Abstract: A method for fabricating an abrasive tool. A tool substrate is provided. A surface of the substrate is coated with an electroplatable bonding material. The electroplatable bonding material comprises a mixture of a conductive material and an adhesive material. Abrasive particles are adhered to the bonding material. The abrasive particles are adhered so as to have a predetermined distribution over the coated surface of the substrate. A metal layer is electroplated to the electroplatable bonding material to secure the abrasive particles to the substrate. Thus, in accordance with the present invention, the fabricated abrasive tool has abrasive particles having the predetermine distribution and fixed to the substrate by the adhesive material and the electroplated metal layer.

Abstract: The present invention is to provide a sliding member and a process for producing the same, which produce a high-quality soft metal layer uniformly coated on a sliding surface by a process alternative to electroplating or ion plating. The metal layer has been formed by ultra-fine metal (silver) particles dissolved in a solvent, which is coated on a sliding surface of the sliding member and dried and fired such that ultra-fine metal particles are melt and bonded to one another. The average particle diameter of the ultra-fine metal (silver) particles is 1 to 20 nm, and in particular 1 to 10 nm. The whole metal coating process can be carried out in the air at room temperature to about 200-300° C.

Abstract: A glass laminate comprising a glass substrate, an oxide layer as a first layer formed on the glass substrate, and at least one multilayer (B) and at least one layer (C) which are laminated in this order or alternately on the first layer, wherein the first layer comprises a zinc oxide film (A) containing Al in a ratio of Al/(Al+Zn) of from 15 to 50 at %, the layer (B) comprises Ag as the main component, the layer (C) is composed of at least one member selected from the group consisting of oxides, nitrides, carbides and double compounds thereof, and the total number of the first layer, the layer(s) (B) and the layer(s) (C) is 2n+1 (wherein n is a positive integer).

Abstract: A protective coating for fuel cell interconnects particularly for metal interconnects used in stacked solid oxide fuel cells, for preventing corrosion problems at high temperature. The protective coating is composed of precious metals such as platinum, palladium, and silver, which are highly conductive and are stable in both oxidizing and reducing atmosphere. While silver is the most economical, platinum and palladium have a high performance. Silver is cheap enough that its use in form of their film does not drive up the fuel cell costs significantly, and can be readily deposited on the metal interconnect using electrochemical techniques, such as electroplating.

Abstract: The present invention relates to a transparent conductive layered structure having a transparent substrate and a transparent conductive layer and transparent coating layer formed in succession on this substrate, used in, for instance, the front panel of CRT, etc., display devices. The main components of said transparent conductive layer are noble metal microparticles with a mean particle diameter of 1 to 100 nm, wherein the microparticles are made from gold and/or platinum and silver and the gold and/or platinum content is within a range exceeding 50 wt % up to 95 wt %, and a binder matrix.

Abstract: A highly reliable sintered compact which can be readily and safely produced, and a method for producing such sintered compact are provided. The sintered compact is preferably formed into a heat sink 1 which comprises a heat sink main body 2. The heat sink main body 2 comprises a substrate 3, a plurality of projections 4 integrally formed with the substrate 3 on its heat dissipation surface, and a molded frame 5 integrally formed with the substrate 3 to surround the projections 4. On each corner of the substrate 3 is formed a circular molded hole 6. The opposite surface of the substrate 3 is formed into a contacting surface which is adapted to be in contact with the heat generating semiconductor chip, and this contacting surface is surface treated, for example, by plating. The sintered compact is produced from metal powders, and it comprises at least one metal selected from tungsten and molybdenum and 2 to 50% by weight of silver.

Abstract: A joint body according to the invention is strong for a heat cycle and generates no local cracks. The joint body has the following features. An end portion of the metal member and the ceramic member are connected via a metal connection portion. The metal connection portion has a metallized layer formed on the ceramic member and a brazing connection portion interposing at least between the metallized layer and an end portion of the metal member. A melt point of a brazing member constructing the brazing connection portion is lower than that of a brazing member constructing the metallized layer.

