Abstract: An apparatus and a method for manufacturing a semiconductor device can provide a good quality film growth in a highly clean reaction atmosphere unaffected by contamination from a furnace opening portion. A reverse-diffusion preventing body 8 is provided between a furnace opening flange 7 and a boat susceptor 19 so that a substrate processing space 20 is isolated from a furnace opening portion space 21 to thereby prevent reverse-diffusion of a contaminant which occurs at a furnace opening portion B, to the substrate processing space 20. At a furnace opening flange 7, a furnace opening exhausting tube 15 is provided which constitutes a furnace opening system for exhausting the space 21 independently of the space 20 so that the space 21 is exhausted while being purged by supplying a purge gas into the space 21, to thereby remove a contaminant from the space 21.

Abstract: A pulp heating apparatus has a heater main body 1 which has a pulp introduction port for introducing pulp, a vapor introduction port for introducing vapor, a disperser for dispersing the pulp introduced via the pulp introduction port under a high temperature and a pulp exhaust port for exhausting the pulp dispersed by the disperser and is arranged in a horizontal direction. The disperser has a spiral vane section which continues spirally around a rotational shaft and discontinuous vane sections around the rotational shaft. The pulp introduction port is provided at a bottom section of the heater main body and is connected to an introduction passage. A screw conveyor is provided on the introduction passage. A forward end of the introduction passage faces towards the spiral vane section.

Abstract: A heater lift mechanism with a ball screw linear actuator provides a relatively maintenance free lift mechanism with low starting torque and high positional accuracy. The heater lift mechanism can also be used to move wafer boats in a vertical furnace. The ball screw linear actuator has substantially reduced backlash over a conventional ACME thread lead screw.

Abstract: An improved method and apparatus for charging, preheating and refining steel. The charging apparatus has a skirted charging section for introducing charge materials, a dynamic gas seal adjacent the charging section and a preheater, the preheater for preheating the charged materials, a connector adjacent the preheater and removably insertable into an electric arc furnace for feeding charged materials into a furnace bath for melting and refining metallic charge therein, and a vibrating conveyor which extends throughout the charging apparatus. The charging apparatus is positioned on rails to be movable by a hydraulic cylinder between a charging position wherein the connector is fully inserted into the furnace, a retracted position where the connector is partially inserted into the furnace and a disconnected position where the connector is fully removed from the furnace.

Abstract: In a material feeding mechanism in association with a continuous sintering apparatus, a material (S) carried by a transporting conveyer (1) into an atmosphere-displacement chamber (2) is fed into a furnace casing (4) of the continuous sintering apparatus by using a loading pusher (3). The transporting conveyor, the atmosphere-displacement chamber, and the loading pusher are arranged in such a manner that a direction in which the material is carried by the transporting conveyor and a direction in which the material is fed from the atmosphere-displacement chamber into the furnace casing by the loading pusher are linearly aligned, and the loading pusher and a drive unit thereof are installed under a floor of the atmosphere-displacement chamber so that the loading pusher moves up over the floor surface of the atmosphere-displacement chamber and moves forward and backward on the floor surface of the atmosphere-displacement chamber when the material is fed into the furnace casing.

Abstract: When carrying workpieces from a loading area in which the workpieces are handled into a heat treatment furnace to make the workpieces subjected to a heat treatment process using a predetermined process gas, the loading area is evacuated and controlled at a predetermined low negative pressure. An exhaust for evacuating the loading area is connected to the loading area, and a controller controls the exhaust so that the loading area is maintained at the predetermined low negative pressure. A specific gas and particles contained in a gas discharged from the loading area are removed by filters.

Abstract: The present invention is an apparatus for performing heat and cooling treatments for a substrate includes: a heating table for mounting the substrate thereon to perform the heat treatment for the substrate; a cooling table for mounting the substrate thereon to perform the cooling treatment for the substrate; a waiting table for allowing the substrate to wait; a carrying mechanism for carrying the substrate between the heating table, the cooling table, and the waiting table; and airflow formation means for forming airflow in a space in which the heating table, the cooling table, and the waiting table are arranged.

