Abstract: A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.

Abstract: A package for being electrically connected to an external printed wiring board and an external electronic device comprises a substrate, a semiconductor chip, a mold compound, and a connector. The substrate is electrically connected to the external printed wiring board. The semiconductor chip is disposed on and electrically connected to the substrate. The molding compound is used for encapsulating the semiconductor chip. The connector is disposed on the substrate for electrically connecting the semiconductor chip to the external electronic device.

Abstract: An adapter. The adapter comprises inner and outer guiding ribs for smoothly guiding the adapter into and out of a socket soldered on a circuit board without bending or breaking translation pins. This substantially enhances lifetime of the adapter and prevents damage to the internal structure of the socket holes.

Abstract: Apparatus and methods of electrically connecting integrated circuits and transducers are described. In particular, a transducer includes a base mountable on a substrate (e.g., a printed circuit board), and an input/output (I/O) lead configured to contact an I/O lead of an integrated circuit mounted on the substrate. The transducer may be mounted on the substrate to contact the transducer I/O lead to the integrated circuit I/O lead. The transducer I/O lead is configured to electrically connect to the integrated circuit I/O lead independently of any electrically conductive path of the substrate. The direct electrical connection between the transducer and the integrated circuit provides a high-speed communication channel that avoids the parasitic and high-inductance limitations generally associated with conventional metallic printed circuit board traces.

Abstract: A burn-in socket assembly (1) includes a base (10) receiving an IC and a number of contacts, a slider member (20) mounted onto the base and capable of moving along the base, a pair of actuation members (30) assembled onto the base, and a cover (40) assembled onto the actuation members and capable of moving up and down. The base forms a pair of receiving elements (141) on front and end sides respectively. Each receiving element includes a body portion (142), a pair of spaced top portion (143) each having slits (144) extending therethrough and an aperture (145) extending therethrough. A sensor is received in the aperture to provide signals to a controller during being operated at high temperature. The controller can reliably control the temperature of the whole assembly in light of the signals from the sensor, thereby avoiding damage of the IC by exorbitant temperature.

Abstract: A method of manufacturing an electrical contact with a crimp ear from a flat ribbon of conductive material including applying a force to the ribbon to form an adjacent pair of approximately semicylindrical depressions on opposite sides of the centerline of the ear, shearing the ribbon at the depression bisectors to form a pair of legs on opposites of the centerline, and forming the legs into a predetermined shape about the centerline. Forming the legs includes straightening the legs and bending the legs to the appropriate predetermine relative angle. Optionally, the ear is coined. Optionally, serrations are inscribed across the ear.

Abstract: In a socket system and method for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, a zif opening on a socket asserts substantially zero force as the pin of the IC device is inserted therein. In addition, a compression mount lead on the socket presses against the contact pad of the circuit board. Once inside the zif opening, the pin is coupled to the compression mount lead via forking leads that press against the pin. Thus, substantially zero force is applied on the body of the IC device. Furthermore, top portions of the forking leads contact a top portion of the pin toward the IC device to minimize an electrical path length.

Abstract: An electrical connector assembly includes a first connector (2), a second connector (4) and a transfer member (3). The first connector has a first housing (20) and a number of first contacts (21) received in the first housing. An Integrated Circuit chip (not shown) electrically connects with the first contacts. The second connector has a second housing (40) and a number of second contacts (41) received in the second housing. The transfer member is disposed between the first connector and the second connector. The transfer member includes a first interface (30) and a second interface (31). The first interface is formed with a number of first conductive portions (300) connecting the first contacts. The second interface provides a number of second conductive portions (301) electrically connecting the second contacts.

Abstract: An electrical connector (100) includes an insulative housing (1), a number of contacts (2), a shield (3) and a camera module (4). The insulative housing has a number of passageways (12) defined therein. The contacts are correspondingly received in the passageways. Each contact includes a holding portion (24) engaging with the passageway and securing the contact with the housing, a soldering portion (26) soldering to a Printed Circuit Board, and a contacting portion (23) electrically connecting the camera modules The camera module mounts on the insulative housing, and have a number of contacting sections (430). The camera module also defines a number of hook engaging portions (44), and a projecting portion (420). The shield has a number of hooking portions (35) corresponding to the hook engaging portions and a cutout (37) engaging with the projecting portion. The shield surfacely and peripherally surrounds the camera module.

