Next To Metal Patents (Class 428/418)
  • Patent number: 7276563
    Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: October 2, 2007
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
  • Publication number: 20070224408
    Abstract: An adhesive as a heat resistant rubber-based adhesive is applied to a region (peripheral region) of integration of a metal sheet (Al sheet) and a resin and to a region (peripheral region) of integration of a fiber sheet (CF sheet) and a resin. The metal sheet and fiber sheet are temporarily fixed to dry the adhesive, then, the joined article is accommodated in an injection molding machine, a polycarbonate resin is injected, and the joined article (metal sheet and fiber sheet) is integrally molded with the polycarbonate resin.
    Type: Application
    Filed: March 26, 2007
    Publication date: September 27, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Koichi Kimura, Masanobu Ishiduka
  • Patent number: 7273687
    Abstract: A toner fuser member has a substrate, on which is formed a toner release surface layer from a composition that includes: about 95 wt. % to about 99.9 wt. % of a cross-linked, glycidyl end-capped bisphenolic polymer having the formula where R1 and R2 are each independently H or an alkyl group containing 1 to about 4 carbon atoms, and R3 and R4 are each independently H, F, or an alkyl group containing 1 to about 4 carbon atoms, Z is a carbonyl cross-linking group, and x is an integer from 1 to about 10; and about 0.01 wt. % to about 5 wt. % of a perfluoroalkylsubstituted glycidyl-reactive compound having the formula where R5 is H or F, Q is OH or SiR6R7R8, R6, R7, and R8 being independently selected from the group consisting of Cl, OH, an alkyl group containing 1 to about 4 carbon atoms, an alkoxy group containing 1 to about 4 carbon atoms, an acyloxy group containing 2 to about 4 carbon atoms, and an amino group containing 0 to about 4 carbon atoms; and n is an integer from 1 to about 15.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: September 25, 2007
    Assignee: Eastman Kodak Company
    Inventors: Jiann-Hsing Chen, Joseph A. Pavlisko, Muhammed Aslam, Nataly Boulatnikov
  • Patent number: 7271224
    Abstract: A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional compound having at least one acyl group which is capable of forming amide group moiety by reaction with a polyamine to form an oligomeror or (A), (B) and (C)monocarboxylic acid having 1 to 8 carbon atoms and/or derivative thereof and a coating and a coated film a gas barrier property the same.
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: September 18, 2007
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takaaki Kutsuna, Shuta Kihara
  • Patent number: 7267877
    Abstract: A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional compound having at least one acyl group which is capable of forming amide group moiety by reaction with a polyamine to form an oligomeror or (A), (B) and (C) monocarboxylic acid having 1 to 8 carbon atoms and/or derivative thereof and a coating and a coated film a gas barrier property the same.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: September 11, 2007
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takaaki Kutsuna, Shuta Kihara
  • Patent number: 7255925
    Abstract: The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: August 14, 2007
    Assignee: LG Chem, Ltd.
    Inventors: Hyuk-Sung Chung, Bong-Jin Jeon, Hyun-Cheol Kim, Eun-Hae Koo
  • Publication number: 20070172665
    Abstract: A spring with high durability has a coating film composed of an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of the coating film. A method of coating a spring with high durability comprises a coating step of making an epoxy resin powder coating containing softening agent which contains an epoxy resin and a softening agent comprising a thermoplastic resin for improving impact resistance of a coating film adhere to a surface on which the coating film is formed, and a baking step of baking the epoxy resin powder coating containing softening agent adhered to the surface.
    Type: Application
    Filed: January 26, 2007
    Publication date: July 26, 2007
    Applicants: Chuo Hatsujo Kabushiki Kaisha, Rock Paint Co., Ltd.