Abstract: In a system for loading, processing and unloading substrates, a carrier has a bottom and a plurality of slots to receive a plurality of substrates for processing in a reactor. The reactor is tubular and has an inlet opening to receive the carrier loaded with substrates. A handling robot loads and unloads the substrates to and from the carrier when the carrier is located outside the reactor. A rotatable base plate supports the carrier and moves the carrier between a first position in proximity of the handling robot and a second position in proximity of the reactor. A lifting device introduces and removes the carrier in and from the reactor by lifting and lowering the carrier from and to the base plate when the carrier is in the second position. A door plate is coupled to the lifting device and to the bottom of the carrier. The door plate closes the inlet opening of the reactor when the carrier is introduced in the reactor and seals the reactor during processing.

Abstract: To provide a high-temperature and high-pressure treatment device in which articles to be treated such as wafers of LSI semiconductors can be transported in a stable attitude, and the entire apparatus is made compact.

Abstract: A hot air slurry dryer having a cylindrical housing with a central shaft rotatably mounted in the housing. Material to be dried moves from an upstream end of the housing to an outlet at a downstream end. A hot air inlet is connected to the upstream end of the housing preferably at an upstream end wall. A material inlet is open to the side wall of the housing downstream of the hot air inlet. The shaft carries structure for breaking up the moist material introduced into the housing and mixing it with the hot air. In a preferred embodiment a drum is carried by the shaft at the inlet end of the cylindrical housing. The drum carries a plurality of agitator blades that pass close by the interior surface of the side wall of the housing.

Abstract: The present invention relates to a method for heat processing of a substrate having the step of baking a substrate, on which a coating film is formed, at a predetermined high temperature, comprising a first step of increasing the substrate from a predetermined low temperature to a predetermined intermediate temperature lower than a predetermined reaction temperature at which the coating film reacts, a second step of maintaining the substrate at the predetermined intermediate temperature for a predetermined period of time, and a third step of increasing the temperature of the substrate to the predetermined high temperature higher than the predetermined reaction temperature.

Abstract: An apparatus for automatically and simultaneously loading a single long wafer boat or a plurality of wafer boats onto a cantilever paddle includes a stationary first track aligned with a first opening of a diffusion furnace and a first carriage moveable on the first track. The first carriage supports a cantilever paddle. A first vertical translation mechanism includes a first stationary part and a first vertically moveable support. A second vertical translation mechanism includes a second stationary part and a second vertically moveable support. A first horizontal translation mechanism includes a first base supported by the first vertically moveable support and a first horizontally moveable arm supported by the first base. A second horizontal translation mechanism includes a second base supported by the second vertically moveable support and a second horizontally moveable arm supported by the second base.

Abstract: A vertical heat-processing apparatus includes a surrounding member, which surrounds a process chamber and a heater. The surrounding member forms a heating space around the process chamber. The heating space has zones juxtaposed in a vertical direction. Temperature sensors are arranged to detect temperatures respectively representing the zones. Supply pipes are arranged to respectively supply a cooling gas to the zones. The supply pipes are respectively provided with valves controlled by a controller. The controller adjusts opening degrees of the valves such that a flow velocity of the cooling gas in a first zone having a lower cooling rate becomes higher than a flow velocity of the cooling gas in a second zone having a higher cooling rate used as a reference.

Abstract: A gas floating-transporting apparatus transports a material to be treated along a predetermined direction in a thermal space so as to thermally treat the material to be treated. The apparatus includes a gas floating mechanism and a transporting mechanism. The gas floating mechanism includes a gas ejection device which expels the gas toward a portion of the material to be treated on which a floating force is acted so as to float the material to be treated, and a gas supply device which supplies the gas to the gas ejection means. The transporting mechanism includes an abutting member which abuts a trailing end of the floated material to be treated and moves along the predetermined direction, and which pushes the material to be treated by the movement thereof, whereby the floated material to be treated is moved along the predetermined direction.

