Abstract: A socket is for use in an electronic system to hold a circuit board module that has spaced electrical pads proximate to two opposite edges thereof. The socket includes a base and electrical conductors. The base has rectangularly arranged peripheral portions and is for receiving the circuit board module. The electrical conductors align with the electrical pads on the circuit board module. At least portions of the electrical conductors are disposed on respectively opposite ones of the peripheral portions to contact at least portions of corresponding ones of the aligned electrical pads on the circuit board module when the circuit board module is held in the socket.

Abstract: An electric connector, by which a chip module can be attached to a circuit board, comprises an insulating body further provided with a pair of metallic reinforcing plates on two opposite sides thereof, a plurality of conducting terminals and a retaining structure detachable from the insulting body that can retain the chip module within the insulating body. The retaining structure is a pair of driving rods pivotally connected to two sides of the insulating body that are not attached with the reinforcing plates. The electric connector assures more stable electric connection between the chip module and the circuit board and is difficult to deform due to its metallic reinforcing plates.

Abstract: An electrical connector (1) comprises an insulative housing (4), a stiffener (6) defined around the housing (4), a clip (7) pivotably engaged on one end of the stiffener (6), and a lever (8) engaged on an opposite end of the stiffener (6) for fastening the clip (7) onto the housing (4). The housing (4) comprises an upper surface (44) and a lower surface (45) opposite to the upper surface (44) and a platform surface (47) projected between the upper surface (44) and the lower surface (45) and a planar sidewall (40) surrounded thereof. The sidewall (1) comprises an upper section (42) and a lower section (48) that is the circumference of the upper sidewall (42) is longer than that of the lower sidewall (48).

Abstract: In an electrical socket including a base for receiving a connection object in a predetermined direction, a plurality of contacts are held by the base and adapted to be contacted with the connection object. A pusher is rotatably held by the base and has an acting portion and an operating portion which is adapted to be operated. The pusher is continuously urged by a spring so that the connection object is brought into press contact with the contact via the acting portion. A cover is coupled to the base to be movable in the predetermined direction. One of the cover and the operating portion has a contact surface faced to the other in the predetermined direction. The other of the cover and the operating portion has a roller adapted to roll on the contact surface following the movement of the cover.

Abstract: In a state wherein front ends of latch members 18A and 18B are apart from each other so that the upper surface of an alignment plate/positioning member 24 is outside, a pressing section 12PU of a heat sink member 12 is brought into contact with the periphery of a semiconductor device 22.

Abstract: A pusher of an IC chip handler has a pusher frame which is attached to a pusher main body to be driven by the IC chip handler and a plurality of pusher heads attached to the pusher frame. Each of the pusher heads comprises a holder which is held by the pusher frame. At least one spring post is freely protruded outward from the inside of the holder, and a compression spring has one end arranged under pressure to a spring receiving portion of the spring post. A spring push plate arranges the compression spring to the spring receiving portion of the spring post under pressure, and an adjusting member adjusts a compression force of the compression spring. A device holding unit is attached to an end of the spring post protruded outside of the holder.

Abstract: An electrical connector (100) is adapted for receiving a module body (4). The connector comprises a dielectric housing (1), a plurality of contacts (2) and a shielding shell (3). The housing has sidewalls (11, 12) forming a cavity (10) to receive the module body therein. The contacts are disposed on the sidewalls of the housing. The shielding shell has sidewalls (31,32) surrounding the housing and a pair of pressing members (33) and at least two clipping members (34) extending from two opposite sidewalls (32) of the shell. Each pressing member comprises a pressing portion (331) for pressing against a surface (421) of the module body and an operating portion (332) extending upwards from the pressing portion. The at least two clipping members resiliently retain on the sidewalls of the dielectric housing.

Abstract: A bolster plate apparatus, used to secure a semiconductor device intermediate a printed circuit board and a heat sink apparatus, includes either an indentation or an open aperture into which a radio frequency absorptive material may be disposed. The absorptive material may be a ferrite material specifically selected to absorb frequencies in the range of the second to fourth harmonic of the processor clock signal frequency. The type of the ferrite material implanted in the bolster plate is selected to maximize the absorption of radio frequency energy, particularly that emitted at the pad vias on the underside of the printed circuit board, without affecting the signal integrity of the other pad connections. The shape of the cutout or aperture is also defined by the arrangement of RF emitting pads on the underside of the printed circuit board.

Abstract: The electrical connector includes a connector body and an accessing device. The connector body includes an insulation body that receives a plurality of pins and has a multilateral through hole in the middle. The PCB has a positioning frame line that corresponds to the through hole. The accessing device has one or a plurality of holes near the middle of the accessing device and the one or the plurality of holes cover at least one part of the positioning frame's two sides that are not located opposite. The precision of the positioning is enhanced substantially and the welding effect is ensured between the electrical connector and the PCB.

Abstract: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.

Abstract: A socket apparatus includes a lid pivotally coupled to a socket. When the lid is in an open position, contacts in the socket are actuated to an open position for receiving an integrated circuit. When the lid is closed, levers coupled to the lid cease actuating the contacts, causing them to close and therefore contact pins of the integrated circuit for testing.

