Preform Stock Acting As Reaction Shaping Surface Cooperating With Recessed Fluent Stock Shaping Means Patents (Class 425/127)
  • Patent number: 6514797
    Abstract: A method and apparatus are provided for assembling a semiconductor package. The invention uses a thin release film placed over package components in a mold cavity. The release film is drawn down over the assembled components and envelops the assembled components with an airtight seal around at least three sides for assisting and defining the flow of encapsulant into empty space between components. A mold compound is flowed into the empty space, assisted by vacuum or air pressure at the airtight seal. The release film is pulled up and away from the assembled components, permitting encapsulant to flow into the remainder of the mold cavity.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: February 4, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Tay L. Chee, Toh K. Seng, Tan K. Chua
  • Patent number: 6514063
    Abstract: The present invention relates to a method and tooling for forming a stent and the stent so formed. The stent includes filaments of a first material and joints of a second material. The present invention also discloses the above described stent in combination with an angioplasty balloon. The tooling in accordance with the present invention provides a fixture having grooves that receive the filaments of the stent to hold the filaments in place for joining. The joining of all of the filaments can be performed simultaneously by laser welding or injection molding a joint material. The tooling in accordance with the present invention also provides the capability to mold the stent as one piece. The method in accordance with the present invention includes the steps of providing a fixture with internal grooves, placing filaments into the grooves and joining the filaments together.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: February 4, 2003
    Assignee: International Business Machines Corporation
    Inventors: Michael A. Acciai, Richard R. Hall, John T. Legg
  • Patent number: 6514064
    Abstract: In order to waterproof a terminal connecting portion of a sheathed wire, in which a terminal fitting and a bare conductor of the sheathed wire are connected with each other, the terminal connecting portion of the sheathed wire is placed into a molding cavity of a molding die such that a bottom face of the terminal connecting portion is closely brought into contact with one of inner faces of the molding cavity. Then molten molding resin is injected into the molding cavity such that a bottom face of a solidified molding resin and the bottom face of the terminal connecting portion define an identical plane.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: February 4, 2003
    Assignee: Yazaki Corporation
    Inventor: Masayuki Kondo
  • Publication number: 20030020196
    Abstract: In a process for producing a polyurethane-foam product molded integrally with an insert, wherein a molded body, including a substrate and a polyurethane-foam molded body being molded integrally with the substrate, is produced, the substrate being disposed in an expansion-molding mold as the insert, a fine groove-shaped polyurethane-foam relief groove and a polyurethane-foam adjuster are formed in an end of the substrate and/or a mold surface of the expansion-molding mold which contacts with the substrate. The relief groove communicates with a cavity of the mold. The adjuster communicates with the relief groove, and has a volume larger than that of the relief groove. The relief groove and the adjuster can control the pressure exerted within the cavity. Polyurethane foam, which is formed by the relief groove and the adjuster, adheres to molded product. Therefore, it is possible to obviate the deflashing operation. An expansion-molding mold therefor is also disclosed.
    Type: Application
    Filed: July 1, 2002
    Publication date: January 30, 2003
    Applicant: TOKAI RUBBER INDUSTRIES, LTD.
    Inventors: Shinji Mayakawa, Juro Ueda
  • Patent number: 6508967
    Abstract: A method of making an interior trim panel for attachment to structure of a vehicle includes the steps of loading a trim blank into a cavity of a mold and loading an edge of the trim blank on a movable slide of the mold. The method also includes the steps of depositing a molten thermoplastic material onto a core of the mold and partially closing the mold. The method further includes the steps of moving the slide into a channel of the core, completely closing the mold, and forcing the molten plastic material into a down-turned flange area of the mold to form the interior trim panel with a down-turned flange.
    Type: Grant
    Filed: December 6, 2000
    Date of Patent: January 21, 2003
    Assignee: Delphi Technologies, Inc.
    Inventors: Carl Henry Visconti, Michael William Jary
  • Patent number: 6506334
    Abstract: A film and heated plastic blank are sized to fit over a mold cavity and a combination of said film and blank formed. The combination is positioned over the mold cavity and formed in said mold cavity into the shape of said mold cavity.