    Inventors: Yasuhiko Kunita, Takayuki Sakakibara, Masami Wakita, Yuichi Kondo, Norio Sawatari
  • Publication number: 20070148470
    Abstract: A composition includes a cross-linkable epoxy resin, a polystyrene-polybutadiene-polymethylmethacrylate tri-block copolymer, and a filler material. The polystyrene-polybutadiene-polymethylmethacrylate tri-block copolymer has a concentration ratio of from about 1:1:1 to about 1:1:1.5.
    Type: Application
    Filed: December 12, 2006
    Publication date: June 28, 2007
    Inventors: Meghan L. Mallozzi, Salvatore M. Attaguile, David J. Baratto
  • Patent number: 7229708
    Abstract: A magnetic encoder, which comprises a stainless steel sheet; and an under coat adhesive containing epoxy resin and organopolysiloxane, a top coat adhesive containing phenol resin, or phenol resin and epoxy resin, and a rubber magnet, as successively laid one upon another on the stainless steel sheet, has distinguished water resistance and saline water resistance, and thus can be effectively used particularly as a magnetic encoder in wheel speed sensors.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: June 12, 2007
    Assignee: NOK Corporation
    Inventors: Katsumi Abe, Kiyofumi Fukasawa, Hironori Nishina
  • Patent number: 7217769
    Abstract: A medical device with a hydrophilic and lubricious coating, wherein the coating includes a hydrophilic polymeric unit layer deposited on the medical device and cross-linked with a plasma deposited double bond monomer. The hydrophilic polymeric unit can include ethylene oxide with one or more primary or secondary alcohol groups or glycosaminoglycans such as hyaluronic acid, and the double bond monomer includes monomers containing at least one double bond, preferably a C?C, C?N or C?O bond, including N-trimethylsilyl-allylamine, ethylene, propylene and allyl alcohol.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: May 15, 2007
    Assignee: BioSurface Engineering Technologies, Inc.
    Inventors: Paul O. Zamora, Meng Chen, Shigemasa Osaki, Ting-Ting Hsieh, Ray Tsang
  • Patent number: 7201957
    Abstract: There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition includes a mixture of monohydroxyaryl, bishydroxyaryl and trishydroxyaryl phosphine oxide and a benzoguanamine/phenol/formaldehyde terpolymer which is used along with an epoxy resin to produce flame-resistant printed wiring boards without the use of halogens.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: April 10, 2007
    Assignee: Great Lakes Corporation
    Inventors: Larry D. Timberlake, Mark V. Hanson, E. Bradley Edwards
  • Patent number: 7202311
    Abstract: There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition includes a mixture of monohydroxyaryl, bishydroxyaryl and trishydroxyaryl phosphine oxide and a benzoguanamine/phenol/formaldehyde terpolymer which is used along with an epoxy resin to produce flame-resistant printed wiring boards without the use of halogens.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: April 10, 2007
    Assignee: Great Lakes Corporation
    Inventors: Larry D. Timberlake, Mark V. Hanson, E. Bradley Edwards
  • Patent number: 7189465
    Abstract: Provided is a chromium-free metal surface treatment agent excellent in rust inhibitive performance which can be used in a surface treatment of metal products, in particular, galvanized metal products. The metal surface treatment agent consists essentially of a siliceous binder solution comprising water and/or alcohol as a solvent, and the concentration of the silica component is 8 to 25% by weight. In particular, a metal surface treatment agent containing an alcoholic solution of alkoxysilane oligomer having a weight averaged molecular weight of 1000 to 10000, which is obtained by hydrolyzed condensation polymerization of alkoxysilane, can suppress the occurrence of white rusting for a long time. It is preferred that 3 to 25 parts by weight of a dispersed nano-sized titanium dioxide powder having an average primary particle size of not more than 70 nm, per 100 parts by weight of the silica component be suspended in the siliceous binder solution.
    Type: Grant
    Filed: August 13, 2004
    Date of Patent: March 13, 2007
    Assignee: Hoden Seimitsu Kako Kenkyusho Co., Ltd.
