Abstract: A steel plate reinforcing sheet that can reduce distortions of the steel plate without reducing its reinforcing property and can also prevent abrupt deformations at end portions thereof with respect to a direction extending along a curving direction of a curved steel plate. The steel reinforcing sheet features a generally rectangular shape, as defined by a length and a width, and two end portions on either side of an imaginary line which bisects the length of the steel plate reinforcing sheet. The steel plate reinforcing sheet is a laminate including a restricting layer and a reinforcing layer, wherein each end portion of the restricting layer includes at least one slit. Each slit extends directly or indirectly across the entire width of the steel plate reinforcing sheet, and the two slits closest to the imaginary line define a minimum distance between slits.

Abstract: An easy open end comprising a resin-coated metal plate obtained by coating a metal substrate with a polyester film via a primer, wherein the primer comprises an epoxy resin or a polyester resin and a resole-type phenol resin, and the resole-type phenol resin has 0.2 to 2.0 methylol groups per a benzene ring. The end can be lightly opened without causing defect at the time of opening the end by pushing in the end of a tab and cutting the score and, particularly, can be excellently opened at high temperatures without arousing the problem even in a state of being heated at high temperatures featuring excellent corrosion resistance, resistance against the content and retort resistance.

Abstract: To provide an epoxy resin composition that can afford a printed wiring board excellent in heat resistance, adhesiveness, prepreg storage stability, and insulation reliability. An epoxy resin composition containing (A) an oxazolidone ring-containing epoxy resin, (B) a novolac-type epoxy resin, (C) a guanidine derivative, and (D) an imidazole as components, wherein the component (A) contains an isocyanuric ring as well as an oxazolidone ring and, the IR absorbance ratio of the isocyanuric ring to the oxazolidone ring is not less than 0.01 and not more than 0.1, the weight ratio of the component (A) to the component (B) is 5:95 to 95:5, the content of the component (C) and the content of the component (D) are 0.01 to 5 parts by weight and not more than 0.

Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Abstract: A process of making a nanoporous substrate, such as the matrix in an electrical laminate, by grafting onto an organic resin backbone a thermolabile functionality by reacting hydrogen active groups of the organic resin with a compound containing thermolabile groups; then thermally degrading the thermolabile groups grafted on the organic resin to form a nanoporous laminate. Advantageously, the nanoporous electrical laminate has a low dielectric constant (Dk) because of the nanopores present in the laminate matrix.

Abstract: In an elastic member for electrophotography, having a conductive or semiconductive elastic layer, the elastic layer contains a vulcanized rubber obtained by vulcanizing a material rubber in the presence of a specific sulfur-atom-containing compound as a vulcanization accelerator that can not easily cause any scorching at the time of high-temperature kneading and extrusion, and yet has relatively high vulcanization rate and also can provide vulcanized rubbers with superior quality.

Abstract: The present invention provides curing agent compositions comprising alkylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: A self-healing composite material comprising a fibre-reinforced polymeric matrix, wherein the polymeric matrix comprises a thermosetting polymer and a thermoplastic polymer.

Abstract: The present invention is directed to non-lithographic patterning by laser (or similar-type energy beam) ablation, where the ablation system ultimately results in circuitry features that are relative free from debris induced over-plating defects (debris relating to the ablation process) and fully additive plating induced over-plating defects. Compositions of the invention include a circuit board precursor having an insulating substrate and a cover layer. The insulating substrate is made from a dielectric material and also a metal oxide activatable filler. The cover layer can be sacrificial or non-sacrificial and is used to remediate unwanted debris arising from the ablation process.

Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.

