Abstract: Method of manufacturing a semiconductor device, includes forming a protective layer over substrate having a plurality of protrusions and recesses. The protective layer includes polymer composition including polymer having repeating units of one or more of: Wherein a, b, c, d, e, f, g, h, and i are each independently H, —OH, —ROH, —R(OH)2, —NH2, —NHR, —NR2, —SH, —RSH, or —R(SH)2, wherein at least one of a, b, c, d, e, f, g, h, and i on each repeating unit is not H. R, R1, and R2 are each independently a C1-C10 alkyl group, a C3-C10 cycloalkyl group, a C1-C10 hydroxyalkyl group, a C2-C10 alkoxy group, a C2-C10 alkoxy alkyl group, a C2-C10 acetyl group, a C3-C10 acetylalkyl group, a C1-C10 carboxyl group, a C2-C10 alkyl carboxyl group, or a C4-C10 cycloalkyl carboxyl group, and n is 2-1000. A resist layer is formed over the protective layer, and the resist layer is patterned.

Abstract: A device includes an interconnect structure, a barrier multi-layer structure, an oxide layer, a pad metal layer, and a passivation layer. The barrier multi-layer structure is over the interconnect structure, the barrier multi-layer structure includes a first metal nitride layer and a second metal nitride layer over the first metal nitride layer. The oxide layer is over the barrier multi-layer structure, in which the oxide layer is an oxide of the second metal nitride layer of the barrier multi-layer structure. The pad metal layer is over the oxide layer. The passivation layer is in contact with the barrier multi-layer structure, the oxide layer, and the pad metal layer.

Abstract: Embodiments of semiconductor devices and fabrication methods thereof are disclosed. In an example, a semiconductor device includes a first semiconductor structure, a second semiconductor structure, and an interposer structure vertically between the first and second semiconductor structures. The first semiconductor structure includes a plurality of logic process-compatible devices and a first bonding layer comprising a plurality of first bonding contacts. The second semiconductor structure includes an array of NAND memory cells and a second bonding layer comprising a plurality of second bonding contacts. The interposer structure includes a first interposer bonding layer having a plurality of first interposer contacts disposed at a first side of the interposer structure, and a second interposer bonding layer having a plurality of second interposer contacts disposed at a second side opposite of the first side of the interposer structure.

Abstract: Semiconductor devices, FinFET devices and methods of forming the same are disclosed. One of the semiconductor devices includes a substrate and a gate strip disposed over the substrate. The gate strip includes a high-k layer disposed over the substrate, an N-type work function metal layer disposed over the high-k layer, and a barrier layer disposed over the N-type work function metal layer. The barrier layer includes at least one first film containing TiAlN, TaAlN or AlN.

Abstract: A laser processing apparatus includes an unloading/loading mechanism for unloading a wafer from and loading a wafer into a cassette placed on a cassette placing stand, a chuck table for rotatably holding the wafer unloaded from the cassette by the unloading/loading mechanism, an image capturing unit for capturing an image of a wafer, and a control unit. The control unit controls the unloading/loading mechanism to orient a mark indicating the crystal orientation of a processed wafer in a predetermined direction different from a direction in which the mark of an unprocessed wafer in the cassette is oriented, when the unloading/loading mechanism houses the processed wafer into the cassette.

Abstract: Certain example embodiments relate to ultra-fast laser treatment of silver-inclusive (low-emissivity) low-E coatings, coated articles including such coatings, and/or associated methods. The low-E coating is formed on a substrate (e.g., borosilicate or soda lime silica glass), with the low-E coating including at least one sputter-deposited silver-based layer, and with each said silver-based layer being sandwiched between one or more dielectric layers. The low-E coating is exposed to laser pulses having a duration of no more than 10?12 seconds, a wavelength of 355-500 nm, and an energy density of more than 30 kW/cm2. The exposing is performed so as to avoid increasing temperature of the low-E coating to more than 300 degrees C. while also reducing (a) grain boundaries with respect to, and vacancies in, each said silver-based layer, (b) each said silver-based layer's refractive index, and (c) emissivity of the low-E coating compared to its as-deposited form.

