Flexible Panel Patents (Class 439/67)
  • Publication number: 20070184682
    Abstract: The present invention comprises an inexpensive and simple means for electrically and mechanically connecting a plurality of printed circuits together. The present invention also comprised embodiments where the printed circuits can be moved relative to each other without breaking the electrical contact between them. Yet another embodiment contemplates a means for joining two linear printed circuits to make a longer circuit. In yet another embodiment, the printed circuits and connections are used to make an inexpensive, reliable electrical harness for contacting a patient-worn sensor to a patient monitor such as an ECG monitor.
    Type: Application
    Filed: February 8, 2007
    Publication date: August 9, 2007
    Inventor: Stephane Gobron
  • Patent number: 7252516
    Abstract: A motherboard includes a first circuit board, a second circuit board, and a connecting member. The connecting member movably connects the first circuit board and the second circuit board, and the connecting member is capable of adjusting a relative position of the first circuit board to the second circuit board.
    Type: Grant
    Filed: January 20, 2007
    Date of Patent: August 7, 2007
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Jie Zhang, Xiong-Dong Peng, Ke-Cheng Lin, Chien-Li Tsai
  • Patent number: 7249955
    Abstract: In some embodiments an apparatus includes a board, a package coupled to the board, and a flex cable coupled to the package and extending between the board and the package. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: July 31, 2007
    Assignee: Intel Corporation
    Inventors: Bryce D. Horine, Gary A. Brist
  • Patent number: 7247034
    Abstract: The present invention prevents a connection defect of a connector. In an electronic device which includes a film-like wiring board and a printed wiring board on which a connector is mounted, the film-like wiring board includes a projecting portion which projects to a side opposite to the printed wiring board at a position where the film-like wiring board is exposed from the connector into which the film-like wiring board is inserted.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: July 24, 2007
    Assignee: Hitachi Displays, Ltd.
    Inventors: Yukio Matsuzaki, Kazumi Akiba, Masaki Tsubokura
  • Patent number: 7248481
    Abstract: Circuit board and system with multi-portion sockets, and signal methods practiced thereon are described herein.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: July 24, 2007
    Assignee: Intel Corporation
    Inventor: Mark B. Trobough
  • Patent number: 7241148
    Abstract: Modules for fixing flexible printed circuit boards. A module comprises a casing and a flexible printed circuit board. The casing has a recess on a lateral side. The flexible printed circuit board has a flexible portion disposed in the recess, wherein the thickness of the flexible portion is substantially equal to the thickness of the recess.
    Type: Grant
    Filed: December 2, 2004
    Date of Patent: July 10, 2007
    Assignee: AU Optronics Corp.
    Inventors: Chih-Chung Chao, Che-Chih Chang
  • Patent number: 7238044
    Abstract: An FPC is electrically connected to a printed wiring board. The FPC includes an elongated substrate and a conductor part laminated on the face of the substrate. The conductor part includes a plurality of conductors extending along the axial direction of the substrate, and elastically deformable first contact terminals each of which extends from the face of the conductors toward the base end of the FPC. The printed wiring board includes an insertion opening formed at the edge surface thereof, and plural line connecting terminals which are formed on the internal wall surface of the insertion opening, and which extend in the inserting direction for inserting the FPC.
    Type: Grant
    Filed: March 23, 2004
    Date of Patent: July 3, 2007
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Shinji Uchida, Hideyasu Yamada, Akihito Funakoshi
  • Patent number: 7238032
    Abstract: An electrical connector assembly including a plug assembly and a socket assembly. The plug assembly includes a first flex cable and a first housing, and a biasing member. The socket assembly includes a second flex cable and a second housing. The plug assembly is adapted to be inserted into the socket assembly to electrically connect the first flex cable to the second flex cable. The biasing member is adapted to be contacted by a portion of the second housing to move the first flex cable out of an aperture of the first housing.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: July 3, 2007
    Assignee: FCI
    Inventors: Thomas B. Pabst, Hans-Otto Geltsch, Harald Pankau
  • Patent number: 7234945
    Abstract: There is provided a technique in which when a display apparatus is assembled, workability of an operation for fixing a printed circuit board disposed at an outer peripheral part of a display panel to a support member can be improved. The display apparatus includes a display panel, a flexible printed wiring board connected to the display panel, a printed circuit board connected to the flexible printed wiring board, and a support member to support the display panel and the printed circuit board. The printed circuit board is supported at a side surface of the support member by bending the flexible printed wiring board, the support member includes, at the surface for supporting the printed circuit board, a first support part to support a second end side of the printed circuit board opposite to a first end to which the flexible printed wiring board is connected and a projection-like second support part provided outside an area where the printed circuit board is supported.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: June 26, 2007
    Assignee: Hitachi Displays, Ltd.