Abstract: It is an object of the present invention to provide an organic coating-treated metal sheet, having a coat capable of satisfying all the corrosion resistance, alkali resistance, solvent resistance, anti-scratch property and adhesion requirements which the conventional nonchromate type coating technologies have been difficult to meet. A surface-treated metal sheet with a coat comprising 50; to 90% by weight of a crosslinked resin matrix (A) and 10 to 50% by weight of an inorganic rust preventive (B) as formed on the metal sheet surface, wherein the crosslinked resin matrix (A) is formed by the reaction between a water-borne resin and a crosslinking agent and has an acid value of 0 to 30 due to carboxylic acid groups not neutralized by an alkali metal and a hydroxyl value of 5 to 50.

Abstract: An exemplary embodiment provides a composite substrate including a resin matrix that has embedded therein a flex circuit and reinforcing filler. The flex circuit includes a metallic circuit on a film that is co-cured with the resin matrix. The metallic circuit may be configured for any of a variety of functions, including for example, dissipating energy generated by a lightning strike on the composite substrate. The flex circuit may also provide a platform for implementation of other communication and maintenance functions.

Abstract: Multi-component epoxy-amine primer systems are disclosed, which include an epoxy component and an amine component that includes a mercaptan terminated material. At least one of the epoxy component and the amine component includes a sulfur-containing polymer. Also disclosed are substrates coated with such primer systems as well as methods for coating substrates with such primer systems.

Abstract: A reinforcing sheet, including a constraining layer and a reinforcing layer; a reinforced substrate, including the reinforcing sheet on a side of a substrate; and a method for reinforcing a substrate, including providing the reinforcing sheet on a side of the substrate. The reinforcing layer contains a foam composition containing (A) an epoxy resin, (B) an epoxy-modified rubber, and (C) a hydrophobic hydrocarbon oil. The reinforcing sheet may exhibit an improved resistance to water.

Abstract: The present invention provides a film-forming composition. The composition includes a reaction product of: a) a polyamine containing a primary amino group and a secondary amino group; and b) an acyclic carbonate. Also provided is a method of preparing a film-forming composition and an article coated with such compositions.

Abstract: The invention relates to an embossing film, in addition to an associated carrier film for applying surface structures, in particular to fibreboard. The invention also relates to a press and to a production method that uses the embossing film. The advantages of the inventive embossing film are that its use during the pressing process is low-maintenance and obtains a particularly even surface structure. In an additional embodiment, the embossing film has one or more metallic additives, in particular aluminium additives. This improves the strength of the film, in particular during the pressing process and improves the thermal conductivity of the embossing film. The heat that occurs or is produced during the pressing process for curing the resins that are used can thus be dissipated more efficiently from the panel. In a further embodiment, the embossing film comprises an acrylate, which increases the mechanical stability of said film.

Abstract: A method and kit for the personal identification of a piece of equipment. An identifying mark having a pre-selected color is applied to a surface of the piece of equipment. The identifying mark is strongly adhered to the surface and has a high abrasion resistance and impact resistance. The identifying mark can be formed from an epoxy resin, such as a two-part epoxy resin. The piece of equipment can be recreational equipment, carpenter's tools or mechanic's tools.

Abstract: The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

Abstract: A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X—R1—Si(OR2)nR33-n, wherein X is NCS— or SCN—, R1 is an alkylene or alkyleneoxyalkylene group, R2 and R3 are monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.

Abstract: The invention relates to a motor vehicle component, particularly a motor vehicle attachment part, preferably a motor vehicle exterior component, particularly preferred a motor vehicle trim component, made of anodized aluminum or an anodized aluminum alloy. The motor vehicle component is provided—at least partially—with a sol-gel coating. The invention further relates to a motor vehicle comprising a corresponding motor vehicle component.

Abstract: The conductive paste of the invention comprises a conductive powder and a binder component, wherein the conductive powder is composed of metal powder which is copper powder or copper alloy powder partially covered on the surface with silver, and is either a mixture of roughly spherical metal powder and flat metal powder, or roughly spherical or flat metal powder alone, and wherein the binder component contains a mixture of an epoxy resin and an imidazole compound with a hydroxyl group or a mixture of an epoxy resin and an imidazole compound with a carboxyl group.

