Abstract: An electrical connector (1) includes four pieces of insulative housing segments (21) having a number of electrical contacts (3) received therein. Each insulative housing segment includes two engaging edges (213) for attaching with another adjacent two insulative housing segments, the at least one engaging edge having at least one connect portion (215) formed thereon. At least one joining member (4) connects the connect portions of the at least two insulative housing segments.

Abstract: A socket adapted for electrically connecting a semiconductor package to a printed circuit board, comprises an insulating body and a plurality of position clump. The insulating body has a plurality of sidewalls, which define a plurality of assembling slots. The position clumps are movably assembled to the assembling slots of the insulating housing, each of the position clump has a position block and a spring member disposed between the position block and the insulating housing, the position block has a supporting face for supporting the IC package and is able to downwardly move toward the mating face of insulating housing.

Abstract: A shielded connector (1) comprises at least a metal housing (10) configured by first, second, third and fourth sidewalls (100, 101, 102, 103) defining a receiving space (104) therebetween, and first and second terminal insert securely attached to the first and third wall of the metal housing. Each terminal insert includes a plurality of terminals (30) molded with an insulating material, each terminal including at least a retaining section (300) which is covered by the insulating material, and defining a plane extending therethrough, and a contact section (304) with a base portion (308) extending from the retaining section, wherein the base portion is away from the plane defined by the retaining section. And each terminal further includes enlarged portion (306), which connected the retaining section and the contact section, and being out of the insulating material so as to effectively reduce the deflection during mating with an inserted element.

Abstract: A socket for a camera module includes an insulative terminal assembly housing that supports a plurality of conductive terminals. The housing serves as the bottom of a socket and it is surrounded with a conductive metal shell that defines a cavity which receives a camera module. The shell has one or more elastic arms that extend into contact with the housing. The shell is movable on the housing, and the housing has one or more projections that serve as stops for the elastic arms to limit the vertical movement of the shell with respect to the housing. This vertical movement permits the shell to move relative to the housing and thereby compensate for warping and the like which may occur on circuit boards to which the socket is mounted.

Abstract: A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.

Abstract: An electrical connector assembly (100) includes a housing (10), a number of signal terminals loaded in the housing (10) and a stiffener (11) disposed around the housing (10), a metal clip (13) and a lever (12) attached to two opposite sides of the stiffener (11), wherein a securing plate (15) is disposed between the metal clip (13) and the chip module (14), and the securing plate (15) is mounted above an upper surface of the chip module (14).

Abstract: A land grid array module is provided that includes a land grid array interface. The interface includes a substrate having a mating face. A contact pad is provided on the mating face of the substrate. The contact pad has an exposed surface with a depression that is configured to restrain transverse movement of a mating contact tip when the mating contact tip is loaded against the contact pad. The substrate layer may include a via having a diameter such that the depression is formed in the contact pad when the contact pad is plated over the via. The depression may also be stamped in the exposed surface of the contact pad. Alternatively, the depression may be surrounded by a raised conductive perimeter that is configured to retain the mating contact tip.

Abstract: An electrical connector for electrically connecting an integrated circuit package to a circuit substrate includes a first and a second unit sections, and each unit section has a number of terminals received therein. Each unit section includes a mating surface, an opposed mounting surface, a fixing edge, and an engaging edge. The engaging edge of the first unit section has a protruding tongue, and the engaging edge of the second unit section defines a recessed portion for engaging the protruding tongue. An interlocking device is formed between the protruding tongue and the recessed portion, so that the protruding tongue is capable of overlapping and combined with the recessed portion via the interlocking device to make the first and the second unit sections become a unitary structure.

Abstract: An electrical connector for electrical connecting a camera module with a circuit board includes an insulative casing and a number of signal terminals. The insulative casing includes a bottom wall and a number of side walls. A receiving space is defined between the bottom wall and side walls for receiving the camera module. The bottom wall defines a receiving opening thereon. The signal terminals are fixed on the side walls and extending beyond the bottom wall configured for electrically connecting with the camera module and the circuit board. The present invention also relates to a camera device having the same.

