Preform Stock Acting As Reaction Shaping Surface Cooperating With Recessed Fluent Stock Shaping Means Patents (Class 425/127)
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Patent number: 7186105Abstract: An apparatus for moulding an article made of thermosetting and thermoplastic material, including a first and a second half-mould (10, 12) provided with respective compression moulding surfaces (14, 16) above to compress between them one or more plates (30), sandwich or agglomerate, made of mouldable thermosetting material (30), and at least one injection moulding area (18) communicating with at least one of said compression moulding surfaces (14, 16), and spacer means (22) provided in said injection moulding area (18) and positioned in such a way as to prevent said plate (30) from penetrating into said injection moulding area (18) when it is compressed between said compression moulding surfaces (14, 16).Type: GrantFiled: July 29, 2003Date of Patent: March 6, 2007Assignee: CRS SRL Centro Ricerche E SperimentazioniInventor: Franco Cesano
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Patent number: 7175405Abstract: A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by the fixed platen; a movable die being held by the movable platen; an open-close mechanism including a screw shaft connected to the movable platen, the open-close mechanism turning the screw shaft so as to move the movable die to and away from the fixed die, whereby the dies can be opened and closed. The fixed die can be taken out from the fixed platen in the direction crossing the open-close direction of the movable die.Type: GrantFiled: November 27, 2002Date of Patent: February 13, 2007Assignee: Apic Yamada CorporationInventors: Kazuhiko Kobayashi, Tsutomu Miyagawa, Tomokazu Asakura, Shusaku Tagami, Hideaki Nakazawa, Naoya Gotoh
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Patent number: 7156632Abstract: Disclosed is an injection mod for a display panel of a washing machine, by which the display panel can be simply formed in one body. The present invention includes a first mold having a first film attached to an inside and a second mold assembled to the first mold to form a cavity with the first mold, the second mold having a second film attached to an inside, the second mold having a gate communicating with an opening provided to the second film.Type: GrantFiled: November 28, 2003Date of Patent: January 2, 2007Assignee: LG Electronics, Inc.Inventors: Hye Yong Park, Dong Ha Choi, Sung Rak Kong, Dong In Kim
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Patent number: 7153116Abstract: The resin molding machine has a simple molding die, which can be easily maintained, and is capable of molding a work without pretreatments. The resin molding machine for molding the work with resin. The resin molding machine comprises: a press section having a molding die; a cavity plate having a cavity hole, which defines a shape and thickness of a resin mold section of the work; a mechanism for repeatedly carrying the cavity plate into and out from the press section; and a mechanism for positioning the cavity plate onto the molding die.Type: GrantFiled: November 24, 2003Date of Patent: December 26, 2006Assignee: Apic Yamada CorporationInventors: Shigeyuki Tofukuji, Tomoo Sakamoto
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Patent number: 7153462Abstract: An injection casting system for encapsulating semiconductor products and method of use includes a mold unit having a cavity, a substrate material placed against the cavity, the cavity being filled by a liquid dispenser in contact with the bottom of the cavity and a running channel at the bottom of the cavity to receive the liquid dispenser for even dispersion of epoxy in the cavity from the bottom of the cavity upward to the top of the cavity.Type: GrantFiled: April 23, 2004Date of Patent: December 26, 2006Assignee: Vishay Infrared Components, Inc.Inventor: Haryanto Chandra
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Patent number: 7153113Abstract: A mold shim or insert is disclosed, which is placed between the surface of a forming mold or mold magnet and a fastener strip that is to be molded into a foam object. The mold shim compensates for the variability of the mold surface and provides a more even surface for the fastener strip to seal against —thereby preventing fouling of the strip's fastening elements during the molding process. Alternative embodiments of the invention are not used with a fastener strip, but instead have engaging members on their non-mold-proximate surface for engaging clips or wires which are thereby embedded into the foam object during the molding process.Type: GrantFiled: July 24, 2003Date of Patent: December 26, 2006Assignee: YKK Corporation of AmericaInventors: Craig Jay Graham, Nobuo Fujisawa, Wolfgang Coronel