    Type: Grant
    Filed: September 22, 2000
    Date of Patent: January 14, 2003
    Assignee: The University of Massachusetts
    Inventors: Thomas I. Ellison, Stephen P. McCarthy, Arthur K. Delusky
  • Patent number: 6497567
    Abstract: A multi-purpose processing apparatus able to perform both an injection molding operation and a cutting/forming operation. The multi-purpose apparatus places a forming operation into unused space within the injection molding machine, thereby utilizing the already present injection molding clamping pressure to pressure form parts. The apparatus results in a process which combines the three steps of forming, cutting, and injection molding into one continuous operation performed within the injection molding machine, as well as eliminating the need for numerous pre-injection molding steps.
    Type: Grant
    Filed: October 4, 1999
    Date of Patent: December 24, 2002
    Assignee: Serigraph Inc.
    Inventors: Kurt F Eschenfelder, Loren R. Johansen, Michael D. McElhatton, Michael Ruminski
  • Publication number: 20020190411
    Abstract: A mold tool includes upper and lower sections defining a cavity within which a plastic film preform is placed before injection of plastic forming a molded article. The plastic film extends between an interface defined between the sections of the mold. The interface secures a position of the plastic film within the mold tool preventing movement during injection of plastic. The interface is specifically configured to secure the plastic film without damage. The specific configuration of the interface is determined according to a relationship between molding process parameters and physical characteristics of the plastic film.
    Type: Application
    Filed: April 5, 2002
    Publication date: December 19, 2002
    Inventor: Horst Schmidt
  • Publication number: 20020182282
    Abstract: The present invention relates to a method and an apparatus for producing a toothbrush comprising a handle and a brush head provided with a plurality of bristle bundles. A basic body of a brush head is produced preferably from a hard component in an injection-moulding means, the bristle bundles being embedded at their ends in bristle-bundle holding sections which are connected by bridge portions. These bridge portions are cut through and the basic body of the brush head is encompassed preferably with a soft component by injection moulding.
    Type: Application
    Filed: June 7, 2002
    Publication date: December 5, 2002
    Inventor: Andreas Lanvers
  • Publication number: 20020180105
    Abstract: The present invention relates to an insert molding method for injection molding of resin or rubber at an insert set in a lower mold by injecting and filling melted resin or rubber into a cavity of an upper mold through a gate in a state where the upper mold and lower mold are disposed so as to be opposed to each other, and the invention relates to a metal mold therefor, wherein a movable supporting member having flexibility, on which the above-described insert is placed, is vertically movably disposed in a recess formed on the upper surface of the above-described lower mold, and the underside thereof is supported by the tip ends of shafts of a plurality of pressing means that independently operate, and the corresponding movable supporting member is moved while being pressed by the respective shafts of the corresponding pressing means to the upper mold at a plurality of positions, and molding is carried out in a state where the upper surface of the above-described insert is uniformly brought into contact with
    Type: Application
    Filed: November 28, 2001
    Publication date: December 5, 2002
    Inventors: Toshio Saito, Ikuhiko Ozeki
  • Patent number: 6481995
    Abstract: A multi-layer roll having a thin fluoropolymer top coat on an elastomeric base layer bonded to a substantially rigid insert is provided. The top coat is formed by placing a thin non-self supporting fluoropolymer sleeve about the insert, or wrapping extruded fluoropolymer film about the insert which is placed in a mold sleeve and positioned in a book mold to hold the membrane in place. Liquid or flowable elastomer is injected into the space between the insert and flexible top coat at a point downstream of where the top layer is held in position between mold elements to prevent wrinkling. The mold is then heated to cure the elastomer.
    Type: Grant
    Filed: January 2, 2001
    Date of Patent: November 19, 2002
    Assignee: Ames Rubber Corporation
    Inventors: Chris F. Delrosario, Melvin F. Luke, Timothy D. Marvil
  • Publication number: 20020164391
    Abstract: A split-mold, which is used for manufacturing semiconductor devices by resin-encapsulating a substrate on which a plurality of semiconductor chips are formed, includes a first mold and a second mold. The second mold has a pressing surface that is provided with a mold release sheet. The second mold has a mold-release-sheet mechanism holding a mold release sheet outside the pressing surface of the second mold and applying tension to the mold release sheet.
    Type: Application
    Filed: July 2, 2002
    Publication date: November 7, 2002
    Applicant: Fujitsu Limited of Kawasaki
    Inventor: Yasuhiro Shinma
  • Patent number: 6475423
    Abstract: A hybrid injection molding machine that has the capability to draw a decorative or fabric sheet into a mold cavity prior to injection into the mold has opposing male and female mold parts. At least one of the mold parts has an insert formed from a porous metal so that a vacuum may be drawn through the insert in order to draw the fabric sheet into all aspects of the insert cavity so that plastic may then be injection molded into the cavity of the mold.