Abstract: A laminated structure for electronic equipment includes a printed circuit board having copper foil, an undercoat plating layer made of tin or silver, formed on the printed circuit board, and a gold plating layer formed on the undercoat plating layer by electroless plating. Tin or silver is a metal which acts as an anticatalyst in electroless plating. After formation of the undercoat plating layer, the printed circuit board is dipped in catalyst-applying treating liquid to inhibit the anticatalyst.

Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.

Abstract: A surface enhanced Raman scattering structure may be used for detecting analytes such as organic contaminants in air and aqueous environments, and metallic and anionic contaminants in water. The structure is fabricated by etching a surface of a glass substrate to form a roughened surface; creating an adhesion layer on the roughtened surface; forming metal islands, such as gold, silver, or copper, on the adhesion layer to create a composite structure; and placing the composite structure in a thiol solution to form a self-assembled monolayer over the metal islands. The thiol solution is selected to attract an analyte of interest. The roughened surface enhances the SERS response of the structure and preferably has an average surface roughness that does not exceed about 2500 Å and a periodicity that does not exceed about 12.5 microns.

Abstract: A metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centent comprises 90.0˜99.5% of an Ag powder, 0˜9.5% of a Cu powder and 0.5˜4.0% of an active metal powder, and 0.0˜0.9% of a titanium oxide powder if necessary.

Abstract: This invention relates to electroless plating of silver onto a substrate, an aqueous silver plating bath, a process for plating a uniform coating of silver onto various substrates using an electroless plating composition, and a silver plated article formed therefrom. The plating bath neither contains nor generates toxic or flammable substances or substances that may contaminate the silver coating. By avoiding strong complexing agents, virtually pure silver may be precipitated from the bath by simple boiling. Silver electroless autocatalytic plating bath consists of silver nitrate, ammonium hydroxide and hydrazine hydrate.

Abstract: A thin film product having a nanostructured surface, a laminate product including the thin film and a temporary substrate opposite the nanostructured surface, a laminate product including the thin film and a final substrate attached to the nanostructured surface and a method of producing the thin film products. The thin film is particularly useful in the electronics industry for the production of integrated circuits, printed circuit boards and EMF shielding. The nanostructured surface includes surface features that are mostly smaller than one micron, while the dense portion of the thin film is between 10-1000 nm. The thin film is produced by coating a temporary substrate (such as aluminum foil) with a coating material (such as copper) using any process. One such method is concentrated heat deposition or a combustion, chemical vapor deposition process.

Abstract: Disclosed are compositions of matter which include a thin metallic and/or metallic oxide, nitride, carbide, silicide, boride, or sulfide coating disposed directly upon a polymeric substrate, in the absence of a carrier layer for the thin coating. Also disclosed are methods to make the composition and an apparatus to practice the method.

Abstract: A method for preparing a copper pad surface for electrical connection that has superior diffusion barrier and adhesion properties is provided. In the method, a copper pad surface is first provided that has been cleaned by an acid solution, a protection layer of a phosphorus or boron-containing metal alloy is then deposited on the copper pad surface, and then an adhesion layer of a noble metal is deposited on top of the protection layer. The protection layer may be a single layer, or two or more layers intimately joined together formed of a phosphorus or boron-containing metal alloy such as Ni-P, Co-P, Co-W-P, Co-Sn-P, Ni-W-P, Co-B, Ni-B, Co-Sn-B, Co-W-B and Ni-W-B to a thickness between about 1,000 Å and about 10,000 Å. The adhesion layer can be formed of a noble metal such as Au, Pt, Pd and Ag to a thickness between about 500 Å and about 4,000 Å.

Abstract: Durable—long lived plastic films carrying sputter-deposited metal layers such as reflective metal layers on both sides are disclosed. The slip side of the plastic film is not preglowed. The nonslip side is preglowed. This combination of glowing and not preglowing leads to the desired long life.

Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.

Abstract: A multi-element composite object composed from first, second, and third metal components is provided, wherein the first metal and the third metal are weld incompatible. The multi-element composite object includes a first component fabricated from a first metal. A second component, fabricated from a second metal, is brazed to the first component A third component, fabricated from a third metal, is inertia welded to the second component . The first metal may be provided as a titanium alloy, e.g. a TiNi alloy. The second metal may be provided as low-carbon mild or alloy steel. The third metal may be provided as alloy steel, e.g., 9310 nickel alloy steel. In an embodiment, the multi-element composite object is a gear assembly, with the first element of the gear assembly object being a shaft and the third element of the gear assembly being a gear member with hardened teeth surfaces. The first and second components can be mechanically keyed together via an anti-rotational element.

Abstract: A coating system and a method for its manufacture are provided. An electrically conductive base coat and a porous overcoat lying over the base coat are arranged on a ceramic substrate. At least one additional deposited layer is arranged on the base coat in such a way that the additional layer is formed in the pores of the porous overcoat adjacent to the base coat. The additional layer is deposited either by currentless or electrolytic deposition. For electrolytic deposition of the additional layer, the ceramic substrate sintered with the base coat and the overcoat is submerged in an electrolytic bath and the base coat is connected as a cathode. The currentless deposition takes place from a solution of the metal to be deposited with the addition of a reducing agent.

Abstract: A multi-coating step immersion coating process for producing a coating of a noble metal on a non-noble metal substrate, wherein the noble metal is of a predetermined amount expressed as a percent of the total weight of coated product, and wherein the non-noble metal substrate is in the form of fine particles or a powder is disclosed. The process also utilizes inter-plating step and post-plating step rinsing step sequences which together with the use of the plurality of coating steps consistently results in high quality product having a uniform coating, excellent corrosion resistance and excellent electrical conductivity. Use of the coated products produced according to the process in a variety of electrically conductive compositions, including plastics, adhesives and inks, and in plastic and resin based electromagnetic shielding materials is also disclosed.

Abstract: Cadmium-free hard solders having working temperatures of less than 630° C., which are easily workable and yield ductile soldered joints, are composed of 30 to 60% by weight of silver, 10 to 36% by weight of copper, 15 to 32% by weight of zinc, 0.5 to 7% by weight of gallium, 0.5 to 7% by weight of tin and 0 to 5% by weight of indium.

Abstract: A dielectric layer has an opening which communicates with a metal line therebeneath. A layer of silver is deposited over the structure and into the opening, and copper is deposited by electroplating in the opening. An additional silver layer is the deposited, and an anneal step is undertaken so that the copper is surrounded or encapsulated by alloy containing copper and silver. After removal of appropriate portions of the silver layers, the copper remains encapsulated or encased by copper-silver alloy.

Abstract: A highly reliable sintered compact which can be readily and safely produced, and a method for producing such sintered compact are provided. The sintered compact is preferably formed into a heat sink 1 which comprises a heat sink main body 2. The heat sink main body 2 comprises a substrate 3, a plurality of projections 4 integrally formed with the substrate 3 on its heat dissipation surface, and a molded frame 5 integrally formed with the substrate 3 to surround the projections 4. On each corner of the substrate 3 is formed a circular molded hole 6. The opposite surface of the substrate 3 is formed into a contacting surface which is adapted to be in contact with the heat generating semiconductor chip, and this contacting surface is surface treated, for example, by plating. The sintered compact is produced from metal powders, and it comprises at least one metal selected from tungsten and molybdenum and 2 to 50% by weight of silver.

Abstract: A sheet of silicate glass having a thickness of 2 mm and composed mainly of SiO2, and containing Al2O3, B2O3, Na2O, F, etc., is immersed in a molten salt comprising a mixture of 50 mol % of silver nitrate and 50 mol % of sodium nitrate. Na ions in the surface of the glass are eluted, diffusing Ag ions in the molten salt into the glass. When a laser beam is applied to the glass substrate thus formed, the glass substrate is evaporated or ablated progressively from its surface. The glass substrate is processed to a smooth finish without causing cracking or breakage.