Abstract: A compact, simple connection unit for mounting an electronic component to a substrate includes connectors having one or more arm portions. The connectors are provided with internal stress, which allows the arm portions to grip the electronic component so that the electronic component can be firmly fixed to the substrate.

Abstract: A connector pad is provided having a base, a top opposite the base, and tapered sidewalls therebetween. The tapering minimizes stress concentrations when the connector pad is bonded into, or on the surface of a structure. The connector pad consists of a plurality of structural load carrying plies suitable for sandwiching a flat structurally integrated wiring array therebetween. A plurality of plated through holes formed in the connector pad enable access to the wiring array therein.

Abstract: A socket for the electrical part of the present invention has a socket body to be mounted on a circuit board and to accommodate the electrical part and a contact pin disposed in the socket body, through which the circuit board and the electrical part are electrically connected. The socket body includes an accommodating surface portion to accommodate the electrical part. A height of the accommodating surface portion is an approximately the same height as that of another socket which is disposed next to the socket. And when a plurality of the sockets for the electrical part are disposed adjacently to each other, the electrical part can be mounted over a plurality of accommodating surface portions in such a manner as bridging the accommodating surface portions.

Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (102) of the housing. The housing defines a base (100) and four sidewalls (12), the base and the sidewalls cooperatively defining a space therebetween for receiving the LGA chip. The base has a multiplicity of passageways along a length thereof, for receiving the corresponding terminals therein. Two adjacent sidewalls each define a resilient beam (13) with an incline surface and joining the sidewall at two ends. A space (15) is defined between the beam and the sidewall. When the LGA chip is placed on the base, the two resilient beams can resiliently act on the chip to ensure reliable engagement between the LGA chip and the connector.

Abstract: A socket, such as a Land Grid Array (LGA) socket, for forming electrical connections between a first surface having a first contact array and a second surface having a second contact array. The socket includes a plurality of compliant contacts, each contact inserted into one of a plurality of passages that extend through a plate. Each contact has a first contact surface for electrically engaging the first contact array, and a second contact surface for electrically engaging the second contact array. At least one of the contacts is a low current contact, and at least one of the contacts is a high current contact capable of passing more current than the low current contact.

Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.

Abstract: In a connector, to which a module body is electrically connected, a connector body has an inner side face defining a chamber which accommodates the module body. The chamber is formed with an opening from which the module body is inserted. A first, conductive terminal is provided on the inner side face such that a conductive member formed on an outer periphery of the module body is brought into contact with the first terminal in a case where the module body is plenarily accommodated in the chamber. A second, grounding terminal is provided on the inner side face and operable to be brought into contact with the conductive member of the module body.

Abstract: Disclosed is an improved IC socket comprising a socket body having a seat surface formed its compartment, on which seat surface an IC package can be put, terminals aligned in confronting relation and mounted in the socket body, each terminal has a contact portion to make contact or engage with a selected lead of the IC package, and an actuator member for displacing the contact portions of the terminals between the withdrawing position in which the contact portions of the terminals are apart from the seat surface of the socket body and the advancing position in which the contact portions of the terminals are so close to the seat surface of the socket body as to permit the contact portions to engage with the leads of the IC package. The contact portion of each terminal comprises a first contact element having an engagement surface confronting the upper surface of the lead and a second contact element having an oblique engagement surface confronting the lower edge of the end of the lead.

Abstract: A socket structure for grid array (GA) Packages, mainly comprises the flexible chassis assembly, the frame, the first hinge cover lid and the second hinge cover lid. The flexible chassis assembly comprises the silicon rubber pad, the inner base plate, the flex-board, two solder mask layers, bumps and solder balls. The flex-board, encompassing the silicon rubber pad and the inner base plate, is used for electrical contacts. Also, the first hinge cover lid is situated and pivoting on the frame by a first hinge pin and a second hinge pin; the second hinge cover lid is situated and pivoting on the frame by a third hinge pin and a fourth hinge pin. By pressing the first hinge cover lid and the second hinge cover lid downward, the hinge pads thereon contact with the substrate of the package and snap the package firm in place. In this invention, the package with pre-attached heat sink can be easily placed into the socket.