    Inventors: Yasuhiko Endo, Tomio Sakai
  • Patent number: 7179552
    Abstract: Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid state at a temperature of 20° C.; (B) an aromatic epoxy resin having 3 or more epoxy groups in one molecule and an epoxy equivalent of 200 or less; (C) a phenol type curing agent; (D) one or more resins selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, a polyamide resin, a polyamideimide resin, and mixtures thereof, and having a glass transition temperature of 100° C. or more; and (E) an inorganic filler.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: February 20, 2007
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Kenji Kawai
  • Patent number: 7169862
    Abstract: A coating composition comprising a film forming binder of a. a modified polyepoxy resin comprising the reaction product of a polyepoxide resin, dimer fatty acids and an organic polyisocyanate, wherein the modified polyepoxide resin has a weight average molecular weight of 1000 to 50,000; and b. at least one amino functional silane crosslinking agent; wherein the coating composition preferably contains pigments and has excellent adhesion to aluminum and aluminum alloy substrates and provides excellent corrosion resistance and is particularly useful as a primer for such substrates.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: January 30, 2007
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Cesar A. S. Rodrigues, Luis Henrique De Almeida Ferrari, Andrew P. Stamegna, Valentina Gordin
  • Patent number: 7157143
    Abstract: Two-component epoxy adhesive compositions, and methods of using the same, are described. The compositions include an epoxy resin component, including at least one epoxy resin and at least one flexibilizer present in the range of about 12 to about 16 weight percent, based on the total weight of the epoxy resin component, and an epoxy curative component, including at least one curing agent and at least one flexibilizer present in the range of about 55 to about 65 weight percent, based on the total weight of the epoxy curative component.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: January 2, 2007
    Assignee: Dow Global Technologies Inc.
    Inventor: Jihong Kye
  • Patent number: 7147921
    Abstract: Anti-fouling compositions are disclosed. The compositions comprise a film-forming resin and an effective amount of silica coated copper. Methods for using the compositions are also disclosed, as are substrates coated with the compositions. The coatings find particular application on substrates that are submerged for extended periods of time in salt water. Methods for promoting oyster cultivation are also disclosed.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: December 12, 2006
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Douglas R. Camp, Steven R. Zawacky
  • Patent number: 7144544
    Abstract: An ultraviolet (UV) light curable formulation useful for repairing composite materials, comprising: an acrylic oligomer, an acrylic monomer, and a photoinitiator. This formulation may include fiberglass. The photoinitiator can be a combination of a bis-acylphosphine oxide and an alpha hydroxy ketone. The formulation can cure rapidly, such as in about 20 minutes. The cured formulation can have a Tg above 150° C.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: December 5, 2006
    Assignee: Texas Research International, Inc.
    Inventors: John W. Bulluck, Brad A. Rix
  • Patent number: 7144630
    Abstract: The present invention relates to improved compositions for aqueous adhesives and aqueous primers that increase the durability of composites made by adhering elastomers to metal.
