Using Platinum Group Metal (i.e., Platinum (pt), Palladium (pd), Rodium (rh), Ruthenium (ru), Iridium (ir), Osmium (os), Or Alloy Thereof) Patents (Class 438/575)
  • Patent number: 5908307
    Abstract: Pre-amorphization of a surface layer of crystalline silicon to an ultra-shallow (e.g., less than 100 nm) depth provides a solution to fabrication problems including (1) high thermal conduction in crystalline silicon and (2) shadowing and diffraction-interference effects by an already fabricated gate of a field-effect transistor on incident laser radiation. Such problems, in the past, have prevented prior-art projection gas immersion laser doping from being effectively employed in the fabrication of integrated circuits comprising MOS field-effect transistors employing 100 nm and shallower junction technology.
    Type: Grant
    Filed: January 31, 1997
    Date of Patent: June 1, 1999
    Assignee: Ultratech Stepper, Inc.
    Inventors: Somit Talwar, Karl-Josef Kramer, Guarav Verma, Kurt Weiner
  • Patent number: 5888891
    Abstract: A schottky diode is formed of a sintered palladium platinum silicide in contact with a lightly doped silicon surface in which the platinum and palladium are present in a ratio of about one part to about 10 parts respectively, by weight.
    Type: Grant
    Filed: August 23, 1996
    Date of Patent: March 30, 1999
    Assignee: International Rectifier Corporation
    Inventor: Herbert J. Gould