Abstract: Electrical contact materials made from Ag-Sn-In system alloys which have been internally oxidized. A substratum or base part of the materials is internally oxidized after having been clad with a thin layer of alloys of the same alloy system, concentration of solute elements of which is, however, smaller than that of the substratum alloys, so that no segregation of the solute metal elements shall be produced within the substratum alloys. Electrical contact resistance and consequent temperature raise of the internally oxidized materials under operation are considerably lowered.

Abstract: Disclosed herein is a radiant energy reflector comprising a laminated article mounted on a contoured support. The article includes a specularly reflective layer of silver protected on one side thereof from deterioration-inducing agents by a transparent cover sheet of polymeric material, and on the opposite side thereof by a non-polymeric protective layer of substantially inert and corrosion-resistant material. Also disclosed is a method for producing the article which yields an intimate and tenacious bond between the cover sheet, reflective layer and protective layer, thus reducing the likelihood of delamination.

Abstract: Plated metal parts, such as sealing lids for semiconductor packages, in which an iron-based alloy layer is electroplated with a first layer of nickel, a first layer of gold is electroplated on the first nickel layer, a second layer of nickel is electroplated onto the first gold layer and a second layer of gold is electroplated onto the second layer of nickel. The resultant plated parts exhibit higher salt atmosphere corrosion resistance than parts plated with a single nickel-gold set. Other metals can be used as the plating layers.

Abstract: The bond strength between a silicon carbide substrate and a metal layer comprised of a series of metal films is improved without detrimentally affecting other properties of such a device by interposing a layer of silicon, Si.sub.2 Mo or mixtures thereof between the substrate and the first metal film in the layer which is preferably Ti, Zr or Hf.

Abstract: Methods for increasing the ductility and reducing the porosity and cracking tendency of a palladium or palladium-silver electrodeposit which comprises providing an underlayer of a palladium/nickel or palladium/cobalt alloy electrodeposit. Also dual layer composite electroplated deposits and their use in electrical contacts or connectors.

Abstract: A clad brazing filler for use in bonding a ceramic to a metal, glass or another ceramic having a substantially different thermal expansion coefficient, and composites using such a filler. According to one aspect of the invention, a brazing filler of a clad type is provided which is composed of a titanium layer adjacent a silver, copper or silver-copper alloy layer, or a combination of silver and copper layers, with the titanium content being in a range of 3 to 80% of the total weight of the layers of the assembly. In accordance with another aspect of the invention, a brazing filler of the clad type is provided which combines the layer arrangement of the first aspect with either a layer of a metal having a low thermal expansion coefficient, a layer of a metal having a low Young's modulus, for a combination layer of both, arranged in any order.

Abstract: A process for metal plating a stainless steel comprising the first step of treating the stainless steel by a cathode electrolysis in an aqueous solution containing free HCl in an amount at least 30 g/l and at least one species of Ni and Co in an amount at least 0.1 g/l; the second step of metal plating the same by Ni or a Ni alloy in a weakly acidic Ni plating bath; and the third step of subsequently plating the same by a noble metal, Cu or an alloy thereof.

Abstract: In the manufacture of a formed contact part of a metal alloy, wherein the formed part is shaped in one or more manufacturing operations without the removal of metal to produce a contact element, the improvement which comprises forming from the alloying constituents a composite material in which the alloying constituents are heterogeneously embedded, the composite material being formed into the contact part without the removal of metal and, after forming, heating the contact part so as to convert the composite material into a homogeneous alloy. The process is particularly applicable to silver-palladium alloys where the alloy would not itself be suitable for the forming operation.

Abstract: A switch for making and breaking a connection between a load circuit and a power line, with two parallelogrammatic linkages terminating in scissorlike contactor pairs, has limitedly swivelable and/or extensible cross-links interconnecting aligned pivotal junctions of the two linkages to provide them with a certain relative mobility. In an operating position, part-cylindrical armatures detachably secured to the two contactor pairs grip respective portions of an elongate countercontact fixedly suspended between a pair of rings attached to the power line, this countercontact comprising a metallic supporting tube also provided with part-cylindrical armatures in the region of the contactor pairs. Each armature may comprise several metallic layers on a base of copper, namely an inner layer of silver, a protective layer of tin on top thereof, and an outer silver layer. The armatures could also be made, at least in part, of a scorchproof material such as silver/cesium oxide.