    Inventors: Yuji Azuma, Masaki Tsubokura
  • Patent number: 7232315
    Abstract: A connection structure for a printed wiring board which enables high density integration is provided. A FCP 2 includes an exposed conductor part 2A including an insulating substrate 22 and a reinforcing plate 24 stacked with this substrate 22 via an elastic member 23. In the exposed conductor part 2A, conductors 21 each having a protrusion 20 formed on a surface is placed on the insulating substrate. The exposed conductor part 2A can be elastically deformed in the thickness direction in which the substrate 22, the reinforcing plate 24 and the like are stacked. A printed wiring board 1 is constructed by stacking an inner layer board 10 and a first outer layer board 11 and a second outer layer board 12 which sandwich this inner layer board 10. A notched groove 10A is formed on the inner layer board 10, and an insertion opening 10B is formed. Through-hole ports 11 which appear on the notched groove 10A side is placed on the first outer layer board.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: June 19, 2007
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Shinji Uchida, Junya Kajimoto, Akihito Funakoshi
  • Patent number: 7229297
    Abstract: A method and system for connecting and using a circuit board connected to a conductive element is disclosed. The circuit board includes a backstop and a plurality of conductive traces positioned on an edge. The conductive element includes a plurality of conductive layers and a plurality of insulating layers alternately placed along the length of the conductive element. The conductive element is placed between the edge of the circuit board having the conductive traces and a clasp prior to inserting the circuit board into the clasp. The conductive element is conformed between the circuit board and the clasp. Each conductive trace contacts a conductive layer as a result of the insertion. The backstop conforms an extending portion of the conductive element to be substantially perpendicular to the circuit board. The assembled device can be used to provide charge to a plurality of electrodes on a substrate simultaneously.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: June 12, 2007
    Assignee: Xerox Corporation
    Inventors: Brian Gobrogge, Gordon Andrews
  • Patent number: 7229292
    Abstract: An interconnect assembly is presented. The assembly includes an interconnect structure including a plurality of interconnect layers disposed in a spaced relationship, where each of the plurality of interconnect layers comprises a plurality of conductive traces disposed thereon. Furthermore, the assembly includes a redistribution layer disposed proximate the interconnect structure, where the redistribution layer is configured to facilitate coupling the interconnect structure to the one or more transducer elements on the transducer array.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: June 12, 2007
    Assignee: General Electric Company
    Inventors: Bruno Hans Haider, Douglas Glenn Wildes, Robert Stephen Lewandowski
  • Patent number: 7223111
    Abstract: An electrical connector that has an array of conductors each having a contact point to make contact with a mating conductive surface. Upon engaging the contact points in a sliding manner with the mating surface, the conductors are displaced, which, in turn, tensions a loading fiber within the connector. Tensioning of the loading fiber provides a contact force between the contact points and the mating surface.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: May 29, 2007
    Assignee: Tribotek, Inc.
    Inventor: Matthew Sweetland
  • Patent number: 7220133
    Abstract: An optical disc apparatus is constructed so that: a first member formed of a plate-shaped or sheet-shaped insulating material is disposed on a flexible printed-wiring board which interconnects a main circuit board and an optical pickup; a second member with a protruding portion is disposed at both sides of the wiring section of the flexible printed-wiring board, on the first member; the protrusions are coupled with a main circuit board by, for example, being inserted into the holes of a planar region on the main circuit board; and the second member presses the flexible printed-wiring board against the main circuit board from one side of the wiring board via the first member, thus fixing the wiring board.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: May 22, 2007
    Assignee: Hitachi-LG Data Storage, Inc.