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Patent number: 7150845Abstract: A method and molding tool for the molding of both one- or multi-component parts preferably comprising plastic material which may be integrated together with parts of another material, such as steel and copper, where the turnable middle section during the molding process is supplied with material on at least one of the surfaces thereof, that in contrast to the normal procedures are not at a right angle to the closing direction between the stationary mold part and the movable mold part of the tool. This can be realized by molding a part or a piece of a part and/or by molding around a special part for the in-molding on at least one of these surfaces of the turnable middle section. This molding and/or insertion can take place while the tool is closed and can be performed on several surfaces at the same time in order to save cycle time.Type: GrantFiled: May 15, 2000Date of Patent: December 19, 2006Inventor: Jes Tougaard Gram
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Patent number: 7147447Abstract: A device with a semiconductor chip (801) assembled on a planar substrate (802) and encapsulation compound (810) surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area (811). The encapsulation compound has a plurality of side areas (812) reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed (813) along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved.Type: GrantFiled: July 27, 2005Date of Patent: December 12, 2006Assignee: Texas Instruments IncorporatedInventor: Yoshimi Takahashi
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Patent number: 7144537Abstract: An apparatus and method for molding multi-material parts. The mold has a plurality of first mold cavities interspersed alternately among a plurality of second mold cavities. A first molten material is injected into the first mold cavities and solidified. Cores with the first material are moved only one mold pitch to the second mold cavities where a second molten material is injected and solidified with the first material to form the multi-material parts which are ejected from the mold when it is opened. In one embodiment, cavities and cores are arranged in a column, and dummy cores on each end of a column of cores close off the injection nozzle in an end cavity from which a core has been removed for a molding cycle. In another embodiment, cavities and cores are arranged radially, and cores are rotationally moved one mold pitch with each molding cycle.Type: GrantFiled: April 25, 2003Date of Patent: December 5, 2006Assignee: Husky Injection Molding Systems Ltd.Inventors: Richard Tustin, Adrian Looije
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Patent number: 7128860Abstract: The invention relates to the production of composite insulators consisting of a shank in the form of a bar or a tube, which is provided with a covering and which comprises plate-like screens which are distanced from each other. The covering and the screens are made of an elastomer material with high insulating qualities. As a result, the number, distance, form and size of the screens can vary from insulator to insulator. According to the invention, at least one injection mould (10a, 10b, 11a, 11b, 12a, 12b, 13a, 13b) for injecting a screen (2, 3, 4, 5, 19, 20, 21, 22) is arranged downstream from a device which is used to provide the shank (1) with a covering. The injection mould can be advanced in order to inject a screen upon the shank and opened in order to unmould said screen. An advancing device is also provided in order to displace (16) the shank (1) or the screen mould.Type: GrantFiled: October 12, 2001Date of Patent: October 31, 2006Assignee: Lapp Insulator GmbH & Co. KG.Inventors: Rene Mainardis, Michael Braune
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Patent number: 7128869Abstract: A process and a production installation for producing shell-shaped, fiber-reinforced plastic parts are provided. The plastic parts can be produced efficiently, in an automated manner which is flexible with respect to the process and workpiece and is operationally reliable. A blank of the endless fiber mat corresponding to a workpiece is placed in an automated manner by industrial robots onto a clamping frame surrounding the female mold and is taken over by the clamping frame in a clamping manner and in such a way that it can slide after itself against a defined resistance. Wide-ranging accessibility required for this is created by a horizontally movable unit, comprising a female mold and a clamping frame, being temporarily moved completely out from the forming press and moved back again into the forming press after completion of loading.Type: GrantFiled: July 7, 2001Date of Patent: October 31, 2006Assignee: DaimlerChrysler AGInventors: Uwe Habisreitinger, Bernhard Nordmann, Michael Ostgathe
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Patent number: 7114939Abstract: A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.Type: GrantFiled: February 20, 2003Date of Patent: October 3, 2006Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Cheng Why Tan, Beng Huat Low, Huck Khim Koay