    Type: Grant
    Filed: February 11, 2000
    Date of Patent: November 5, 2002
    Assignee: Slipmate Company
    Inventors: Vincent Masterson, Mark Matecki
  • Patent number: 6474970
    Abstract: A mould is described for moulding an elastomeric glazing profile in situ on a single major face of a sheet of glazing material, e.g. a glass sheet. The mould comprises a first mould segment and at least one further mould segment which are relatively movable into intimate contact, so that they define, together with the sheet, a mould cavity for moulding the profile on the single major face. The profile has a show face, (i.e. one which is visible in use), and the portion of the mould cavity that moulds the show face is entirely formed by a single mould segment to avoid mould lines on the show face. Also described are a corresponding moulding method and the glazing product thereby obtained, which may be used as a vehicle window.
    Type: Grant
    Filed: May 15, 2000
    Date of Patent: November 5, 2002
    Assignee: Societá Italiana Vetro-SIV-S.p.A.
    Inventors: Nicola Caldoro, Ciro Paudice
  • Publication number: 20020158365
    Abstract: Mold to make a plastics material piece, this mold comprises two parts defining between them a cavity corresponding to the piece to be made, each mold part has a peripheral zone for coming into contact with the peripheral zone of the other mold part, and the two zones, when united in this way, define the joint face of the mold. One of the mold parts is made up of two blocks, namely a central block substantially defining the mold cavity and a peripheral block supporting the peripheral zone, the two blocks being suitable for sliding relative to each other in the mold closure direction, and the peripheral block being capable of being moved so as to move the peripheral zone of said peripheral block away from the edges of the sheet.
    Type: Application
    Filed: January 22, 2001
    Publication date: October 31, 2002
    Inventors: Charles-Guillaume Blanchon, Thierry Vuaillat
  • Patent number: 6471501
    Abstract: A mold for press-molding a resin package body includes a lower mold and an upper mold, wherein the upper mold includes a press plate held in a tiltable manner with respect to a press head used for urging the upper mold against the lower mold and a lock mechanism for locking the press plate. The lower mold includes an inner die carrying a semiconductor device and a resin tablet and an outer die surrounding the inner die in a manner movable up and down with respect to the inner die. In operation, the press plate is first engaged with the outer die in the unlocked state to achieve an exact parallelism with respect to the inner die, and after locking the press plate and melting the resin tablet, the press plate is urged further toward the inner die while simultaneously lowering the outer die such that the space formed by the lower die, outer die and the press plate for accommodating a semiconductor chip is collapsed.
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: October 29, 2002
    Assignee: Fujitsu Limited
    Inventors: Yasuhiro Shinma, Muneharu Morioka, Norio Fukasawa, Yuzo Hamanaka, Tadashi Uno, Hirohisa Matsuki, Kenichi Nagashige
  • Patent number: 6461137
    Abstract: A mold, a molding apparatus embodying said mold, and a method of use thereof. The mold has a moveable mold core and a multi-part mold base having at least a fixed mold base and at least one moveable or slideable mold base slideable from an adjacent to an adjoining position with regard to said fixed mold base. When the moveable mold core is in its closed position the slideable mold portions are adjoining the fixed mold portion to define a mold cavity. The mold base may be shaped so as to aid in forming a part, or to hold a sheet of material onto which molding material is to be deposited so as to encapsulate the part on one or more edges or surface regions.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: October 8, 2002
    Inventors: Charles E. Ash, John H. Gillen
  • Publication number: 20020140122
    Abstract: An inventive mold is adapted to adhere skin materials having a boundary portion and a resin to each other, and is provided with a resin blocking member which is so embedded as to extend substantially along the boundary portion of the skin materials placed in the mold, and a movable member for projecting the resin blocking member from a molding surface. If such a mold is used, a flow of the resin supplied into the mold can be controlled by projecting the resin blocking member to thereby control an arrival timing of the resin at the boundary portion. Thus, displacement of the boundary portion and wrinkling can be securely prevented from occurring.