Abstract: Solder balls are offset in the horizontal direction from fixing portions while their positional accuracy is ensured, and signal paths are shortened in a ball grid array IC socket. Contacts fixed to contact hosing apertures of a housing include base portions, contact arms, and terminal portions that extend from the lower ends of the base portions toward a circuit board. The contact arms protrude so as to extend upward and then are bent unidirectionally. The terminal portions are constituted by transition portions that link solder ball pads to the base portions, while offsetting the solder ball pads in the same direction as the contact arms. The transition portions include vertical portions which are substantially perpendicular to the solder ball pads or inclined portions angled upwardly from the solder ball pads. The vertical or inclined portions prevent movement of the solder balls, thereby preventing positional misalignment and deformation thereof.

Abstract: Disclosed is an interposer assembly that can be located between an integrated circuit package and a circuit carrying element for establishing communication there between. The interposer assembly includes a frame defining a window that holds together a plurality of panels having apertures for accommodating electrical contacts. Each panel includes an interlocking edge for engaging an opposing interlocking edge of an adjacent panel and a frame edge for engaging the frame. The apertures can be arranged across the panels to extend from the frame edge to a location near the interlocking edges. In various embodiments, the interlocking edges can be formed as a tongue and groove design or as a pair of interlocking claws. In an embodiment, the frame edge can include a flange that is set within a step formed on the frame. The panel and frame may be permanently joined by heat staking.

Abstract: An assembly of the present invention has an integrated circuit device electrically and mechanically connected to the substrate. At least one electrically conductive connecting element is on one of the substrate and circuit device and at least one socket is on the other of the substrate and circuit device. The socket receives the at least one connecting element and comprises at least two resilient members. The resilient members are biased against the connecting element so that the circuit device and the substrate are held in electrical and mechanical connection by the biasing force of the resilient members against the connecting element.

Abstract: A packaged device adapter assembly for use with high density integrated circuit packages, e.g., micro lead frame packages, micro lead chip carriers, quad flat no lead packages, and micro ball grid array packages, etc., includes an alignment structure for aligning a packaged device therein.

Abstract: A hermaphroditic or non-gender specific electrical connector is provided having at least two portions which press or mate together in forming the connector. A first connection unit and a substantially identical second connection unit are joined. Elongated cantilever-type conductive contacts may be provided for connection with a counterpart second set of elongated cantilever-type conductive contacts within apertures or slots in respective insulative housings. Solder portions or solder balls may be provided for interconnection of the elongated contacts with external circuit board traces or the like. Furthermore, a retaining device for such a connector is provided. The retaining device is configured for reversibly holding an electrical connector and facilitating precise placement of the connector on a circuit board.

Abstract: A socket for electrical parts, which is mounted on a circuit board, comprises a socket body on which the electrical part is accommodated, and a plurality of contactors disposed on the socket body for establishing an electrical connection between the circuit board and the electrical part. The socket body comprises a contact unit in which the contactors are held and the contact unit is comprised of plates to be superimposed. Each plate has a plurality of through holes through each of which the contactor is inserted. A hole size of the through holes of one plate being different from that of another plate which is directly disposed on the one plate so as to form a stepped portion between the through holes of the one plate and another plate. The stepped portion is used for preventing the contactor from coming off from the contact unit.

Abstract: An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a support member over the recess configured to electrically engage a bumped contact. The support member is suspended over the recess on spiral leads formed on a surface of the substrate. The spiral leads allow the support member to move in a z-direction within the recess to accommodate variations in the height and planarity of the bumped contacts. In addition, the spiral leads twist the support member relative to the bumped contact to facilitate penetration of oxide layers thereon. The spiral leads can be formed by attaching a polymer substrate with the leads thereon to the substrate, or by forming a patterned metal layer on the substrate. In an alternate embodiment contact, the support member is suspended over the surface of the substrate on raised spring segment leads.

Abstract: A hermaphroditic or non-gender specific electrical connector is provided having at least two portions which press or mate together in forming the connector. A first connection unit and a substantially identical second connection unit are joined. Elongated cantilever-type conductive contacts may be provided for connection with a counterpart second set of elongated cantilever-type conductive contacts within apertures or slots in respective insulative housings. Solder portions or solder balls may be provided for interconnection of the elongated contacts with external circuit board traces or the like. Solder balls also may serve to hold the first end of cantilevered contacts in place within opposed insulative bases that are adapted to mate to each other. The connector may be provided in a two part co-planar array.

