Nickel Coating Patents (Class 427/438)
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Patent number: 5252360Abstract: A process for the production of engraved rolls and plates for printing operations wherein there are applied to a base member of metal, after it has been engraved, at least two layers of a metal and, respectively, a metal compound for increasing the hardness and the corrosion protection in order to achieve surface hardness values of at least 2000 HV.Type: GrantFiled: July 10, 1992Date of Patent: October 12, 1993Inventors: Wolfgang Huttl, Alois Vester
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Patent number: 5227332Abstract: In the plating of articles, particularly the filling of via-holes (16) in the manufacture of semiconductor devices, a catalyst, for example palladium, is incorporated throughout the body of material (12) to which plating is to be effected, as compared with activating just the surface of the body.Type: GrantFiled: July 25, 1991Date of Patent: July 13, 1993Assignee: LSI Logic CorporationInventor: Neil Morris
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Patent number: 5223052Abstract: A method treating a surface of rotors in a screw-type rotary fluid machine, with the method comprising the steps of: conducting a non-electrolytic Ni plating on the surface of each rotor so as to form a first layer of non-electrolytic Ni plating layer; heating the rotor having the first layer at a temperature not lower than 500.degree. C.; and forming, at least, a second layer of an organic resin so as to cover the first layer.Type: GrantFiled: April 3, 1991Date of Patent: June 29, 1993Assignee: Hitachi, Ltd.Inventors: Akihiko Yamamoto, Toshihiro Yamada, Tatsuo Natori, Kotaro Naya, Motohiro Satoo, Mitsuru Fujiwara, Katsumi Matsubara, Kazuaki Shiinoki, Hirotaka Kameya
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Patent number: 5194295Abstract: Nickel or cobalt diffusion is suppressed in ceramic articles having a nickel or cobalt underlayer followed by a gold overlayer, by heat-treating the article in a reducing atmosphere at a temperature of at least about 650.degree. C. and subsequently depositing a final gold layer. By suppressing the diffusion of nickel or cobalt, the adhesion of hermetic lids attached thereto by soldering is improved.Type: GrantFiled: February 19, 1992Date of Patent: March 16, 1993Assignee: General Electric CompanyInventor: Charles D. Iacovangelo
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Patent number: 5183692Abstract: A method for producing a coating composed of an electroless metal plate, such as a copper plate, tightly bonded to a polyimide layer comprises a multi-step cure of the polyimide layer carried out in combination with a palladium-catalyzed electroless deposition process. A solution of a polyamic acid compound that is the precursor for the desired polyimide resin in a vaporizable solvent is applied to a substrate and heated preferably to temperature below 250.degree. C., to form a soft-cured polyimide film. The film is immersed in an aqueous palladium-tin colloidal suspension to deposit the colloidal particles thereon, which particles are then activated to form palladium nuclei dspersed on the surface. The soft-cured film is then heated, preferably above about 250.degree. C., to vaporize residual solvent and form a hard-cured polyimide layer having the palladium nuclei dispersed on the surface.Type: GrantFiled: July 1, 1991Date of Patent: February 2, 1993Assignee: Motorola, Inc.Inventors: Prosanto K. Mukerji, Russell Mallen, George Demet, Harry Fuerhaupter
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Patent number: 5164225Abstract: A method of fabricating a thin-film EL device comprising the steps of sequentially forming and stacking a first electrically conductive layer of first electrodes, a first insulating layer, a luminous layer, a second insulating layer and a second electrically conductive layer of second electrodes; previously forming a pattern of the first conductive layer all over a zone for formation of the first electrodes and a zone for formation of electrode terminals; and immersing it into a plating solution to selectively form a terminal pattern only on the first conductive layer, whereby the need for pattern aligning operation can be eliminated, only immersion of it into the plating solution enables easy formation of the precise terminal pattern without providing any damage to the elements of the EL device, and the obtained device can maintain its stable characteristics for a long period of time.Type: GrantFiled: March 25, 1991Date of Patent: November 17, 1992Assignee: Kabushiki Kaisha Komatsu SeisakushiInventors: Takashi Nire, Satoshi Tanda