    Inventors: Masahiro Matsuo, Yoichi Narui, Kohei Takita
  • Patent number: 7210942
    Abstract: The present invention relates to a connection structure for a printed wiring board to be electrically connected to a FPC. The FPC comprises a long substrate, a plurality of conductors laminated on the surface of the substrate and extending along an axial direction of the substrate. The printed wiring board comprises a planar main wiring board, an insertion opening, and a plurality of the through-hole terminals. Each of the conductors of the FPC abuts the through-hole terminal upon the insertion of the FPC into the insertion opening of the printed wiring board. According to the invention, a connector structure to be connected to FPC is provided inside the printed wiring board in order to mount circuit element in high density, and thus improve degree of freedom in designing wiring pattern.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: May 1, 2007
    Assignee: J. S. T. Mfg. Co., Ltd.
    Inventors: Shinji Uchida, Hiroshi Yamane, Wataru Sugihara
  • Patent number: 7212413
    Abstract: An electronic device with flexible printed circuit board structure. The electronic device includes a first flexible printed circuit board and a second flexible printed circuit board. The first flexible printed circuit board has a first bent portion. The second flexible printed circuit board has a second bent portion penetrating the first bent portion as the first and the second flexible printed circuit boards are bent simultaneously.
    Type: Grant
    Filed: May 12, 2004
    Date of Patent: May 1, 2007
    Assignee: AU Optronics Corp.
    Inventors: Che-Chih Chang, Chia-Jung Wu
  • Patent number: 7204698
    Abstract: An electronic device comprises a flexible printed circuit board and a circuit board. The flexible printed circuit board comprises two first connection portions and a multifunction opening, wherein the multifunction opening comprises a flow-stopping portion and a first positioning hole, the flow-stopping portion is disposed between the two first connection portions and serves to prevent solder bridging between the connection portions during reflow, and the first positioning hole is formed to be continuous with an end of the flow-stopping portion to form a single elongated opening (120). The circuit board comprises a first positioning aperture corresponding to the first positioning hole, wherein the circuit board is connected to the flexible printed circuit board. A second positioning hole (110) and a second positioning aperture (211) may be formed on the flexible printed circuit board and the circuit board and the multifunction opening 120 may be expanded to include both the positioning holes.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: April 17, 2007
    Assignee: AU Optronics Corp.
    Inventors: Che-Chih Chang, Chin-Kun Hsieh
  • Patent number: 7188408
    Abstract: A method of making an electrical connector includes the steps of: providing a connector body (2) having an insert (5) defining a recessed area (54a) at one side and a number of channels (54b) at an opposite side; assembling a ground bus (4) to the recessed area of the insert, the ground bus including a carrier strip (46) with a number of fingers (460) extending therefrom; assembling a number of signal contacts (3) to the channels of the insert, each signal contact including a board mounting portion (32); and displacing the carrier strip such that each finger extends into space (320) between the mounting portions of two adjacent signal contacts.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: March 13, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Iosif R. Korsunsky, Joanne E. Shipe, Robert W. Brown
  • Patent number: 7179091
    Abstract: An edge mount electrical connector assembly includes a flexible circuit having a first end for connecting to one major surface of the circuit board and a second end for connecting to another major surface of the circuit board, and an electrical connector connected to the flexible circuit in between the first and the second ends of the flexible circuit.
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: February 20, 2007
    Assignee: Samtec Inc.
    Inventor: John A. Mongold
  • Patent number: 7168960
    Abstract: A connecting mechanism, designed for attaching a sheet-like conducting cable with an upper and down insulating films sandwiching a conducting core consisting a plurality of wires onto a conducting pad on a computer circuit board, comprises a retaining structure having an upper cover and two sidewalls that define a receptacle space, a clipping piece capable of being inserted into the interior of the retaining structure, a reinforcing plate connected to the sheet-like conducting cable and a flexible plastic piece housed within the reinforcing plate between the clipping piece and the wire for providing a uniform clipping force over the wire, whereby the sheet-like conducting cable can be electrically connected to the conducting pad on the computer board.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: January 30, 2007
    Assignee: Lotes Co., Inc.