Abstract: A soldering foil having a multi-layer structure for the stress-free joining of ceramic bodies to metal is described along with a process for making the foil. The soldering foil contains two layers of an active solder, particularly a Cu/Ti solder, provided with an intermediate cushion layer, preferably of copper, which absorbs the stresses. Between the copper cushion layer and the active solder layers barrier layers of silver are arranged which are very thin in relation to the copper and solder layers. The soldering foil permits a low-stress and extremely durable connection to be established between metal and ceramic, simultaneously permitting relatively large deviations in the temperature and time parameters of the soldering process.

Abstract: This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.

Abstract: An ornamental composite material has a covering of an Ni-, Au-, Ag- or Cu-base alloy, and a core of a mineral powder aggregate. A layer of a metal different from the metals of the alloy of the covering can be clad on the inner surface of the covering as needed. The ornamental composite material is preferably used for various parts of a spectacle frame.

Abstract: A conductive element having a metallization paste screen printed on its surface is made using a paste containing 65 to 95% by weight silver and 5 to 35% by weight cadmium/antimony alloy dispersed in a liquid vehicle.

Abstract: A silver-coated electric material wherein a partial or total surface of an electroconductive or non-electroconductive substrate is provided with a coating of silver or silver alloy, having the first intermediate coating layer made of Ni, Co, Cr, Pd or their alloys and the second intermediate coating layer made of Sn, Cd, Pd, Ru or their alloys between the silver coating and the surface of the substrate, and the method of preparing the same.

Abstract: A multilayer metal/organic polymer composite which has a formable thermoplastic polymer layer, a first metal layer adhered to the polymer layer and a second metal layer adhered to the first metal layer. The first metal layer is formed either from one metal or from an alloy of two or more metals. Suitable alloys are those which begin melting at a temperature within a range of from about 85 to 150 percent of the forming temperatures in degrees Kelvin of the polymer layer. If the first meal layer is formed from one metal, the metal is suitably, copper, silver, nickel or manganese. The second metal layer is a metal or an alloy of two or more metals that melts at a temperature which is less than that at which the first metal layer melts.

Abstract: An infrared radiation reflecting substrate, having deposited thereon a first layer formed from a metal or an alloy, and a second layer deposited on the first layer and consisting of a solar radiation absorbing amorphous material, such as amorphous carbon. The substrate can be formed from an infrared radiation reflecting layer deposited on a primary substrate.

Abstract: Bearings can be lubricated with ductile metal films. It has been found that the service life of such lubricating films can be improved by the use of metals which are alloyed with a component having a higher surface tension than the metal.

Abstract: Case for a semiconductor component, including at least two parts, one of the parts being a cap, at least the cap being formed of a material having low hydrogen permeability and a weak catalytic effect for an oxyhydrogen gas reaction.

Abstract: An improved crystal is provided with an aluminum baseplate, a nickel plating on the aluminum baseplate, and a silver plating on the nickel plating. The nickel is plated on the aluminum baseplate before the aluminum has oxidized to provide high yields of stable crystals.

Abstract: A molybdenum disc suitable for the use as a semiconductor. The disc has a thickness of about 0.5 to several mm and is coated with a noble metal that is applied to the molybdenum in a layer thickness of 0.02.mu. via an intermediate layer of chromium having a layer thickness of 0.5 to 10.0.mu..

Abstract: There is described an electrical contact piece made of a silver-metal oxide material as contact coating, a carrier made of copper, or iron and an intermediate layer which furnishes a high adhesive strength of the contact coating to the contact carrier even at a high number of switchings. The intermediate layer consist essentially of a silver alloy having 2 to 12 weight % of tin, indium, and/or germanium.

Abstract: Electronic chip having a composite stratified metal back and method of making it in which strata of metal and/or metal alloys are deposited on the back of the silicon base or a wafer carrying a plurality of circuit components on its face at least one of the strata being resistant to passage of copper at attaching and operational temperatures, and a stratum of solder is provided on the surface of the previously deposited strata for joining the chip to a lead frame.

