Abstract: A compound arrangement comprising a first component of metal being brazed to a second component of metal. The first component has an external cylindrical surface touching an cylindrical internal surface of the second component. The second component clasps the first component tightly, so that the second component exerts compressive stress on said external surface of the first component.

Abstract: An electrical contact, especially an electrical contact of a plug connector, includes a metallic substrate on which a contact layer is applied in the form of a gradient layer. The gradient layer is formed by at least two elements of which one is silver and forms a matrix for the second element or forms an alloy therewith, or of which one is tin and the other is phosphorus or of which one is indium and the other is tin.

Abstract: A copper-based deposited alloy strip for a contact material has a maximum value of a difference not larger than 100 MPa among three of tensile strengths, that are a tensile strength in a rolling direction thereof, a tensile strength in a direction crossing the rolling direction with an angle of 45 degrees, and a tensile strength in a direction crossing the rolling direction with an angle of 90 degrees. A process for producing the copper-based deposited alloy strip for a contact material includes the steps of: performing a solution heated treatment on a copper alloy strip; and performing an aging heat treatment on the copper alloy strip.

Abstract: A steel wire (e.g., a piano wire) for use in a stringed musical instrument is designed to have a specific chemical composition in which phosphorus content ranges from 0.015 weight percent to 0.050 weight percent, wherein the total decarburized layer depth of a decarburized layer formed on the surface, which is subjected to decarburized depth measurement using a microscope method as defined in the Japanese Industrial Standard JIS G 0588, is reduced to 2 ?m or less. Other chemical substances included in the chemical composition of the steel wire are preferably defined in the standard JIS G 3502 regarding chemical compositions of piano wires. In manufacturing, a rolled steel material is subjected to wire drawing and patenting under prescribed conditions, wherein the sound quality realized by the steel wire installed in a stringed musical instrument can be noticeably improved by adopting both chemical composition control and total decarburized layer depth control.

Abstract: A bonding pad structure for a semiconductor device includes a first lower metal layer beneath a second upper metal layer in a bonding region of the device. The lower metal layer is formed such that the metal of the lower metal layer is absent from the bonding region. As a result, if damage occurs to the structure during procedures such as probing or bonding at the bonding region, the lower metal is not exposed to the environment. Oxidation of the lower metal layer by exposure to the environment is prevented, thus improving reliability of the device.

Abstract: The present invention relates to an Ag alloy film. Particularly, it is preferably used as a reflective film or semi-transmissive reflective film for an optical information recording medium having high thermal conductivity/high reflectance/high durability in the field of optical information recording media, an electromagnetic-shielding film excellent in Ag aggregation resistance, and an optical reflective film on the back of a reflection type liquid crystal display device, or the like. The Ag alloy film of the present invention comprises an Ag base alloy containing Bi and/or Sb in a total amount of 0.005 to 10% (in terms of at %). Further, the present invention relates to a sputtering target used for the deposition of such an Ag alloy film.

Abstract: An exemplary copper-silver alloy wire includes a conductive core containing copper, and a copper-silver cladding layer surrounding the conductive core. A ratio of silver to copper by weight in the copper-silver cladding layer is in a range from 1% to 30%. An exemplary method for manufacturing the copper-silver alloy wire includes steps of: providing a conductive core containing copper; forming a silver layer surrounding the conductive core; and heating the silver layer and peripheral portions of the conductive core so as to form a copper-silver cladding layer at an interface between the silver layer and the conductive core. The copper-silver alloy wire has high electrical conductivity, low current loss and high anti-interference.

Abstract: A brazing material for brazing tungsten/carbide/cobalt substrates (e.g., wear pads) to substrates comprising titanium or alloys thereof (e.g., fan or compressor blades). The brazing material includes silver, aluminum, nickel, copper, and titanium present in respective amounts to provide a post-braze hardness of between 450 and 550 KHN to thereby increase the impact resistance of the braze joint. The substrates may be brazed by induction heating at temperatures up to about 1750° F. (about 954° C.).