    Inventor: Ted Ju
  • Patent number: 7168959
    Abstract: An electrical connector for receiving a module (200) includes a shield (10, 11) defining a receiving space (104) for receiving the module, an FPC (3) received in the receiving space for electrically connecting the module and a support element connected to the FPC for maintaining an electrical connection between the FPC and the module.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: January 30, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Wei Nan Kuo, Jen-Jou Chang
  • Patent number: 7165977
    Abstract: An electrical connector (1) comprises an insulative housing (10), a conductive member (20) received in the insulative housing, and a Flexible Printed Circuit Cable (70) electrically connecting with the conductive member. The FPC has one end electrically connecting with the conductive member, and the other end comprising a plurality of golden fingers (72) opposite to the insulative housing, and wherein the FPC forms a pair of wings (73) adjacent to the golden fingers, and adapted for preventing excessive insertion of the golden fingers.
    Type: Grant
    Filed: April 10, 2006
    Date of Patent: January 23, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hong-Bing Jiang, Chia-Huang Lin, Yong-Hong Tang, Xin Song
  • Patent number: 7153144
    Abstract: A module connector has a simple module base connector capable of being used instead of a module socket, thereby allowing connection to wiring members such as an inexpensive flexible flat cable. The module base connector, formed as a thin plate, is interposed between a plurality of terminals of a small-sized module and a wiring member. This base connector includes a fitting frame and a connector housing which are formed integrally. A module fitting part of the fitting frame is provided with a terminal pattern electrically connected to the plurality of terminals of the module housing. The connector housing is provided with connection terminal pieces each having an elastic contact portion connected at one end to the wiring member of a flexible flat board, and a press contact portion connected at the other end to the terminal pattern.
    Type: Grant
    Filed: September 15, 2004
    Date of Patent: December 26, 2006
    Assignee: SMK Corporation
    Inventors: Fumio Ohsawa, Masaki Hayashi, Kiyoshi Asai
  • Patent number: 7147480
    Abstract: The present invention provides a simple structure for connecting a flexible printed circuit board to a printed circuit board in which when connecting a flexible printed circuit board to a printed circuit board, the positioning thereof can be made easily, the connection therebetween can be made smoothly and rigidly, and further the assembling time can be reduced. Patterns, on a flexible printed circuit board and a printed circuit board are aligned and connected with each other by soldering. An elongate hole is formed in the vicinity of and along the edge portion in a connecting part of the printed circuit board, and two rectangular holes communicating with the elongate hole are formed at both longitudinal ends of the elongate hole, while two notches for controlling insertion depth are provided at opposing ends of the connecting edge of the flexible printed circuit board.
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: December 12, 2006
    Assignee: Funai Electric Co., Ltd.
    Inventor: Aiichiro Ikeda
  • Patent number: 7144256
    Abstract: The invention relates to a connector arrangement, between a flexible ribbon cable (1) and a component (5) of an electrical circuit, whereby the flexible ribbon cable (1) has a stripped conductor region on one side of the end for connection, comprising a housing (2) in which the flexible ribbon cable end is clamped and in which an elastic element (3) subjects the stripped end to pressure. The component (5) comprises a socket (4) for the housing (2), in which the housing (2) may be clipped and with contact strips (6) arranged therein against which the stripped regions of the flexible ribbon cable (1) are pressed, when the housing (2) is in the terminal position thereof within the socket (4).
    Type: Grant
    Filed: October 29, 2003
    Date of Patent: December 5, 2006
    Assignee: FCI
    Inventors: Thomas Bernhard Pabst, Hans-Otto Geltsch
  • Patent number: 7144257
    Abstract: An electro-optical device is provided wherein a plurality of electronic components is integrally mounted on a circuit board and the circuit board is then connected to an FPC board. In the FPC board, a protrusion portion extending in the length direction of the FPC board is formed, and terminals of the protrusion portion and terminals of the circuit board are connected to each other in a state where an end of the circuit board overlapping the surface of a main body of the FPC board enters the back surface side of the protrusion portion and thus the protrusion portion overlaps the circuit board, so that the circuit board is disposed to intersect the protrusion portion.
