, Hidenobu Tanimura, Yuya Mizobe
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Patent number: 8357588Abstract: A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.Type: GrantFiled: February 22, 2011Date of Patent: January 22, 2013Assignee: Infineon Technologies AGInventors: Stephen Bradl, Walther Grommes, Werner Kröninger, Michael Melzl, Josef Schwaiger, Thilo Stache
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Patent number: 8354001Abstract: There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.Type: GrantFiled: December 20, 2011Date of Patent: January 15, 2013Assignee: Intevac, Inc.Inventors: Terry Bluck, Stuart Scollay, Edric Tong
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Patent number: 8347915Abstract: A method of exhausting a gas in a chamber of a load-lock system having a first valve defining an opening for supplying a gas and a second valve defining an opening for conveyance of an article. The method includes a gas supplying step for supplying a gas heated by a heater into the chamber through the first valve, while the first valve and the second valve are kept open, a conveying step for conveying the article into the chamber while the second valve is kept open, and an exhausting step to be carried out after the gas supplying step and the conveying step are executed and the first and second valves are closed, to exhaust the gas inside the chamber while the first valve and the second valve are kept closed.Type: GrantFiled: August 22, 2007Date of Patent: January 8, 2013Assignee: Canon Kabushiki KaishaInventor: Kazuyuki Kasumi
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Patent number: 8348583Abstract: A loader is provided, which is disposed in a low cleanliness room along a border between the low cleanliness room and a high cleanliness room, for transporting a dust free article between an inside of a container receiving the dust free article and the high cleanliness room, comprising a movable stage for mounting the container; an opening portion through which the dust free article is transported between the container and the high cleanliness room; a door for opening and closing the opening portion; a unifying means for unifying a cover of the container and the door when the container approaches the door; and a driving apparatus for moving the cover and the door unified within the loader to open and close the opening portion and the container.Type: GrantFiled: December 21, 2001Date of Patent: January 8, 2013Assignee: Rorze CorporationInventors: Toshiaki Fujii, Osamu Horita, Koji Ohyama, Toshiya Nakayama, Fumio Sakiya, Mineo Kinpara
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Patent number: 8352074Abstract: A path planning apparatus and method of a robot, in which a path, along which the robot accesses an object to grasp the object, is planned. The path planning method includes judging whether or not a robot hand of a robot collides with an obstacle when the robot hand moves along one access path candidate selected from plural access path candidates along which the robot hand accesses an object to grasp the object, calculating an access score of the selected access path candidate when the robot hand does not collide with the obstacle, and determining an access path plan using the access score of the selected access path candidate.Type: GrantFiled: July 21, 2010Date of Patent: January 8, 2013Assignee: Samsung ElectronicsInventors: Guochunxu, Kyung Shik Roh, San Lim, Bok Man Lim, Myung Hee Kim
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Patent number: 8328940Abstract: In one embodiment, a transfer robot for transferring a substrate includes a supporting means, a transfer robot arm including a first sub-robot arm and a second sub-robot arm arranged over the supporting means, an inner rail and an outer rail adjacent to the inner rail overlying the supporting means. The first sub-robot arm is adapted to move in a straight line motion along the inner rail and the second sub-robot arm is adapted to move in a straight line motion along the outer rail. The second sub-robot arm surrounds the first sub-robot arm.Type: GrantFiled: March 4, 2011Date of Patent: December 11, 2012Assignee: Jusung Engineering Co., Ltd.Inventors: Jae-Wook Choi, Young-Rok Kim