Abstract: A facility for the thermal treatment of workpieces has a processing or heating chamber and at least one transport device, extending essentially completely through the processing or heating chamber, with which the workpieces to be treated can be transported through the processing or heating chamber. At least two processing or heating levels are hereby located on top of one another in the processing or heating chamber, with each processing or heating level having at least one separate transport device. This type of facility can preferably be used as a soldering facility, particularly a reflow soldering facility, or as a facility for the hardening or drying of plastics or adhesives.

Abstract: A heating processing chamber has a plate for holding a wafer and a heater heating the plate portion. The plate portion is composed of a plurality of divided plates separated from each other, and thereby the plate is hard to break even through a drastic change in temperature, thus making it possible to increase the durability of the plate.

Abstract: When an oxidation process for semiconductor wafers is carried out by a batch type furnace, the uniformity of the thickness of a film is intended to be improved so as to be capable of carrying out a low temperature process. In a system for feeding a mixed gas of hydrogen gas and water vapor into a reaction vessel to carry out a so-called wet oxidation, a ventilation resistance material is provided in an outside passage of a double-pipe passage for heating gas in an external combustion system, and a mixed gas of hydrogen gas and hydrogen chloride gas is passed through the ventilation resistance material to be heated to a process temperature or higher by means of the heater of the combustion system to previously produce a very small amount of water vapor to carry out a dry oxidation. When dinitrogen oxide gas is used for producing a nitrogen containing silicon oxide film, dinitrogen oxide gas is passed through the outside passage to be previously activated.

Abstract: This invention related to a substrate transfer apparatus having an arm holder moving into and out of a cassette while a substrate is mounted thereon, a forward and backward driving mechanism for moving the arm holder forward and backward, and a contact support member for supporting the substrate in contact with a lower surface peripheral portion of the substrate placed on the arm holder, said contact support member comprising a first defining portion for defining a front end of the substrate placed on the arm holder, and a second defining portion facing the first defining portion, for defining a rear end of the substrate placed on the arm holder.

Abstract: A semiconductor fabricating apparatus having a vertical reaction furnace, a boat for holding plural wafers in a multi-layered fashion and being loaded into the vertical reaction furnace, a storage disposed at a location corresponding to the boat for storing at least one of the wafer cassettes, a wafer transfer device for transferring the wafer between the storage and the boat, a cassette transfer unit for transferring the wafer cassettes between the apparatus and outside thereof, a cassette transfer device for effecting the transfer of the wafer cassettes between the cassette transfer unit and the storage, and a plurality of cassette shelves disposed within a range allowing transfer of the wafer cassettes from the cassette transfer device for receiving the wafer cassettes in upwardly-oriented positions.

Abstract: A jig comprises: a main body; a retainer for retaining a block in which at least one row of sections to be sliders is aligned; a middle load application section coupled to a portion of the retainer located in the middle of the length thereof; end load application sections coupled to portions of the retainer near ends of the length thereof; middle couplers located between the middle load application section and each of the end load application sections, respectively, for coupling the main body to the retainer; and end couplers for coupling the main body to the ends of the length of the retainer. The length between the middle of the retainer and each of the ends thereof is greater than the length between the middle of the retainer and each of the end load application sections.

Abstract: In a substrate conveying system, the temperature adjustment for a substrate is performed by use of a temperature adjusting plate which is provided at a substrate transfer station where a substrate can be transferred from or to an outside structure, by which the substrate temperature adjustment can be accomplished without a decrease of a processing speed of a semiconductor manufacturing apparatus and without deposition of contaminations.

Abstract: The invention provides a coke oven charging machine including a mobile frame and a coke oven feed device on the mobile frame. The coke oven feed device includes a movable, elongate charging plate having a first end and a second end, retractable side-walls adjacent the charging plate, first and second end walls adjacent the first and second ends of the charging plate and a shuttle section adjacent the first end of the charging plate for spanning an area between the first end of the charging plate and an entrance to the oven. The shuttle section has opposed shuttle side walls and a shuttle end wall. A charging plate moving device is provided for moving the charging plate into and out of the oven. The charging machine apparatus provides a means for quickly charging coking ovens with a compacted coal charge so that lower quality coals may be used to make metallurgical coke.