Abstract: A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition to exhibiting a fire retardancy.

Abstract: In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Table having a second ionization potential of up to 20 eV, typically Zn2SiO4, ZnCrO4, ZnFeO4 or ZnMoO4. When used for semiconductor encapsulation, the epoxy resin composition is highly reliable and cures into a product which is effective for minimizing electrical failure such as defective insulation due to a copper migration phenomenon.

Abstract: Zirconia particles, methods of making zirconia particles, composite materials that contain the zirconia particles, methods of making the composite materials, and zirconia sols that contain the zirconia particles are described. The zirconia particles are substantially non-associated and have an average size no greater than 50 nanometers and may contain yttrium. The zirconia particles are prepared by a method that includes two separate hydrothermal treatments.

Abstract: A coating material includes: (A) a compound of formula (I) Ra4-nSiXan, ??(I) wherein: Xa is a hydrolysable radical; Ra is a non-hydrolysable radical; n is 2, 3 or 4; (B) a compound of formula (II) wherein: Xb is a hydrolysable radical; Rb is a non-hydrolysable radical without an epoxide function, an acryloxy function, a methacryloxy function and an isocyanate function; Yb is a non-hydrolysable radical with a crosslinkable function; p is 2 or 3; q is 1 or 2; the sum of p and q is less than or equal to 4; (C) a crosslinking agent; (D) an organozirconium, organotitanium or organoaluminum compound containing hydrolysable organic radicals; (E) a hydrolysis catalyst; (F) crosslinkable prepolymers of epoxy and epoxysiloxane resins, (G) optional corrosion inhibitors; (H) optional compounds for reducing the reactivity of component (D); wherein n and the sum of p+q are not at the same time each 4.

Abstract: A surface-modified member including a metal base, a surface modification layer formed on at least a part of a surface of the metal base, the surface modification layer containing a metal hydroxide, and at least one of a curable resin layer, an ink layer and a coating material layer which is provided on at least a portion of the surface modification layer. A method of modifying a surface of a metal member, including applying an energy to at least a part of the surface of the metal member to produce a metal hydroxide on the surface of the metal member.

Abstract: A thermally conductive adhesive composition includes a powder of a high melting point metal or metal alloy, a powder of a low melting point metal or metal alloy, and a polymerizable fluxing polymer matrix composition having a polyepoxide polymer resin and a low-melting solid or liquid acid-anhydride and a polymer diluent or diluents with carbon carbon double bonds and/or functional hydroxyl groups. The ratio by weight of the low melting point powder to high melting point powder ranges from about 0.50 to about 0.80, and may range from about 0.64 to about 0.75, and may be 0.665. Heretofore unpredicted substantially higher thermal conductivity improvements in performance have been found using these ratios of low melting point powder to high melting point powder.

Abstract: A composition for the manufacture of a circuit material comprises a solvent composition having a boiling point below 160° C.; an epoxy compound having an average epoxy functionality of greater than one, an epoxy equivalent weight of less than about 6,000 Daltons, a softening point of less than about 160° C., and solubility in the solvent composition; an aromatic polymer co-curable with the epoxy compound, and soluble in the solvent composition; and, optionally, a catalyst for the polymerization of epoxy groups. The composition for the manufacture of a circuit material can further comprise a filler additive and/or a flame retardant additive.

Abstract: A motor winding wire. The motor winding wire may be configured for use in, and direct exposure to, a hydrocarbon environment. The motor winding wire may be electrically insulated by one polymer layer, whereas another, outer, polymer layer is employed to provide moisture resistance as well as other contaminant and hydrocarbon environment shielding to the underlying layer. Additionally, this manner of polymer layering over the motor winding wire is achieved in a manner cognizant of the limited dimension of the motor winding wire.