    Type: Grant
    Filed: February 10, 2005
    Date of Patent: December 5, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Masanori Yumoto, Chiaki Imaeda, Yoshihisa Hirano
  • Patent number: 7137828
    Abstract: A reinforced flexible printed circuit board (20) includes a conductive portion (21) and a connection portion (22). The conductive portion includes a first metallic wire layer (23) having a plurality of conductive metallic wires, and two first Insulation layers (24). The connection portion includes a second metallic wire layer (26) having a plurality of conductive metallic wires, two second insulation layers (27), and a reinforcement board (29) having a hand-grip portion (291). The reinforcement board is attached to one of the second insulation layers to reinforce the connection portion, and the hand-grip portion is positioned at an end of the reinforcement board so that it is convenient for workers to assemble the reinforced flexible printed circuit board to other components.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: November 21, 2006
    Assignee: Innolux Display Corp.
    Inventors: Cheng Hsien Yu, Hsueh Tien Chang, Mao-Yuan Huang
  • Patent number: 7131849
    Abstract: Embodiments of a connector (which may also be also referred to as a connector unit) are described. In accordance with one embodiment, the connector may comprise a case, first and second connectors, at least one stiffener bar, and at least one flexible circuit. The first connector may be located in a first opening of the case and the second connector may be located in a second opening of the case. The stiffener bar may be disposed in the case. The first connector may receive a first end of the flexible circuit while a second end of the flexible circuit may be interposed between the stiffener bar and the second connector.
    Type: Grant
    Filed: June 16, 2005
    Date of Patent: November 7, 2006
    Assignee: Yamaichi Electronics U.S.A., Inc.
    Inventors: Takeshi Nishimura, Toshiyasu Ito, Kiyoshi Abe
  • Patent number: 7131861
    Abstract: The subject of the invention is a connection device for a flex circuit (12), comprising a support (16), means (18) for positioning flex circuit (12) relative to said support (16) and conformation means (20) for flex circuit (12), characterized in that conformation means (20) has at least one bent spring strip (24) comprising at least one bend (26) positioned between flex circuit (12) and a surface (28) so as to increase the elastic effect of said strip (24).
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: November 7, 2006
    Assignee: FCI
    Inventor: Michel Aeschbacher
  • Patent number: 7125281
    Abstract: The present disclosure is directed to methods and devices that use a contact interface for establishing an electrical connection with an electrical component. In certain exemplary embodiments, the contact interface of a device includes at least one loading fiber and at least one conductor having at least one contact point. The conductor(s) is coupled to a loading fiber so that an electrical connection can be established between the contact point(s) of the conductor(s) and the electrical component when the device is engaged with the electrical component. In certain exemplary embodiments, a conductor is woven with, or wound around, a loading fiber. In some exemplary embodiments, the conductor is comprised of a shaped contact and a conductive lead. The present disclosure is also directed to methods and devices for testing the electrical integrity or functionality of an electrical component.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: October 24, 2006
    Assignee: Tribotek, Inc.
    Inventor: Matthew Sweetland
  • Patent number: 7121859
    Abstract: A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.