Abstract: An electronic assembly is provided, with a socket body having a support plane. The support plane supports a surface of a package substrate, especially a contoured package substrate, and thereby limits the extent of travel of springs held by the socket body. Spring fingers are also provided to align the package substrate in x- and y-directions relative to the socket springs. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body.

Abstract: The present invention provides a socket capable of attaching an IC chip in such a manner that a rear face of the IC chip faces a detector side. By fitting the shape of a package lead (10) into the shape of a positioning structure (6), a package (9) is positioned at and housed in a predetermined portion inside a housing part (2). The package (9) is housed in such a manner that a rear face (9b) thereof faces upwardly. The package lead (10) is pressed by one end (3a1) of a top portion (3a) of a socket lead (3), and is also sandwiched between the socket lead (3) and a upper face of a protrusion (6a) of the positioning structure (6) in the vertical direction. As a result, the socket lead (3) and package lead (10) are securely brought into contact with each other, and the package (9) and a socket base (1) are mutually fixed.

Abstract: A battery pack for two 2032 batteries includes a molded plastic base having an upper surface on which the batteries are received and columnar standoff posts projecting from a bottom surface, as well as a molded plastic housing sized to receive the batteries and an upper portion of the base and having ears through which screws are passed to be received by press-fit threaded inserts mounted on an integrated circuit packaging substrate and tightened to a predetermined torque. Like terminals of the batteries are joined by a welded plate, with conductive pins connected to each plate extending through the base and projecting from a bottom surface of the battery pack. A mounting guide ensures connection of proper pins to corresponding receptacles of an integrated circuit packaged during mounting of the battery pack on the integrated circuit packaging substrate.

Abstract: A frequent problem that arises in particular with regard to the analysis of memory components is that the memory components have to be tested under realistic conditions in a real application environment. In practice, such components are normally firmly soldered in on a module carrier. Owing to the thermal load during soldering, this solution cannot always be used and, furthermore, the contacts that are made should be detachable. Commercially available contact bases with detachable contacts cannot be used, however, since their dimensions are too large and they do not fit in the available surface area on the module carrier. The novel contact base is sufficiently small that a plurality of contact bases can be arranged closely one next to the other in a row in a very small space on a module carrier. The module carrier has plug contacts to be plugged into a commercial socket in order to make contact.

Abstract: According to one embodiment of the present invention, an integrated socket is disclosed. The socket includes a socket grid to receive one or more pins from a component, a frame coupled to the socket grid to provide structural support, and a cable receptacle integrated into the socket to receive a cable.

Abstract: An integrated circuit (IC) socket assembly (1) includes an insulative housing (11), a holding component (12) and a multiplicity of electrical terminals (13). Each of the terminals includes a head portion (135) forming a first contact portion (131) at a free end thereof for electrically contacting an IC (2), a holding portion (133) engaging the terminal in the holding component, and a second contact portion (132) for electrically contacting a burn-in board (3) by Through Hole technology. Some of the terminals further include connecting portions (134) each bending from ends of the holding portions to ends of the second contact portions. Each of the connecting portions has a desired length in a horizontal direction, to decreases the difficulty of making the holes in the burn-in board and assembling the second contact portions into the burn-in board by Through Hole technology.

Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (110) received in passageways (101) of the housing. The housing has a base (100) and sidewalls (102, 104), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. Two sidewalls each define recesses (1021), thereby forming projections (1020). When terminals are installed near the projections, a carrier strip (11) connecting the terminals is bent so that connecting sections (111) of the carrier strip are received in corresponding recesses. The connecting sections are cut off, and the carrier strip is removed. The recesses enable the carrier strip to be manipulated so that sufficient space is made available for cutting off of the connecting sections without interfering with the sidewall. The projections provide precise fitting positioning of the LGA chip in the space.

Abstract: A semiconductor device-socket is provided, in which a partition wall for dividing slits engaged with a contact portion of a contact terminal in an object under test-accommodation member has a slope for guiding leads of a semiconductor device onto the contact portion of an adjacent contact terminal.