Abstract: Semiconductor structures and fabrication methods are provided. An exemplary fabrication method includes providing a base substrate having an opening and forming a first gate layer in the opening. The first gate layer closes a top of the opening and includes a void. The method also includes forming a second gate layer on the first gate layer. An atomic radius of a material of the second gate layer is smaller than gaps among the atoms of the material of the first gate layer. Further, the method includes performing a thermal annealing process to cause atoms of the material of the second layer to pass through the first gate layer to fill the void.

Abstract: Processes for selective deposition of material on a workpiece are provided. In one example, the method includes placing a workpiece on a workpiece support in a processing chamber. The workpiece has a first material and a second material. The second material is different from the first material. The method includes performing an organic radical based surface treatment process on the workpiece to modify an adsorption characteristic of the first material selectively relative to the second material such that the first material has a first adsorption characteristic and the second material has a second adsorption characteristic. The second adsorption characteristic being different from the first adsorption characteristic. The method includes performing a deposition process on the workpiece such that a material is selectively deposited on the first material relative to the second material.

Abstract: Techniques for selectively removing a metal or conductive material during processing of a semiconductor die for high-voltage applications are provided. In some embodiments, the techniques treat a metallized semiconductor die to transfer a feature from a patterned photoresist layer deposited on the metallized semiconductor die. In addition, the patterned metallized semiconductor die can be subjected to an etch process to remove an amount of metal according to the feature in the pattern, resulting in a treated metallized semiconductor die that defines an opening adjacent to at least a pair of neighboring metal interconnects in the die. The treated metallized semiconductor die can be further treated to backfill the opening with a dielectric material, resulting in a metallized semiconductor die having a backfilled dielectric member.

Abstract: A method for forming a bond pad structure includes forming an interconnect structure on a semiconductor device, forming a passivation layer on the interconnect structure, forming at least one opening through the passivation layer, forming an oxidation layer at least in the opening, and forming a pad metal layer on the oxidation layer. A portion of the interconnect structure is exposed by the at least one opening.

Abstract: A semiconductor interconnect structure and its manufacturing method are presented. The manufacturing method includes: providing a substrate structure, wherein the substrate structure comprises: a substrate; a first metal layer on the substrate; a dielectric layer on the substrate, wherein the dielectric layer covers the first metal layer, and wherein the dielectric layer has a hole extending to the first metal layer; and a hard mask layer on the dielectric layer; removing the hard mask layer on the dielectric layer; selectively depositing a second metal layer at the bottom of the hole; and depositing a third metal layer, wherein the third metal layer fills the hole. This semiconductor interconnect structure provides improved reliability over conventional structures.

Abstract: The semiconductor device includes a substrate, an epi-layer, a first etch stop layer, an interlayer dielectric (ILD) layer, a second etch stop layer, a protective layer, a liner, a silicide cap and a contact plug. The substrate has a first portion and a second portion. The epi-layer is disposed in the first portion. The first etch stop layer is disposed on the second portion. The ILD layer is disposed on the first etch stop layer. The second etch stop layer is disposed on the ILD layer, in which the first etch stop layer, the ILD layer and the second etch stop layer form a sidewall surrounding the first portion. The protective layer is disposed on the sidewall. The liner is disposed on the protective layer. The silicide cap is disposed on the epi-layer. The contact plug is disposed on the silicide cap and surrounded by the liner.

Abstract: The present invention relates to a method for producing a via through a base layer of a microelectronic device, the method including formation of a hole leading to at least one first face of the base layer and filling the hole by at least one first filling material. The method also includes at least partially removing the at least one first filling material over a depth from the first face of the base layer, the depth being strictly less than a thickness dimension of the hole, so as to produce a hollow portion. Further, method includes a second step of at least partially filling the hollow portion by at least one second filling material.

Abstract: Provided are atomic layer deposition methods to deposit a tungsten film or tungsten-containing film using a tungsten-containing reactive gas comprising one or more of tungsten pentachloride, a compound with the empirical formula WCl5 or WCl6.

Abstract: A semiconductor device is provided. The semiconductor device can have a substrate including dielectric material. A plurality of narrow interconnect openings can be formed within said dielectric material. In addition, a plurality of wide interconnect openings can be formed within said dielectric material. The semiconductor device can include a first metal filling the narrow interconnect openings to form an interconnect structure and conformally covering a surface of the wide interconnect openings formed in the dielectric material, and a second metal formed over the first metal and encapsulated by the first metal to form another interconnect structure within the wide interconnect openings.