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Patent number: 5158604Abstract: Viscous aqueous electroless plating solutions comprising ionic depositable metal species such as copper or nickel, metal complexing agent such as EDTA, metal reducing agent such as formaldehyde or hypophosphite and thickener such as xantham gum, silica or carboxymethylcellulose have a viscosity greater than 50 cp, for instance up to 20,000 cp. The viscous solutions are useful for electrolessly depositing metal onto moving or inclined catalytic substrates and as a component of kits for applying electrolessly deposited metal images to such surfaces.Type: GrantFiled: July 1, 1991Date of Patent: October 27, 1992Assignee: Monsanto CompanyInventors: Albert W. Morgan, George D. Vaughn, Douglas H. Teramura
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Patent number: 5147692Abstract: Conductive surfaces such as copper and/or tungsten surfaces, particularly copper circuitry areas of printed circuit board substrates or fused tungsten circuitry areas of fused tungsten-ceramic packages, are activated for receipt of electroless nickel plating thereon by providing the surfaces with particulate zinc metal, particularly by contact of the surfaces with an aqueous suspension of particulate zinc metal.Type: GrantFiled: April 23, 1991Date of Patent: September 15, 1992Assignee: MacDermid, IncorporatedInventor: Jon E. Bengston
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Patent number: 5145517Abstract: A process of electrolessly metallizing a body on the surface thereof with a metal coating incorporating particulate matter therein, which process comprises contacting the surface of said body with a stable electroless metallizing bath comprising a metal salt, an electroless reducing agent, a complexing agent, an electroless plating stabilizer, a quantity of particulate matter which is essentially insoluble or sparingly soluble in the metallizing bath, and a particulate matter stabilizer (PMS), and maintaining said particulate matter in suspension in said metallizing bath during the metallizing of said body for a time sufficient to produce a metallic coating with said particulate matter dispersed therein.Type: GrantFiled: March 11, 1991Date of Patent: September 8, 1992Assignee: Surface Technology, Inc.Inventors: Nathan Feldstein, Deborah J. Lindsay
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Patent number: 5141778Abstract: A method for producing extremely smooth metal coatings on zincated aluminum substrates using a special double zincating procedure and/or a specially formulated electroless metal plating bath employing a unique plating process.Type: GrantFiled: January 23, 1991Date of Patent: August 25, 1992Assignee: Enthone, IncorporatedInventors: Eugene F. Yarkosky, Patricia A. Cacciatore
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Patent number: 5079040Abstract: To electrolessly depositing nickel on tungsten surfaces or molybdenum surfaces which have been deposited on surfaces of ceramic bodies, the ceramic bodies are nucleated, preferably after thorough cleaning, for example with aqueous hydrofluoric acid, by immersion in an aqueous solution containing palladium ions and then introduced into an electroless nickel-plating bath. Before the nickel-plating, the nucleated ceramic bodies are treated in a bath containing a complexing agent for palladium ions, for example in an aqueous cyanide solution.Type: GrantFiled: August 15, 1989Date of Patent: January 7, 1992Assignee: Hoechst CeramTec AktiengesellschaftInventor: Jurgen Brandenburger
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Patent number: 5077099Abstract: An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, and an electroless metal depositing apparatus for carrying out the process.Type: GrantFiled: March 14, 1990Date of Patent: December 31, 1991Assignee: MacDermid, IncorporatedInventors: Peter E. Kukanskis, Edward T. Donlon
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Patent number: 5045436Abstract: The invention relates to compositions containinga) at least one organic polymer andb) a dibenzalacetone palladium complex of formula I ##STR1## which is homogeneously dissolved in said polymer but is not copolymerisable therewith, in which formula IR.sup.1 is hydrogen, C.sub.1 -C.sub.18 alkyl, C.sub.1 -C.sub.18 alkoxy or unsubstituted or substituted phenyl,R.sup.2 has one of the meanings of R.sup.1 or is also an amino, nitro or cyano group, an --O--C.sub.m H.sub.2mn OR.sup.4 or --O--CH.sub.2 --CH.OR.sup.4 --CH.sub.2.OR.sup.5 radical or a halogen atom or a glycidyl ether radical,R.sup.3 is hydrogen or C.sub.1 -C.sub.4 alkyl or the two groups R.sup.3 together form a C.sub.2 -C.sub.4 polymethylene chain,R.sup.4 and R.sup.5 have one of the meanings of R.sup.1,q is a value from 1 to 3.5,m is a value from 2 to 6 andn is a value from 0 to 20, with the proviso that the composition does not contain a polymer with an olefinic double bond.Type: GrantFiled: March 3, 1989Date of Patent: September 3, 1991Assignee: Ciba-Geigy CorporationInventors: Bernd Tieke, Sheik A. Zahir