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Patent number: 7060215Abstract: A method of manufacturing an overmolded trim component includes providing a first mold portion and a movable mold element. The movable mold element includes first and second mold surfaces positioned at a first angle with respect to one another. The movable mold element is then positioned into the first position to define a first cavity. A first material is then introduced into the first cavity, thereby forming a substrate. The substrate includes a first substrate surface is at a second angle with respect to a second substrate surface. The movable mold element is then positioned into the second position to define a second cavity. A second material is then introduced into the second cavity, thereby forming an overmolded trim component. The movable mold element is oriented at a third angle with respect to the first substrate surface and at a fourth angle with respect to the second substrate surface.Type: GrantFiled: March 19, 2003Date of Patent: June 13, 2006Assignee: Lear CorporationInventors: Michael P. Schoemann, Robert J. Adams, Glenn Cowelchuk, William J. Noble
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Patent number: 7040884Abstract: A system for manufacturing foamed plastics laminated panels at a high volume is disclosed. Press modules include a pair of opposed spaced open frame members with longitudinal raised sections attached to perpendicular supports. The open frame members move relative to one another, support respective panel outer skin layers; and recieve therebetween edge sealing members of a predetermined thickness. A spacing between the open frame members and a hinge is adjustable to move a first open frame member relative to a second frame member. Clamps retain the open frame members in a predetermined space relationship, and when actuated, forms a mould cavity defined by the outer skin layers and edge sealing members supported by the open frame members. An inlet introduces an a liquid foamable plastics material into the moulded cavity, and a delivery system delivers liquid reactants in predetermined proportions to a selected mould cavity formed in a selected press module.Type: GrantFiled: January 31, 2003Date of Patent: May 9, 2006Assignee: Euretech International Pty Ltd.Inventor: Tonny Bergqvist
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Patent number: 7018190Abstract: A resin multilayer molding method in which a skin material having a resin decorating layer on a surface and a core-material resin are integrally molded in a mold, comprising the steps of: presetting a relationship of a glass transition point (Tgs) of the resin decorating layer of the skin material and a supply temperature (Tc) of a molten resin forming a core material to satisfy Tgs<Tc, and performing molding on a condition that a maximum temperature (Tsm) of the resin decorating layer of the skin material during clamping satisfies Tsm>Tgs.Type: GrantFiled: December 23, 2002Date of Patent: March 28, 2006Assignee: Ube Industries, Ltd.Inventors: Akio Okamoto, Etsuo Okahara
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Patent number: 7005103Abstract: An automotive trim product is made as follows. A single or multiple layer sheet is extruded so as to include at least one color pigmented and/or metallized layer therein. The sheet is then thermoformed into a three-dimensionally shaped preform via vacuum forming or the like. The preform is placed into a cavity of an injection molding apparatus and heated semi-molten material is injected thereinto. The semi-molten material bonds to the preform in the cavity. After cycling, the molding apparatus ejects a final automotive trim part. Optionally, some processing (e.g. trimming) may be performed following ejection.Type: GrantFiled: September 27, 2001Date of Patent: February 28, 2006Assignee: Guardian Automotive Trim, Inc.Inventors: Henry H. Smith, John Sienkiewicz
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Patent number: 6998085Abstract: A process for the production by a moulding process of a micro-cellular or non-cellular elastomeric polyurethane skin layer or, more generally, to a process for the production of a composite comprising a first layer shaped part, which is made by a moulding process from a polyurethane reaction mixture, and a second layer shaped part which is adhered to the first part to form the composite. In order to avoid the use of release agents on the back side of the first layer shaped part, and thus the negative effect on the adhesion of the second layer shaped part, and the penetration of reaction mixture on this back side between the slides (9–10) of the mould, the mould surface (4) is covered on the back side of the moulding with a removable flexible covering (12), with a removable rigid pre-shaped covering or with a permanent non-stick coating layer.Type: GrantFiled: July 31, 2001Date of Patent: February 14, 2006Assignee: RecticelInventors: Hugo De Winter, Yvan Vanluchene Yvan
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Patent number: 6981861Abstract: The present invention relates to a foaming mold using hollow tubes, and more particularly, to an improved mold for use in manufacturing a foamed product through foaming (or expansion molding), in which gas generated from the foamed product during the foaming can be smoothly discharged to the outside. The foaming mold using the hollow tubes comprises a mold unit including separate first and second half molds having inner cavities engraved in conformity with a molded product; the plurality of hollow tubes that are isolated and sealed from one another in respective regions and located between the first and second half molds to enclose an outer periphery of the configuration of the molded product; and a plurality of vents that are formed within the second half mold to communicate with the hollow tubes so that air in the isolated hollow tubes can be independently vented. According to the present invention, it is possible to improve the quality of the final molded product obtained through the foaming.Type: GrantFiled: November 20, 2003Date of Patent: January 3, 2006Assignee: Hyundai Mobis Co., Ltd.Inventor: Sung Kuk Park