Abstract: A Land Grid Array connector (1) comprises an socket (2) having opposite upper and lower surfaces, a plurality of contacts (4) received in the socket and a retention frame (3) assembled with the socket. Each contact comprises upper and lower contacting sections (41, 42) extending beyond the upper and lower surfaces of the socket adapted for electrically connecting with a Central Processing Unit and Printed Circuit Board. The retention frame comprises a base portion (31) defining an opening to interferentially receive the outer periphery of the socket and four sidewalls (32) extending upwardly beyond the base portion. The socket fills up the opening after assembled to the retention frame and forms a receiving space together with the base portion and the four sidewalls of the retention frame which is originally communicating with the opening before the socket is assembled to the retention frame adapted for accommodating the Central Processing Unit.

Abstract: An apparatus may include an integrated circuit package comprising a plurality of conductive pads and having a face, and a socket coupled to the integrated circuit package and to the conductive pads, the socket having a footprint. In some aspects, the footprint is smaller than the face.

Abstract: A socket assembly for connecting an array of bulbous terminals such as balls wherein the female element is a miniature tube that has resilient prongs that grip the corresponding terminals with varying force during insertion and deletion. The tube is of resilient conductive material that has been sliced or helically partitioned into opposing prongs forming slots of a width that increases with axial distance from the end of the tube so as to allow the prongs of the connector to grip around the ball-like bulbous terminal and mechanically retain the terminal within the connector. The tubular element of the connector may be made by forming prongs in one or both ends of a tube by cuts of a width that increases with distance from the end of the tube.

Abstract: An electrical connector (100) for electrically connecting a Central Processing Unit (CPU) with a Printed Circuit Board (PCB), includes a base (2), a plurality of insulative layers (34), a plurality of contacts (4) and a plurality of cams (33). The base defines a cavity (21) and the insulative layers are stacked and received in the cavity. The insulative layers define a plurality of passageways therein. The contacts are received in the passageways of the insulative layers. The cams are rotatable around to push different insulative layers to have different degrees of movement in a predetermined direction.

Abstract: A processor assembly includes a computer processor, a voltage converter, and a converter-power connector. A carrier structure holds these components in rigid relationship with each other.

Abstract: An electrical connector adapted for connection an Integrated Circuit (IC) chip to a printed circuit board (PCB) includes an insulating housing having a plurality of passageways, a plurality of contacts received in the passageways and a frame moveable assembled on the housing to allow the IC chip to be inserted therein. The frame includes a first and second side walls parallel to each other and a third side wall connecting with ends of the first and second side walls without a sidewall opposite the third wall, thereby a hatch is defined opposite to the third wall.

Abstract: An electric connector provided with a plurality of connecting elements which electrically connect a first electrode group and a second electrode group opposite between two devices, wherein (a) first contact points in contact with electrodes of the first electrode group of the connecting elements correspond to intersection points on an a×b where a and b correspond to pitch size, and (b) second contact points in contact with electrodes of the second electrode group of the connecting elements form at least two groups.

Abstract: An IC socket includes a socket body defining a first receiving cavity with a bottom wall, a cover attached pivotally on one end of the socket body and a locking member for locking the cover to the socket body. The IC socket further includes four detachable aligning elements mounted on four corners of the bottom wall. The four aligning elements have a plurality of positioning surfaces adapted for corporately defining a second receiving cavity for snugly accommodating an IC package therein. Different aligning elements with different dimensions can be replaced to mount on the socket body for different IC packages, thus a cost of manufacturing is reduced.

Abstract: A socket adapted for electrically connecting a module, comprises a board-like housing, and a plurality of latching units provided on the housing for retaining the module. Each latching unit has at least one latching arm and a silicon plug abutting against the latching arm. The silicon plug can support the latching arm and provide an additional strength for the latching arm.