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Patent number: 5017410Abstract: Electroless plating compositions are described which produce a boron containing nickel coating. The compositions comprise a water soluble nickel salt, a chelating agent, an alkali metal hydroxide, a boron containing reducing agent, and thiocarbanilide. The composition is particularly useful for providing such coatings on gas turbine engine parts and results in improved wear resistance.Type: GrantFiled: May 23, 1988Date of Patent: May 21, 1991Assignee: United Technologies CorporationInventor: Henry M. Hodgens, II
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Patent number: 5011708Abstract: A method of preventing the growth of microorganisms on the surface of a substrate in contact with the environment, while simultaneously preventing corrosion of these substrates by depositing nickel-63 onto the substrate.Type: GrantFiled: June 6, 1989Date of Patent: April 30, 1991Assignee: University of Virginia Alumni Patents FoundationInventors: James L. Kelly, Ralph J. Reda
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Patent number: 5006367Abstract: A method for the electroless coating of ferromagnetic substrates substantially free of microspheres or other unwanted auxillary matter, thereby reducing the roughness of the coated articles. The method and articles produced are subjected to a magnetic field and demagnetized prior to the plating step. The method is of particular utility in the coating of textile machinery parts operating at high rotational speed in the minimizing of dust and yarn damage. The method is also of great utility in the deposition of composite electroless coatings.Type: GrantFiled: February 13, 1990Date of Patent: April 9, 1991Assignee: Surface Technology, Inc.Inventor: Thomas S. Lancsek
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Patent number: 4997686Abstract: A process of electrolessly metallizing a body on the surface thereof with a metal coating incorporating particulate matter therein, which process comprises contacting the surface of said body with a stable electroless metallizing bath comprising a metal salt, an electroless reducing agent, a complexing agent, an electroless plating stabilizer, a quantity of particulate matter which is essentially insoluble or sparingly soluble in the metallizing bath, and a particulate matter stabilizer (PMS), and maintaining said particulate matter in suspension in said metallizing bath during the metallizing of said body for a time sufficient to produce a metallic coating with said particulate matter dispersed therein.Type: GrantFiled: April 16, 1990Date of Patent: March 5, 1991Assignee: Surface Technology, Inc.Inventors: Nathan Feldstein, Deborah J. Lindsay
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Patent number: 4983428Abstract: Electroless plating compositions are described which produce a boron containing nickel coating. The compositions comprise a water soluble nickel salt, a chelating agent, an alkali metal hydroxide, a boron containing reducing agent, and ethylenethiourea. The composition is particularly useful for providing such coatings on gas turbine engine parts and results in improved wear resistance.Type: GrantFiled: June 9, 1988Date of Patent: January 8, 1991Assignee: United Technologies CorporationInventor: Henry M. Hodgens, II
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Patent number: 4954370Abstract: A novel electroless plating bath composition and method for the use thereof, are described for depositing a layer of nickel on anodized aluminum substrates for facilitating direct attachment of electronic chips thereto; the bath composition being a neutralized solution of nickel sulfate, sodium citrate, lactic acid and dimethylbomine in deionized water.Type: GrantFiled: December 21, 1988Date of Patent: September 4, 1990Assignee: International Business Machines CorporationInventor: Issa S. Mahmoud
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Patent number: 4935263Abstract: A strain detector which has a driven shaft for receiving a stress; a high magnetostrictive rate magnetic layer made of one of Co--B, Co--P, Co--Ni--B, Ni--Fe--P, and Co--Ni--P formed by electroless plating on the outer periphery of the driven shaft; and a detecting coil disposed through a gap on the periphery of the magnetic layer for detecting a variation in the permeability by a strain responsive to the stress of the magnetic layer, a method for manufacturing the strain detector which has the steps of forming a high magnetostrictive plating layer made of one of Co--B, Co--P, Co--Ni--B, Ni--Fe--P and Co--Ni--P by electroless plating on the periphery of the driven shaft; and selectively removing the plating layer to obtain a magnetic layer made of a plurality of magnetic pieces aligned in parallel at a predetermined angle with respect to the central axis of the driven shaft.Type: GrantFiled: December 16, 1988Date of Patent: June 19, 1990Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Hiroshi Satoh, Yoshihiko Utsui, Kuraki Kitazaki, Takashi Taniguchi, Kiyoshi Hayashi