    Type: Grant
    Filed: January 23, 2003
    Date of Patent: December 5, 2006
    Assignee: Rohm and Haas Company
    Inventors: Peter James Jazenski, Paul Anthony Dorrington, Dean Edward Hoy, Lipa Leon Roitman
  • Patent number: 7141303
    Abstract: The invention provides protective articles comprising a backing that comprises a fluorinated polymer and a curable adhesive on at least one layer of the backing. The protective articles of the invention may be used to provide substrates or articles of the invention having a fluorinated surface. The invention also provides methods of preparing such articles, methods of repairing appliqués, and methods of edge sealing appliqués.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: November 28, 2006
    Assignee: 3M Innovative Properties Company
    Inventors: Timothy J. Clemens, Timothy M. Dietz, Daniel R. Fronek, Charles D. Hoyle, Joseph H. Verkinderen, Mark D. Weigel
  • Patent number: 7141619
    Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: November 28, 2006
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Michael J. Pawlik, Dennis W. Jones, Ralph C. Gray, Richard M Nugent, Jr., Yves Le Disert, Laurent Deronne
  • Patent number: 7056585
    Abstract: A prepreg comprising a thermosetting resin (D) composition containing, as an essential component, an aluminum hydroxide-boehmite composite (A) obtained by hydrothermal treatment of aluminum hydroxide, and a substrate (I), a laminate using the above prepreg, and a metal-foil-clad laminate using the above laminate.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: June 6, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hiroyuki Mishima, Tsuyoshi Isozaki, Hidenori Kimbara, Norio Nagai
  • Patent number: 7052751
    Abstract: A fuel transport tube having improved fuel vapor permeation characteristics comprising an inner conductive nylon tubular structure containing a conductive agent selected from the group consisting of carbon fibers and carbon fibrils; an aluminum barrier layer on the outside surface of the nylon inner tubular layer; and a non-conductive nylon layer on the outer surface of the aluminum layer; and a method for making the fuel transport tube are disclosed.
    Type: Grant
    Filed: July 15, 2003
    Date of Patent: May 30, 2006
    Assignee: Dayco Products, LLC
    Inventors: Christopher W. Smith, Jerry Shifman, Jeremy Duke, John E. Mobley
  • Patent number: 7041399
    Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: May 9, 2006
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Yasuyuki Hirai, Norihiro Abe, Yoshiyuki Takeda
  • Patent number: 7037586
    Abstract: The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be produced by using this film. A layer: a heat-resistant resin layer with a thickness of from 2 to 250 ?m which layer is made of a heat-resistant resin having a glass transition point of 200° C. or more or a decomposition temperature of 300° C. or more, and B layer: a roughenable cured resin layer with a thickness of from 5 to 20 ?m which layer is made of a cured product of a thermosetting resin composition containing at least component (a) of an epoxy resin having two or more epoxy groups in a molecule and component (b) of an epoxy curing agent, the cured product being capable of roughening with an oxidizing agent.
    Type: Grant
    Filed: January 12, 2004
    Date of Patent: May 2, 2006
    Assignee: Ajinomoto Co., Inc.
    Inventors: Tadahiko Yokota, Shigeo Nakamura
  • Patent number: 7033678
    Abstract: A resin coated metal sheet of the invention has an epoxy resin layer on a galvanized metal sheet, wherein the resin layer contains iron phosphide and at least one selected from the group consisting of aluminum triphosphate, calcium ion exchange silica and amorphous magnesium silicate compound. In the resin coated metal sheet, the epoxy resin is an urethane modified epoxy resin and/or dimer acid modified epoxy resin, and the iron phosphide has a maximum particle diameter of 15 ?m or less. The resin coated metal sheet has excellent weldability, formability and corrosion resistance.
    Type: Grant
    Filed: April 26, 2004
    Date of Patent: April 25, 2006
    Assignee: Kobe Steel, Ltd.
    Inventors: Hironobu Nakanishi, Kazuhisa Fujisawa, Hiroo Shige, Masatoshi Iwai
  • Patent number: 7023084
    Abstract: The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding precision and minimal bleeding of adhesive resin. A Cu foil resin film is formed by bonding an adhesive resin to a Cu foil and pre-forming, at an essentially central position, a cut-out for a cavity used to mount a semiconductor element. The Cu foil resin film is bonded using the adhesive resin directly to a heat dissipation plate. A conductor wiring pattern is formed on the Cu foil resin film. Furthermore, the heat dissipation plate includes a stopping section used to prevent resin from bleeding onto a cavity when bonding with the adhesive resin of the Cu foil resin film.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: April 4, 2006
    Assignee: Sumitomo Metal (SMI) Electronics Devices Inc.