    Type: Application
    Filed: March 28, 2002
    Publication date: October 3, 2002
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Yoshitaka Kobayashi, Nobuhiro Usui
  • Publication number: 20020140114
    Abstract: A sealing apparatus for sealing by resin a semiconductor wafer having semiconductor elements on its surface. The apparatus includes an upper mold and a lower mold having an area where the semiconductor wafer is mounted, the lower mold having an uneven surface in the area and a shock absorber under the lower mold.
    Type: Application
    Filed: March 25, 2002
    Publication date: October 3, 2002
    Inventor: Jiro Matsumoto
  • Publication number: 20020142058
    Abstract: A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressure lower than the injection pressure applied to the plunger (101) to form debris cavities (DC1, DC2) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.
    Type: Application
    Filed: March 11, 2002
    Publication date: October 3, 2002
    Inventors: Yasuo Tanaka, Jiro Matsumoto
  • Publication number: 20020132022
    Abstract: A device for foaming around a transparent pane for a motor vehicle roof, including a top tool having a top shaping structure mounted on a top carrier, and a bottom tool having a bottom shaping structure mounted on a bottom carrier. The shaping structures act as a boundary for the area to be peripherally foamed, and the top tool and the bottom tool are made adjustable relative to one another for inserting or removing the pane and the interchangeable bottom shaping structure. The top shaping structure is also interchangeable to enable matching of the peripheral foaming device to different size and shape panes to be peripherally foamed.
    Type: Application
    Filed: February 15, 2002
    Publication date: September 19, 2002
    Applicant: Webasto Vehicle systems International GmbH
    Inventors: Karl Stangl, Christian Dunzinger
  • Patent number: 6447280
    Abstract: An injection mold for manufacturing two-component elongated members includes first and second mold cavity members mounted for relative movement toward and away from one another through an open central frame which carries a rotatable central mold plate in it. The central mold plate is configured to engage the parts of the first and second mold cavity members, which do not directly engage one another through the opening in the frame. When the mold is opened, the rotatable mold plate in the central frame member is rotated to place a pre-form on the opposite side of the mold for injection of a second component in the opposite side of the mold. The central frame moves one-half the distance between the first and second mold cavity members; and the rotatable mold plate is rotated 180° in each cycle.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: September 10, 2002
    Assignee: Tech Mold, Inc.
    Inventor: Tod M. Grimm
  • Patent number: 6447406
    Abstract: A golf ball mold including a spherical cavity having a large number of projections for shaping dimples on the inner wall surface with a parting surface provided at a position substantially corresponding to an equator of the cavity, provided with a plurality of core support pins elongating reciprocally movably on a circle centering on each pole of the cavity of the upper mold or the lower mold with a predetermined radius with a predetermined distance with each other in the cavity in the direction perpendicular to the parting surface. In the golf ball mold, the support pins have a dimple shaping projection at the tip portion thereof having a round shape on the cavity wall surface level, protruding from the position to the cavity center direction when the support pins are withdrawn to the cavity wall surface position.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: September 10, 2002
    Assignee: Bridgestone Sports Co., Ltd.
    Inventor: Tamotsu Kato
  • Publication number: 20020121715
    Abstract: A mold apparatus and method for forming a shaped laminate in one step are provided where the laminate includes a cladding layer and a foam backing layer. The apparatus includes a male mold half matable to a female mold half that define a mold cavity. An inlet is mounted on the mold apparatus for introducing foamable materials into the mold cavity. Edge folding members, carried by one of the mold halves, movable from a retracted position to an extended position, fold the cladding layer over at least part of the edge of the foam backing layer. Trim blades are located adjacent to the edge folding members movable from a retracted position adjacent the cavity to an extended position engaging the other mold half to sever the cladding layer to define the finished shape of the laminate.
    Type: Application
    Filed: November 9, 2001
    Publication date: September 5, 2002
    Inventors: Paul Sandefer, Benji Rude, Arthur C. Stein, Douglas Litwiller, Thomas W. Gibson, David White
  • Patent number: 6439537
    Abstract: The invention is a seat bun mold (10) with a recess (12) suitable for containing a fastener strip (18) to be molded into the seat bun, the recess (12) having an end wall (14) shaped so as to provide a snap-fit seal against the end of the fastener strip (18), in order to prevent fouling of the fastener strip (18) during the seat bun molding process. End wall (14) extends from the bottom to the top of the recess (12), and substantially curves inward along its lower extent and outward along its upper extent. The end of fastener strip (18) is snapped into recess (12) by first aligning fastener strip (18) over recess (12) and then exerting downward pressure. The tension of the end of fastener strip (18) against end wall (14) forms a seal to prevent intrusion of liquid molding material through end wall (14) of recess (12).