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Patent number: 8328946Abstract: A conveyor assembly for conveying substrates through a vapor deposition system includes a first carriage rail and a second carriage rail disposed at an opposite side of the conveyor assembly. The first and second carriage rails include a plurality of roller positions spaced longitudinally therealong. The carriage rails further include a pair of wheels at each of the roller positions, with the wheels spaced apart so as to define a cradle at the respective roller position. At least one of the wheels at each roller position on is drive wheel. A plurality of rollers extend between the first and second carriage rails. The rollers have ends that drop into the cradles at the roller positions such that the rollers are removable from the carriage rails by being lifted out of the cradles at the roller positions.Type: GrantFiled: December 30, 2009Date of Patent: December 11, 2012Assignee: PrimeStar Solar, Inc.Inventors: Edwin Jackson Little, Christopher Rathweg
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Patent number: 8328494Abstract: A vacuum assembly used for warming processed substrates above the dew point to prevent unwanted moisture on the processed substrate surfaces as well as reducing negative impact on manufacturing throughput. The vacuum assembly includes a processing chamber, a substrate handling robot, and a heater which may be an optical heater. The processing chamber is configured to cryogenically process one or more substrates. The transfer chamber is connected to the processing chamber and houses the substrate handling robot. The substrate handling robot is configured to displace one or more substrates from the processing chamber to the transfer chamber. The heater is connected to the transfer chamber above the substrate handling robot such that the heater emits energy incident on the substrate when the substrate handling robot displaces the substrate in the transfer chamber.Type: GrantFiled: December 15, 2009Date of Patent: December 11, 2012Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Roger B. Fish, Jeffrey E. Krampert
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Patent number: 8317923Abstract: Protective self aligned buffer (PSAB) layers are layers of material that are selectively formed at the surface of metal layers in a partially fabricated semiconductor device. In a Damascene interconnect, PSAB layer typically resides at an interface between the metal layer and a dielectric diffusion barrier layer. PSAB layers promote improved adhesion between a metal layer and an adjacent dielectric diffusion barrier layer. Further, PSAB layers can protect metal surfaces from inadvertent oxidation during fabrication process. A PSAB layer may be formed entirely within the top portion of a metal layer, by, for example, chemically converting metal surface to a thin layer of metal silicide. Thickness of PSAB layers, and, consequently resistance of interconnects can be controlled by partially passivating metal surface prior to formation of PSAB layer. Such passivation can be accomplished by controllably treating metal surface with a nitrogen-containing compound to convert metal to metal nitride.Type: GrantFiled: April 16, 2010Date of Patent: November 27, 2012Assignee: Novellus Systems, Inc.Inventors: Kaushik Chattopadhyay, Bart van Schravendijk, Yongsik Yu, Mandyam Sriram
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Patent number: 8313277Abstract: A variety of process modules are described for use in semiconductor manufacturing processes.Type: GrantFiled: October 23, 2007Date of Patent: November 20, 2012Assignee: Brooks Automation, Inc.Inventors: Peter van der Meulen, Christopher C Kiley, Patrick D. Pannese
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Patent number: 8303232Abstract: There are disposed two second substrate transferring apparatuses 60a and 60b, which are configured to transfer substrates W between substrate processing units 40 and a substrate accommodating part 30, in the up and down direction so as to correspond to the respective groups to which the plurality of substrate processing units 40 are divided. In addition, there is disposed a substrate displacing apparatus 35 that is configured to displace a substrate W, which has been transferred by a first substrate transferring apparatus 50 to the substrate accommodating part 30 and is not yet processed by the wafer processing unit 40, to another position in the up and down direction in the substrate accommodating part 30, as well as displace a substrate W, which has been processed by the wafer processing unit 40a and transferred by the second substrate transferring apparatus 60a to the substrate accommodating part 30, to another position in the up and down direction in the substrate accommodating part 30.Type: GrantFiled: November 17, 2009Date of Patent: November 6, 2012Assignee: Tokyo Electron LimitedInventor: Seiki Ishida
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Patent number: 8297319Abstract: A method for pressurizing a substrate carrier including pressurizing a chamber that is of unitary construction with the carrier and/or a substrate cassette within the carrier and maintaining a pressure within the carrier by releasing gas from the chamber into the carrier.Type: GrantFiled: September 14, 2007Date of Patent: October 30, 2012Assignee: Brooks Automation, Inc.Inventors: Daniel Babbs, William Fosnight