Abstract: Electrical contact device, in particular for low-voltage switches and contactors, comprising a contact element produced in one piece. Said contact element comprises in particular a first conducting area and a second contact area, said first area and said second area being produced with materials of different types. The device according to the invention is suitably produced through a sintering process of at least two powders of conductive material of different types, in order to define in said contact element a first conducting area produced with a first of said powders, and a second contact area produced with a second of said powders.

Abstract: A metal structure (100) for a contact pad of a semiconductor, which has interconnecting traces of a first copper layer (102). The substrate is protected by an insulating overcoat (104). The first copper layer of first thickness and first crystallite size is selectively exposed by a window (110) in the insulating overcoat. A second copper layer (105) of second thickness covers conformably the exposed first copper layer. The second layer is deposited by an electroless process and consists of a transition zone, adjoining the first layer and having copper crystallites of a second size, and a main zone having crystallites of the first size. The distance a void can migrate from the second layer is smaller than the combined thicknesses of the first and second layers. A nickel layer (106) is on the second copper layer, and a noble metal layer (107) is on the nickel layer.

Abstract: According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.

Abstract: An exemplary copper-silver alloy wire includes a conductive core containing copper, and a copper-silver cladding layer surrounding the conductive core. An exemplary method for manufacturing the copper-silver alloy wire including steps of: providing a conductive core containing copper; forming a silver layer surrounding the conductive core; and heating the silver layer and peripheral portions of the conductive core so as to form a copper-silver cladding layer at an interface between the silver layer and the conductive core. The copper-silver alloy wire has high electrical conductivity, low current loss and high anti-interference.

Abstract: Electrically conductive films comprising a flexible support, an extensible metal or metal alloy layer, and a crosslinked polymeric protective layer have at least one permanently deformed curved region. The films can be light transmissive and can have regions of compound curvature, and the metal or metal alloy layer can be substantially continuous. The films have reduced susceptibility to fracture or corrosion compared to commercially available electromagnetic interference (EMI) shielding films.

Abstract: A coating system and coating method for damping vibration in an airfoil of a rotating component of a turbomachine. The coating system includes a metallic coating on a surface of the airfoil, and a ceramic coating overlying the metallic coating. The metallic coating contains metallic particles dispersed in a matrix having a metallic and/or intermetallic composition. The metallic particles are more ductile than the matrix, and have a composition containing silver and optionally tin. The method involves ion plasma cleaning the surface of the airfoil before depositing the metallic coating and then the ceramic coating.

Abstract: A perpendicular magnetic recording medium including an interlayer structure for crystallographically orienting a layer of a hexagonal close-packed (hcp) perpendicular magnetic recording material formed thereon, comprising in overlying sequence from a surface of a magnetically soft underlayer: (1) a first crystalline layer of a material having a first lattice parameter and a strong preferred growth orientation; (2) a second crystalline layer of a material having a second lattice parameter and the same strong preferred growth orientation as the first crystalline layer; and (3) a third crystalline layer of an hcp material, having a [0002] lattice parameter similar to or different from that of the second lattice parameter of the second crystalline layer and a strong <0002> preferred growth orientation, wherein: the second crystalline layer has a lower interfacial energy with the first crystalline layer and a higher interfacial energy with the third crystalline layer, owing to a lower surface energy of th

Abstract: A multiple layer structure comprising a pair of spaced-apart crystalline layers of different materials with an intermediate crystalline layer between and in contact with each of the pair of crystalline layers, the intermediate crystalline layer providing one of the crystalline layers of the pair with a stronger out-of-plane preferred growth orientation than if each of the pair of crystalline layers are in overlying contact. Disclosed and preferred embodiments include perpendicular magnetic recording media comprising the multiple layer structure as an intermediate layer structure beneath a perpendicular magnetic recording layer for strengthening a preferred out-of-plane growth orientation of the latter.

Abstract: An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of; setting a metal sheet on a reel for metal sheet unwinding; setting a metal foil on a reel for metal foil unwinding; unwinding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a first thin metal film on the metal sheet surface; unwinding the metal foil from the metal foil-unwinding reel and activating a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of the second thin metal film so that the first thin metal film formed on the metal sheet is in contact with the second thin metal film formed on the metal foil.