Abstract: An object of the present invention is to provide a material for a sliding contact whose alloy composition does not contain an environmentally detrimental substance such as Cd, which exhibits excellent contact resistance, whose electrical functions are good and free of time-course variation, and which further exhibits excellent wear resistance. The material for a sliding contact assumes the form of an Ag—Zn—Pd, Ag—Zn—Pd—Cu, Ag—Zn—Pd—Ni, or Ag—Zn—Pd—Cu—Ni alloy. In the compositions of these alloys, the Zn content is 0.1-3.0% by weight, the Pd content is 0.1-1.5% by weight, and the balance is Ag. When Cu is contained, the Cu content is 0.1-3.0% by weight. When Ni is contained, the Ni content is 0.01-0.5% by weight. Zn, Pd, and Cu are present in the Ag &agr; phase in the form of solid solution. Ni particles are finely dispersed in the alloys. A composite clad material is formed through use of the material for a sliding contact.

Abstract: A multilayer ceramic part of the invention comprises an internal conductor layer and a ceramic layer which are formed by co-firing. The internal conductor layer is formed of an electrical conducting material containing silver as a main component, and the ceramic layer is formed of an yttrium-iron-garnet based oxide magnetic material with silver added thereto. Thus, the multilayer ceramic part can be fabricated in high yields, even when its size is much more smaller than that of a multilayer ceramic part fabricated until now.

Abstract: In the present invention, a metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centent comprises 90.0˜99.5% of an Ag powder, 0˜9.5% of a Cu powder and 0.5˜4.0% of an active metal powder, and 0.0˜0.9% of a titanium oxide powder if necessary.

Abstract: Reproducible texturing of magnetic recording media is enhanced by sputtering a buffer layer, such as Ni—P, on a nonmagnetic substrate, prior to sputtering a textured bump layer. A magnetic recording medium comprising a sputter textured metal layer and high coercivity is achieved by employing an underlayer, such as NiAl or FeAl, preferably a composite underlayer containing a chromium or chromium-alloy layer and a NiAl layer, on the sputter textured layer. Advantageously, the buffer layer, underlayer, textured bump layer, magnetic layer and carbon overcoat can be sputter deposited in a single apparatus.

Abstract: A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.

Abstract: The present invention provides a lead frame material and a process for manufacturing a lead frame material. The process includes forming an intermediate layer on a lead frame substrate by vacuum deposition and forming a top protective layer on the intermediate layer by vacuum deposition. By using vacuum deposition, the coating material can be selected from a wider variety of materials; thus, coatings with novel compositions can be formed. The intermediate layer can be Ni, Ag, W, Zn, Cr, Mo, Cu, Sn, Al, Ta, Co, Nb, or alloys thereof, and the top protective layer can be Pt, Ir, Re, Ru, Rh, Pd, Au, Ag, or alloys thereof.

Abstract: A corrosion resistant, multi-layer structure on a substrate including an adhesion metallic layer on the substrate, a cushion metallic layer on the adhesion layer, a diffusion barrier layer on the cushion layer, and an impermeable gold layer that encapsulates all the layers, is substantially even on all sides of the layers, and contacts a region on the substrate adjacent the layers to prevent oxidation and corrosion.

Abstract: A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase.

Abstract: A glazing covered ferrite core electrode terminal has a ferrite core, a glazing covered layer coated on a surface of the ferrite core, a silver paste layer disposed on the glazing covered layer, a nickel plated layer disposed on the silver paste layer, a solder plated layer disposed on the nickel plated layer, and a solder paste layer disposed on the solder plated layer.