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Patent number: 8292563Abstract: A sorter for handling and sorting semiconductor wafers is provided. The sorter has a housing, a handling and transport device and at least one nonproduction wafer buffer module. The housing has at least one holding area for interfacing one or more semiconductor wafer carriers to the housing. The housing defines an access path along which semiconductor wafers are transported between the housing and the one or more semiconductor wafer carriers. The handling and transport device is connected to the housing for transporting semiconductor wafers along the access path. The at least one nonproduction wafer buffer module is connected to the housing. The at least one nonproduction wafer buffer module buffers nonproduction wafers sorted by the sorter to one or more semiconductor wafer carriers.Type: GrantFiled: June 28, 2005Date of Patent: October 23, 2012Assignee: Brooks Automation, Inc.Inventor: Clinton M. Haris
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Patent number: 8272826Abstract: A substrate processing apparatus includes first and second transfer chambers, first and second load lock chambers for exchanging one or more substrates with respective ones of first and the second transfer chambers, and a substrate transfer unit, located between the first and second load lock chambers, for transferring the one or more substrates to the first and second load lock chambers.Type: GrantFiled: June 24, 2008Date of Patent: September 25, 2012Assignee: Advanced Display Process Engineering Co., LtdInventors: Cheol Rae Jo, Jang-Wan Park, Won Ki Jeong
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Patent number: 8261905Abstract: A drive rail includes a sealed interior cavity and an exterior drive surface that extends along a length of the drive rail. A first magnetic member is disposed within the interior cavity and adjacent to a surface of the interior cavity that is immediately opposite the exterior drive surface. A drive mechanism is disposed within the interior cavity and in connection with the first magnetic member, and is configured to move the first magnetic member within the interior cavity along the length of the drive rail, such that the first magnetic member remains immediately opposite the exterior drive surface. The first magnetic member is configured to magnetically couple through the exterior drive surface to a wafer carrier disposed adjacent to the exterior drive surface. Movement of the first magnetic member within the interior cavity along the drive rail causes corresponding movement of the wafer carrier along the exterior drive surface.Type: GrantFiled: May 25, 2010Date of Patent: September 11, 2012Assignee: Lam Research CorporationInventors: Arnold Kholodenko, Anwar Husain, George Khait
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Patent number: 8257013Abstract: The present invention provides a substrate treatment apparatus which sets substrate loading intervals to treatment chambers to a fixed value and prevents the occurrence of stagnancy of substrates in the treatment chambers. The substrate treatment apparatus includes a substrate conveyance chamber 5 which has a substrate conveyance device 11, a plurality of treatment chambers 6 to 9 in which a treatment time of at least one treatment chamber differs from treatment times of other treatment chambers and the respective treatment chambers are communicated with the conveyance chamber, and a control part 12 which controls a conveyance operation of the substrate conveyance device by setting treatment schedules of the substrates.Type: GrantFiled: November 18, 2005Date of Patent: September 4, 2012Assignee: Hitachi Kokusai Electric Inc.Inventor: Satoshi Takano
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Patent number: 8246284Abstract: An apparatus with a plurality of load-lock chambers stacked having independently controlled pressures within their interior regions is provided. According to one or more embodiments, each load-lock chamber includes a pump valve connected to a pump line and a vent valve connected to a vent line to independently control the changes of pressure within the interior regions of the chambers. Methods for conveying substrates held within these chambers from the apparatus to one or more processing chambers, which may be in-line, are also provided.Type: GrantFiled: March 5, 2009Date of Patent: August 21, 2012Assignee: Applied Materials, Inc.Inventor: Peter G. Borden