    Inventors: Shigehisa Tomabechi, Akihiro Hamano
  • Patent number: 7018715
    Abstract: Provided are an organic coated steel having an epoxy resin layer coated on the surface of the steel product, which is formed by curing an epoxy resin composition comprising an epoxy resin and an epoxy resin curing agent as principal components and which has an oxygen permeability coefficient of 2 ml-mm/m2·day·MPa or less at a temperature of 23° C. and a relative humidity of 60% RH, an organic coated steel having the above epoxy resin layer and a polymer resin layer laminated in order on the surface of a steel product and a rust preventing method for metal in which a coating layer of the above epoxy resin layer is formed on the surface of metal.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: March 28, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takaaki Kutsuna, Shuta Kihara
  • Patent number: 7018716
    Abstract: Corrosion- and chip-resistant coatings for high tensile steel components, such as automotive coil springs, are formed from a coating powder composition of “toughened” epoxy resin. In a single coat embodiment, the entire coating is loaded with at least 75 phr zinc powder. In a dual coat embodiment, an inner coat is loaded with at least 75 phr zinc and an outer, zinc-free coating is reinforced by the addition of fibers and/or by a foaming agent which renders it porous.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: March 28, 2006
    Assignee: Rohm and Haas Company
    Inventors: Tina L. Grubb, Catherine A. Kleckner, William E. Wertz, Michael C. Siminski, Andrew T. Daly, Jeno Muthiah
  • Patent number: 6995363
    Abstract: A MALDI plate suitable for MS or MS-MS analysis provided with a composite coating that comprises a hydrophobic coating and a thin layer coating of a mixture of a MALDI matrix material and an intercalating agent such as a polymer is disclosed. A MALDI plate produced in accordance with the present teachings is useful for suppression of matrix ions in the low mass region (<1,000 daltons) of a MALDI-MS spectrum.
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: February 7, 2006
    Assignees: Applera Corporation, MDS Inc.
    Inventors: Michael P. Donegan, Andrew J. Tomlinson, Perumanath H. Nair, Peter Juhasz
  • Patent number: 6971163
    Abstract: The attachment of an electrical component to an electrical termination on a component-carrying substrate by a solder bump technique of a thermally curable adhesive composition for encapsulating purposes is described which comprises a thermosetting polymer and a chemical cross-linking agent which has fluxing properties but which is unreactive or of severely restricted reactivity with the polymer without the action of heat and/or catalyst. The composition is to be thermally curable when heated to soldering temperatures in a reaction which is catalyzable merely by metal oxide fluxed from metal surfaces by cross-linking agent then dissolved in the thermosetting polymer.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: December 6, 2005
    Assignee: Dow Corning Corporation
    Inventors: Hugh Patrick Craig, David John James Lowrie
  • Patent number: 6960391
    Abstract: The present invention relates to a carrier-added copper foil and a print substrate using such copper foil characterized in comprising a resin layer and a functional material layer at least on a part of the copper foil. A carrier-added copper foil and a print substrate using such copper foil are obtained by forming an insulating layer and functional material layer having an area smaller than the area of the copper foil on the surface of the carrier-added copper foil with the screen printing method, thereby improving the handling of such copper foil, preventing the adhesion of contaminants such as resin powder on the copper foil surface during the cutting procedure, preventing scratches and dimples caused by foreign matter, and effectively preventing the generation of scratches, wrinkles and creases during the cutting, packaging and transportation procedures.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: November 1, 2005
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Takashi Natsume, Fumiaki Akase
  • Patent number: 6946198
    Abstract: A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25° C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.