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Patent number: 6981859Abstract: The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.Type: GrantFiled: February 24, 2003Date of Patent: January 3, 2006Assignee: Murata Manufacturing Co., Ltd.Inventors: Shingo Okuyama, Tadahiro Nakagawa, Takehiko Miura, Makoto Fukuda
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Patent number: 6972100Abstract: One aspect of the present invention pertains to an apparatus for forming a rigid foamed cementitious core within a plurality of article shells. In general, the apparatus can be comprised of a shell bank for retaining a plurality of article shells and comprising a sled and a plurality of reinforcement shells, a filing station for delivering a gas-entrained cementitious material, and a pump. The gas-entrained cementitious material cures to form a rigid foamed cementitious core within each article shell in the plurality of article shells.Type: GrantFiled: April 29, 2003Date of Patent: December 6, 2005Assignee: TT Technologies, Inc.Inventors: Ronald C. Minke, David R. Redding
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Patent number: 6948923Abstract: A form, fill and seal packaging machine for forming, filling and sealing a carton, molds a closure directly onto the carton. The machine includes a carton erection station adapted to receive a carton in a generally flat form and to erect the flat form carton into a tubular form defining an internal carton region. A direct injection molding station has an internal mold tool and an external mold tool. The internal mold tool is configured for receipt within the internal carton region and the internal mold tool and the external mold tool are configured to receive and clamp the carton therebetween. The direct injection molding station further includes a polymer injection system for injecting polymer from a location external of the carton to the internal mold tool. The closure is directly molded in place on the carton. A mold tool set, a method for carrying out the molding and a closure molded thereby are also disclosed.Type: GrantFiled: February 24, 2004Date of Patent: September 27, 2005Assignee: Tetra Laval Holdings & Finance, SAInventors: John Lees, Terry Erickson, Terry Berglin, Mike Robertson, Nicholas Cook, Russell Stacy-Ryan, Jens Mogard
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Patent number: 6942478Abstract: The present invention relates to a packaging mold with electrostatic discharge protection comprising a pot block and at least one receiver. The pot block comprises a plurality of pots and runners. Each of the pots branches and connects the runners for injecting molding compound into the runners through the pots. The receiver for supporting a plurality of substrate plates connects the runners for receiving the molding compound from the runners to package the dice on the substrate plates. Each receiver comprises a receiving surface contacting the substrate plate; wherein the receiving surface is roughened to reduce static electric charges generated when separating the substrate plates and the packaging mold. Additionally, the surfaces of the runners are roughened to reduce static electric charges generated in the runners when separating the molding compound and the runners. It prevents the dice packaged from damage due to static electric charges to raise the yield rate of semiconductor package products thereby.Type: GrantFiled: October 10, 2002Date of Patent: September 13, 2005Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Meng-Tsang Lee, Kuang-Lin Lo
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Patent number: 6936206Abstract: There is provided an arrangement of a mold including a mold base (1), a cavity block (2) provided within the mold base (1), a heat insulating layer (5) provided between the mold base (1) and the cavity block (2), and a system of a flow passage (A) through which a heating medium and a cooling medium are alternately and repeatedly supplied, wherein a space is provided at a contact portion between the cavity block (2) and the mold base (1) based on anticipation of a thermal expansion of the cavity block (2). Further, the cavity block (2) may be arranged to have inlet and outlet slots communicating with the channel (A), and the inlet and outlet slots may be attached with conduits thermally insulated from the mold base (1).Type: GrantFiled: April 28, 2000Date of Patent: August 30, 2005Assignees: Mitsui Chemicals, Inc., Ono Sangyo Co., Ltd.Inventors: Yosihisa Satoh, Akihiko Imagawa, Masahiko Yamaki, Masataka Takamura, Masayuki Nunome, Kazumi Shinto