Abstract: A new material consisting of a multilayer crystalline structure which is coherent perpendicular to the layers and where each layer is composed of a single crystalline element. The individual layers may vary from 2.ANG. to 100.ANG. or more in thickness.

Abstract: The present invention relates to a stratified, corrosion-resistant complex comprising a metal substrate and an outer layer made of a noble material. According to the invention the substrate is composed of an alloy having, by weight at least 45% nickel, at least 7% chromium, and at least 7% molybdenum, all the other components of the substrate representing at most 15% of the alloy.The invention is particularly useful for making the backs of watch cases.

Abstract: A silver-cadmium oxide material having throughout a substantially uniform cadmium oxide distribution and suitable for use as electrical contact material is made from silver-cadmium oxide having an internal cadmium oxide depleted zone. The layers are bonded together by hot rolling which reduces the bonded material to a thickness less than the original thickness of the combined layers. Two or more layers of material are superimposed one over another and bonded and reduced in thickness by hot rolling. The process is repeated with bonded material from preceding steps a sufficient number of times to obtain a material having a substantially uniform dispersion of cadmium-oxide particles throughout the interior thereof.

Abstract: A method of laminating first and second metal sheets to one another, comprises the steps of superposing the metal sheets and including therebetween a layer of amorphous metal and laminating the sheets to one another. During the lamination a pressure is applied by cold rolling for bonding the first and second sheets together.

Abstract: A multi-layer solar energy collector of improved stability comprising: (1) a substrate of quartz, silicate glass, stainless steel or aluminum-containing ferritic alloy; (2) a solar absorptive layer comprising silver, copper oxide, rhodium/rhodium oxide and 0-15% by weight of platinum; (3) an interlayer comprising silver or silver/platinum; and (4) an optional external anti-reflective coating, plus a method for preparing a thermally stable multi-layered solar collector, in which the absorptive layer is undercoated with a thin film of silver or silver/platinum to obtain an improved conductor-dielectric tandem.

Abstract: A multifiber electrical brush formed of an electrically conductive matrix material having plural electrically conducting fiber wires embedded therein and extending therefrom, wherein the fiber wires have a diameter varying from 1 to 120.mu.m, a length on the order of 100 times greater than the diameter thereof, and a packing density between 1-25%. Suitable materials for the fiber wires are platinum, gold, silver, copper, palladium, or niobium which may be embedded in a copper, silver, or other suitable matrix material, or copper embedded in an aluminum matrix. The fiber wires may be provided with a coating of a suitable barrier material on the lateral surfaces thereof as may be required to protect the fiber wires from etching during removal of the matrix material, or to prevent and/or retard interdiffusion between the matrix material and the fiber wire material during annealing or hot-forming of brush stock, and/or to impart improved electrical performance to the resultant electrical brush.

Abstract: Disclosed is a silver-cadmium-nickel alloy coating including small but effective amounts of cadmium and nickel, namely, at least, about 6 weight percent cadmium and 0.5 weight percent nickel, to impart a gold-color to the coating substantially equivalent to that of a 12-16 karat gold layer of similar thickness. The gold-colored alloy coating can replace a 12 karat gold inner layer in a duplex coating having a 22 karat gold outer layer, and thereby provide substantial savings in gold.A highly alkaline aqueous cyanide plating bath is employed in the electroplating process in conjunction with increased current density to ensure that a critical minimum amount of cadmium is deposited in the alloy coating.

Abstract: Disclosed is an electrical contact of composite layer type which comprises an interrupting layer consisting of Cu-W alloy, Cu-WC alloy or Cu-W-WC alloy containing 20 to 60 wt % of Cu and being bonded to the top surface of a base plate, and a contacting layer consisting of Ag-WC alloy, Ag-W alloy or Ag-W-WC alloy containing 20 to 60 wt % of Ag and being bonded to the top surface of said interrupting layer.