    Type: Grant
    Filed: June 25, 2003
    Date of Patent: September 20, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Akio Takahashi, Yuichi Satsu, Harukazu Nakai, Masao Suzuki, Yuzo Ito, Shuichi Oohara
  • Patent number: 6942922
    Abstract: The present invention provides a cationic paint composition containing, as a vehicle component, a xylene-formaldehyde resin-modified amino group-containing epoxy resin obtained by reacting an epoxy resin having an epoxy equivalent of 180 to 2,500 with an alkyl phenol and/or a carboxylic acid, a xylene-formaldehyde resin, and an amino group-containing compound.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: September 13, 2005
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Shigeo Nishiguchi, Hidenori Sawada, Hideki Iijima, Koji Kamikado
  • Patent number: 6933050
    Abstract: The present invention features phosphorus containing epoxy resin compositions useful for imparting flame retardant properties to prepregs, resin-clad metal foils, and laminate boards constructed therefrom. The phosphorus containing epoxy resin composition (a) comprises a phosphorus containing epoxy resin (A) and a hardener. The phosphorus containing epoxy resin (A) has an epoxy equivalent of 300-500 g/eq. and comprises the reaction product of a phosphorus containing organic compound (B) and at least one epoxy resin (C). Phosphorus containing compound (B) is the reaction product of organic phosphorus compounds (b) having one active hydrogen atom bonded to a phosphorus atom and a quinone compound, wherein the molar ratio of (b) to quinone is from 1.25:1 to 2:1. This molar excess of (b) yields a phosphorus containing compound (B) that comprises both the reaction product of (b) and quinone, as well as un-reacted (b).
    Type: Grant
    Filed: February 6, 2003
    Date of Patent: August 23, 2005
    Assignees: Matsushita Electric Works, Ltd., Tohto Kasei Co., Ltd.
    Inventors: Takashi Sagara, Toshiharu Takata, Kiyoaki Ihara, Hidetaka Kakiuchi, Kazuo Ishihara, Chiaki Asano, Masao Gunji, Hiroshi Sato
  • Patent number: 6921577
    Abstract: A water-based metal surface treatment agent for the surface treatment of metals including aluminum products such as pre-coated aluminum sheets gives excellent coating film adhesion, flexibility and acid resistance. The water-based metal surface treatment agent contains the following components (1) to (3): (1) A copolymer, containing in a side chain, a diketene or ketoester capable of switching between keto and enol tautomeric forms, and containing at least one hydrophilic side chain containing a cationic group, an anionic group, or a nonionic group; (2) An epoxy resin modified with a phosphoric acid type compound; and (3) A water-soluble curing agent.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: July 26, 2005
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Takashi Ouchi, Katsuyuki Tsuchida, Masashi Kumagai
  • Patent number: 6916524
    Abstract: A marking (4, 5) is formed in an outer layer (3; 23; 43) comprising a polymer material with an inorganic main chain and with certain visual properties by at least one region (9; 29; 49) of the outer layer (3; 23; 43) of which at least one of the visual properties shows a deviation, visible to the human eye, from the same property in other regions (9; 29; 49?) of the outer layer (3; 23; 43). Since the marking (4, 5) is obtained by means of at least a locally changed visual property of material of the outer layer (3; 23; 43) itself, the marking (4, 5) does not constitute a substantial interruption of the outer layer (3; 23; 43), and the application of the marking (4, 5) does not cause any substantial unevennesses in the outer layer (3; 23; 43). The following are further described: an element having such an outer layer (3; 23; 43) and a method of applying such a marking (4, 5).
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: July 12, 2005
    Assignee: Koninklijke Philips Electronics N.V.