Abstract: An etching method that includes using the etching liquid composition containing (A) 0.1 to 15 mass % of hydrogen peroxide, (B) 0.01 to 1 mass % of a fluoride ion source, (C) 2-hydroxyethane sulfonic acid or a salt thereof in an amount of 0.1 to 20 mass % in terms of organic sulfonic acid, (D) 0.01 to 5 mass % of at least one compound selected from the group consisting of azole-based compounds and compounds having a structure that has a 6-membered heterocycle including at least one nitrogen atom and three double bonds, and (E) water, is provided.

Abstract: Interconnect structures and methods of fabricating an interconnect structure. A first mandrel line, a second mandrel line, and a non-mandrel line between the first mandrel line and the second mandrel line are provided. A first sidewall spacer is formed adjacent to a section of the first mandrel line and is arranged between the section of the first mandrel line and the non-mandrel line. A first cut is formed that extends partially across the non-mandrel line adjacent to the first spacer to narrow a section of the non-mandrel line. The section of the first mandrel line is removed selective to the first sidewall spacer to form a second cut. An interconnect is formed using the non-mandrel line. The interconnect includes a narrowed section coinciding with a location of the narrowed section of the non-mandrel line.

Abstract: A manufacturing method of a metal layer, a functional substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method of a metal layer includes: forming an insulating layer on a base substrate; forming an etching buffer layer on the insulating layer; patterning the etching buffer layer and the insulating layer to form a plurality of recessed microstructures in the insulating layer; stripping the etching buffer layer; and forming a metal layer on the insulating layer, a surface of the metal layer adjacent to the insulating layer is formed with a plurality of protruded portions which are filled into the plurality of recessed microstructures. The manufacturing method of a metal layer may form a metal layer with anti-reflection effect.

Abstract: A method of non-ablatively laser patterning a multi-layer structure, the multi-layer structure including a substrate, a first layer disposed on the substrate, a second layer disposed on the first layer, and a third layer disposed on the second layer, the method including generating at least one laser pulse having laser parameters selected for non-ablatively changing the conductivity a selected portion of the third layer such that the selected portion becomes non-conductive, and directing the pulse to the multi-layer structure, wherein the conductivity of the first layer is not substantially changed by the pulse.

Abstract: An advanced metal conductor structure is described. An integrated circuit device including a substrate having a dielectric layer is patterned. The pattern includes a set of features in the dielectric for a set of metal conductor structures. An adhesion promoting layer is disposed over the set of features in the patterned dielectric. A nitridized ruthenium layer is disposed over the adhesion promoting layer. A cobalt layer disposed over the nitridized ruthenium layer filling the set of features, wherein the cobalt layer is formed using a physical vapor deposition process.

Abstract: A silicon chalcogenate precursor comprising the chemical formula of Si(XR1)nR24-n, where X is sulfur, selenium, or tellurium, R1 is hydrogen, an alkyl group, a substituted alkyl group, an alkoxide group, a substituted alkoxide group, an amide group, a substituted amide group, an amine group, a substituted amine group, or a halogen group, each R2 is independently hydrogen, an alkyl group, a substituted alkyl group, an alkoxide group, a substituted alkoxide group, an amide group, a substituted amide group, an amine group, a substituted amine group, or a halogen group, and n is 1, 2, 3, or 4. Methods of forming the silicon chalcogenate precursor, methods of forming silicon nitride, and methods of forming a semiconductor structure are also disclosed.

Abstract: Embodiments of the present application provide a method for producing an array substrate. The array substrate includes a planarization layer provided on a layer of thin film transistors and a first electrode provided on the planarization layer for a light emitting device. The method includes the steps of: forming a pixel definition layer for placing the first electrode, a via hole for the first electrode and a spacer on the planarization layer by a single patterning process with a single mask. The array substrate is produced by the method provided by the present embodiment, so that the number of the used patterning processes and the number of the used masks are reduced.

Abstract: An electronic device and method for production is disclosed. One embodiment provides an integrated component having a first layer which is composed of copper or a copper alloy or which contains copper or a copper alloy, and having an electrically conductive second layer, whose material differs from the material of the first layer, and a connection apparatus which is arranged on the first layer and on the second layer.

Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.