Abstract: To permit direct bonding of a composite electric contact-and-bonding material to a carrier, such as a reed, magnetic strip, or the like, by thermo-electric heating, the side of the contact-and-bonding material is formed with projections, preferably projecting ridges, ribs, or beads, and a bonding or solder material in wire form is adhered, by rolling on to the valley between the projecting ridges, the bonding or soldering material leaving space free between adjacent ridges or ribs and not filling the entire recess, but projecting outwardly at least as far as the projections or ridges, and preferably slightly therebeyond. The soldering or bonding wire may have round or polygonal, preferably triangular cross section with a pointed tip extending outwardly to provide for concentration of heat upon resistance heating the contact material against the carrier strip.

Abstract: In a heat wave-reflective or electrically conductive laminated structure composed of(A) a shaped solid substrate,(B) a transparent thin layer having a high refractive index in contact with one or both surfaces of a layer (C) below, wherein when the layer (B) is provided on both surfaces of the layer (C), it may, at one surface, be a transparent thin layer (B) whose refractive index is not high,(C) a transparent heat wave-reflective thin layer of an electrically conductive metal in contact with the substrate (A) or with the transparent thin layer (B), and(D) optionally, a transparent top layer; the improvement wherein said layer (C) is a layer composed of at least about 50% by weight of Ag, about 3 to about 30% by weight of Au and about 0.5 to about 30% of Cu, the amounts being based on the total weight of Ag, Au and Cu.

Abstract: Lead frame of sufficient mechanical strength, lowered cost, excellent plating affinity and enhanced anticorrosion is obtained through increased contents of P and Cu and remarkably reduced content of Ni or Cr even without employment of the preparative Ni strike plating necessitated in the prior art.

Abstract: Silver alloy for sliding contact, containing 2 to 8% Mo, up to 10% Cu, up to 10% Pd and remainder of Ag. This alloy has high wear resistance, low electrical contact-resistance and low mechanical friction. So, when it is used as a sliding contact material, the sliding contact has a long operation life.

Abstract: A process, article produced therefrom, and compositions are described for the reception of electroless plating onto a substrate of a non-catalytic metal or non-catalytic alloy. The process comprises contacting the surface of the non-catalytic substrate with a promotor composition containing ions selected from the group of nickel, cobalt, iron, and mixtures thereof and a suitable reducing agent, and thereafter contacting the treated surface with an electroless plating bath comprising hypophosphite for metallic build-up.

Abstract: An improved brazed construction and method for fabrication of equipment having a corrosion resistant liner on a base metal backing is disclosed, and involves incorporating symmetrical convolutions in the liner normal to the direction of maximum thermal expansion.

Abstract: Zirconium-base alloy channels, fuel cladding tubes and other components are made resistant to accelerated pustular corrosion in a boiling water reactor environment by coating them with a small amount of a suitable electronically conducting material.

Abstract: Silver alloy wire for the production of jewelry, especially jewelry chains is made of a solder containing nucleus and a jacket of silver or silver alloy wherein the solder containing nucleus has a core of silver or silver alloy surrounded by a layer of brass.

Abstract: Composite electrical contact composed of a copper base portion clad with a contact portion of Ag-SnO alloy. The contact and base portions are fusion bonded by an interfacial alloy layer of Ag and Cu and an adjacent diffusion layer of Cu as the result of heat-treatment of the contact at the eutectic temperature of Ag and Cu.

Abstract: An improved selective absorber on a glass substrate having high solar absorption and low infrared emission. The Selective Absorber on a glass substrate includes an electrically conducting layer of silver metal having a thickness on the order of 0.1 microns, and an absorbing layer of either black nickel or, alternatively, a layer of oxidized iron over a layer of nickel or bright nickel. The method of this invention defines the process of producing the Selective Absorber on a glass substrate by thoroughly cleaning the glass, chemically depositing a thin layer of silver metal over the clean glass surface, then electroplating an absorbing layer over the silver layer. The absorbing layer may be electroplated black nickel or, alternatively, an electroplated layer of nickel or bright nickel, such as cobalt-nickel, and an electroplated cover layer of iron. The glass substate and composite layers are heat treated to thermally cured to improve its optical and properties.