Abstract: A processing unit for a substrate has a vertical thermal processing furnace 4 having a bottom and an opening 4a provided at the bottom. A boat 3 holding substrates W in vertical multistairs can be placed on a first lid 17, and the first lid 17 can open and close the opening 4a of the vertical thermal processing furnace 4 with the boat 3 placed thereon. The processing unit also has a boat-placing portion 19 on which the boat 3 and another boat 3 can be placed and a boat conveying mechanism 21 for conveying the two boats 3 alternatively between the boat-placing portion 19 and the first lid 17. A second lid 18 hermetically closes the opening 4a of the vertical thermal processing furnace 4 when the first lid 17 opens the opening 4a but no boat 3 passes through the opening 4a.

Abstract: A high-temperature conveyor furnace with a low friction conveyor travel surface is provided. The furnace includes a muffle defining a heating chamber, hearth plates providing a hearth surface within the heating chamber, and a conveyor belt to convey product through the heating chamber. The conveyor belt is formed of a first material, such as a nickel-chrome alloy. A plurality of low-friction inserts are supported by the hearth plates, preferably in openings in the hearth plates, to provide a surface upraised from the hearth surface upon which the conveyor belt travels. The inserts are formed of a second material, such as an electronics grade ceramic, that is different from the first material of the conveyor, which minimizes friction between the inserts and the belt. The low-friction surface is particularly suitable for high temperature, low dewpoint furnace applications, such as stainless steel brazing.

Abstract: A method and apparatus for preventing N2O from becoming super critical during a high pressure oxidation stage within a high pressure oxidation furnace is disclosed. The method and apparatus utilize a catalyst to catalytically disassociate N2O as it enters the high pressure oxidation furnace. This catalyst is used in an environment of between five atmosphere to 25 atmosphere N2O and a temperature range of 600° to 750° C., which are the conditions that lead to the N2O going super critical. By preventing the N2O from becoming super critical, the reaction is controlled that prevents both temperature and pressure spikes. The catalyst can be selected from the group of noble transition metals and their oxides. This group can comprise palladium, platinum, iridium, rhodium, nickel, silver, and gold.

Abstract: A transfer valve assembly (10) for use as a feed valve or a discharge valve includes a series of open-faced pockets (46) biased by leaf springs (48) off of a central hub (44) and an arcuate saddle piece (22) mounted at an opening (14) of a sterilizer vessel (12) for transferring containers from an infeed conveyor (34) onto an interior reel (18). The engagement of open-faced pockets (46) with saddle (22) creates a seal to prevent the escape of steam, but gaps are provided between pockets (46) which allow for a controlled escape of steam in a manner that allows the pressure within the sterilizer vessel to be maintained at a slightly elevated level.

Abstract: A heating furnace reheats batches of iron steel products, which differ in their thermal state, introduced in succession into the furnace. The furnace has heating zones followed by at least two equalization zones, the products passing through at least one of these zones, at a speed different from that of the other zones. This speed can be adjusted depending on the thermal objective for the products to be reheated, and at least one of these zones is used as a heating zone.

Abstract: A furnace for thermal processing of substrates includes a substrate cassette that supports at least one substrate and a process chamber for thermal processing. A process chamber that includes a port for receiving a substrate, a heater that generates a thermal distribution, and a rotatable member having a substrate support. The rotatable member rotates a substrate positioned on the substrate support so that a temperature of the substrate is controlled according to a temperature profile. A transport mechanism transports substrates between the substrate cassette and the substrate support of the rotatable member.

Abstract: A substrate heater having a chamber, a heating element located in the chamber, and an elevator having a substrate holder. The holder can hold a plurality of planar substrates in a general spaced stacked configuration. The holder can be moved to allow substrates to be inserted and removed from various locations on the holder. In one embodiment the substrates are located very close to each other to accelerate the rate of heat transfer to newly inserted substrates. In another embodiment, the holder has an individual horizontal heater on the elevator for each substrate.