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Patent number: 8231731Abstract: A process for producing a semiconductor device, comprising the steps of conducting film formation on substrate (10) in reactor (1); and unloading the substrate (10) after film formation from the reactor (1) and thereafter effecting forced air cooling of the interior of the reactor (1) while the substrate (10) is absent in the reactor (1). The stress of deposited film adhering in the reactor (1) is increased over that exhibited at air cooling without blower so as to positively generate thermal stress with the result that the deposited film would undergo forced cracking over that exhibited at air cooling without blower. Microparticles scattered by the cracking are efficiently discharged from the reactor forcibly through purging in the reactor in the state of atmospheric pressure.Type: GrantFiled: May 2, 2011Date of Patent: July 31, 2012Assignee: Hitachi Kokusai Electric, Inc.Inventors: Kenichi Suzaki, Jie Wang
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Patent number: 8231322Abstract: A load lock is provided for a semiconductor substrate processing system having a transport robot mounted therein. The load lock transport supplies substrates directly to a processing chamber without the need for a central transport robot. The load lock transport is a dual element robot designed for minimum clearance and space and operates within a matching load lock chamber of minimum volume.Type: GrantFiled: April 18, 2008Date of Patent: July 31, 2012Assignee: Brooks Automation, Inc.Inventor: Mark A. Talmer
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Patent number: 8215890Abstract: A method and system for aligning robotic wafer transfer systems provides a wafer cassette having one or more wafer slots having portions covered with an electrically conductive material and a sensor that is in electrical communication with the electrically conductive material. When a wafer is loaded into a wafer cassette such as may be contained within a wafer transfer module such as a FOUP, an indication of position is delivered to the sensor which detects the alignment and indicates if the loaded wafer undesirably contacts either or both of the opposed grooves that form the wafer slot of the wafer cassette. An indication of the wafer's position may be provided from the sensor to a controller that delivers a signal for aligning the wafer transfer blade of the wafer transfer robot responsive to the signal indicative of position.Type: GrantFiled: March 12, 2009Date of Patent: July 10, 2012Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuo-Shu Tseng, Yi-Chang Sung, Chia-Chi Tsao, Chih-Che Lin
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Patent number: 8206551Abstract: There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.Type: GrantFiled: June 16, 2009Date of Patent: June 26, 2012Assignee: Intevac, Inc.Inventors: Terry Bluck, Stuart Scollay, Edric Tong
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Patent number: 8205352Abstract: Embodiments of the present invention generally relate to an apparatus and methods for rinsing and drying substrates. One embodiment provides an end effector comprising a body having a contact tip for contacting an edge area of a substrate, wherein the end effector is configured to support the substrate while the substrate is in a rinsing bath and while the substrate is being dried from the rinsing bath, and the contact tip comprises a hydrophilic material.Type: GrantFiled: July 13, 2011Date of Patent: June 26, 2012Assignee: Applied Materials, Inc.Inventors: John S. Lewis, Michael Biese, Garrett H. Sin, Chidambara A. Ramalingam, Balaji Chandrasekaran, Tak Fan (Kerry) Ling
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Patent number: 8206076Abstract: A cassette waiting block is connected to a transfer in/out block of a coating and developing treatment system, and in the cassette waiting block, a cassette transfer in/out unit, a cassette waiting unit, a cassette delivery unit, and a substrate processing unit are provided. In the cassette waiting block, a cassette transfer unit for transferring the cassette between the cassette transfer in/out unit, the cassette waiting unit, and the cassette deliver unit, and a transfer unit for transferring the substrate between the cassette in the cassette waiting unit and the substrate processing unit are provided. Each cassette waiting unit has an opening mechanism for opening a port of the cassette.Type: GrantFiled: June 11, 2008Date of Patent: June 26, 2012Assignee: Tokyo Electron LimitedInventors: Issei Ueda, Yasushi Hayashida, Akira Miyata, Kensei Yamamoto, Yuichi Yamamoto, Michiaki Matsushita