Abstract: An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc discharge wherein a voltage between the arc-resistant terminal and a second terminal immediately after separation thereof is DC36V to 60V and a current between terminals during contact is 6A to 30A. In another embodiment, the an electrical contact portion comprising at least 80 mass % of metal having a boiling point of not less than 1000 degrees centigrade. According to the present invention, since the electrical contact portion or the final contact portion of the terminal includes a specific metal-based material, even when the voltage applied between the terminals is increased and an arc discharge is liable to be generated, the arc discharge can be suppressed.

Abstract: The invention provides a material for sliding contacts that is suitable for a small-sized DC motor used in recent downsized CD players and is excellent in durability. A material for sliding contacts used in a commutator of a small-sized DC motor that consists essentially of 0.01 to 3.0% Ni by weight, 0.01 to 6.0% ZnO by weight and/or 0.01 to 3.0% MgO by weight, furthermore, in some cases, 0.01 to 5.0% Cu by weight, and the balance Ag, in which Ni metal particles, ZnO particles or MgO particles are dispersed in the matrix of Ag.

Abstract: Metal-carbon composite powders and methods for producing metal-carbon composite powders. The powders have a well-controlled microstructure and morphology and preferably have a small average particle size. The method includes forming the particles from an aerosol of powder precursors. The invention also includes novel devices and products formed from the composite powders.

Abstract: The present invention provides a Y-type hexagonal ferrite thin film suitable for high frequency devices, having a crystal structure with the c-axis oriented perpendicular to the surface of the thin film. The present invention also provides a method of producing the Y-type hexagonal ferrite thin film, comprising the steps of preparing a viscous solution containing a metal-organic complex which is formed using a primary component including a Fe+3 ion, and a secondary component including a Ba2+ ion, at least one transition metal ion selected from the group consisting of Fe2+, Co2+, Ni2+, Zn2+, Cu2+ and Mn2+; and optionally at least one metal ion selected from the group consisting of Sr2+, Ca2+ and Pb2+, forming a film having a Y-type ferrite composition on a surface made of noble metal through a coating process using the viscous solution, and burning the film at a temperature of 750° C. or more.

Abstract: An electrically conductive composite material for use in the manufacture of electrical contact components, consisting of a metal strip and a contact layer made of a silver or tin contact material, which contact layer is applied at least to one side of the metal strip, whereby the contact material contains as a first additive 0.5 to 60 weight percentage of carbon powder in the form of fine particles having a diameter of ø1=5 to 200 nm and 0.5 to 60 weight percentage of a second powdery additive in the form of fine particles having a diameter of ø2=5 to 200 nm. Moreover a device for the gas atomization of a jet of a flowable or liquid material and a method for the manufacture of an electrically conductive composite material and its use are disclosed.

Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

Abstract: Disclosed are conductive powder having a packing density of 68% by volume or more with a relative value preferably comprising 60 to 92% by weight of roughly spherical and silver-plated copper powder part of the surface of which has been coated with 3 to 30% by weight of silver based on an amount of roughly spherical copper powder with exposing at least a surface of a portion of an alloy of copper with silver, and the surface of which is coated with 0.02 to 1.0% by weight of an aliphatic acid based on an amount of the roughly spherical and silver-plated copper powder, and 8 to 40% by weight of silver powder, and a method for preparing the same.

Abstract: An oxide ceramic material is provided to contain aluminum oxide as a principal component, and at least one selected from A and B shown below as an auxiliary component: A: niobium oxide and copper oxide B: copper oxide, titanium oxide, and silver oxide. With this, it is possible to provide an oxide ceramic material having sinterability at a low temperature and a high heat conductivity, as well as a ceramic substrate, a ceramic laminate device, and a power amplifier module employing the same.