Abstract: A method of fabricating a gate stack for a semiconductor device includes the following steps after removal of a dummy gate: growing a high-k dielectric layer over an area vacated by the dummy gate; depositing a thin metal layer over the high-k dielectric layer; annealing the replacement gate structure in an ambient atmosphere containing hydrogen; and depositing a gap fill layer.

Abstract: A device comprises a metal gate structure in a trench and over a substrate, wherein the gate structure comprises a first metal sidewall in the trench, wherein the first metal sidewall becomes progressively thinner towards an upper portion of the first metal sidewall, a second metal sidewall in the trench, wherein the second metal sidewall becomes progressively thinner towards an upper portion of the second metal sidewall and a metal bottom layer on a bottom of the trench and between the first metal sidewall and the second metal sidewall.

Abstract: A method for manufacturing a semiconductor device includes a first step of forming a first electrode on one main surface side of a semiconductor wafer; a second step of bonding a first film to another main surface side of the semiconductor wafer; a third step of bonding a second film to an outer peripheral portion of the semiconductor wafer by applying pressure to the second film on the semiconductor wafer using a plurality of cylindrical rollers, after the second step; and a fourth step of forming a plating layer on the first electrode on the one main surface side of the semiconductor wafer by a plating process, after the third step.

Abstract: Described are apparatus and methods for forming films comprise indium and arsenic. In particular, these films may be formed in a configuration of two or more chambers under “load lock” conditions. These films may include additional components as dopants, such as aluminum and/or gallium. Such films can be used in metal/silicon contacts having low contact resistances. Also disclosed are devices including the films comprising indium arsenide.

Abstract: Methods are described herein for etching metal films which are difficult to volatize. The methods include exposing a metal film to a chlorine-containing precursor (e.g. Cl2). Chlorine is then removed from the substrate processing region. A carbon-and-nitrogen-containing precursor (e.g. TMEDA) is delivered to the substrate processing region to form volatile metal complexes which desorb from the surface of the metal film. The methods presented remove metal while very slowly removing the other exposed materials. A thin metal oxide layer may be present on the surface of the metal layer, in which case a local plasma from hydrogen may be used to remove the oxygen or amorphize the near surface region, which has been found to increase the overall etch rate.

Abstract: Under one aspect, a nanotube diode includes: a cathode formed of a semiconductor material; and an anode formed of nanotubes. The cathode and anode are in fixed and direct physical contact, and are constructed and arranged such that sufficient electrical stimulus applied to the cathode and the anode creates a conductive pathway between the cathode and the anode. In some embodiments, the anode includes a non-woven nanotube fabric having a plurality of unaligned nanotubes. The non-woven nanotube fabric may have a thickness, e.g., of 0.5 to 20 nm. Or, the non-woven nanotube fabric may include a block of nanotubes. The nanotubes may include metallic nanotubes and semiconducting nanotubes, and the cathode may include an n-type semiconductor material. A Schottky barrier can form between the n-type semiconductor material and the metallic nanotubes and/or a PN junction can form between the n-type semiconductor material and the semiconducting nanotubes.

Abstract: The present invention belongs to the technical field of integrated semiconductor circuits, and relates to a method used in a process no greater than 32 nm to improve the electromigration resistance of Cu interconnects. Coating layers on Cu interconnects, such as CuSi3, CuGe, and CuSiN, can be prepared by autoregistration, and with the use of new impervious layer materials, the electromigration resistance of Cu interconnects can be largely improved and the high conductivity thereof can be kept, which provides an ideal solution for interconnection process for process nodes no greater than 32 nm.

Abstract: Method of forming transistor devices is disclosed that includes forming a first layer of high-k insulating material and a sacrificial protection layer above first and second active regions, removing the first layer of insulating material and the protection layer from above the second active region, removing the protection layer from above the first layer of insulating material positioned above the first active region, forming a second layer of high-k insulating material above the first layer of insulating material and the second active region, forming a layer of metal above the second layer of insulating material, and removing portions of the first and second layers of insulating material and the metal layer to form a first gate stack (comprised of the first and second layers of high-k material and the layer of metal) and a second gate stack (comprised of the second layer of high-k material and the layer of metal).

Abstract: A memory process is described. A substrate is provided, having therein trenches and conductive lines buried in the trenches and having thereon an array area, wherein each of the conductive lines has an array portion in the array area. A contact area apart from the array area is defined on the substrate, wherein each of the conductive lines has a contact portion in the contact area. The substrate between the contact portions of the conductive lines is etched down to below the tops of the conductive layers to form gaps between the contact portions of the conductive lines. The gaps are then filled with an insulating layer.