Abstract: An electrical connector includes an insulating housing having a longitudinal and a lateral wall defining a top face and at least one contact. The lateral wall defines a slot thereon. The contact includes a main body located one the top face of the lateral wall and a contacting arm located above the longitudinal wall, a connecting portion extending from an inner edge of the main body and a retaining portion extending from an outer edge of the main body. The retaining portion is retained and received in the slot. A pressed portion laterally extends from the main body.

Abstract: A socket, for electrically connecting an IC package and a printed circuit board, comprises a base received with a plurality of contacts, a stiffener surrounding the base and bolts mounting the socket to the printed circuit board. The stiffener has a horizontal plate, which has engaging holes by drawing, so the engaging hole has a sidewall extending beyond the horizontal plate to keep the bolt in the engaging hole of the stiffener.

Abstract: A burn-in socket for electrical connecting with package having solder balls, includes a base and a number of contacts received in the base. Each contact has a spring section movable in the base, a contact section extending upwardly from the spring section and a retention section extending downwardly from the spring section. The contact section includes three tips at a top end thereof for contacting with the solder balls of the package thereby supporting the solder balls.

Abstract: Modification of the connections between a die package and a system board is described. In one example a pattern redistribution module is used in a socket. The module has a first array of contacts on one side of the module. The contacts have a first configuration to connect to the socket. A second array of contacts is on another side of the module opposite the first array of contacts and has a second configuration to connect to a package containing a die. A board is between the first and the second array of contacts to interconnect contacts of the first array of contacts to contacts of the second array of contacts.

Abstract: The present invention provides an electrical connector system for establishing electrical connection between an IC package (e.g. CPU) and a PCB. The electrical connector system comprises a base having opposing perimeter walls extending upwardly from peripheral edges of said base, a plurality of contacts and a protective plate. The perimeter walls provide a substantially continuous contact-receiving surface between said perimeter walls and the perimeter walls define a cavity therebetween above the contact-receiving surface. The plurality of contacts is arranged on the contact receiving-surface, and each including a contact engaging portion extending above the contact-receiving surface. The protective plate is floatably arranged on the perimeter walls of the base and substantially above the contact engaging portions and has a plurality of holes correlated to the contact engaging portions such that the contact engaging portion can extend through the hole when the plate is pushed toward the base.

Abstract: A socket for an electrical part comprises a socket body to be mounted on a wiring board and a contact unit mounted on the socket body and provided with a plurality of electro-conducting members. The contact unit including a unit body vertically movable with respect to the socket body, the unit body being provided with the electro-conducting member which comprises an upper contact portion to be contacted with a terminal of the electrical part accommodated on the unit body and a lower contact portion to be contacted with an electrode portion of the wiring board. A contact pressure between the upper contact portion and the terminal of the electrical part is designed to be equal to a contact pressure between the lower contact portion and the electrode of the wiring board.

Abstract: The configuration comprises a base board to be mounted a circuit board, with an IC receiving concave place and a resilient member receiving area, having an upper wall and a lower wall surrounding the resilient member receiving area, the upper wall provided with a first slot for contact and the lower wall provided with a second slot, a contact comprising a first contact portion on which a lead of the IC is loaded, a second contact portion coming into contact with a circuit lead of the circuit board, a contact main body communicating the first contact portion with the second contact portion, and a compressing portion protruding from the rear of the contact main body, the resilient member receiving area receiving the resilient member of integral structure, set in the resilient member receiving area, in which a plurality of contacts are implanted, wherein the compressing portion compresses the resilient member in order that a contact pressure can be obtained for the contact to the IC lead and the circuit lead by

Abstract: A socket connector, adapted for electrically connecting an IC package and a printed circuit board, comprises a frame, an insulative housing, a cover plate, a heat pipe retainer, two heat pipes, a backplane, and a plurality of fastening members. The insulative housing is located in and surround by the metal substrate frame. The heat pipe retainer with the heat pipes are seated on the IC package received in the insulative housing. The cover plate is on the heat pipe retainer. The fastening member fastens the frame, the cover plate and the backplane together and to the printed circuit board. The heat pipe retainer is formed with a post in a center thereof, and the cover plate is formed with a hole receiving the post, so that the heat pipe retainer is flexibly orientated and can rotates around the hole.