Abstract: A glass circuit substrate wherein nuclei of Pd (palladium) are placed on a glass substrate and a plating layer of Pd--P (palladium--phosphorus) is placed on the nuclei. A fabrication method of the glass circuit substrate comprises steps of forming nuclei of Pd on a glass substrate; and therefore forming a plating layer of Pd--P on the nuclei.

Abstract: 16 A thick-film circuit (10) includes an electrically conductive substrate (12), such as stainless steel, and a first layer of a gold-rich conductor (15) applied directly thereon. The gold layer is fired in a non-oxidizing atmosphere, such as nitrogen, to ensure a solid mechanical and electrical connection between the gold and the substrate. A next layer of a silver composition (20) containing a first proportion of silver to a conductive metal is directly applied to the gold layer (15). Preferably, the composition (20) includes palladium in equal parts with the silver to achieve a secure mechanical and electrical contact with the gold layer with a minimum resistivity. A silver-rich layer (23) is then applied directly onto the intermediate layer. This silver-rich layer (23) is a composition of silver and the conductive metal in a second proportion greater than the first proportion. In one embodiment, this second proportion is three parts silver to one part palladium by weight.

Abstract: Durable--long lived plastic films carrying sputter-deposited metal layers such as reflective metal layers on both sides are disclosed. The slip side of the plastic film is not preglowed. The nonslip side is preglowed. This combination of glowing and not preglowing leads to the desired long life.

Abstract: Metal-carbon composite powders and methods for producing metal-carbon composite powders. The powders have a well-controlled microstructure and morphology and preferably have a small average particle size. The method includes forming the particles from an aerosol of powder precursors. The invention also includes novel devices and products formed from the composite powders.

Abstract: A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase.

Abstract: A seed layer is deposited under an underlayer in magnetic thin film media. The seed layer material has a similar lattice parameter and a similar crystal structure to the underlayer material. The preferred structure involves a nickel-aluminum seed layer, under a chromium underlayer, under a cobalt-based magnetic layer. Use of the nickel-aluminum seed layer produces higher coercivity and lower media noise in the resultant magnetic thin film. The coercivity and media noise values for the resultant magnetic thin film are dependent upon deposition parameters, and recommended deposition parameters are given.

Abstract: Composite nanoparticles comprising an elemental metal core surrounded by a metal-containing shell material are described wherein the particles have an average diameter of from about 5-500 nm; the core metal is preferably selected from the group consisting of the transition metals and especially Fe, Co and Ni, whereas the shell material is advantageously a metal such as an alkaline earth metal, or a metal salt such as a metal oxide or metal halide. The shell material is preferably more oxophilic than the elemental core material, enabling the core metal to remain purely metallic. These core/shell composite particles can be used to fabricate magnetizable recording media such as tapes and disks.

Abstract: A surface coating on an insulative material substrate, assuring protection against electromagnetic interference in corrosive environments, comprises two stacked metallic layers. The first layer, in contact with the substrate, is a layer of nickel-based alloy containing about 2% to 20% by weight of an element from group V B from the Periodic Table of the Elements. The second, surface layer is a layer of silver or one or its alloys. Applications include insulative material cases for electrical or electronic components including a shield consisting of a surface coating of this kind.

Abstract: The invention relates to a transparent substrate, in particular glass substrate, provided with a thin-film stack including at least one metal film with properties in the infrared, in particular a low-emissivity one, arranged between two coatings which each include at least one anti-reflection film based on dielectric material, and at least one protective film based on a sacrificial metal or a partially or fully oxidized sacrificial metal or a sacrificial metal alloy placed between the said metal film and one of the said coatings. According to the invention, the film placed directly below and/or above the said metal film contains at least one of the noble metals Pd, Au, Ir, Pt and Rh. The low-level addition of one or more of these metals to the others, namely the film placed below and/or above the metal film, leads to an increase in the chemical stability and the hardness of the thin-film stack.