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Patent number: 4880597Abstract: A fuel element for a nuclear reactor having a zirconium tin alloy cladding tube, with a thin coating of enriched boron-containing alloy burnable poison, such as nickel-thallium-boron deposited from a reducing agent by an electroless plating process.Type: GrantFiled: June 24, 1988Date of Patent: November 14, 1989Assignee: Combustion Engineering, Inc.Inventors: William J. Bryan, Nathan Fuhrman
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Patent number: 4871582Abstract: Disclosed is a method of manufacturing a magnetic recording medium which comprises the steps of: forming a non-magnetic layer on a substrate by using a non-magnetic material which is magnetizable by heat to a predetermined temperature, and then locally heating the non-magnetic layer to magnetize the heated part to thereby form a magnetic layer thereat.Type: GrantFiled: August 20, 1987Date of Patent: October 3, 1989Assignee: Brother Kogyo Kabushiki KaishaInventor: Takeshi Miyabayashi
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Hydrazine bath for chemically depositing nickel and/or cobalt, and a method of preparing such a bath
Patent number: 4844739Abstract: The bath uses nickel-II-tri(ethylenediamine) hydroxide and/or cobalt-II-tri(ethylenediamine) hydroxide having the formula M(NH.sub.2 --C.sub.2 H.sub.4 --NH.sub.2).sub.3 (OH).sub.2 as a source of the metal to be deposited, where M represents nickel and/or cobalt, and where the ethylenediamine acts as the complexing agent.Type: GrantFiled: November 19, 1986Date of Patent: July 4, 1989Assignee: Office National d'Etudes et de Recherches AerospatialesInventors: Pierre J. Josso, Isabelle V. Gossart, Claude Duret-Thual -
Patent number: 4842961Abstract: A lid or cover for a ceramic enclosure is formed of a substrate of an iron-based alloy, e.g., Kovar, alternately plated and coated with electrolytic nickel and electroless nickel, with an outer gold electroplate. The alternate electroplate and electroless nickel layers render the lid highly corrosion resistant without the need for an expensive, unrecoverable buried gold layer.Type: GrantFiled: March 4, 1988Date of Patent: June 27, 1989Assignee: Advanced Materials Technology Corp.Inventors: Thomas J. Basile, Jean LaPlante
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Patent number: 4840820Abstract: A process is provided for improving the electroless nickel plating of aluminum which has been pretreated with a barrier coating such as zinc by employing multiple plating baths under controlled operating conditions.Type: GrantFiled: October 15, 1985Date of Patent: June 20, 1989Assignee: Enthone, IncorporatedInventors: Paul B. Schultz, Eugene F. Yarkosky
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Patent number: 4830889Abstract: A process for co-depositing fluorinated carbon with electroless nickel which provides a uniformly dispersed co-deposit. The process includes the use of a non-ionic, wetting agent in combination with a cationic wetting agent for the suspension of fluoronated carbon in the electroless nickel solution.Type: GrantFiled: September 21, 1987Date of Patent: May 16, 1989Assignee: Wear-Cote International, Inc.Inventors: James R. Henry, Ernest M. Summers
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Patent number: 4816119Abstract: This invention comprises the use, during the plating processing of thin-film magnetic recording media, of an oxidizing treatment immediately preceding the electroplating of the magnetic layer. This oxidizing treatment can be controlled to produce desired high levels of coercive force and low levels of media noise.Type: GrantFiled: September 4, 1987Date of Patent: March 28, 1989Assignee: Digital Equipment Corp.Inventors: Gary C. Rauch, Young David J., Earl R. C. Johns, Robert L. Stone, Carolyn A. Messinger
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Patent number: 4793201Abstract: A static pressure lead screw includes a porous ceramic body having fluid flow paths as part of a flank. The porous ceramic body is fixed by a tubular base member through which the fluid does not flow. Fluid guide holes for supplying the fluid to the porous body extend through the tubular base member and are connected to the porous body. In a preferred embodiment, an electroless-plated layer is formed in a surface layer of the flank or an inner portion continuous with the surface layer, thereby obtaining various high-accuracy static pressure guides with high statical stiffness.Type: GrantFiled: September 9, 1987Date of Patent: December 27, 1988Assignee: Nippon Telegraph and Telephone CorporationInventors: Munenori Kanai, Sunao Ishihara, Hiroo Kinoshita