Abstract: An integrated circuit socket with capacitors and shunts is disclosed. According to one embodiment of the invention, a socket is divided into a shunt area, a socket pin area, and a land side capacitor area. The shunt area may contain a variable number of power shunts, ground shunts, and capacitors. The capacitors are connected across, and serve to decouple, power shunts and ground shunts. The shunts are to supply an electrical current from the capacitors to an integrated circuit device. The socket pin area may be surrounded by a metal fence serving as to lessen electromagnetic interference and as a ground and/or signal reference. The fence may be divided into sub-areas each comprising a coaxial differential signal pin opening pair. In alternate designs, an elongated power bar may serve as a power or ground shunt and may be used with several capacitors.

Abstract: The present invention provides bumpless ultrasonic bonding of flexible wiring board pieces. A metal coating 26 is formed on the surface of a contact region 181 of a metal wiring 28 of each of two flexible wiring board pieces 10, 30 and ultrasonic wave is individually applied by an ultrasonic resonator 45 to the contact regions 181 in contact with each other. The metal coatings 26 are bonded to form a multilayer flexible wiring board 50. The bumpless process eliminates any plating step for forming bumps without being influenced by non-uniformity bump height. A thermoplastic resin film 33 may be formed on the surface of one flexible wiring board piece 30 to bond flexible wiring board pieces 10, 30 by the adhesion of the resin film 33.

Abstract: A socket for an electrical part includes a socket body having one surface to which an electrical part is to be mounted and another surface to which a printed circuit board is to be mounted, and a contact pin provided for the socket body for achieving electrical connection between the electrical part and the printed circuit board. The contact pin is provided with a springy portion formed with a plurality of curved portions, an electrical part side contact portion formed to a front end side of the springy portion so as to be contacted to a terminal of the electrical part to be thereby electrically connected thereto, a printed circuit board side contact portion formed to one of the curved portions of the springy portion so as to be contacted to the printed circuit board to be thereby electrically connected thereto, and an electric path formed between these contact portions.

Abstract: A test socket assembly for use in testing integrated circuits includes a spring holder plate having a plurality of holes for receiving a plurality of electrically conducting springs, and a plurality of electrically conducting springs in the plurality of holes. A test socket including a plurality of pins for receiving leads of an integrated circuit is mounted on the spring holder plate with the pins extending into the plurality of holes in the spring holder plate with each pin engaging a spring. The holder plate is positionable on a printed circuit board with the plurality of holes in the spring holder plate being in alignment with electrical contacts or pads on the printed circuit board, the plurality of springs electrically interconnecting the contacts and the plurality of pins.

Abstract: A connector pad is provided having a base, a top opposite the base, and tapered sidewalls therebetween. The tapering minimizes stress concentrations when the connector pad is bonded into, or on the surface of a structure. The connector pad consists of a plurality of structural load carrying plies suitable for sandwiching a flat structurally integrated wiring array therebetween. A plurality of plated through holes formed in the connector pad enable access to the wiring array therein.

Abstract: An IC socket of the present invention is to strengthen a cover member by coupling a lower surface or a lateral surface of a partition wall of the cover member to a rib to prevent the partition wall from breaking and improve the accuracy. The IC socket of the present invention has a socket body on which an IC package is mounted, a plurality of contacts provided in the socket body, and a cover member of a frame shape having an opening at a center thereof and movable upward and downward, wherein a rib is provided to be coupled to a lower surface or a lateral surface of the partition wall for sectioning a cam surface of the cover member operating the movable contact section.

Abstract: A socket may comprise an array of first contacts and a set of second contacts having a greater conductive cross-sectional area than the first contacts. The set of second contacts may also have a greater conductive area efficiency than the array of first contacts, with conductive area efficiency defined as a total conductive cross-sectional area divided by a total occupied area. The array of first contacts may electrically couple signal pads of a land grid array (LGA) component with a plurality of signal lines in a printed circuit board (PCB). The set of second contacts may electrically couple power delivery land pads of the LGA component with power and ground planes of the PCB.

Abstract: A socket assembly for an integrated circuit test, and its integrated circuit and tester, are provided to select a direct or indirect connection of an integrated circuit to a test board. This configuration provides increased efficiency, and reduced load capacity through direct connection so as to increase reliability of an electrical characteristic test. The socket assembly includes a guide block, a guide part and a pressurizing plate. The guide block is in a terminal region of a test board, the guide block defining an area into which an integrated circuit can be inserted opposite terminals formed on the test board in the terminal region. The guide part is provided on an inner side wall of the guide block, to guide an insertion position of the integrated circuit so that respective leads of the integrated circuit are aligned with the corresponding terminals of the test board.