Abstract: A method of forming a nonvolatile memory cell includes forming a first electrode and a second electrode of the memory cell. Sacrificial material is provided between the first second electrodes. The sacrificial material is exchanged with programmable material. The sacrificial material may additionally be exchanged with select device material.

Abstract: In one embodiment, a semiconductor device includes a first contact pad disposed at a top side of a workpiece, a second contact pad disposed at the top side of the workpiece. An isolation region is disposed between the first contact pad and the second contact pad. A metal strip is disposed at least partially within the isolation region. The metal strip is not coupled to an external potential node.

Abstract: A method for manufacturing a semiconductor device includes: forming an insulating film on a substrate where a first conductive film is formed; forming a recess in the insulating film such that the first conductive film is exposed in a portion of the recess; forming a metal oxide film to cover the insulating film and the first conductive film after forming a recess; performing a hydrogen radical treatment of irradiating the substrate with atomic hydrogen after forming a metal oxide film; and forming a second conductive film in the recess.

Abstract: A method of forming a semiconductor device structure comprises forming a mold template comprising trenches within a mold material. Structures are formed within the trenches of the mold template. A wet removal process is performed to remove the mold template, a liquid material of the wet removal process remaining at least in spaces between adjacent pairs of the structures following the wet removal process. A polymer material is formed at least in the spaces between the adjacent pairs of the structures. At least one dry removal process is performed to remove the polymer material from at least the spaces between the adjacent pairs of the structures. Additional methods of forming a semiconductor device structure, and methods of forming capacitor structures are also described.

Abstract: A method of producing a semiconductor device, comprising the steps of forming a through hole in a semiconductor substrate having a first main surface, a second main surface opposite to the first main surface, and a first conductive layer disposed on the second main surface so that the through hole passes through the semiconductor substrate from the first main surface to the second main surface; forming an insulation film to extend from a bottom portion of the through hole to the first main surface through a side surface of the through hole; coating an organic member on the insulation film on the side surface of the through hole and the first main surface; removing an air bubble in the organic member and between the organic member and the insulation film; and forming a first opening portion in the organic member.

Abstract: Methods of fabricating a semiconductor device are described. The method includes forming a patterned oxide layer having a plurality of openings over a substrate, depositing a metal layer in the openings to form metal plugs, depositing a global transformable (GT) layer on the oxide layer and the metal plugs, and depositing a capping layer directly on the GT layer without exposing the GT layer to ambient air. The GT layer on the oxide layer transforms into a dielectric oxide and the GT layer on the metal plugs remains conductive during deposition of the capping layer.

Abstract: A method is disclosed that includes the operations outlined below. A plurality of dummy conductive cells that provide different densities are formed in a plurality of empty areas in a plurality of metal layers of a semiconductor device according to overlap conditions of the empty areas between each pair of neighboring metal layers.

Abstract: Disclosed is a package that includes a wafer substrate and a metal stack seed layer. The metal stack seed layer includes a titanium thin film outer layer. A resist layer is provided in contact with the titanium thin film outer layer of the metal stack seed layer, the resist layer forming circuitry. A method for manufacturing a package is further disclosed. A metal stack seed layer having a titanium thin film outer layer is formed. A resist layer is formed so as to be in contact with the titanium thin film outer layer of the metal stack seed layer, and circuitry is formed from the resist layer.

Abstract: A memory process is described. A substrate is provided, having therein trenches and conductive lines buried in the trenches and having thereon an array area, wherein each of the conductive lines has an array portion in the array area. A contact area apart from the array area is defined on the substrate, wherein each of the conductive lines has a contact portion in the contact area. The substrate between the contact portions of the conductive lines is etched down to below the tops of the conductive layers to form gaps between the contact portions of the conductive lines. The gaps are then filled with an insulating layer.

Abstract: Generally, the subject matter disclosed herein relates to conductive via elements, such as through-silicon vias (TSV's), and methods for forming the same. One illustrative method of forming a conductive via element disclosed herein includes forming a via opening in a substrate, the via opening extending through an interlayer dielectric layer formed above the substrate and a device layer formed below the interlayer dielectric layer, and extending into the substrate. The method also includes forming a first portion of the conductive via element comprising a first conductive contact material in a bottom portion of the via opening, and forming a second portion of the conductive via element comprising a second conductive contact material different from the first conductive contact material in an upper portion of the via opening and above the first portion.