    Inventor: Keng Kit Yeo
  • Patent number: 6913815
    Abstract: The present invention provides a plastics-covered metal plate excellent in chipping resistance, corrosion resistance etc. made by covering one surface or both surfaces of a metal plate with at least two kinds of plastics layers whose rates of elongation are different and a process of covering a car body by using said covered metal plate.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: July 5, 2005
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Tadashi Watanabe, Tadayoshi Hiraki, Akira Tominaga, Takeshi Yawata
  • Patent number: 6900270
    Abstract: Provided is a curable coating composition comprising a reactive compound having one or more structures of the formula: wherein X is a primary carbamate group, Y is a hydroxy or halide group, n is an integer of 2 or more, n? is an integer of 1 or more, and R0, R1, R2, R3, R4 and R5 may be H or a group selected from alkyl groups, aliphatic groups, cycloaliphatic groups, aromatic groups and mixtures thereof, with the provisos that at least one R1 or R2 group is selected from the group consisting of aliphatic groups, cycloaliphatic groups, aromatic groups, and mixtures thereof, and in substantially all structures primary carbamate group X is attached to a carbon atom having a lower degree of substitution than a carbon atom to which functional group Y is attached.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: May 31, 2005
    Assignee: BASF Corporation
    Inventors: Walter H. Ohrbom, Craig S. Schang
  • Patent number: 6890994
    Abstract: The invention provides an acrylic polymer or oligomer comprising random repeating units of the formula: a method of making said polymers and curable coating compositions comprising the same.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: May 10, 2005
    Assignee: BASF Corporation
    Inventors: Walter H. Ohrbom, Craig S. Schang, Donald Campbell, Donald L. St. Aubin
  • Patent number: 6890997
    Abstract: The present invention provides ultraviolet (UV) curable powders for powder coatings comprising one or more than one free radical curable epoxy resin and one or more than one second free radical curable resin, or, alternatively, one or more than one free radical curable unsaturated polyester resin in combination with one or more than one wax, and one or more than one free radical photoinitiator, wherein the coating powder has an average particle size of 5 to 25 microns. Further, the present invention provides a method for making a powder for thin (1.0 to 4.0 mil), smooth coatings having an average particle size of from 5 to 25 microns, the method preferably comprising jet milling dry powder or spray drying an aqueous emulsion, fluid mixture, or a supercritical suspension of a powder or of the composition for making the powder.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: May 10, 2005
    Assignee: Rohm and Haas Company
    Inventors: Andrew T. Daly, Navin Shah, Richard A. Kraski, Jr.
  • Patent number: 6887574
    Abstract: A curable flame retardant epoxy resin composition including (a) at least one flame retardant epoxy resin; (b) at least one amphiphilic block copolymer; and (c) a curing agent. Such components are present in the curable composition in the appropriate amounts and ratios such that, upon curing, the block copolymer self-assembles into a nano structure morphology, such as a worm-like micelle morphology. The resulting cured product made from the composition of the present invention has a remarkably increased high fracture resistance; and allows the use of flame retardant epoxies in applications where fracture resistance is an issue.
    Type: Grant
    Filed: June 6, 2003
    Date of Patent: May 3, 2005
    Assignees: Dow Global Technologies Inc., Regents of the University of Minnesota
    Inventors: Jennifer M. Dean, Frank S. Bates, Ha Q. Pham, Nikhil E. Verghese
  • Patent number: 6878424
    Abstract: A connecting member, used for serially connecting two carrier tapes, comprises a base film, a belt-like reference band substantially fixed on the base film, a bonding tape adhering on the base film, and a cover film covering the bonding tape. A straight reference face is provided on a longitudinal side of the reference band closely to the bonding tape.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: April 12, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroto Sumida, Kunio Tanaka
  • Patent number: 6861147
    Abstract: Provided is a gas barrier film in which in coating or laminating a single layer film or a multiplayer film comprising at least one (a) thermoplastic resin layer on which an inorganic compound is vapor deposited or (b) layer comprising metal foil, wherein 40% by weight or more of a skeletal structure represented by the following Formula (1) is contained in an epoxy resin-cured product formed from an epoxy resin composition comprising an epoxy resin and an epoxy resin curing agent as principal components.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: March 1, 2005