Abstract: A wafer support device is provided. The wafer support device includes a susceptor having a surface configured to support a bottom surface of a wafer. The susceptor has a plurality of guiding recesses. The wafer support device also includes a pin lift that has a plurality of pins extending therefrom. The plurality of pins is configured to be passed via the plurality of guiding recesses of the susceptor to engage the bottom surface of the wafer. The susceptor is configured to be moved relative to the plurality of pins in a direction substantially orthogonal to the surface of the susceptor.

Abstract: A processing chamber tube used in a semiconductor furnace is guided during its removal from the furnace by a plurality of circumferentially spaced guides. The guides are mounted for adjustable radial movement on a ring-shaped plate. The plate is secured on the base of the furnace. The guides are preferably in the form of rollers which engage and guide the tube during its removal from the furnace.

Abstract: A floor (2) of the device communicates with one or more ash-extraction pipes (3) associated with a semi-cooled conveyor. The conveyor is a drag conveyor (5) that travels over a semi-cooled floor (12) inside a housing (4). Several such semi-cooled floors are positioned one above another at several levels. The floors (12) at each level are divided into several tables (16) separated by slots (17) that extend across the direction traveled by the conveyor. The tables are mutually displaced level by level such that the rear end of every table is above the front end of a table in the floor just below it.

Abstract: A transport system operates to convey articles preferably through an oven before their subsequent removal. The transport system is synchronized with an article delivery system to receive and subsequently convey articles for final distribution on one or more conveyor belts. This is accomplished by drive mechanism which rotates a plurality of support bars having hooks. These hooks are used to catch articles as they are provided to the transport system and retain these articles during conveyance. An adjustable chute is used to impede the conveyance of only the articles. This causes the articles to be removed from the hooks and slide down the chute to the conveyor belt(s).

Abstract: A wafer handling apparatus and method includes a wafer carrier station for supporting a wafer carrier, such as an enclosed pod, that holds one or more wafers. A grounded interface panel is provided between the carrier station and a clean testing or processing environment. A z-movement mechanism moves the carrier station and the wafer carrier in a z-direction. A door opening mechanism removes a door from said carrier through a door opening in the interface panel. A handler mechanism includes a wafer holding device, such as a flat end effector, that moves into the wafer carrier at a separate access opening to load or unload a wafer to or from the wafer carrier. Wafer carriers holding different amounts of wafers can be used with no major structural changes to the apparatus.

Abstract: A wafer transfer apparatus used during the processes of manufacturing semiconductor devices has a chuck assembly which includes at least a pair of retainers for accommodating a group of wafers, each wafer retainer having a wafer guide with a plurality of slots formed at regularly spaced intervals and a guide supporter for supporting the wafer guide. At least one nozzle is formed on the wafer guide and is connected to a gas supply member for supplying gas. When the chuck assembly moves downwardly so as to load wafers into a quartz boat, the nozzle sprays the gas so that quartz particles deposited in the slots can be blown off, thereby preventing contamination.

Abstract: An apparatus for loading wafers into horizontal quartz tube, the apparatus includes a base plate, holding plate, trolley main body and two supporting bases. The base plate has a plurality of stages, which is lifted by a loading rod and fixed atop thereon, for placing wafers. The holding plate has a plurality of fixing screws and altitude adjusting screws for supporting the base plate and changing an altitude of the base plate to match an altitude of wafer boat. The trolley main body, which supports the holding plate by supporting pillars, provides with a plurality of position holes for carrying the holding plate and moving the base plte. The two supporting bases are connected by a solid plate, whose both ends are respectively attached at hollows formed at the middle of each of the two supporting bases. The two supporting bases are provided with a pair of slide bearings on either side of the solid plate.

Abstract: An air blow apparatus peels wafers off and simultaneously removes grease and grindstone grains by blowing air into gaps formed between semiconductor wafers sliced by a wire saw from a semiconductor ingot. Two injection nozzles 1a, 1b are symmetrically mounted at predetermined positions with respect to the central line c of the semiconductor wafer 10. Air injections 11a, 11b are injected from the outer top of the semiconductor wafer 10. Injection nozzles 1a, 1b are arranged so that they are movable in the longitudinal direction of the semiconductor ingot. Air injections 11a, 11b are set to be blown out at a cone shape of about 30 degrees.