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Patent number: 8197177Abstract: Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.Type: GrantFiled: February 4, 2008Date of Patent: June 12, 2012Assignee: Brooks Automation, Inc.Inventors: Peter van der Meulen, Christopher C Kiley, Patrick D. Pannese, Raymond S. Ritter, Thomas A. Schaefer
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Patent number: 8192132Abstract: In a transfer chamber having a housing with a transfer region and a passing band region, a transport device comprising a first arrangement of transport rollers is arranged in the transfer region of the housing, and a passing band comprising a second arrangement of transport rollers is arranged in the passing band region of the housing. The passing band region of the housing is subdivided by a horizontal wall, which is arranged above the passing band, into a transport space, which is located below the horizontal wall, and a pump space, which is located above the horizontal wall. The pump space has a vacuum port or a vacuum pump connected to it.Type: GrantFiled: November 26, 2008Date of Patent: June 5, 2012Assignee: VON ARDENNE Anlagentechnik GmbHInventors: Jochen Krause, Michael Hofmann
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Patent number: 8187923Abstract: A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.Type: GrantFiled: July 3, 2008Date of Patent: May 29, 2012Assignee: International Business Machines CorporationInventors: Paul Stephen Andry, Leena Paivikki Buchwalter, Matthew J. Farinelli, Sherif A. Goma, Raymond R. Horton, Edmund J. Sprogis
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Patent number: 8177048Abstract: A vacuum processing apparatus includes a vacuum chamber capable of keeping a first pressure lower than an atmospheric pressure, a driving source disposed in the vacuum chamber, an electric power supply mechanism including a primary side mechanism disposed outside the vacuum chamber for supplying electric power to the driving source and a secondary side mechanism disposed in the vacuum chamber for receiving the electric power from the primary side mechanism in a contactless relationship, and a vessel capable of accommodating airtightly the secondary side mechanism under a second pressure higher than the first pressure.Type: GrantFiled: August 6, 2009Date of Patent: May 15, 2012Assignee: Sinfonia Technology Co., Ltd.Inventors: Yushi Sato, Toshio Miki, Yosuke Muraguchi, Katsumi Yasuda, Kazunari Kitaji, Yasushi Muragishi, Minoru Maeda
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Patent number: 8171964Abstract: The invention provides a purge apparatus that purges the gas in the interior of a FOUP with a high purging efficiency and an apparatus for opening/closing the lid of a FOUP for use in the purge apparatus. The purge apparatus has a cabinet having an opening portion through with the lid of the FOUP can pass, a door that can close the opening portion and hold the lid, and a gas supply nozzle provide in the cabinet. In this apparatus, a seal member is provided in such a way as to surround an element that is provided on the surface of the door and adapted to actuate a latch mechanism of the lid. The seal member spatially separates the element that is adapted to actuate the latch mechanism from the external space in a state in which the door is holding the lid.Type: GrantFiled: March 12, 2009Date of Patent: May 8, 2012Assignee: TDK CorporationInventor: Tsutomu Okabe
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Patent number: 8172949Abstract: A computer readable storage medium storing a program for performing an operation method of a substrate processing apparatus is provided. The operation method includes the steps of introducing a nonreactive gas into the vacuum preparation chamber before the gate valve is opened while the substrate is transferred between the vacuum preparation chamber of the vacuum processing unit and the transfer unit, stopping introducing the nonreactive gas when an inner pressure of the vacuum preparation chamber becomes same as an atmospheric pressure, starting an evacuation process of the corrosive gas in the vacuum preparation chamber and then opening to atmosphere performed by letting the vacuum preparation chamber communicate with an atmosphere, and opening the gate valve after the step of opening to atmosphere.Type: GrantFiled: March 5, 2010Date of Patent: May 8, 2012Assignee: Tokyo Electron LimitedInventors: Tomoyuki Kudo, Jun Ozawa, Hiroshi Nakamura, Kazunori Kazama, Tsuyoshi Moriya, Hiroyuki Nakayama, Hiroshi Nagaike
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Apparatus for manufacturing magnetic recording disk, and in-line type substrate processing apparatus