Abstract: A method of sputter depositing silver selenide and controlling the stoichiometry and nodular defect formations of a sputter deposited silver-selenide film. The method includes depositing silver-selenide using a sputter deposition process at a pressure of about 0.3 mTorr to about 10 mTorr. In accordance with one aspect of the invention, an RF sputter deposition process may be used preferably at pressures of about 2 mTorr to about 3 mTorr. In accordance with another aspect of the invention, a pulse DC sputter deposition process may be used preferably at pressures of about 4 mTorr to about 5 mTorr.

Abstract: The metal film of the present invention is a dense film of a single crystal that has very low surface roughness and very good crystal orientation because an arithmetic mean roughness of the surface is not larger than 2 nm and a (111) peak intensity of X-ray diffraction is not less than 20 times the sum of all other peaks. Also the metal oxide film of the present invention is a dense film that includes less oxygen defects and almost no voids therein because a content of a non-oxidized metal is not higher than 1 mole % of a metal component that constitutes the metal oxide and a packing density is 0.98 or higher.

Abstract: A new article of manufacture, for example a faucet or other article of hardware, has a specified decorative color, and is resistant to corrosion, abrasion and attack by chemicals. The article includes a substrate, one or more corrosion resistant layers applied to the substrate, a thin transition layer having a composition that varies systematically from a first composition to a second composition and in which the first composition has, at least in part, the function of corrosion protection, and in which the second composition determines the visible color or that portion of the substrate to which the transition layer is applied.

Abstract: The layer sequence built on a substrate in thin-film technology includes an electrically conductive sputtered layer and an electrically conductive reinforcing layer for reinforcing or strengthening the sputtered layer, which is applied on the sputtered layer by a method other than sputtering. In order to remove conducting material from the conductive layers with the aid of a laser for the purposes of adjustment while producing as little contaminating material as possible, the electrically conductive reinforcing layer has a reduced thickness or is completely eliminated in regions of the electrically conductive layers to be adjusted than in other regions outside of the regions to be adjusted.

Abstract: A laminate having improved visible light transmittance and abrasion resistance, which comprises a substrate, and a titanium oxide layer, a metal layer and a titanium oxide layer laminated alternately in this order on the substrate in (2n+1) layers (wherein n is a positive integer), wherein an interlayer having a refractive index of less than 2.4 at a wavelength of 550 nm is interposed at at least one interlaminar boundary between the titanium oxide layer and the metal layer.

Abstract: A method of forming a surface finish of trivalent chromium on metal or plastics substrates by electrodeposition from an aqueous plating solution of trivalent chromium ions in which the trivalent chromium is deposited on a layer of silver or silver alloy whereby the color and/or corrosion resistance of the trivalent chromium is comparable to surface finishes of hexavalent chromium. The invention avoids the health and safety risks associated with the electrodeposition of hexavalent chromium surface finishes.

Abstract: A tough wear-resistant hard member that includes a hard composite member and a support that has a surface area adjacent to the hard composite member wherein the hard composite member is affixed to the support over at least a portion of the adjacent surface area of the support. The hard composite member includes a plurality of discrete hard constituents distributed in the hard composite member wherein each one of the discrete hard constituents is of a size so as to have a surface area between about 0.001 square inches and about 16 square inches. The hard composite member further contains a matrix powder that includes particles wherein substantially all of the hard particles have a size smaller than the size of the hard constituents.

Abstract: Electrocatalyst powders and methods for producing electrocatalyst powders, such as carbon composite electrocatalyst powders. The powders have a well-controlled microstructure and morphology. The method includes forming the particles from an aerosol of precursors by heating the aerosol to a relatively low temperature, such as not greater than about 400° C.

Abstract: A coating system and a method for its manufacture are provided. An electrically conductive base coat and a porous overcoat lying over the base coat are arranged on a ceramic substrate. At least one additional deposited layer is arranged on the base coat in such a way that the additional layer is formed in the pores of the porous overcoat adjacent to the base coat. The additional layer is deposited either by currentless or electrolytic deposition. For electrolytic deposition of the additional layer, the ceramic substrate sintered with the base coat and the overcoat is submerged in an electrolytic bath and the base coat is connected as a cathode. The currentless deposition takes place from a solution of the metal to be deposited with the addition of a reducing agent.