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Patent number: 6899533Abstract: A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressure lower than the injection pressure applied to the plunger (101) to form debris cavities (DC1, DC2) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.Type: GrantFiled: March 11, 2002Date of Patent: May 31, 2005Assignees: Casio Computer Co., Ltd., Oki Electric Industry Co., Ltd.Inventors: Yasuo Tanaka, Jiro Matsumoto
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Patent number: 6893244Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.Type: GrantFiled: August 11, 2003Date of Patent: May 17, 2005Assignee: Micron Technology, Inc.Inventor: Steven G. Thummel
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Patent number: 6887413Abstract: A covering or trim part includes an injection molding compound and a decor part durably connected with the molding compound. The decor part may contain a real-wood veneer as well as a metal part. The covering a trim part is made by combining an injection molding operation with a cutting operation of the decor part in the injection. A multi-part injection mold permits more complicated molding and undercutting and/or the forming of variable wall thicknesses.Type: GrantFiled: April 22, 1999Date of Patent: May 3, 2005Assignee: DaimlerChrysler AGInventor: Rolf Schumacher
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Patent number: 6884055Abstract: A potting compound injection apparatus includes a pneumatic tube for inserting single part potting compound and injecting the compound into the cells of a composite panel. The pneumatic tube has an open end for releasing potting compound and an opposed end interconnected to a pneumatic pressure source. The potting compound injection apparatus may also include a frame for maneuvering the pneumatic tube with respect to the composite panel. A method of injecting a potting compound includes applying potting compound through a pneumatic tube into a composite panel having cells.Type: GrantFiled: May 29, 2002Date of Patent: April 26, 2005Assignee: The Boeing CompanyInventor: Gordon M. Cox
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Patent number: 6877973Abstract: An apparatus for manufacturing a lens sheet comprises an application device, a substrate supply device, a pressing device and an irradiation device. The application device applies ionizing radiation curing type resin in the form of liquid on the upper surface of a forming die for a lens sheet to form an uncured resin body on the upper surface of the forming die. The substrate supply device places a substrate on the uncured resin body. The pressing device presses the substrate against the uncured resin body to flatten the uncured resin body, so as to form a uncured resin layer, while spreading the uncured resin body to an outside periphery of the forming die. The irradiation device irradiates ionizing radiation on the uncured resin layer through the substrate to cure the uncured resin layer.Type: GrantFiled: October 24, 2001Date of Patent: April 12, 2005Assignee: Dai Nippon Printing Co., Ltd.Inventors: Kazuyuki Matsumoto, Hitomu Watanabe
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Patent number: 6872346Abstract: A problem in the manufacture of filters using tubular membrane bundles is keeping potting material from flowing into the openings at the ends of the tubes. A preferred embodiment of a method for manufacturing a tubular membrane filter employs a non-contact heat source such as radiant heating to melt the tips of the tubular membranes. This prevents the migration of potting material into the tubes when the potting material is flowed into the ends of tube bundles during the manufacturing process for a filter.Type: GrantFiled: March 20, 2003Date of Patent: March 29, 2005Assignee: NxStage Medical, Inc.Inventor: Martin Stillig
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Patent number: 6860731Abstract: A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.Type: GrantFiled: July 9, 2001Date of Patent: March 1, 2005Assignee: ASM Technology Singapore PTE Ltd.Inventors: Shu Chuen Ho, Teng Hock Kuah, Man Ho Hui, Srikanth Narasimulau, Murali Sarangapani
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Patent number: 6857865Abstract: A mold structure for package fabrication is proposed, and includes a top mold, a fixture and a bottom mold. The top mold is formed with at least an upwardly recessed portion; the fixture is formed with a plurality of downwardly recessed portions; and the bottom mold has a recessed cavity for receiving the fixture therein, and adapted to be engaged with the top mold, wherein a resilient member is disposed on an inner wall of the recessed cavity, and interposed between the fixture and the recessed cavity of the bottom mold, allowing the resilient member to provide a resilient force for properly positioning the fixture. By using the above mold structure, chips mounted on a substrate can be firmly supported in the mold structure without causing chip cracks during a molding process for encapsulating the chips.Type: GrantFiled: June 20, 2002Date of Patent: February 22, 2005Assignee: UltraTera CorporationInventors: Chung-Che Tsai, Wei-Heng Shan