Abstract: The electrical connecting apparatus disclosed herein includes a frame member having a recess for receiving a device under test provided with a plurality of electrodes, a plurality of contacts provided in correspondence to the electrodes, a plurality of slots formed in the bottom portion of the recess of the frame member and arranged parallel to each other so as to receive the contacts such that the tip of each contact can abut the corresponding electrode, an elastic member disposed across the slots over the bottom portion within the recess to elastically hold the contacts, and a cap member mounted on the frame member and sandwiching the elastic body together with the frame member.

Abstract: A contact includes a support member, a first spring portion, a second spring portion, a third spring portion and a fourth spring portion. The first spring portion extends obliquely upper forwardly from an upper end of the support member and has, at an apex, a first contact point which contacts with an IC package. The second spring portion is bent from the first contact point, to extend obliquely lower rearwardly and have a first touch portion. The third spring portion extends obliquely lower forwardly from a lower end of the support member and has a second contact point which contacts with a printed-wiring board, thus being in contrast with the first spring portion with respect to the support member. The fourth spring portion is bent from the second contact point, to extend obliquely upper rearwardly and has a second touch portion for contacting with the first touch portion.

Abstract: The present invention provides an electrical connector for establishing electrical connection between an IC module and a PCB. The electrical connector comprises an insulative housing and a set of electrical contacts received in the housing. The insulative housing has a mating surface and a mounting surface opposite thereto. The mating surface defines a supporting block extending upwardly thereof for supporting an IC module when said IC module is mated with the electrical connector. A reinforced element is defined in the supporting block, so as to reinforce said supporting block.

Abstract: An electrical connector for electrically connecting an integrated circuit package to a circuit substrate includes a first and a second unit sections, and each unit section has a number of terminals received therein. Each unit section includes a mating surface, an opposed mounting surface, a fixing edge, and an engaging edge. The engaging edge of the first unit section has a protruding tongue, and the engaging edge of the second unit section defines a recessed portion for engaging the protruding tongue. An interlocking device is formed between the protruding tongue and the recessed portion, so that the protruding tongue is capable of overlapping and combined with the recessed portion via the interlocking device to make the first and the second unit sections become a unitary structure.

Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing has a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four raised portions (102) extending upwardly around the base. A multiplicity of protrusions (106) is respectively extended upwardly from the walls. When a force is exerted down the LGA chip to make the LGA chip engage with the terminals, the protrusions and the four raised portions can support the force for separate the force without making the LGA chip deforming downwardly. This ensures that engagement between the connector and the LGA chip is accurate and reliable.

Abstract: Provided is an electrical connector having first and second surfaces and configured to establish electrical communication between two or more electrical devices. The electrical connector includes an insulative housing and a resilient, conductive contact retained in an aperture disposed from the first surface to the second surface. To contact the electrical devices, the contact includes a center portion from which extends two diverging, cantilevered spring arms that project beyond either surface of the electrical connector. To shorten the path that current must travel through the contact, one spring arm terminates in a bellows leg that extends proximate to the second spring arm. When placed between the electrical devices, the spring arms are deflected together causing the bellows leg to press against the second spring arm. For retaining the contact within the aperture, the contact also includes retention members extending from the center portion that engage the insulative housing.

Abstract: A socket connector is provided for securely mounting an IC package (20) on a printed circuit board, said socket connector comprises an insulative housing (30) configured by a base (301) and four perimeter walls (302) to define a inner cavity adapted for receiving said IC package (20). Said four perimeter walls (302) include a first sidewall (3021) with a push finger (3025), a second sidewall (3022), a third sidewall (3023) and a fourth sidewall (3024). Said second sidewall (3022) and said fourth sidewall (3024) further include a plurality of retaining tab (3027) adapted for biasing guiding notches (2011) of said IC package (20) relative to said retaining tab (3027) by a elastic force generated from a push finger (3025) after said IC package (20) is fully mounted in said insulative housing (30) of said socket connector.