Abstract: A coated article that can be used in applications such as insulating glass (IG) units, so that resulting IG units can achieve high visible transmission of at least 70% (e.g., when using clear glass substrates from 1.0 to 3.5 mm thick), combined with at least one of: (a) SHGC no greater than about 0.45, more preferably no greater than about 0.40; (b) SC no greater than about 0.49, more preferably no greater than about 0.46; (c) chemical and/or mechanical durability; (d) neutral transmissive color such that transmissive a* is from ?5.0 to 0 (more preferably from ?3.5 to ?1.5), and transmissive b* is from ?2.0 to 4.0 (more preferably from 1.0 to 3.0); and (e) neutral reflective color from the exterior of the IG unit (i.e., Rg/Rout) such that reflective a* is from ?3.0 to 2.0 (more preferably from ?2.0 to 0.5), and reflective b* is from ?5.0 to 1.0 (more preferably from ?4.0 to ?1.0).

Abstract: According to one aspect of the invention, a structure and method for providing improved thermal conductivity of a thermal interface material (TIM) made of phase changed polymer matrix and a fusible filler material is disclosed. The TIM may also have a non-fusible filler material and a percentage of a non-phase change polymer added to the phase change polymer matrix. The TIM, used to mate and conduct heat between two or more components, can be highly filled systems in a polymeric matrix where the fillers are thermally more conductive than the polymer matrix.

Abstract: With an Al—Cu bonded structure, an Ag layer can be remained at the Al—Cu bonding interlayer providing ductile deformation behavior and a tensile strength at the bonded interlayer similar to that of the Al base material. This results in superior bonding characteristics. Furthermore, a thin Al—Cu bonded structure can be obtained as a result of using the Al—Cu dissimilar material bonded section, which has superior workability, as the base material to perform rolling for wall-thickness reduction. The thin Al—Cu structure has superior dimensional accuracy and can meet diverse dimensional demands. The structure combines the light weight of Al with its particular heat transfer and heat dissipative characteristics and anti-corrosive properties of Cu, allowing it to meet the compact, thin, light-weight, and high-performance needs of electronic devices. The structure can be widely used in heat exchanges and heat transfer devices.

Abstract: A coated article that can be used in applications such as insulating glass (IG) units, so that resulting IG units can achieve high visible transmission of at least 70% (e.g., when using clear glass substrates from 1.0 to 3.5 mm thick), combined with at least one of: (a) SHGC no greater than about 0.45, more preferably no greater than about 0.40; (b) SC no greater than about 0.49, more preferably no greater than about 0.46; (c) chemical and/or mechanical durability; (d) neutral transmissive color such that transmissive a* is from ?5.0 to 0 (more preferably from ?3.5 to ?1.5), and transmissive b* is from ?2.0 to 4.0 (more preferably from 1.0 to 3.0); and (e) neutral reflective color from the exterior of the IG unit (i.e., Rg/Rout) such that reflective a* is from ?3.0 to 2.0 (more preferably from ?2.0 to 0.5), and reflective b* is from ?5.0 to 1.0 (more preferably from ?4.0 to ?1.0).

Abstract: A cadmium-free optical steep edge filter comprising I-III-VI compound semiconductor systems of stoichiometric or non-stoichiometric composition, where the I-III-VI compound semiconductors are systems with one or more of the following elements: for the univalent (I) elements: Cu, Ag for the tervalent (III) elements: Al, In, Ga for the hexavalent (VI) elements: S, Se, Te.

Abstract: Ceramic-containing bodies can be bonded to other ceramic-containing bodies, or to metals or metal-containing bodies, by way of an aluminum-silicon brazing alloy. Such alloys feature high thermal conductivity and a melting range intermediate to Cu—Sil and Au—Si. By depositing a layer of silicon or aluminum, e.g., by vapor deposition, onto a surface of the ceramic-containing body, the formation of deleterious intermetallic phases at the brazing interface is avoided. This technique is particularly useful for joining reaction-bonded silicon carbide (RBSC) composite bodies, and particularly such composite bodies that contain appreciable amounts of aluminum as a metallurgical modification of the residual silicon phase. When the RBSC body contains minor amounts of the aluminum alloying constituent, or none, the metallization layer is not required. The resulting bonded structures have utility as mirrors, as packaging for electronics, and in semiconductor lithography equipment, e.g.