Abstract: A semiconductor device includes a substrate, a substrate-side electrode layer, an intermediate electrode layer, and a front-side electrode layer. The substrate includes a semiconductor layer and a projection portion, the projection portion being formed on a surface of the semiconductor layer. The substrate-side electrode layer is provided on the projection portion. The intermediate electrode layer extends from on a part of the substrate-side electrode layer, which part of the substrate-side electrode layer is located on the projection portion, to just above a region of the substrate in which region the projection portion is not provided. The front-side electrode layer is provided on a surface of the intermediate electrode layer. A Young's modulus E1 of the substrate-side electrode layer, a Young's modulus E2 of the intermediate electrode layer, and a Young's modulus E3 of the front-side electrode layer satisfy a relationship of E3>E1>E2.

Abstract: A method of forming a memory device. The method provides a semiconductor substrate having a surface region. A first dielectric layer is formed overlying the surface region of the semiconductor substrate. A bottom wiring structure is formed overlying the first dielectric layer and a second dielectric material is formed overlying the top wiring structure. A bottom metal barrier material is formed to provide a metal-to-metal contact with the bottom wiring structure. The method forms a pillar structure by patterning and etching a material stack including the bottom metal barrier material, a contact material, a switching material, a conductive material, and a top barrier material. The pillar structure maintains a metal-to-metal contact with the bottom wiring structure regardless of the alignment of the pillar structure with the bottom wiring structure during etching. A top wiring structure is formed overlying the pillar structure at an angle to the bottom wiring structure.

Abstract: A method of forming a metal semiconductor alloy that includes forming an intermixed metal semiconductor region to a first depth of a semiconductor substrate without thermal diffusion. The intermixed metal semiconductor region is annealed to form a textured metal semiconductor alloy. A second metal layer is formed on the textured metal semiconductor alloy. The second metal layer on the textured metal semiconductor alloy is then annealed to form a metal semiconductor alloy contact, in which metal elements from the second metal layer are diffused through the textured metal semiconductor alloy to provide a templated metal semiconductor alloy. The templated metal semiconductor alloy includes a grain size that is greater than 2× for the metal semiconductor alloy, which has a thickness ranging from 15 nm to 50 nm.

Abstract: A system and method are disclosed for providing a through silicon via (TSV) with a barrier pad deposited below the top surface of the TSV, the top surface having reduced topographic variations. A bottom TSV pad is deposited into a via and then polished so the top surface is below the substrate top surface. A barrier pad is then deposited in the via, and a top TSV pad deposited on the barrier pad. The top TSV barrier pad is polished to bring the top surface of the top TSV pad about level with the substrate. The barrier pad may be less than about 1 microns thick, and the top TSV pad may be less than about 6 microns thick. The barrier pad may be a dissimilar metal from the top and bottom TSV pads, and may be selected from a group comprising titanium, tantalum, cobalt, nickel and the like.

Abstract: According to one exemplary embodiment, a semiconductor device includes a chip main body; a first layer that is provided on the chip main body and contains nickel and phosphorus; and a second layer that is provided on the first layer and contains nickel and phosphorus and has a higher phosphorus concentration than that of the first layer.

Abstract: According to example embodiments, a wire structure includes a first wire that includes a first wire core and a first carbon shell surrounding the first wire core, and a second wire that extends in a longitudinal direction from the first wire. The first wire core has a wire shape. The first carbon shell contains carbon.

Abstract: A semiconductor device includes a semiconductor chip and a joined member. The semiconductor chip has a semiconductor substrate, a first electrode, and a second electrode. The first electrode is arranged on a first surface of the semiconductor substrate. The second electrode is arranged on a second surface of the semiconductor substrate. The first electrode is joined to the joined member via a joint material. A tensile force in a surface direction of the first surface that is applied to the first surface of the semiconductor substrate from the first electrode due to thermal expansion of the first electrode at a melting temperature of the joint material is at least equal to a tensile force in the surface direction that is applied to the second surface of the semiconductor substrate from the second electrode due to thermal expansion of the second electrode at the melting temperature.