Abstract: For preventing or reducing temperature gradient caused bending of a structural element made of a material capable of withstanding heating to a specific temperature for an extended period of time, when heating the element to the specific temperature, the structural element is connected to an adjacent supporting structural element through a high temperature resistant supporting body. The structural element, providing the high temperature resistant supporting body is provided as a pultruded profiled body including a solidified high temperature resistant resin and reinforcing fibers at least a part of which are constituted by fibers exhibiting high strength and high stiffness at a low temperature and a reduced strength and a reduced stiffness when exposed to and possibly deteriorated at the specific temperature. The structural element is fixated relative to its supporting structure by means of the pultruded body.

Abstract: A prepreg, for printed wiring boards, comprising a flame resistant resin composition containing a specific cyanate ester resin, a nonhalogen epoxy resin, boehmite which is hardly soluble in acids or alkalis and a silicone powder which is a flame retardant assistant, and a base material, which prepreg retains high-degree flame resistance without a halogen compound and has excellent resistance to chemical, high glass transition temperature, excellent soldering heat resistance and excellent heat resistance after moisture absorption, and a laminate or metal-foil-clad laminate obtained by curing the above prepreg.

Abstract: The invention detailed herein comprises a family of radiation-curable coating formulations specifically for metal substrates. These coating formulations are based on multifunctional acrylate resins formed by the reaction of acrylate monomers and oligomers with ÿ-keto esters (e.g., acetoacetates), ÿ-diketones (e.g., 2, 4-pentanedione), ÿ-keto amides (e.g., acetoacetanilide, acetoacetamide), and/or other ÿ-dicarbonyl compounds that can participate in the Michael addition reaction. An essential novelty of these coating resins is that they will cure under standard UV-cure conditions without the addition of traditional photoinitiators. Other materials, both reactive (conventional acrylates) and non-reactive (e.g., solvents) may also be incorporated into the resin oligomers to enhance the coatings properties on metal substrates.

Abstract: The invention relates to a one-step fluoropolymer, especially polyvinylidene fluoride (PVDF), coating for use on metals, especially use on metal fuel line and brake tubes, etc, to provide a protective barrier with superior chemical resistance, impact resistance and heat resistance as well as good flexibility. The coating composition contains, on a resin solids basis, 75-94 percent polyvinylidene fluoride resin, 5-20 percent acrylic resin, and 1-15 percent polyepoxide resin. The coating has excellent adhesion on metal substrates, particularly on non-pretreated galvanized steel, without the need for a primer coating.

Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 ?m, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 ?m being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 ?m or less.

Abstract: Disclosed is an electrically conductive member, comprising a substrate of a metal or a resin and an electrically conductive elastic layer formed to cover the substrate, wherein the electrically conductive elastic layer is formed of a rubber elastic body prepared by dispersing at least an electrically conductive powder used as a conductive agent into a rubber compound, followed by vulcanizing the rubber compound, the electrically conductive powder being obtained by curing and powdering an electrically conductive rubber compound or an electrically conductive resin mixture.

Abstract: The invention provides a steel plate reinforcing sheet having light weight and thin layer, providing sufficient adhesion and reinforcing effect to a steel plate, and having excellent workability. In the steel plate reinforcing sheet comprising a restricting layer and a resin layer, a curing composition is first prepared by mixing rubber components comprising diene-based rubber and rubber having a vinyl group in its side chain, with a cross-linking agent capable of reacting with these rubber components, and then by kneading the mixture. Thereafter, the curing composition thus prepared is rolled by molding, to form a resin layer. Then, the resin layer thus formed is adhesively bonded to the restricting layer, to produce a steel plate reinforcing sheet.

Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

Abstract: There is provided a technology that can be applied as a substrate material to ordinary resin substrate materials and allows the adhesive strength between this substrate material and a plating metal layer to be increased; more specifically, there is provided an ordinary resin substrate material with an increased adhesive strength between the substrate material and a plating metal layer. The present invention relates to a resin substrate material such as an epoxy resin whose surface is swellable in a solution containing imidazolesilane and a palladium or other noble metal compound having a catalytic action in electroless plating and which has been surface-treated with the solution, and to an electronic component substrate material manufactured by performing electroless plating on this resin substrate material.