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Patent number: 6849219Abstract: An injection moulding apparatus for hollow parts comprises first and second co-operating dies, each die including a first male die core and a female die recess. One of the dies is rotatable about an axis. In a first angular position of the rotatable die, the male die core of the first die co-operates with the female die recess of the second die and the male die core of the second die co-operates with the female die recess of the first die, to define first and second moulds in which half-components may be formed. In a second angular position of the rotatable die, the respective female dies recesses of the first and second dies co-operate to form a third mould in which the half-components may be joined. The apparatus makes use of a single injector differentially controlled for each stage.Type: GrantFiled: January 31, 2001Date of Patent: February 1, 2005Assignee: Swan Valley Designs LimitedInventor: David Rollins
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Patent number: 6840751Abstract: A die mold machine for molding a plurality of semiconductor assemblies on multiple substrate/leadframes includes a plurality of die mold layers stacked vertically one above the other to form a plurality of die mold sections. The top die mold layer has at least one aperture or die hall in the top most die layer and apertures or die halls in the in-between layers for passing molding compound which flows through the die hall in the top layer down through the die halls or apertures between the die mold layers into the die mold sections for molding semiconductor assemblies on said substrate/leadframes between said die mold layers.Type: GrantFiled: August 22, 2002Date of Patent: January 11, 2005Assignee: Texas Instruments IncorporatedInventor: Akira Matsunami
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Patent number: 6837697Abstract: A form, fill and seal packaging machine for forming, filling and sealing a carton, molds a closure directly onto the carton. The machine includes a carton erection station adapted to receive a carton in a generally flat form and to erect the flat form carton into a tubular form defining an internal carton region. A direct injection molding station has an internal mold tool and an external mold tool. The internal mold tool is configured for receipt within the internal carton region and the internal mold tool and the external mold tool are configured to receive and clamp the carton therebetween. The direct injection molding station further includes a polymer injection system for injecting polymer from a location external of the carton to the internal mold tool. The closure is directly molded in place on the carton. A mold tool set, a method for carrying out the molding and a closure molded thereby are also disclosed.Type: GrantFiled: April 18, 2002Date of Patent: January 4, 2005Assignee: Tetra Laval Holdings & Finance, SAInventors: John Lees, Terry Erickson, Terry Berglin, Mike Robertson, Nicholas Cook, Russell Stacy-Ryan, Jens Mogard
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Patent number: 6835340Abstract: A method for producing a multilayer molded article in which an skin material having nap on the outer surface thereof is integrally molded with a substrate of a synthetic resin, using a mold comprising a pair of male and female mold halves. In this method, after the fabric skin material and the molten resin are clamped in the mold and primary cooling is carried out, the mold is opened halfway to form a predetermined gap between the mold halves, and the molten synthetic resin undergoes secondary cooling and hardens while the mold is held in the half-open state. In the present invention, the time period for the operation to open the mold halfway is set at one second or less. By limiting the half-opening operation time period to the short period of one second or less, recovery of the nap is reliably achieved without the nap tending to stay flattened.Type: GrantFiled: February 19, 2002Date of Patent: December 28, 2004Assignee: Sumitomo Chemical Company, Ltd.Inventors: Takeo Kitayama, Atsushi Saitoh
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Publication number: 20040247854Abstract: A foaming tool has a first mold part, a second mold part, and at least two cavities for producing at least two composite parts from a substrate. A compensation zone is disposed between the two cavities and is adapted to accommodate a relief zone formed on the substrate. The substrate has a first component section and a second component section adapted to be arranged in the cavities of the foaming tool. The first and second component sections receive a foamed backing of an expandable material to form the composite parts. The substrate has a relief zone between the first and second component sections to handle any stresses on the substrate and prevent surface defects in the substrate.Type: ApplicationFiled: May 27, 2004Publication date: December 9, 2004Inventors: Matthias Ludwig, Marcus Lutz, Frank Niebuhr, Harald Batke