Abstract: A new and improved magnetic recording disk can be prepared by interposing between an aluminum substrate disk and a recording alloy layer a support layer located on the substrate disk and a shield layer located between the support layer and the recording layer. The support layer is a hard, semi-crystalline nickel alloy layer having magnetic properties which is of such a character that if it is contacted by a recording head during the use of the disk it will tend to form a powder which will not interfere with subsequent use of the disk or recording head. The shield layer is of a nonmagnetic metal and serves to reflect signals from the recording head so that they do not reach the support layer.

Abstract: Alloys of the atomic composition, Ag.sub.(25-66) Cu.sub.(16-68) In.sub.(7-18) in the form of thin foil, are made ductile by the presence of appreciable amounts of amorphous phase and a metastable, micro-crystalline, solid solution, single phase and are especially suited for fabricating preforms for preplacement in a joint to be joined by an operation such as brazing.

Abstract: A method is described for reducing the defect density in a crystalline film grown on a substrate with which it has a substantial misfit. The principle of the method is to grow the film, not directly from the substrate, but from a layer of small islands previously deposited onto the substrate. The technique has been fully investigated for the growth of Ag (and then Au) films on NaCl, a substantial improvement in the quality of the overgrown film being obtained when an intermediate layer of Ni islands is deposited on the NaCl prior to the deposition of the Ag.

Abstract: The contact element is produced by ultrasonic welding one or more contact pieces onto a carrier, an intermediate layer in the form of a metal powder, for example aluminium, being interposed between the contact piece and the carrier prior to such welding in order to assist in the welding of contact pieces made of material which would otherwise be difficult to weld.

Abstract: Improved electrical contact materials and a method for manufacturing same are disclosed. The improved materials comprise mechanically elongated billets composed of at least a first metal and the oxide of a second metal. The billets include a plurality of alternating substantially coaxial zones of metal-metal oxide and zones devoid of the metal oxide. The zones devoid of the metal oxide serve as slip zones and render the contact material readily formable into any desired electrical contact shape.

Abstract: A low-current contact structure formed on a contact member or substrate of various layers is described. A layer of refractory material is connected via a layer of easily diffusive metal with a layer of noble metal through diffusion annealing.

Abstract: A composite superconductor having both filamentary and film conductors for carrying the pure and impure components of direct current, respectively, or for alternating current, is disclosed, together with a method of making it, and a preferred arrangement for its use in high power transmission lines.

Abstract: A filler metal composition and method are provided for producing strong brazed joints between metal parts, e.g. steel parts, assembled in joint-forming relationship with each other, the filler metal comprising an indium-containing silver brazing alloy consisting essentially by weight of about 30% to 70% Ag, about 3% to 20% In, about 3% to 20% Zn, up to about 0.5% Si and the balance essentially copper.

Abstract: For the diffusion bonding of members of titanium and some titanium alloys, layers of Cu, Ag and Ni are deposited by plating on both sides of a sheet of etched, chemically clean, titanium or titanium alloy foil of a thickness preferably less than 0.001 inch. The plated foil is interposed between faying surfaces of the members to be bonded together, and the members, with the interposed foil, are sealed under pressure, in an inert atmosphere and under partial vacuum or hard vacuum of, for example, 10.sup..sup.-4 Torr. The parts thus prepared are heated to brazing temperature to render liquidus plating material and thereby establish a diffusion bridge between each plated face of the foil and the adjacent faying surface of each of the members. Heating is continued to induce atomic diffusion in the zone thus established between the titanium of the foil and the members, and between the members themselves, until the diffusion zone becomes principally titanium with traces of plating materials diffused throughout.

Abstract: A process for plating beryllium copper with an excellent electrically conductive material such as gold for use in high reliability applications wherein a heat treating step is employed after forming to yield a desired hardness spring temper comprising the steps of: providing a copper-rich surface on the beryllium copper; electroplating the copper-rich surface with a diffusion barrier preplate; heat treating the beryllium copper material to a desired temper; and electroplating the material with a high electrically conductive material. This process provides for a void-free, durable gold plate which can be produced by a continuous automated strip plating line before and after heat treating.