Abstract: This invention relates to a multilayered magnetic structure comprising an alternate stack of:layers (6, 16) of a first type based on magnetic materials,layers (12) of a second type, made of Ag or an Ag rich alloy,a thin interface layer (8, 14) of Co or a Co rich alloy being located at the interface between layers of the first type and layers of the second type.The invention also relates to a process for making this type of structure.Applications to sensors based on magnetoresistive effects, such as current sensors or magnetic heads.

Abstract: An electrical terminal is disclosed where the terminal is formed of an electrically-conductive metal substrate such as copper alloys, aluminum alloys or stainless steel with the substrate having a codeposited composite coating of titanium nitride and gold or silver on the surface. The coating provides wear resistance in high temperature and vibration environments while retaining and demonstrating low friction and low contact resistance properties.

Abstract: Sintered silver-iron material for electrical contacts, with properties comparable with those of silver-nickel materials, is obtained by using iron powder having more than 0.25% carbon by weight and microhardness higher than 200 HV 0.025 and sintering in a hydrogen-free protective gas.

Abstract: An Ag--Cu alloy for a sliding contact containing:a) 0.1 to 8.0 wt. % of Cu, based on the weight of the alloy, wherein at least 70 wt. % of the Cu contained in the alloy is solid-solubilized in an Ag-.alpha.-phase; andb) 0.1 to 4.0 wt. %, based on the weight of the alloy, of at least one metal selected from the group consisting of Ge, Ni, Sn, In, Zn, Mg, Mn, Sb, Pb and Bi.The Ag--Cu alloy is desirably utilized to form a composite with a Cu or Cu alloy base material. Such composite has been found to be very useful for fabricating the commutator of a compact DC motor.

Abstract: Nesting electrical connectors comprising a substrate and a silver-nickel-carbon electrodeposit atop the substrate. The electrodeposit is at least about 0.5 micrometers thick, and comprises about 10 to about 25 atomic percent nickel which is dispersed as a discontinuous phase throughout a continuous phase of the silver and has a Scherrer grain size less than about 5 nanometers. The carbon comprises about 5 to about 15 atomic percent of the deposit and has a non-crystalline graphite structure.

Abstract: A magnetoresistive element includes a first magnetic layer; and laminations of a second magnetic layer, a non-magnetic layer and a third magnetic layer. The laminations are adjacent to the first magnetic layer. The second magnetic layer and the third magnetic layer have different coercive forces, wherein the first magnetic layer is selected from CoCrTa, NdFe, and alloys thereof.

Abstract: A magnetic head having a laminated magnetic film in which crystal orientation of precipitated small crystal particles can be controlled and the soft magnetic characteristic in the thickness of the laminated magnetic film can easily be controlled. The magnetic head has the laminated magnetic film formed by laminating thin magnetic layers, each having a composition as Fe.sub.x M.sub.y N.sub.z, and metal layers. The laminated magnetic film is subjected to heat treatment so that metal atoms forming the metal layers are diffused into the thin magnetic films. Thus, the laminated magnetic film contains small crystal particles of .alpha.Fe, the direction of crystal of which is controlled by the diffused metal atoms. Therefore, the laminated magnetic film has an excellent soft magnetic characteristic also in the direction of the thickness thereof.

Abstract: A transparent substrate particularly of glass, provided with a stack of thin layers having at least one metallic layer (4) having properties in the infrared range particularly having low emissivity and two coatings having a base of dielectric material located one (8) under and the other (9) over the layer having properties in the infrared range, as well as a protective metallic layer (5) place immediately over an in contact with the layer having properties in the infrared range, characterized in that in order to prevent the modification of properties of the stack, particularly optical and thermal properties, in the case where the substrate is submitted to a thermal treatment of the tempering or bending kind, firstly the second coating (9) having a base of dielectric material, includes a barrier layer for the diffusion of oxygen chosen from the following materials: components of silicon SiO.sub.2, SiO.sub.x C.sub.y SiO.sub.N N.sub.y, nitrates such as Si.sub.3 N.sub.