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Publication number: 20040232600Abstract: A process and apparatus for manufacturing fiberglass-reinforced panels are provided. The apparatus includes a guide mechanism and drive mechanism to drive individual elongate molds through a gel coating spraying section and thereafter through an oven to cure the gel coat. The elongate molds are thereafter driven through first and second resin/fiberglass application stations to apply a composite of resin and fiberglass strands. The apparatus also includes a station whereby wooden boards may be placed over the top of the resin and the fiberglass strands, and thereafter to a vacuum station whereby a vacuum can be placed over the wooden boards, such that when a vacuum is drawn on the composite, the resin is drawn into the wooden boards to form an integrated deposit panel.Type: ApplicationFiled: May 18, 2004Publication date: November 25, 2004Inventor: Lester D. Miller
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Patent number: 6821469Abstract: A method of manufacturing a roller includes: forming a hollow cylindrical body that includes a fully solidified outer peripheral surface and a semi-solidified interior, with an inner peripheral surface swelling inwardly; and pressing the swollen portion of the inner peripheral surface outwardly by pulling an insert die from the semi-solidified cylindrical body, to thereby allow the outer periphery of the cylindrical body to swell outwardly in a barrel-like manner. A primary molded product including a through hole along a central axis is thereby formed, and a secondary resin is injected into the through hole of the primary molded product.Type: GrantFiled: July 9, 2002Date of Patent: November 23, 2004Assignee: Fuji Photo Film Co., Ltd.Inventor: Teruo Ashikawa
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Patent number: 6817854Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.Type: GrantFiled: May 20, 2002Date of Patent: November 16, 2004Assignee: STMicroelectronics, Inc.Inventors: Michael J. Hundt, Tiao Zhou
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Publication number: 20040219244Abstract: Method for producing a fiber-reinforced plastic component including arranging a fiber composite semi-finished product on a tool, forming a first cavity, forming a second cavity adjacent to the first cavity, suctioning air from the second cavity, distributing the matrix material over the at least one side using a flow promoting device, and allowing the matrix material to penetration into the fiber composite semi-finished product from a vertical direction. This Abstract is not intended to define the invention disclosed in the specification, nor intended to limit the scope of the invention in any way.Type: ApplicationFiled: June 24, 2004Publication date: November 4, 2004Inventors: Jurgen Filsinger, Thomas Lippert, Franz Stadler, Stefan Utecht
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Publication number: 20040212129Abstract: Manufacturing a coating for an impression cylinder whereby a carrier and a cylinder shape is provided. A hollow cylinder is positioned between the carrier and the cylinder shape, and material to form the coating in the spaces is introduced between the carrier and the hollow cylinder (the internal field) and between the hollow cylinder and the cylinder shape (the external field). The hollow cylinder is removed at a certain pre-selected velocity from between the carrier and the cylinder shape.Type: ApplicationFiled: October 28, 2003Publication date: October 28, 2004Applicant: NexPress Solutions LLCInventors: Udo Drager, Detlef Schulze-Hagenest
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Publication number: 20040183228Abstract: A problem in the manufacture of filters using tubular membrane bundles is keeping potting material from flowing into the openings at the ends of the tubes. A preferred embodiment of a method for manufacturing a tubular membrane filter employs a non-contact heat source such as radiant heating to melt the tips of the tubular membranes. This prevents the migration of potting material into the tubes when the potting material is flowed into the ends of tube bundles during the manufacturing process for a filter.Type: ApplicationFiled: March 20, 2003Publication date: September 23, 2004Inventor: Martin Stillig
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Patent number: 6790400Abstract: The present invention relates to a method and to Apparatus for molding a receptacle fitted with a covering label. The technical field of the invention is that of molding a receptacle out of plastics material. In a method of molding a receptacle fitted with a covering label (1b) which is inserted into the mold (93) prior to injection, the label is shaped and at least two edges of the label are joined together, after which the shaped label is placed on a male portion (91) of the mold.Type: GrantFiled: October 26, 2000Date of Patent: September 14, 2004Inventor: Paul A. Muller
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Patent number: 6783718Abstract: A mold to make a plastics material piece includes two parts defining a cavity corresponding to the piece to be made, each part has a peripheral zone for coming into contact with the other part's peripheral zone to define the mold's joint face. One part is made up of two blocks, namely a central block and a peripheral block, the two blocks suitable for sliding relative to each other in the mold closure direction, and the peripheral block capable of movement so as to move the peripheral zone away from the edges of the sheet. A method of making a plastics material piece includes placing a sheet in a part of a mold, moving a peripheral block, closing the mold, and moving the peripheral block to a molding position while keeping the first and second peripheral zones in contact.Type: GrantFiled: January 22, 2001Date of Patent: August 31, 2004Assignee: Compagnie Plastic OmniumInventors: Charles-Guillaume Blanchon, Thierry Vuaillat