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: August 27, 2002
    Assignee: YKK Corporation of America
    Inventors: Nobuo Fujisawa, Tsuyoshi Minato, Craig Jay Graham
  • Patent number: 6436329
    Abstract: Methods for making fused film-plastic parts and parts made thereby are disclosed. The paint film covered parts include a show surface section with a paint film laminate overlying the plastic substrate of this section of the part to provide the desired aesthetic appeal. An attachment flange section of the part is provided and is usually hidden from sight when the part is assembled to the auto or truck body structure. The flange serves as a location at which clamps, bolts, rivets or the like can support or attach to the auto to truck structure. A raised portion, such as a boss section, is provided intermediate the show surface section and the attachment flange. This boss is adapted for contiguous or closed spaced positioning adjacent the auto or truck structural part. The boss is completely covered by the paint film with the paint film terminating along the attachment flange.
    Type: Grant
    Filed: February 19, 1999
    Date of Patent: August 20, 2002
    Assignee: Green Tokai Co., Ltd.
    Inventors: William H. Hardgrove, Hiroaki Yamamoto, Michael A. Swartz, Andrew G. Yorde
  • Publication number: 20020101003
    Abstract: Novel thermoplastic pipes which can withstand extremely high internally generated and/or applied pressures for utilization within, primarily, high pressure underground liquid and gas transport systems are provided. Such pipes are improvements over standard metal (i.e., steel, lead, and the like) pipes due to construction costs, shipping costs, implementation costs (particularly underground), modulus strength allowances to compensate for underground movements (i.e., earthquakes and tremors), non-rusting characteristics, and ease in manufacture. Such pipes are preferably reinforced with specific fabric articles which permit a lower thickness of plastic to be utilized than is generally required to withstand high pressure situations. A simplified, potentially on-site production method for producing more uniform, better-performing pipes as well as a specific molding dorn for such a purpose are also contemplated within this invention.
    Type: Application
    Filed: January 26, 2001
    Publication date: August 1, 2002
    Inventor: Willy DeMeyer
  • Publication number: 20020101006
    Abstract: An injection-molding mold having two parts adapted to take up between them the periphery of a substrate and one of which defines a molding cavity connected to means for feeding a coating material for encapsulating a row of spaced integrated circuit chips carried by a mounting face of said substrate and placed in said cavity, characterized in that the part (10) with cavities (14) includes a slot (17) for injecting the coating material into said cavity above the mounting face (2) of the substrate, recessed into its face (12) bearing on the substrate (1) along said row of chips and extending approximately the whole length of that row of chips.
    Type: Application
    Filed: February 1, 2001
    Publication date: August 1, 2002
    Applicant: STMicroelectronics S.A.
    Inventor: Christophe Prior
  • Patent number: 6413460
    Abstract: A method of producing a partially covered panel comprising a series of manufacturing steps. A covering is formed to have a perimeter portion. The covering is generally formed using a thermoforming operation. The perimeter portion is formed into a flange-shape. A mold movable between open and closed position is moved to an open position. The mold includes a first and second surface. The covering is placed juxtaposed the first surface. A retainer is extended to retain the covering in position prior to and during the molding operation. The retainer engages the perimeter flange portion of the covering. The mold is moved to the closed position. The retainer, covering and first surface define a first cavity section. A first quantity of molten plastic is injected under pressure into this first cavity section. The molten plastic pushes the flange portion against the retainer and the retainer prevents the seepage of plastic between the first surface and the covering.
    Type: Grant
    Filed: September 10, 1998
    Date of Patent: July 2, 2002
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Aaron Stanley Wisniewski, Talavane Suryanarayan, Hazel Wagner, Frederick J. Homburg, Calvin Columbus Nichols, Charles Luke Berry
  • Publication number: 20020079611
    Abstract: A film is placed over a mold cavity extending over the mold cavity rim. The film is held in place over the mold cavity by a frame member which engages the film adjacent the mold cavity rim. The frame is magnetically secured in place over the mold cavity rim to hold the film over the mold cavity rim. Molten plastic is provided over the film and the film and plastic is formed into a molded article having the shape of the mold cavity.