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

Abstract: A stir device for a base on an integrated circuit chip is arranged in the base between a receiving space on an upper cover thereof and a receiving space on a lower seat thereof and the stir device includes a push lever and an actuation rod. The actuation rod has at least one tooth part and the receiving space of the upper cover has a meshing recess to accommodate the tooth part. Therefore, once the push lever of the stir device is turned, the upper cover can displace horizontally such that connecting pins on an integrated circuit chip, which is inserted into the upper cover can firmly contact with the contacts inserted into the lower seat.

Abstract: In order to carry out the electric property evaluation of internal wiring of an IC, the IC is attached to an IC socket, and terminals of the IC socket are connected with the external wiring via leads and coaxial connectors. The IC is directly in touch with a heating plate, for making the IC have a high temperature. The IC socket is provided with protrusions thereon, for forming a gap between the IC socket and the IC. On this account, it is possible to acquire an IC socket module in which the temperature of the IC is kept consistent when the evaluation of the internal wiring and wiring members of the IC is carried out at a high temperature.

Abstract: A connection housing includes a base body with lateral walls, which extend around the base body on the top and which enclose the component to be inserted as well as inner contacts that are arranged between the component and at least one lateral wall. Polymer protuberances for forming outer contacts are shaped onto the underside. The connection between the inner contacts of the top and the outer contacts of the underside is effected by micro-boreholes that are located underneath the component in the middle area of the base body. This results in the provision of a housing, which requires little space on a printed circuit board and which can be economically produced preferably while using laser structuring.

Abstract: The present invention provides a socket capable of attaching an IC chip in such a manner that a rear face of the IC chip faces a detector side. By fitting the shape of a package lead (10) into the shape of a positioning structure (6), a package (9) is positioned at and housed in a predetermined portion inside a housing part (2). The package (9) is housed in such a manner that a rear face (9b) thereof faces upwardly. The package lead (10) is pressed by one end (3a1) of a top portion (3a) of a socket lead (3), and is also sandwiched between the socket lead (3) and a upper face of a protrusion (6a) of the positioning structure (6) in the vertical direction. As a result, the socket lead (3) and package lead (10) are securely brought into contact with each other, and the package (9) and a socket base (1) are mutually fixed.

Abstract: A compression mount receptacles (16) is provided for mounting test and burn-in sockets (14) to surface mount pads of circuit boards (18). The receptacle (16) includes coil spring contacts (52) having active portions provided by loosely wound coils (54) which provide compliance for accommodating tolerances and changes in distances between the test and burn-in sockets (14) and the circuit boards (18). The coil spring contacts (52) further include first and second end portions (56, 58), with some of the end portions (56) being formed of close wound coils in which adjacent coils are in contact to provide lineal circuit paths. Conductive contact tangs (60) extend within respective ones of the coil spring contacts (52) and provide substantially lineal circuit paths which electrically connect between respective ones of first and second electrical contacts (22, 20), providing a shortened contact circuit across the loosely wound coils (54) of the coil spring contacts (52).

Abstract: A socket for an electrical part which is mounted to a circuit board includes a contact sheet disposed on the circuit board, and a land sheet disposed between the contact sheet and the electrical part. The contact sheet includes an elastic body in form of plate having elasticity and insulating property and a conductive portion embedded in the elastic body and the conductive portion has end portions exposed to both surfaces of the elastic body so as to be electrically connected to the land sheet. The land sheet is composed of an insulating sheet having both surfaces on which electrode portions are formed respectively to be electrically conductive to each other. One of the electrode portions is formed on one side of the surfaces of the land sheet to be contacted and electrically connected to a terminal of the electrical part, and the other one thereof is formed on the other one side of the surfaces of the land sheet to be contacted and electrically connected to the conductive portion of the contact sheet.

Abstract: A zero insertion force connector basing on surface contact having a connector base with multiple connecting terminals installed thereon in array form, a sliding cover, and a clamping lever for securing the sliding cover in position. Each connecting terminal is appropriately bent at the lower end to form a contact surface, so that when the connector is placed on a substrate, each connecting terminal is matched by a corresponding solder pad leading to the internal circuit inside the substrate. With only a small amount of applied force to join the connecting terminals onto the substrate by soldering, the connector can thus be mounted onto the substrate with reliability.