Patent number: 8147924Abstract: An apparatus for manufacturing a magnetic recording disk includes a magnetic-film deposition chamber in which a magnetic film for a recording layer is deposited on a substrate; a lubricant-layer preparation chamber in which a lubricant layer is prepared on the substrate in vacuum; and a cleaning chamber in which the substrate is cleaned in vacuum after the magnetic-film deposition in the magnetic-film chamber and before the lubricant-layer preparation in the lubricant-layer chamber. The apparatus may further include a transfer system that transfers the substrate from the cleaning chamber to the lubricant-layer preparation chamber without exposing the substrate to the atmosphere.Type: GrantFiled: September 2, 2008Date of Patent: April 3, 2012Assignee: Canon Anelva CorporationInventors: Naoki Watanabe, Nobuyoshi Watanabe, Kazunori Tani, Shinji Furukawa, Hiromi Sasaki, Osamu Watabe -
Patent number: 8132996Abstract: A substrate-treating apparatus includes: a plurality of modules disposed along a first direction, each of the plurality of modules having an inner space for containing a substrate; a transfer unit transferring the substrate among the plurality of modules, the transfer unit including at least one track disposed along the first direction and at least one movable transfer chamber moving along the at least one track; and a gate valve fixed to each of the plurality of modules and combined with the at least one movable transfer chamber. The at least one movable transfer chamber is isolated from an exterior atmosphere while moving.Type: GrantFiled: June 6, 2010Date of Patent: March 13, 2012Assignee: Jusung Engineering Co., Ltd.Inventor: Klaus Hügler
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Patent number: 8118535Abstract: Methods, systems and apparatus for swapping pods within a semiconductor processing tool during a substrate processing cycle. A dirty pod carrying a substrate in need of processing is provided within the processing tool, and the substrate is transferred into a processing chamber thereof. At least one clean pod is also provided within the processing tool. Upon substrate processing completion, the processed substrate is transferred from the chamber directly into a clean pod within the processing tool. Wherein a plurality of substrates are processed within the chamber, a plurality of clean pods may be provided within the tool whereby the plurality of substrates are transferred into a single clean pod or split into subsets that are transferred into different clean pods within the processing tool. The clean pod(s) carrying the processed substrate(s) are then transferred to other tool(s) for continued semiconductor fabrication processing.Type: GrantFiled: May 18, 2005Date of Patent: February 21, 2012Assignee: International Business Machines CorporationInventors: Jeffrey P. Gifford, Edward Sherwood
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Patent number: 8104770Abstract: A process chamber 10 comprising a container (12), a lid (14), and a sealed interface (16) therebetween. The container's interface surface (30) and/or the lid's interface surface (32) includes at least one groove (36) in which a seal (40) is situated. The seal (40) comprises an elastomeric element (50) and a metallic element (60). The elastomeric element (50) and the metallic element (60) can be arranged and adapted to seal the chamber's interface (16) sequentially during its conversion to a sealed condition. And/or the elastomeric element (50) and the metallic element (60) can be arranged and adapted to seal the chamber's interface in series once the lid (14) is in its sealed condition.Type: GrantFiled: February 1, 2008Date of Patent: January 31, 2012Assignee: Parker-Hannifin CorporationInventors: Amitava Datta, Peter G. Amos, Dominick G. More, Kenneth W. Cornett, Jeremy Payne
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Patent number: 8097084Abstract: A vacuum chamber system for semiconductor processing includes at least two evacuable vacuum chambers for receiving semiconductor elements to be processed, each including a vacuum chamber opening and a vacuum chamber sealing surface, and transfer aspects by which one of the vacuum chambers can be moved relative to another of the vacuum chambers and can be docked with it in a vacuum-tight manner by producing substantially parallel opposite positions of the vacuum chamber sealing surfaces which are subject to possible misalignments. At least one of the vacuum chambers has support aspects which support one vacuum chamber on the other vacuum chamber in the evacuated, docked state.Type: GrantFiled: January 19, 2007Date of Patent: January 17, 2012Assignee: Vat Holding AGInventors: Friedrich Geiser, Rene Brulc