    Type: Application
    Filed: December 27, 2000
    Publication date: June 27, 2002
    Inventors: Thomas M. Ellison, Arthur K. Delusky, Stephen P. McCarthy
  • Publication number: 20020079615
    Abstract: The present invention is directed to an apparatus and method for venting trapped air and gasses in a mold. The mold and method comprise or use at least one pin formed from multiple pin sections. When assembled, the pin sections provide space on the interior of the pin through which trapped air and gasses can escape from the mold. The present invention may also be used to assist in ejecting an object from the mold. The pins can have circular or non-circular cross-sections and also may have dimple-forming projections to conform to a golf ball dimple pattern.
    Type: Application
    Filed: December 22, 2000
    Publication date: June 27, 2002
    Inventors: Paul A. Puniello, Robert A. Wilson
  • Patent number: 6402495
    Abstract: A resin-molding die for embedding in a molded resin a plurality of bus bars connected with each other via a bridge portion includes a supporting member formed on a first mold, for supporting the bus bars, a pin-receiving hole formed in the supporting member at a position associated with the bridge portion, and a pin provided on a second mold at the position associated with the bridge portion and the pin-receiving hole, for cutting and raising the bridge portion substantially at an intermediate part thereof.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: June 11, 2002
    Assignee: Kabushiki Kaisha T AN T
    Inventors: Hisashi Soga, Kouichi Sinzawa, Yoshihisa Fuse
  • Patent number: 6402494
    Abstract: The present invention relates to a method and an apparatus for producing a toothbrush comprising a handle and a brush head provided with a plurality of bristle bundles. A basic body of a brush head is produced preferably from a hard component in an injection-moulding means, the bristle bundles being embedded at their ends in bristle-bundle holding sections which are connected by bridge portions. These bridge portions are cut through and the basic body of the brush head is encompassed preferably with a soft component by injection moulding.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: June 11, 2002
    Assignee: M + C SChiffer GmbH
    Inventor: Andreas Lanvers
  • Publication number: 20020064635
    Abstract: A molded product which is free of flash resulting from application of a coating agent or the like, parting surface covering masks for preventing the flash, and producing methods of these. The mask is mounted to each of a lower mold and an upper mold, so as to cover parting surfaces which are at inner side than a rim molding portion and cover their vicinities. Adjusting portions are attached to a mask body of the mask, and are capable of correspondingly getting tight contact with the parting surfaces. Accordingly, even when the coating agent is applied to the each mold by using a spray gun or the like in this state, the coating agent is not applied to the parting surfaces and their vicinities.
    Type: Application
    Filed: November 27, 2001
    Publication date: May 30, 2002
    Inventors: Tomohiro Takefuji, Akio Ono, Koji Ishii, Takemichi Yamauchi
  • Publication number: 20020058081
    Abstract: A multilayer molded article constitutes a resin body and a skin material which covers a part of the surface of the resin body so that an edge part of the skin material present on the surface of the resin body is placed in a groove formed on the surface of the resin body. The article is produced by providing an unclosed mold having a lower mold having at least one pin for fixing the edge part of the skin material at a position where the edge part of the skin material is placed and an upper mold having a kick for forming the groove, placing the skin material on the lower mold and fixing the edge part of the skin material with the pin, supplying a mass of resin melt between the skin material and the lower mold, and closing the upper and lower molds to form the multilayer molded article.
    Type: Application
    Filed: January 7, 2002
    Publication date: May 16, 2002
    Applicant: Sumitomo Chemical Company, Limited
    Inventors: Shohei Masui, Masahito Matsumoto, Nobuhiro Usui, Toshihiro Hosokawa, Ryuichi Ishitsubo
  • Publication number: 20020051831
    Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.
    Type: Application
    Filed: November 13, 2001
    Publication date: May 2, 2002
    Inventor: Steven G. Thummel
  • Patent number: 6375699
    Abstract: The injection mold for insert-molding a synthetic material around the edge of a filter material comprising at least one particle filter layer and at least one active carbon layer of active carbon particles, is provided with a first mold half and a second mold half which comprise mutually confronting mold walls. In their assembled state, the two mold halves define a receiving space for the filter material, a molding space for accommodating the edge of the filter material and for forming the synthetic material to be arranged by insert molding around the edge of the filter material, with at least one injection channel entering the molding space, and a transition space arranged between the receiving space and the molding space for accommodating the edge portion of the filter material adjacent the edge of the filter material. The transition space is formed with a constricted portion for preventing the leakage of synthetic material from the molding space into the receiving space.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: April 23, 2002
    Assignee: 3M Innovative Properties Company
    Inventor: Roland Beck
  • Publication number: 20020038916
    Abstract: A method for molding and aligning microstructures on a patterned substrate using a microstructured mold. A slurry containing a mixture of a ceramic powder and a curable fugitive binder is placed between the microstructure of a stretchable mold and a patterned substrate. The mold can be stretched to align the microstructure of the mold with a predetermined portion of the patterned substrate. The slurry is hardened between the mold and the substrate. The mold is then removed to leave microstructures adhered to the substrate and aligned with the pattern of the substrate. The microstructures can be thermally heated to remove the binder and optimally fired to sinter the ceramic powder.