Abstract: A heat transfer apparatus comprises a load frame having load springs and an open region that exposes an electronic component. The load frame is mounted to a printed circuit board on which the electronic component is mounted. A heat sink assembly is disposed on the load frame and has a main body in thermal contact with the electronic component through a thermally conductive material. The heat sink assembly has load arms for engaging the load springs. A load plate extends between the load arms and has an actuation element operative to displace the main body relative to the load plate and thereby resiliently deform the load springs and produce a load force that compresses the thermally conductive material to achieve a desired thermal interface gap between the main body and the electronic component. Non-influencing fasteners secure the heat sink to the load frame and maintain the desired thermal interface gap.

Abstract: A socket for mounting on a substrate includes a terminal exposure part that exposes the plurality of substrate connection terminals of the contacts at lower opposing edges of the socket, and a central part that includes a bottom surface bulging part that protrudes downwardly to define a bottom surface of the socket housing. An insulative contact support board that houses the contacts is housed inside a thickness of the bulging part. A bottom surface of a substrate connection terminal of the contacts supported by the contact support board is exposed at the terminal exposure part. A bottom surface bulging part is inserted into a housing bottom mating hole formed in the connection substrate, and the substrate connection terminal is connected to a pattern terminal provided on the upper surface of an edge of the housing bottom mating hole.

Abstract: A thermally enhanced coreless thin substrate with embedded chips, which mainly includes a patterned carrier metal layer, at least one chip, at least one dielectric layer and at least one wiring layer, is disclosed. The chip is attached to a heat sink portion of the patterned carrier metal layer. The dielectric layer is formed over the patterned carrier metal layer and covers the chip. The wiring layer is formed on the dielectric layer for electrically connecting the patterned carrier metal layer and the chip. In the process of manufacturing the thermally enhanced coreless thin substrate with embedded chips, the heat sink portion is formed by patterning the patterned carrier metal layer after finishing the formation of the wiring layer. Thus, a thin board type electronic device that combines a heat sink, a carrier substrate and embedded chips together to form an integral unit is fabricated.

Abstract: An electrical connector for interconnecting integrated circuits (ICs) to a circuit board, includes a number of contacts (9) and an insulative housing (8) having a mating face (81) toward an IC, a mounting face (83) for attaching to a printed circuit board (7), and rows and columns of passageways extending from the mating face to the mounting face. The housing comprises outer standoffs (832) and at least one central standoff (834) on the mounting face. The height of the outer standoff is larger than that of the central standoff.

Abstract: A socket can be used for testing an integrated circuit package having a plurality of rows of leads. The socket includes a base that is aligned with a circuit board having a plurality of contact pads. A plurality of rows of contact fingers are electrically coupled to the plurality of contact pads, each of the plurality of rows of contact fingers for engaging a corresponding one of the plurality of rows of leads in response to a retention force applied to the integrated circuit package. Each of the contact finger has a cantilevered end that is supported by a supporting force generated by an elastic contact in response to the retention force.

Abstract: An adjustable test socket for aligning an electronic device with spring probes in a test fixture is provided having two adjustable walls or four adjustable walls.

Abstract: A socket, for electrically connecting an IC package with gaps on two sides thereof and a printed circuit board, comprises an insulative housing, a plurality of contacts received in the insulative housing and a pair of engaging clumps. The insulative housing has a bottom wall and a plurality of sidewalls upwardly extending from the bottom wall, the sidewalls and the bottom wall together define a space for the IC package, two opposed sidewall further have engaging slots. The engaging clump is received in the engaging slot, and has a post entering into the space to engaging with the gap of the IC package and a transverse arm abutting against and position the IC package.