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Patent number: 4751110Abstract: An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.Type: GrantFiled: July 14, 1986Date of Patent: June 14, 1988Assignee: Shipley Company Inc.Inventors: Michael Gulla, Terrell A. Benjamin, Mark Farsi
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Patent number: 4737418Abstract: A lid for closing an electronics package exhibits a high corrosion resistance. The lid is formed of a metal substrate which is clad with rolled or worked nickel, and covered with a layer of gold or precious metal electroplate. At edges of the lid, which are not covered with cladding, a layer of nickel is electroplated, employing the dogbone effect to concentrate the metallization at the edges. The rolled or worked metal has a much smaller porosity than an electroplated layer, and the nickel cladding can be applied to the desired thickness in much less time than nickel electroplate.Type: GrantFiled: December 22, 1986Date of Patent: April 12, 1988Assignee: Advanced Materials Technology Corp.Inventor: James A. Slattery
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Patent number: 4728560Abstract: Electrical printed circuit boards are obtained in an elegant manner without the usual etching methods and without using bonding agent layers in a wet chemical manner on the basis of the principles of the semi or fully additive technique by using precious metal compounds for activation and base material of a type which has (a) a specific total pore volume per unit area of 0.015-0.045 dm.sup.3 /m.sup.2, (b) a mean pore diameter of 0.05-5.0 .mu.m and (c) a mean pore depth of 0.05-4.0 .mu.m.Type: GrantFiled: March 4, 1986Date of Patent: March 1, 1988Assignee: Bayer AktiengesellschaftInventors: Kirkor Sirinyan, Gerhard D. Wolf, Ulrich von Gizycki, Rudolf Merten
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Patent number: 4717587Abstract: A method of producing electrically conductive structures on non-conductors, in which the deposition of metallic films on non-conductive substrates is carried out by disintegration of metallo-organic compositions in a glow discharge zone of a plasma reactor.Type: GrantFiled: March 17, 1986Date of Patent: January 5, 1988Assignee: Schering AktiengesellschaftInventors: Harald Suhr, Christian Oehr, Ernst Feurer
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Patent number: 4699811Abstract: Chromium is employed as the mask in selective electroless plating of nickel or copper on a substrate. The chromium is applied conveniently by electroplating in the case of conductive substrates or by sputtering in the case of non-conductive substrates.Type: GrantFiled: September 16, 1986Date of Patent: October 13, 1987Assignee: MacDermid, IncorporatedInventor: David J. Kunces
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Patent number: 4696724Abstract: High nickel/iron alloy steel plate for LNG or LPG tanks having 35-37% nickel content is plated with nickel in an amount of 1 to 10 g/m.sup.2, and then chromated, except electro-chromating treatment, to obtain thereon a chromate film having a chromium content of 5 to 100 mg/m.sup.2.Type: GrantFiled: March 27, 1986Date of Patent: September 29, 1987Assignee: Nisshin Steel Co., Ltd.Inventors: Takenori Deguchi, Kazuko Uchida, Takao Ikita, Shigeaki Maruhaski, Kazuo Hoshino, Keiji Oosaki
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Patent number: 4695489Abstract: A method of applying nickel directly to a non-activated tungsten surface is disclosed, in which the tungsten surface is immersed in an aqueous electroless nickel plating bath containing a water-soluble nickel salt; ethylenediaminetetraacetic acid; hydrazine; and monoethanolamine for a period of time sufficient to deposit a layer of nickel on the tungsten surface.Type: GrantFiled: July 28, 1986Date of Patent: September 22, 1987Assignee: General Electric CompanyInventors: Kenneth P. Zarnoch, Charles D. Iacovangelo
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Patent number: 4670312Abstract: Method for preparing aluminum, especially large aluminum pieces or articles having a surface layer of aluminum oxide for subsequent metal plating wherein the aluminum or aluminum alloy substrate is immersed in a bath containing metal salts and acid such that the acid content relative to the metal salt is sufficient to remove the surface aluminum oxide layer without substantial attack on the underlying aluminum while enabling the permanent deposit thereon of a continuous, smooth, adherent metal or metal alloy coating directly onto the aluminum, thereby replacing the aluminum oxide layer. Subsequent, essentially blister-free electroless or electrolytic plating of nickel or a nickel alloy, copper or a copper alloy onto the metal or metal alloy coated aluminum are made possible thereby.Type: GrantFiled: February 7, 1985Date of Patent: June 2, 1987Assignee: John RaymondInventor: Robert Ehrsam