    Type: Application
    Filed: October 5, 2001
    Publication date: April 4, 2002
    Applicant: 3M Innovative Properties Company
    Inventors: Raymond C. Chiu, Timothy Lee Hoopman, Paul Edward Humpal, Vincent Wen-Shiuan King, Kenneth R. Dillon
  • Patent number: 6364648
    Abstract: The fixture of the invention provides a bottom portion into which a mold half is placed. Movably mounted above the bottom portion is a top portion having two horizontal plates adapted to slide relative to each other to control the X direction and Y direction and hold a preform or wafer. The top portion is further adapted to allow for the adjustment of the relative angle between the preform or wafer and mold half, as well as adjustment of the distance between the top portion and bottom portion.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: April 2, 2002
    Assignee: Johnson & Johnson Vision Care, Inc.
    Inventors: Joseph A. Bishop, Eric S. Dogan
  • Publication number: 20020028261
    Abstract: A method for molding composite items, constituted by beads of sintered expanded resin and by inserts, comprising the steps of: using a movable half-mold and first and second half-molds which can perform a translational motion at right angles to the direction of motion of the movable half-mold; performing the molding operation by means of one of the translatable half-molds mated with the movable half-mold, translating the translatable half-mold from a position for accessing the half-mold to a molding position, simultaneously accessing the other one of the translatable half-molds when the other one of the translatable half-molds is located at the region for access to the translatable half-mold.
    Type: Application
    Filed: June 22, 2001
    Publication date: March 7, 2002
    Applicant: ALESSIO S.R.L.
    Inventor: Gianni Franco Alessio
  • Publication number: 20020020940
    Abstract: A resin tape substrate with a semiconductor chip mounted thereon is put to an attachment area surface of a cavity bottom surface, and a plurality of suction holes connected to a suction system are disposed in the attachment area surface, wherein the attachment area surface of the cavity is formed in a semiconductor resin mold, so that the molten resin given into the cavity does not flow into the back surface of the resin tape substrate which is sucked on the attachment area surface in the mold.
    Type: Application
    Filed: June 25, 2001
    Publication date: February 21, 2002
    Inventor: Mika Kiritani
  • Publication number: 20020015748
    Abstract: The resin molding machine and a method of resin molding of the present invention are capable of securely and efficiently mold a work piece, on which a plurality of elements are arranged. The resin molding machine comprises: a lower die on which a work piece to be molded is set; an upper die clamping the work piece with the lower die; a clamper being provided to the upper die, the clamper enclosing a resin molding space of the upper die, the clamper being capable of vertically moving in the upper die and always biased downward, wherein a lower end of the clamper is downwardly projected from a resin molding face of the upper die when the lower die and upper die are opened; and a release film feeding mechanism feeding release film, which is easily peelable from the upper die and resin for molding, so as to cover the rein molding space.
    Type: Application
    Filed: October 5, 2001
    Publication date: February 7, 2002
    Inventors: Fumio Miyajima, Kunihiro Aoki, Tsutomu Miyagawa, Hideaki Nakazawa
  • Patent number: 6343918
    Abstract: A sheet-decorating injection molding machine is provided with a female mold, a male mold, a sheet clamper for fixedly holding a decorative sheet on a parting surface of the female mold, and a hot plate having a first heating plate and a second heating plate jointed at corresponding edges thereof in a V-shape. The heating surfaces of the first and second heating plates face the female mold. The V-shaped hot plate is moved to a position near the decorative sheet held by the sheet clamper on the female mold to heat the decorative sheet uniformly.