Abstract: An electrical connector for electrically connecting a chip module to a printed circuit board includes an insulative housing with a number of contacts, a metal stiffener surrounding the insulative housing, a metal clip pivotally assembled to one end of the metal stiffener; and a lever pivotally assembled to the other end of the metal stiffener. The metal clip has a main portion, an engaging tab extending angularly from the main portion, and a pair of hooks mounting to the metal stiffener. The metal stiffener includes a block portion engaging with the main portion to avoid the tab disengaging from the lever.

Abstract: An adjustable test socket for aligning an electronic device with spring probes in a test fixture is provided having two adjustable walls or four adjustable walls.

Abstract: An electrical connector (100) for connecting an electronic package with a circuit substrate comprises an insulative housing (1), a number of contacts (4) and at least one alignment pin (2), the insulative housing (1) includes a plurality of passageways (116) for receiving the contacts (4) and at least one alignment holes (111), the insulative housing (1) also defines a number of spring ribs (112) extending into the alignment hole (111).

Abstract: Provided are a method, device and system in which, in one embodiment, a socket for an integrated circuit package includes a standoff adapted to engage and support the package in a first position in which the package contact terminals are disengaged from socket contact terminals. The standoff is adapted to move to a second position in which the package contact terminals are engaged with the socket contact terminals. In another embodiment, male and female alignment members guide package contact terminals into engagement with socket contact terminals.

Abstract: An IC socket (1) mounted on a system board (4) for connecting an IC package comprises a socket body (2) defining an upper interface (21) for receiving the IC package and a bottom mounting surface (22) opposite to the interface (21), and a plurality of contacts (3) received in the socket body (2). The socket body (2) has at least one undercut (26) at the bottom thereof for accommodating other elements (5) on the system board (4).

Abstract: An electrical connector assembly includes an insulative housing (1), and a reinforcing frame (4) removably disposed on the insulative housing. The insulative housing includes a base (10) having a top side, and side walls (11) upwardly extending from the top side of the base, with a datum protrusion (111) formed on each of the side walls. The reinforcing frame includes a plurality of reinforcing pieces (41) located laterally on outer faces of the datum protrusions. The providence of the reinforcing pieces adjacent the datum protrusions can prevent the damage of the datum protrusions or portions of the side walls around the datum protrusions during the not-properly loading or removable process of an IC package onto the insulative housing.

Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing has a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four raised portions (102) extending upwardly around the base. A multiplicity of protrusions (106) is respectively extended upwardly from the walls. When a force is exerted down the LGA chip to make the LGA chip engage with the terminals, the protrusions and the four raised portions can support the force for separate the force without making the LGA chip deforming downwardly. This ensures that engagement between the connector and the LGA chip is accurate and reliable.

Abstract: An IC socket includes a socket body with a plurality of contacts disposed therein, a cover rotatablely coupled to the socket body and at least one slider in the socket body. The socket body defines a receiving space for receiving an IC package, and the cover has a driving member. The slider has one end engageable with the driving member and the other end extending toward the receiving space. When the IC socket is in a close position, the slider touches the IC package or close to the IC package to keep a reliable connection between the IC socket and the IC package.

Abstract: Disclosed are a camera module and a camera module assembly. The camera module can include a Printed Circuit Board (PCB) provided on an outer side thereof with contact terminals connected to a corresponding socket module, an image sensor mounted on the PCB, and a housing disposed on the PCB. The camera module assembly includes a camera module provided on a lower surface thereof with contact terminals, and a socket module in which the camera module is coupled.

Abstract: An electrical connector assembly (5) includes an insulative housing, a number of electrical contacts (7) retained in the insulative housing, a chip module disposed above the insulative housing and comprising a number of connecting elements (80) to electrically connect the electrical contacts, and a printed circuit board (6) disposed below the insulative housing and comprising a number of conductive elements (60) to electrically connect the electrical contacts. The central axis of each connecting element of the chip module is aligned with the central axis of the conductive element of the printed circuit board in up-to-down direction.