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Patent number: 4666786Abstract: A composite nickel plated sliding surface is obtained by the formation of a composite nickel plating film on a sliding surface of an automobile part such as an engine cylinder or piston by electroless nickel plating. The plating film contains at least one member of wear resistant particles having an average particle size of 0.1 to 1.0.mu. selected from SiC, TiC, WC, BC.sub.4, TiN, Al.sub.2 O.sub.3 or the like, and also at least one member of lubricating particles having an average particle size of 1 to 10.mu. selected from BN, MoS.sub.2, and Teflon. The nickel plating bath is adjusted to have a phosphorus concentration of 0.5 to 12%. When the matrix of the nickel plating film has a phosphorus concentration of 0.5 to 5%, the film hardness is improved.Type: GrantFiled: February 27, 1985Date of Patent: May 19, 1987Assignees: Aisin Seiki Kabushiki Kaisha, Toyota Jidosha Kabushiki KaishaInventors: Hideo Yano, Keiichi Kano, Hitoshi Ozawa, Shinji Kato, Yoshio Takagi
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Patent number: 4617204Abstract: Processes for (1) depositing main group metals on inorganic and metallic substrates, (2) depositing transition metals on organic, inorganic and metallic substrates, and (3) depositing combinations of main group metals and transition metals on organic, inorganic and metallic substrates. The resulting products have useful electrical, optical and/or decorative properties.Type: GrantFiled: June 28, 1985Date of Patent: October 14, 1986Assignee: The United States of America as represented by the United States Department of EnergyInventor: Robert C. Haushalter
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Patent number: 4613518Abstract: Edge termination of monolithic capacitors having thin electrode layers bonded in dielectric resin is accomplished by ashing away some resin to expose electrode edge surfaces, plating the edge surfaces by vapor deposition, and depositing a conductive layer on the coating by electroless plating, schooping or applying conductive epoxy.Type: GrantFiled: January 14, 1985Date of Patent: September 23, 1986Assignee: SFE TechnologiesInventors: Mooyoung Ham, John W. Duffy
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Patent number: 4600609Abstract: An electroless nickel plating method and composition is disclosed wherein a soluble acetylenic compound is included within the plating bath in small amounts effective to improve the specularity of the nickel deposit without substantially decreasing the electroless plating rate of the bath. The method and compositions of the invention are useful in producing mirror-bright electroless nickel coatings free of haze.Type: GrantFiled: May 3, 1985Date of Patent: July 15, 1986Assignee: MacDermid, IncorporatedInventors: Harold Leever, Leo J. Slominski
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Patent number: 4594273Abstract: The rate of deposition of metallic film on a substrate in an electroless plating process is substantially increased without affecting film properties or causing adverse consequences to the plating bath. The boiling point of the plating bath is elevated either by adding to the bath a substance, such as ethylene glycol, which does not alter the reactivity of the bath, or by providing a sealed enclosure over the bath to increase the ambient pressure. The bath is then heated to a substantially higher temperature but below the temperature at which localized boiling occurs. Excellent metal film qualities are obtained on the substrate at a substantially higher rate than in conventional electroless plating and no nucleation sites are created in the bath to cause spontaneous decomposition of the bath.Type: GrantFiled: November 19, 1984Date of Patent: June 10, 1986Assignee: International Business Machines CorporationInventors: Saad K. Doss, Peter B. P. Phipps
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Patent number: 4594263Abstract: Laser marking of metal surfaces, particularly semiconductor device packages, is accomplished by depositing an electroless nickel layer on the surface, converting the nickel surface to a form in which it is highly absorptive of radiant energy and exposing the converted nickel surface to laser energy through a mask. The resulting mark is highly resistant to abrasion and corrosion. In addition, the method is highly suitable for use with automated laser marking equipment. Furthermore, it appears that the presence of the converted electroless nickel surface in the region of welds increases the hermeticity of the welds. This is particularly useful in packages of the TO-3 type and similar types.Type: GrantFiled: December 17, 1984Date of Patent: June 10, 1986Assignee: Motorola, Inc.Inventors: Lee E. Folk, Reginald K. Asher