    Type: Grant
    Filed: October 30, 1997
    Date of Patent: February 5, 2002
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Hiroyuki Atake
  • Patent number: 6344162
    Abstract: The method of manufacturing semiconductor devices is capable of efficiently manufacturing semiconductor devices and preventing production of bad products. The method is executed in a molding machine including an tipper die and a lower die, in one of which a plurality of cavities corresponding to resin-molded parts of the semiconductor devices are formed. And, the method comprises the steps of: covering inner faces of the cavities and a parting face of one of the dies, which contacts a substrate of the semiconductor devices, with release film, which is easily peelable from the dies and resin for molding; clamping the substrate with the dies; filling the resin in the cavities; and forming the semiconductor devices by cutting the molded substrate.
    Type: Grant
    Filed: June 22, 1999
    Date of Patent: February 5, 2002
    Assignee: Apic Yamada Corporation
    Inventor: Fumio Miyajima
  • Patent number: 6342176
    Abstract: The object of the invention is to provide a method for molding a resin-molded article having an excellent surface appearance without any resin-intrusion part on the front surface of a skin thereof. In the invention, the skin is placed on a part of a inner wall of a mold and then injecting a synthetic resin into a cavity of the mold to effect an integral molding of a resin-molded article having the skin on a part thereof, wherein a mold having a first gate on a first inner wall part located on the part other than the back surface of the skin placed on the inner wall of said mold and a second gate on a second inner wall part which faces the back surface of the skin placed on the inner wall is employed; and wherein the synthetic resin is first injected from said first gate until the tip portion of the synthetic resin comes close to the edge of said skin, and then the synthetic resin is injected from the second gate.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: January 29, 2002
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Atsushi Goto, Akio Nakano, Tatsuo Yamada, Kenichi Furuta, Minoru Toda, Tetsuya Fujii
  • Patent number: 6340442
    Abstract: A method and apparatus for producing tubular molded products from molding material includes a mold casing and a mold core having a common longitudinal central axis which is vertically disposed. The mold casing and mold core are spaced from one another to define a molding space therebetween. A supply device supplies molding material from above the molding space into the molding space. Treatment apparatus is disposed at treatment zones on the mold core for treating the molding material in the molding space, the treatment including treating the molding material by shaking the molding material or treating the molding material by heating the molding material, or both.
    Type: Grant
    Filed: March 28, 1997
    Date of Patent: January 22, 2002
    Assignee: iloma Automatisierungstechnik GmbH
    Inventor: Manfred Brokmann
  • Patent number: 6332766
    Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: December 25, 2001
    Assignee: Micron Technology, Inc.
    Inventor: Steven G. Thummel
  • Patent number: 6332991
    Abstract: A container for cross-linking composite materials on dental bridges and arches and on individual teeth, comprising: a plurality of plate-like elements which can be stacked and clamped together, at least one of the plate-like elements, which is internal to the plurality of plate-like elements, being constituted by a plurality of blocks which can be removed independently of each other to form an area which is suitable to constitute a mold into which it is possible to place a metallic structure on which the elements of a dental prosthesis are to be formed, the at least one of the plate-like elements and a plate-like element that is adjacent thereto in an upward region and constitutes the top plate-like element of the container being both made of a material which is transparent to light.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: December 25, 2001
    Inventors: Silvia Assi, Antonio Tissi
  • Patent number: 6325607
    Abstract: A decoration sheet is fed on a mold and then is heated to a temperature above a heat distortion temperature thereof, is conformed to the surface of a cavity of the mold by vacuum drawing. Then the molds are clamped, and a resin is injected to adhere the decoration sheet to the resin. The decoration sheet is preheated to a temperature below the heat distortion temperature by sheet preheating means before fed onto the mold. The decoration sheet preheated by the sheet preheating means is fed to the mold by sheet feeding means.
    Type: Grant
    Filed: April 28, 1999
    Date of Patent: December 4, 2001
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Hiroyuki Atake
  • Patent number: 6319433
    Abstract: A method of forming an ophthalmic lens using a composite ophthalmic lens vacuum mold to quickly and inexpensively produce, on-site, multi-focal, prescription and non-prescription optical quality eyeglasses, with or without photochromic, and photochromic non-prescription (e.g., sunglasses, safety glasses, reading glasses, etc.) optical quality eyeglass via a vacuum remolding. The method further includes a rigid remolding process for forming the composite ophthalmic lens.
    Type: Grant
    Filed: September 14, 1999
    Date of Patent: November 20, 2001
    Assignee: Invicta Corporation
    Inventor: George Kohan