Abstract: To dry semiconductor substrates, especially silicon wafers subsequent to rinsing after etching, the substrate is exposed to the action of radiation which contains an IR portion and a UV portion, the IR portion being greater than the UV portion. The IR-UV radiation quickly dries the substrate and prevents contamination of the substrate with undesirable particles or limits it to a nondisruptive degree. To execute drying with IR-UV radiation, an arrangement is proposed in which the substrate is moved through directly from the treatment liquid (rinsing medium) between two rod-shaped radiators which emit IR-UV radiation.

Abstract: This invention relates to a sealing device useful for attachment to a process equipment such as vertical shaft kiln (VSK) for providing air-seal self-controlled discharge of product from the said equipment, which comprises a chamber (1) having at its top end an inlet (3) with flange (2) for fitting to the discharge chute of a process equipment and a discharge outlet (16) at its bottom end, the said chamber being provided with a partition wall (4) having an inlet gate (5) & a discharge gate (6) hinged to its top & bottom respectively, the free ends of the hinged gates being such as to sit on means (7) and (8) to provide air seal, means (9,10,11,12,13,14,15,17,18,19,20& SOL) being provided for simultaneous operation of the inlet & discharge gates, the said means [9(a) & (b) and SOL] being connected to a control circuit for actuating the movement of the gates, the discharge outlet being fitted onto a volumetric discharge unit (21) provided with means (22) for measuring the quantity of product discharge.

Abstract: A method pertaining to the baking of products (B) in a baking oven (1) in which the products are supported by at least one rotary oven trolley (17) comprises rotating the trolley through a number of revolutions in one direction (R1) during the baking process, and thereafter reversing the direction of rotation and continuing rotation of the trolley through several revolutions in the opposite direction (R2) before again reversing the direction of rotation of the trolley. The trolley (17) keeps the same axial position in both directions of rotation. An arrangement for carrying out the method includes a drive device (20-26) for alternating rotation of the oven trolley through an equal number of revolutions in both directions during the baking process.

Abstract: A vertically oriented thermal processor for processing batches of semiconductor wafers held within a processing chamber. The processing chamber is contained within a processing vessel. A furnace liner surrounds the processing vessel in spaced relationship. A flow path for cooling fluid is supplied between the furnace liner and an inner wall of the furnace heater. The flow occurs through end and base segments forming part of the furnace heating enclosure. The end and base segments have interior ports which communicate with a manifold chamber. The manifold chamber is advantageously divided into inner and outer chambers by shields which reflect radiant heat. The inner and outer manifold chambers are connected by manifold connecting passages formed between the shields.

Abstract: An apparatus and method for high-temperature precision sintering applications are disclosed wherein a flowable bed of a refractory particulate material is used to support an article during sintering to minimize distortions caused by shrinkage.

Abstract: A support boat for objects-to-be-processed including a plurality of support shelves formed in multi-stages spaced from each other by a vertical pitch for mounting a plurality of objects-to-be-processed which are to be heat treated in a vertical heat treatment apparatus; and a plurality of support bars for interconnecting the support shelves vertically spaced from each other and holding the same, the support boat comprising a light shielding plate disposed above an uppermost one or below a lowermost one of the support shelves for blocking heat rays from a heater for heating, whereby abrupt heating of central parts of those of the objects-to-be-processed which are positioned near the top or the bottom of the support boat is suppressed, and all the objects-to-be-processed can have substantially the same heat history.

Abstract: An apparatus for charging a feed material onto a rotating hearth of a rotary hearth furnace, the rotary hearth furnace including refractory lined inner and outer walls and having a refractory roof supported thereon, the apparatus comprising a table mounted above the rotating hearth and capable of receiving feed material from outside of the rotary hearth furnace, the table extends transversely across the rotating hearth and having a first end including a distribution member, a second end including a plurality of discharge slots, and an intermediate leveling plow; wherein feed material free falls over said distribution member and is distributed across the width of the table and then adjusted to a uniform depth such that as the rotating hearth passes under the stationary table a curtain of feed material is loaded onto the hearth.