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Takaaki Kutsuna, Shuta Kihara
  • Patent number: 6858674
    Abstract: The invention provides a primary carbamate functional material of the formula: a method of making said materials and curable coating compositions comprising the primary carbamate functional material of the invention. The primary carbamate functional material comprises the reaction product of (1) at least one material P comprising one or more functional groups (i) which are reactive with a functional group Z but which are substantially nonreactive with a primary carbamate group X of monomeric reactive compound (2), and (2) a monomeric reactive compound comprising one or more structures of a particular formula.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: February 22, 2005
    Assignee: BASF Corporation
    Inventors: Walter H. Ohrbom, Craig S. Schang
  • Patent number: 6855430
    Abstract: The present invention relates to parts for car body comprising plastic-covered metallic material prepared by sticking a plastic film having a topcoat finishing property on one side or both sides of a molded and electrodeposition coated metallic material and to a coat-finishing process of a car body by using said parts for car body.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: February 15, 2005
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Tadayoshi Hiraki, Akira Tominaga, Takeshi Yawata
  • Patent number: 6841251
    Abstract: A composition having sealing and sound dampening properties is disclosed which comprises one or more polyepoxides comprising at least two epoxide groups per molecule; a thermoplastic polyester polymer; a curing agent adapted to react with the polyepoxides; inorganic particles having an oil absorption value of less than 70; and inorganic microparticles different from the previously mentioned inorganic particles, the inorganic microparticles having an average particle size prior to incorporation into the composition ranging from 0.5 to 200 microns. Multilayer composites, coated substrates, and methods for forming sound dampening coatings on a metallic substrate are also provided.
    Type: Grant
    Filed: February 5, 2004
    Date of Patent: January 11, 2005
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Umesh C. Desai, Marvis E. Hartman, Anthony C. Palermo
  • Patent number: 6841252
    Abstract: The invention relates to a laminate, comprising a plastic layer which contains a thermoplastic, which plastic layer is joined at least on one side to a substantially parallel metal skin. The invention also relates to a metal-plastic-metal laminate of this type. According to the invention, the core layer includes, in addition to the thermoplastic, a solvent and a hardener, the thermoplastic being dissolved in the solvent to make the thermoplastic processible, during production of the laminate, at a temperature lower than the glass transition temperature of the thermoplastic, and the hardener being capable of reaction with the solvent, or the core layer includes polymer particles dispersed in the thermoplastic, which polymer particles are formed from a solvent and a hardener capable of reaction with the solvent. In this way, the core layer becomes easier to work during the production of the laminate, while the laminate itself, after cold-working, is dimensionally stable at elevated temperature.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: January 11, 2005
    Assignee: Corus Staal BV
    Inventors: Michael Theodorus Kroes, Andries Cornelis De Muijnck, Hendrik Bart Van Veldhuizen
  • Publication number: 20040258922
    Abstract: Water-based adhesive compositions are described that includes epoxy capsules and a polymeric amine that is water soluble or water dispersible. The epoxy capsules include an outer shell material and an epoxy resin encapsulated by the outer shell material. The polymeric amine functions as an epoxy curative and as a binder resin. The compositions are substantially free of other additional organic binders. The compositions are suitable for use as mechanical fastener adhesives.
    Type: Application
    Filed: June 20, 2003
    Publication date: December 23, 2004
    Inventors: Peggy S. Willett, Robert D. Waid, Randy S. Frank, Tony R. Carrozzella
  • Patent number: RE39615
    Abstract: The invention relates to an adhesive composition, comprising: (A) at least one phenolic resole resin; and (B) the product made by reacting (B-1) at least one difunctional epoxy resin, with (B-2) at least one compound represented by the formula wherein in Formulae (I) and (II): G, T and Q are each independently functional groups selected from the group consisting of COOH, OH, SH, NH2, NHR1, (NHC(?NH))mNH2, R2COOH, NR12, C(O)NHR1, R2NR12, R2OH, R2SH, R2NH2 and R2NHR1, wherein R1 is a hydrocarbon group, R2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; T can also be R1, OR1 or SO2C6H4—NH2; and Q can also be H. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: May 8, 2007
    Assignee: Nikko Materials USA, Inc.
    Inventor: Charles A. Poutasse