Abstract: A process is provided for coating metallic workpieces with a bearing material, wherein the workpiece first receives a hard chromium plating having a pearl or columnar structure type surface. A predominantly silver layer is then galvanically deposited, which fills in and smooths the pearl or columnar structure type surface of the hard chromium plating. Optionally, additional hard chromium platings and predominantly silver-containing layers may be applied, preferably galvanically. The predominantly silver layer may advantageously contain a graphite component.

Abstract: An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKal rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150 g/L of copper sulphate and 30-250 g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.

Abstract: A coated metallic mesh having a molecular layer thereon comprising: (1) a metallic mesh comprising at least one aperture; (2) a coating disposed on the metallic mesh that at least partially fills at least one aperture so as to form a partially-filled aperture; and (3) a molecular layer comprising at least one molecule having a hydrophilic region and a hydrophobic region, wherein the hydrophilic region at least partially extends into the partially-filled aperture. Also, provided are coated metallic meshes having bilayers and a method of providing a molecular layer to a coated mesh.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: A magneto-optical recording medium has a configuration such that information recorded can be read from a region smaller than a beam spot by applying an external magnetic field and directing a light beam in reproducing. The magneto-optical recording medium includes a magnetic recording layer for recording and holding information, a magnetic reproducing layer provided on one side of the magnetic recording layer on which the light beam is incident, a nonmagnetic layer provided on another side of the magnetic recording layer opposite to the magnetic reproducing layer, and a magnetic assist layer provided on the nonmagnetic layer. The magnetic assist layer has a coercive force smaller than an external magnetic field applied in recording or reproducing information.

Abstract: A thin film alloy material with the design of optic reflection and semi-transmission, which not only can make a single layer film have the effect of reflection and semi-transmission simultaneously, but also can attain the effect that has different reflectivity and half-transmittance by adjusting the ratio of alloy and the thickness of thin film. In a thin film that has relative upper and lower surfaces, there are a first alloy layer and a second alloy layer coated on the upper and lower surface; wherein the first alloy layer is composed of silver and metal X, and the metal X is chosen from one of the following metals: titanium, zirconium, hafnium; the second alloy layer is composed of silver, copper, and metal X, and the metal X is chosen from one of the following metals: titanium, zirconium, hafnium.

Abstract: A device or an enclosed area that can cause or is sensitive to electromagnetic interference (EMI) is shielded by at least partially surrounding the device or the area with a visible light-transmissive film comprising a flexible support, an extensible visible light-transmissive metal or metal alloy layer and a visible light-transmissive crosslinked polymeric protective layer, and connecting at least one grounding electrode to the metal or metal alloy layer. The film has reduced susceptibility to fracture or corrosion compared to commercially available EMI shielding films.

Abstract: A polymer solder hybrid (PSH) thermal interface material (TIM). The PSH TIM includes a solder with a low melt temperature and a filler with a high melt temperature. Upon initiation of reflow, the filler diffuses into the solder to form a new filler-solder alloy having an increased melting point and added robustness.

Abstract: A method for electrodepositing a uniformly thick coating on a metallic mesh is provided, the method comprises the steps of: (1) providing a metallic mesh having a plurality of apertures having at least one dimension greater than nanometer scale sizes; (2) subjecting the metal mesh to a relatively fast deposition of an electrodeposited material so as to substantially uniformly coat said mesh with electrodeposited material; and (3) subjecting the product of the relatively fast deposition step to a relatively slow deposition of an electrodeposited material so as to reduce at least one dimension greater than nanometer scale size to a size of nanometer scale. Also provided are metallic meshes so prepared and spectral filters.

Abstract: An improved method for plating an organic substrate with silver is disclosed. Improved plating is achieved in part through the use of Na4EDTA, which facilitates improved grain formation and recovery of silver from waste material. Articles prepared using the method of the invention are also disclosed.