Abstract: A kiln assembly (10) with a tunnel kiln (12) having an entrance (14) and exit (16). Two parallel guideways (18) are provided extending through the kiln (12), each adjacent a side wall of the kiln (12). A plurality of car members (20) are movable respectively along either of the guideways (18) carrying support members (24) extending therebetween. Ware is loaded on to the support members (24) at the entrance (14), and is unloaede at the exit (16), are provided. Return guideways (22) are provided extending around opposite sides of the kiln (12) such that the car members (20) from the respective guideways (18) pass around opposite sides of the kiln (12) in a different spacing from when travelling through the kiln (12).

Abstract: A system for automatic loading of wafer boats onto a cantilever paddle for insertion of the wafer boats into a furnace tube includes an end effector carriage moving on a track and supporting an end effector having spaced, parallel pads to engage opposed outer side portions of a wafer boat. The end effector receives a wafer boat from a robotic arm of an elevator. The robotic arm moves transversely relative to the track to position the wafer boat over the track on which the paddle carriage moves. The end effector carriage moves the end effector pads under the wafer boat, lifts it from a pair of elevator tines, moves the wafer boat over a desired part of the paddle, and lowers the wafer boat onto the paddle. The end effector carriage then returns the end effector to an initial location.

Abstract: A furnace system for preventing gas leakage is disclosed. The furnace system includes a bottom board for holding a furnace tube. A gas injection device is connected to the furnace tube at a first port for injecting reaction gas into the furnace tube. An exhaust subsystem is connected to the furnace tube at a second port. The exhaust subsystem has a first node, a second node, a third node and a fourth node. A vacuum seal is connected to the furnace tube at a third port for preventing the exhaust gas from leaking. The vacuum seal is connected to the exhaust subsystem at the first node and the second node. Finally, an N.sub.2 sealing tube is connected to furnace tube and surrounding the seam between the furnace tube and the bottom board.

Abstract: A vertical heat treatment system has a transfer apparatus for transferring semiconductor wafers and a cassette serving as a transport container for the semiconductor wafers. The transfer apparatus has a base disposed to be vertically movable and rotatable within a horizontal plane. Wafer arms for transferring the wafers placed on them are disposed on the base. The wafer arms can reciprocally move on the base between a standby position and an advanced position in the horizontal direction. A cassette arm for transferring a cassette placed on it is also disposed on the base. The cassette arm can reciprocally move on the base between a retreat position and a protruded position in the horizontal direction. The wafer arms and the cassette arm are reciprocally movable in opposite directions to oppose each other. While the wafer arms and the cassette arm are at the standby position and the retreat position, respectively, a holding portion of the cassette arm is present immediately above the wafer arms.

Abstract: A drop-out conveyor transports heated slabs from a pusher-type slab reheat furnace to a roller table. The drop-out conveyor comprises at least one reciprocating carriage or slab cart movable between a first slab loading position and a second slab discharge position. A track is provided for supporting each carriage between the loading position and the discharge position. A reciprocating mechanism drives the cart between the first position and the second position. A slab receiving mechanism is attached to the carriage for receiving and transporting the slab thereon. The drop-out conveyor provides for transferring the slab from the slab receiving mechanism to the roller table.

Abstract: A furnace installation as an intermediate storage between a mandrel-free coiling mechanism for strip-shaped cast billet, which is arranged downstream of a thin slab casting installation, and an uncoiling mechanism communicating with a downstream rolling mill, and a system for transporting the coiled bundles through the furnace installation. The furnace installation includes an integral coiling mechanism on the charging side. At least one transporting device for transporting the bundles is provided outside and below the furnace installation and is movable along the furnace installation. The transporting device penetrates into the furnace installation by lifting/lowering supports for the bundle to be transported. The uncoiling mechanism is likewise integrated in the furnace installation at a distance from the coiling mechanism which allows a plurality of bundles arranged adjacent to one another to be picked up. The uncoiling mechanism communicates with the coiling mechanism via the transporting device.