    Type: Grant
    Filed: September 13, 2005
    Date of Patent: October 17, 2006
    Assignee: Palo Alto Research Center Incorporated
    Inventors: Koenraad F. Van Schuylenbergh, Armin R. Völkel, Thomas H. DiStefano, Michel A. Rosa, David K. Fork, Eugene M. Chow, Meng H. Lean
  • Patent number: 7121840
    Abstract: A resin free and solder free electrical connection in a disk drive suspension interconnect is provided including an electrical connection between conductive traces of a first metal layer and a second metal layer with a conductor pin having electrical connection with the outer surfaces of each metal layer and free of any solder and resin in making the connection.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: October 17, 2006
    Assignee: Magnecomp Corporation
    Inventor: Warren Coon
  • Patent number: 7108515
    Abstract: A wiring substrate to be used in a variety of electronic apparatuses, and an input device, such as an optically transparent touch panel, using the same wiring substrate, and a method of manufacturing the same input device are disclosed. The invention simplifies a construction of the wiring substrate, reduces the number of manufacturing steps of the substrate, and makes all the connectors of the substrate in a single-sheet structure. The electrical and mechanical connections of those connectors to other connecting means can be thus highly reliable. Plural wiring patterns 22, 23, 24 and 25, and connectors 22A, 23A, 24A and 25A are formed on a first principal surface of wiring substrate 20. Substrate 20 includes flexible bending section P—P, and when substrate 20 is bend along bending section P—P, some connectors such as 24A, 25A are placed on a second principal surface opposite to the first one, so that wiring substrate 20 is formed.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: September 19, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Koji Tanabe, Shoji Fujii, Yosuke Chikahisa
  • Patent number: 7108516
    Abstract: The flexible board of the present invention is formed so that a bent portion is formed by bending the film edge side of the connection terminal of an input outer lead formed on the surface of a film that has flexibility. A connection portion constructed of a portion corresponding to the connection terminal of the film and the bent portion is inserted in a recess portion of a connector provided for a main body circuit board. A stopper inside the recess portion pressurizes the bent portion, and the connection terminal of the input outer lead is connected to an electrode terminal via the bent portion and the portion of the film. By merely forming the bent portion at the film, the connection portion of the flexible board that conforms to the connector of a prescribed standard of ZIF or the like can be formed simply and inexpensively.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: September 19, 2006
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Katsuyuki Naitoh
  • Patent number: 7101194
    Abstract: A multiple-contact woven connector including a weave arranged to provide a plurality of tensioned fibers and a conductor woven with the plurality of tensioned fibers so as to form a plurality of peaks and valleys along a length of the conductor. The conductor has a plurality of contact points positioned along the length of the conductor, such that when the conductor engages a conductor of a mating connector element, at least some of the plurality of contact points provide an electrical connection between the conductor of the multiple-contact woven connector and the conductor of the mating connector element. The tensioned fibers of the weave provide a predetermined contact force between the at least some of the plurality of contact points of the conductor of the multiple-contact woven connector and the conductor of the mating connector element.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: September 5, 2006
    Assignee: Tribotek, Inc.
    Inventors: Matthew Sweetland, Nam P. Suh
  • Patent number: 7094067
    Abstract: The present invention provides a connection structure between a printed circuit board and a flexible circuit board that enables the number of assembly steps including steps using soldering to be reduced and enables detachment of the flexible circuit board to be prevented. Printed-side conductive patterns formed on a printed circuit board is connected with flexible-side conductive patterns formed on a flexible circuit board. The connection structure comprises: two printed-side openings provided in the printed-side conductive patterns of the printed circuit board; two flexible-side openings provided in the flexible circuit board to align with the printed-side openings when the flexible-side conductive patterns are brought into contact with the printed-side conductive patterns; a frame having two leg parts that are inserted through the both openings; and an elastic pressing member interposed between the frame and the flexible circuit board.
    Type: Grant
    Filed: October 7, 2003
    Date of Patent: August 22, 2006
    Assignee: Hosiden Corporation
    Inventor: Tsuyoshi Kitagawa
  • Patent number: 7094063
    Abstract: An interconnect formed using a stiff layer having a plurality of holes extending there through. A first flexible layer is bonded to a first side of the stiff layer. The first flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. A second flexible layer is bonded to a second side of the stiff layer. The second flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. Signal paths are formed in the holes, the signal paths connecting the plurality of conductive bumps on the first layer to the plurality of conductive bumps on the second layer.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: August 22, 2006
    Assignee: Agilent Technologies, Inc.
    Inventors: Bob J. Self, Donald M. Logelin, Robert H. Wardwell
  • Patent number: 7090506
    Abstract: A signal transmission device. The signal transmission device comprises a first and a second flexible printed circuit boards, connecting an display module and a system. The first flexible printed circuit board electrically connects the display module and the system. The second flexible printed circuit board electrically connects the display module and the first flexible printed circuit board, wherein the first and second flexible printed circuit boards are joined by hot bar soldering or anisotropic conductive film (ACF) bonding.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: August 15, 2006
    Assignee: Au Optronics Corp.