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Patent number: 4588480Abstract: A method of producing a wear protection coating on a surface of a structural part of titanium or a titanium base alloy comprising applying a metallic nickel layer which adheres to the surface of the structural part and thereafter subjecting the thus coated structural part to a heat treatment to form diffusion layers of Ti.sub.2 Ni and TiNi.sub.3 between the titanium and the nickel. Thereafter, the layer of nickel alone or with the layer of TiNi.sub.3 is removed to leave the titanium part covered by a protection layer of the remaining diffusion layer.Type: GrantFiled: May 22, 1984Date of Patent: May 13, 1986Assignee: MTU Motoren-und Turbinen-Union Munchen GmbHInventor: Martin Thoma
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Patent number: 4581260Abstract: An electroless plating bath tank with air sparging and bath heating attachments is provided with a workpiece rack on which multiple horizontal spindles bearing workpieces are rotated about their own axes while also being rotated eccentrically about a horizontal axis, so as to expose the workpiece more uniformly to the action of the bath.Type: GrantFiled: September 25, 1984Date of Patent: April 8, 1986Assignee: Ampex CorporationInventor: Shamil A. Mawla
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Patent number: 4567066Abstract: A process is provided for improving the electroless nickel plating of aluminum which has been pretreated with a barrier coating such as zinc by employing multiple plating baths under controlled operating conditions.Type: GrantFiled: October 23, 1984Date of Patent: January 28, 1986Assignee: Enthone, IncorporatedInventors: Paul B. Schultz, Eugene F. Yarkosky
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Patent number: 4563371Abstract: The metallization of porous solid bodies, such as, for example, ion exchange materials, by loading the surfaces of the metal-free substrates with transition metal ions and subsequently treating them with reducing agents can be improved by activating the substrates, before or after the loading with metal ions, with elements of group 1 or 8 of the periodic table or compounds thereof and sensitizing any activating ions still present. The metallization products are useful hydrogenation catalysts.Type: GrantFiled: December 23, 1983Date of Patent: January 7, 1986Assignee: Bayer AktiengesellschaftInventors: Kirkor Sirinyan, Peter M. Lange, Rudolf Merten, Alfred Mitschker
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Patent number: 4554184Abstract: A method for plating a metal from an electroless plating bath onto a substrate is provided which includes providing a source of an electroless plating bath at a non-plating temperature in a master mixing tank; transferring at least a portion of the plating bath to at least one plating cell, changing the bath temperature to a plating temperature, and contacting the substrate to be plated with the bath at a plating temperature.Type: GrantFiled: July 2, 1984Date of Patent: November 19, 1985Assignee: International Business Machines CorporationInventors: Michael J. Canestaro, Ronald A. Kaschak, Donald G. McBride, Donald P. Seraphim
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Patent number: 4552787Abstract: A metal is deposited onto a substrate from an electroless plating solution by plating an initial layer of metal onto the substrate, then contacting the metal-plated substrate with a solution of an acid; and plating an additional layer of metal onto the plated, acid-treated substrate. The process reduces the plating void defects.Type: GrantFiled: February 29, 1984Date of Patent: November 12, 1985Assignee: International Business Machines CorporationInventors: Paul Chebiniak, Ronald A. Kaschak, Lois J. Root
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Patent number: 4528245Abstract: This invention relates to a process for conditioning the surfaces of natural and synthetic plastic materials for electroless plating of a metal coating thereon by exposing such materials to an atmosphere comprising ozone, contacting said exposed materials with a conditioning solvent, such as an aqueous solution of sodium, potassium or lithium hydroxide, and thereafter rinsing said contacted materials with an aqueous solution of one or more surfactants.Type: GrantFiled: February 27, 1984Date of Patent: July 9, 1985Assignee: Allied CorporationInventor: Jill M. Jobbins
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Patent number: 4510183Abstract: A method for applying a wear-resistant coating to a working surface of an object, which working surface is to be exposed to wear. To coat the object, it is dipped in a bath of molten metal containing unmolten hard metal carbide particles dispersed therein, whereby a coating is formed on the object.Type: GrantFiled: September 14, 1983Date of Patent: April 9, 1985Assignee: Rabewerk Heinrich ClausingInventor: Atilla Akyol