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Patent number: 6783346Abstract: A device (1) and method for injection molding articles (25) with several plastic material components. The device (1) includes a fixed, first half mold (3), a second half-mold (6) that is movable relative to the first half-mold (3) for the purpose of opening and closing the device (1). The device also includes at least two further half-molds (10, 11), which are jointly movable relative to the first and second half-molds (3, 6), and which, in the closed position of the device (1), are situated between the first and the second half-molds (3, 6) such that cavities are formed in each of a first and a second parting plane (32, 33). The two further half-molds (10, 11), which are jointly movable, include a device (22), which in the case of an opened device (1) serves to transport the article (25) out of a first cavity (21.1) into a second cavity (21.2) so that the article (25) can be injection molded around with a further material component in the second cavity (21.2).Type: GrantFiled: January 28, 2002Date of Patent: August 31, 2004Assignee: Foboha GmbHInventors: Werner Bodmer, Rainer Armbruster
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Publication number: 20040159976Abstract: The invention provides a boots for a resin constant velocity universal joint in which a different thickness portion is integrally formed in an inner diameter of a large diameter side end portion of a primarily molded resin bellows in accordance with a secondary molding. A resin bellows (8) constituted by a bellows portion (55), and a small diameter side end portion (40) and a large diameter side end portion (41) which are provided in both end sides of the bellows portion (55) is molded in accordance with a primary molding, and a different thickness portion (56) corresponding to a secondarily molded product is integrally formed in an inner periphery of the large diameter aide end portion (41) of the primarily molded resin bellows (8) by being secondarily molded within an injection metal mold (64). At this time, a molten material of the different thickness portion (56) is injected into a secondary molding space from an optional position of a thin portion.Type: ApplicationFiled: March 26, 2003Publication date: August 19, 2004Inventors: Kazuhiko Sueoka, Yasuji Takada
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Patent number: 6776599Abstract: A method and device for providing a gate blocking material. Specifically, a method for molding a substrate having known good and bad sites thereon, by blocking the gate area of the bad sites during the molding process. A blocking material or an injection pin are used to interrupt the flow of molding compound through an injection molding system, and thereby prevent molding compound from flowing onto the known bad substrate sites.Type: GrantFiled: December 24, 2002Date of Patent: August 17, 2004Assignee: Micron Technology, Inc.Inventors: Bret K. Street, Casey L. Prindiville, Cary Baerlocher
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Patent number: 6776597Abstract: A tool for multi-component injection molding of plastic toothbrush bodies 4 for toothbrushes has two tool halves 1, 1′ which can be opened and closed. In one tool half 1 a linearly movable transfer device 6 is arranged. The hollow mold spaces 2 for injection molding the first component are formed exclusively by the two tool halves 1, 1′. For transferring the injection-molded blanks (3) in the second station, the transfer device 6 moves into the area of the injection-molded blanks 3, picks them up by vacuum suction cups 11, and transfers the injection-molded blanks 3 by linear movement into the second station.Type: GrantFiled: November 27, 2001Date of Patent: August 17, 2004Assignee: Braun Formenbau GmbHInventor: Klaus Bühler
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Publication number: 20040156937Abstract: Disclosed is an injection mod for a display panel of a washing machine, by which the display panel can be simply formed in one body. The present invention includes a first mold having a first film attached to an inside and a second mold assembled to the first mold to form a cavity with the first mold, the second mold having a second film attached to an inside, the second mold having a gate communicating with an opening provided to the second film.Type: ApplicationFiled: November 28, 2003Publication date: August 12, 2004Inventors: Hye Yong Park, Dong Ha Choi, Sung Rak Kong, Dong In Kim
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Patent number: 6773247Abstract: A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.Type: GrantFiled: November 2, 2000Date of Patent: August 10, 2004Assignees: Towa Corporation, Shimizu Co., Ltd.Inventors: Michio Osada, Keiji Maeda, Yoshihisa Kawamoto, Yoshiji Shimizu, Toshiyuki Nishimura, Susumu Yamahara