    Inventors: Kuang-Tao Sung, Jun-Hsian Lao
  • Patent number: 7090505
    Abstract: The invention concerns a method for connecting first contact studs of a structure bearing electrodes for measuring or for stimulating a physiological activity with second studs of at least a downstream circuit, each second stud being traversed by an opening perforating the downstream circuit. The method includes the following steps: a) placing the downstream circuit on the structure, so that the opening of a second stud is located opposite a first stud; and b) depositing in the opening of the second stud a conductive material providing the connection between the first second stud opposite.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: August 15, 2006
    Assignee: Microvitae Technologies
    Inventor: Thierry Herve
  • Patent number: 7086869
    Abstract: In a flat flex cable, signal lines are surrounded by logic ground planes above and below which are viaed together left and right. The ground planes coupled with the flex cable dielectric determine characteristic the impedance and attenuation of the cable and provide differential signal EMI shielding. All signal layers and logic ground planes are enclosed within the two outermost shield layers which are viaed together left and right and around the connectors to enclose both signal layers and logic ground planes to provide common mode EMI shielding.
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: August 8, 2006
    Assignee: International Business Machines Corporation
    Inventors: John Richard Dangler, Matthew Stephen Doyle, Thomas Donald Kidd, Bradley Lewis Martin, Kevin J. Przybylski, Jason Thomas Stoll
  • Patent number: 7083426
    Abstract: The invention relates to a tension-relief attachment for multiple cables, especially flat-ribbon cables, having a bearing wall (11) which is provided with parallel bearing troughs (15), and having an abutment part (3) which presses the cable wires (19) against the bearing troughs (15) of the bearing wall (11). A base plate (5) is provided out of whose top the bearing wall (11) projects upwards, the bearing troughs, which are in the form of shells, being seated on the top (9) of the base plate (5) and extending from there to the upper edge (17) of the bearing wall (11). Furthermore, an abutment wall (27) is provided which can be pressed against the bearing wall (11) and is provided with bearing troughs (29) which are in mirror-image form and are in the form of shells, each of which is allocated to a bearing trough (15) of the bearing wall (11).
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: August 1, 2006
    Inventors: Nikola Dragov, Uwe Schindler
  • Patent number: 7083427
    Abstract: A multiple-contact woven connector comprising at least one conductor woven onto a plurality of loading fibers. Each conductor has at least one contact point. The loading fibers are capable of delivering a contact force at the contact points of the conductors. The connector may further include mating conductors having a contact mating surfaces. Electrical connections can be established between the contact points of the conductors and the contact mating surfaces of the mating conductors. The contact mating surfaces may be curved. In exemplary embodiments, the contact mating surfaces are convex. The multiple-contact woven connectors of the present disclosure can be utilized as power connectors or, alternatively, as data connectors.
    Type: Grant
    Filed: February 27, 2003
    Date of Patent: August 1, 2006
    Assignee: Tribotek, Inc.
    Inventors: Matthew Sweetland, James Moran, Nam P. Suh
  • Patent number: 7077662
    Abstract: A contact connector is provided that has at least one loading fiber and a plurality of conductors. Each conductor may have at least one contact point. Each conductor may contact a single loading fiber, and each loading fiber may be capable of delivering a contact force at each contact point. In one example, the connector may be a power connector having a power circuit and a return circuit. In another example, the connector may be a data connector having at least one signal path.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: July 18, 2006
    Assignee: Tribotek, Inc.