Abstract: Embodiments of the present invention pertain to reducing particle generation as a result of metal to metal contact during the manufacturing process. According to one embodiment, a metal component that will be used in manufacturing a hard disk drive is cleaned. The metal component is coated with a substance to reduce a probability that the metal component will come into contact with other metal during the manufacturing of the hard disk drive, wherein the coating of the substance encapsulates the metal component and provides lubrication between the metal component and the other metal.

Abstract: A barrier layer, a composite article comprising the barrier layer and a substrate, and a method for making the composite article are provided. The barrier layer is disposed on a surface of the substrate, wherein the barrier layer comprises a barrier coating and a repair coating disposed on the barrier coating. The repair coating comprises a metal based compound. An electroactive device comprising the composite article is also provided.

Abstract: An epoxy resin composition includes an epoxy resin, a curing agent, a coupling agent, and an inorganic filler. The coupling agent may include a hydrocarbon-substituted siloxane resin having at least one terminal hydroxy group.

Abstract: An electrical device includes two electrodes and a conductive polymer layer, containing a mixture of a polymer and a conductive filler, separating the electrodes. A oxygen barrier material containing a thermosetting polymer component is present on the exposed surface of the conductive polymer layer that is not in contact with the laminar electrodes. The oxygen barrier material may be a polyamine-polyepoxide material, and may provide for acceptable barrier properties over a wide range of humidity levels.

Abstract: A slip-resistant coating composition comprising (i) a binder comprising a polyepoxide and a polyamine; (ii) a micaceous pigment selected from the group consisting of mica and micaceous iron oxide and blends thereof; (iii) at least one other pigment; wherein the micaceous pigment is present at a level of at least 4% PVC based on total volume solids and wherein the total PVC of the coating is at least 35%. The slip-resistant coating would have a slip coefficient of at least 0.50 after cure and is especially useful in the manufacture of structural joints.

Abstract: A curable thermal interface material is provided comprising a functionalized elastomer and a filler. Preferred materials comprise an epoxidized polybutadiene cured with an iodonium catalyst and a filler comprising silver and/or aluminum oxide.

Abstract: The present invention provides a curable alkanolamine containing epoxy powder coating composition comprising at least one epoxy resin, at least one alkanolamine, a curing agent in an amount effective to cure the coating and optionally at least one zinc borate compound. Further, the present invention provides a method of cathode corrosion protection which includes the steps of subjecting a metal substrate to a mechanical treatment, applying the curable alkanolamine containing epoxy powder coating composition to the surface of the metal substrate, and polarizing the coated material as a cathode. The present invention also relates to a process for making and applying the alkanolamine containing epoxy powder coating compositions of the present invention.

Abstract: A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.

Abstract: The present invention relates to a cationic electrodeposition coating composition substantially free of lead compounds, which is excellent in curability and can be finish-coated with a splendid appearance, and an article coated with the composition. The invention provides a lead-free electrodeposition coating composition excellent in curability and a coated article, the composition being capable of forming a coating film, which emits less tin compounds to have no influence on appearance of a finish coating film and film performances.

Abstract: An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include fiberglass. The photoinitiator can be a combination of a bis-acylphosphine oxide and an alpha hydroxy ketone. The formulation can cure rapidly, such as in about 20 minutes. The cured formulation can have a Tg above 150° C.

Abstract: The invention is to provide a surface-treated steel sheet of good white rust resistance with no chromium in its surface treatment film, and it has realized a surface-treated steel sheet of higher-level corrosion resistance by forming a reaction layer of plating metal with a barrier layer effective for anticorrosion not in a two-layered film but in a single-layered film.

Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.