    Inventors: Matthew Sweetland, James Moran, Andrew Wallace
  • Patent number: 7077689
    Abstract: A plug connector for printed circuits comprises a plug (10), which supports the contact section (42) of the printed circuit (40) on one side and a retaining element (261, 262), by means of which the plug (10) may be pre-fixed, restrained in a pre-determined axial catch position in the port. On passing the axial catch position, the contact section (42) reaches the contact position with the contact spot of the port, by means of a vertical movement component, where the contact section is locked in a final position by means of a locking element.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: July 18, 2006
    Assignee: Dieter Holzle Technik-Projekte GmbH
    Inventors: Dieter Hölzle, Hubert Willmann, Wilfried Weber
  • Patent number: 7070421
    Abstract: Embodiments of the invention provide a rotating disk storage device including a connection structure between an FPC and a printed board and providing allowance for dimensional tolerances. In one embodiment, the rotating disk storage device includes a disk enclosure, an FPC supporting portion, and a flexible printed circuit board assembly provided with an FPC terminal area that extends along a front surface of the FPC supporting portion and further beyond an end portion of the FPC supporting portion. When the printed board is mounted on the disk enclosure, a connector terminal contacts and gives pressure to an FPC terminal formed in the FPC terminal area. This causes the FPC terminal area to flex in the direction of an arrow.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: July 4, 2006
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Hirofumi Nozaki, Shinichi Kimura, Hiroki Kitahori, Kenji Kuroki
  • Patent number: 7070422
    Abstract: A flexible circuit board. The flexible circuit board is connected to an LCD module, comprising a first conductive portion, a second conductive portion, a third conductive portion, a conductive trace and a slot. The second conductive portion is disposed at the border of flexible circuit board and comprises a first contact pad. The third conductive portion is located between the first and second conductive portions. The conductive trace comprises a first trace segment a second trace segment. The first conductive segment connects the first conductive portion with the first contact pad, and the second trace segment connects the second conductive portion with the third conductive portion, wherein the slot is formed between the first and second trace segments.
    Type: Grant
    Filed: February 24, 2006
    Date of Patent: July 4, 2006
    Assignee: AU Optronics Corp.
    Inventors: Min-Chien Kuo, Che-Chih Chang
  • Patent number: 7067334
    Abstract: A tape carrier package with a widow that is capable of confirming an alignment extent between the tape carrier package and a print wiring board in bonding the tape carrier package mounted with an integrated circuit on the liquid crystal panel and the print wiring board. In the package, the integrated circuit is mounted onto a base film. Input pads are connected to the integrated circuit and formed on the base film. Dummy pads are formed at the left and right side thereof not to be connected to the integrated circuit. Windows are provided by opening the base film adjacent to the dummy pads to expose at least two of said dummy pads.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: June 27, 2006
    Assignee: LG. Philips LCD Co., Ltd.
    Inventor: Hyoung Soo Cho
  • Patent number: 7063542
    Abstract: A compliant electrical probe device. The device has an anisotropic conductive elastomer (ACE) material-based layer defining two opposing faces, and having a series of conductive pathways extending between the faces. The device further includes at least two flexible circuit elements, each flexible circuit element defining two opposing faces, one face of one of the flexible circuit elements in electrical and physical contact with one face of the ACE-based layer, and one face of the other flexible circuit element in electrical and physical contact with the other face of the ACE-based layer, the other face of each of the flexible circuit elements carrying one or more electrically-conductive pads that define the device contacts, the flexible circuit elements each further comprising a series of conductive pathways extending between its faces. The ACE-based layer and the flexible circuit elements make up the device.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: June 20, 2006
    Assignee: Paricon Technologies Corporation
    Inventors: Roger E. Weiss, Christopher Cornell
  • Patent number: 7063561
    Abstract: The invention relates to a clamping connector for at least two aligned flexible ribbon cables, said connector including a base body, spring elements for pressing together the surfaces to be brought into contact, and a counter body. The base body and the counter body can be fixed to each other in a pre-locking position and a final locking position. The respective skinned partial regions of at least two flexible ribbon cables are pressed against each other in order to bring the same into contact. The sides of the base body and the counter body, facing the flexible ribbon cables, are provided with complementary recesses or projections by which means the flexible ribbon cables can be guided to form a cable grip.
    Type: Grant
    Filed: October 28, 2003
    Date of Patent: June 20, 2006
    Assignee: FCI
    Inventor: Thomas Bernhard Pabst
  • Patent number: 7059868
    Abstract: A system and method for connecting flexible circuitry in a disk drive system such as that used in computer systems. The system and method allow a large number of traces to be connected in a small area by forming male and female connector portions at an end of a mating pair of traces. the male and female portions are formed using conventional flexible circuit fabrication techniques, making possible very accurate control of very small built-in type connectors. The connection can be uncoupled and re-coupled, and added security of attachment can be achieved through the use of ultra-sonic bonding and use of a mechanical clamp.
    Type: Grant
    Filed: March 3, 2003
    Date of Patent: June 13, 2006
    Assignee: Western Digital (Fremont), Inc.
    Inventor: Yan Yan