Abstract: An elasto-plastic socket for Land or Ball Grid Array package comprising a plurality of metal contacts embedded in a substrate by lamination. The curved plate spring of the metal contacts enable large deformation to accommodate all tolerances other than package tolerance and ensure uniform contact pressure across the package because they are designed based on the application of elasto-plasticity theory. An elasto-plastic stiffener shares the pressure from heat sink to package substrate and semiconductor. A cutting edge subsystem assembly for Land or Ball Grid Array package integrates L/BGA socket, L/BGA package and heat sink with a frame on top of PCB to increase the stiffness. The methods of post manufacturing including post forming and post age hardening used for testing socket application can increase the durability.

Abstract: A holding fixture that holds a component and mounts the component on an electronic circuit board includes a holding member that holds the component at a side of a first surface of the electronic circuit board, a first fixing member that includes a first base that is engageable with the holding member, and an elastic member that is pivotally attached to the base, sandwiches the electronic circuit board at a side of a second surface of the electronic circuit board, and elastically supports the holding member at the side of the first surface, the second surface opposing to the first surface, and a second fixing member that includes a second base that is engageable with the holding member, and a projection member that projects from the second surface of the electronic circuit board and is engageable with the elastic member.

Abstract: An LGA connector (1) includes an insulative housing (2), a stiffener (3) defined around the housing, a clip (4) pivotably engaged on one end of the stiffener, and a lever (5) engaged on an opposite end of the stiffener for fastening the clip onto the housing. The stiffener includes a bottom plate (31) and a plurality of side walls (32) extending from the bottom plate, and the housing includes a plurality of side surfaces aligned with said side walls, each of the side plates (42) defining a pair of slant sides in the free end. The clip includes a pressing plate (41) and a pair of side plates (42) extending from the pressing plate (41). A slot (34) is formed in corresponding position of the bottom plate (31) of the stiffener for accepting the side plate (42) of the clip (4) partly with the slant sides abutting against the inner side of the slot (34) when the clip (4) is rotated to a horizontal closed position.

Abstract: An IC socket includes a socket body (10), a plurality of contacts received in the socket body, a first press cover (12) pivotally mounted at one end of the socket body, and a second press cover (14) pivotally mounted at an opposite free end of the first press cover. The second press cover includes a pair of legs (148) extending from two sides of the end mounted onto the first press cover. A lever (20) is defined at corresponding end of the socket body, and two ends of the lever extend out of two sides of the socket body. Said extending out ends are corresponding to the legs, and each end defines a rigid sleeve (60) therearound. When the first press cover and the second press cover are rotated to a horizontal close position, the legs will engage with the sleeve rather than engage with the lever directly.

Abstract: In some embodiments, a retractable ledge socket is presented. In this regard, a socket ledge is introduced to receive a processor, and to reposition to allow the processor to contact socket connections. Other embodiments are also disclosed and claimed.

Abstract: An LGA connector (1) includes an insulative housing (2), a stiffener (3) defined around the housing, a clip (4) pivotably engaged on one end of the stiffener, and a lever (5) engaged on an opposite end of the stiffener for fastening the clip onto the housing. The stiffener includes a bottom plate (31) and a plurality of side walls (32) extending from the bottom plate, and the housing defines two raised lower surfaces (210) in two opposite ends thereof. Said ends is corresponding to the ends of the stiffener that engages lever and clip respectively, and each lower surface and the bottom plate defining a gap therebetween. Thus, even if two ends of the stiffener bend, the gaps will avoid the housing from distorting alone with the stiffener.

Abstract: A structure is disclosed for preventing stacking connectors on a first and a second boards from coming apart that are fitted to each other. The first and second boards connected by said stacking connectors being fitted to each other are clamped by a clamping member. The clamping member is connected to surfaces on the first and second boards that connect to ground.

Abstract: An assembly includes a circuit board with a ball grid array device attached to a first side of the circuit board. A brace surrounding the ball grid array device has a series of mounting holes and a series of members extending between the mounting holes. The brace is removably secured to the first side of the circuit board at the mounting holes.

Abstract: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.

Abstract: A module connector, to which a module (5) is electrically connected, comprises a base (10) loaded with a number of terminals (2) and defining a receiving room for receiving the module; and an outer shell (4) comprising sidewalls (43) and a top wall (41), and assembled to the base after the module accommodated in the receiving room of the base, the top wall defining a through hole (42) for one end of the module to protrude out therefrom, and the sidewalls provided with resilient arms (44) for elastically pressing the module towards the terminals.

Abstract: An LGA connector assembly (1) includes an insulative housing (10), a plurality of terminals (12) received in the housing, and a metal clip (40) mounted on the housing. The clip is disposed on the housing to press an LGA chip upon the terminals and has two opposite slant sides (42). A first pressing portion (421) is bent to the housing in a middle portion thereof, and a second pressing portion (422) with a cantilever configuration extending from one end of the first pressing portion. A clasping portion (423) is defined at a distal end of the second pressing portion. When an LGA chip is disposed on the housing, the first pressing portion and the clasping portion can press the LGA chip onto the terminals to prevent the LGA chip moving upwardly relative to the housing, thereby ensuring the reliably electrical connection between the LGA chip and the connector assembly.

Abstract: The electrical connector (1) includes a base having a number of terminals (12) thereon and a load plate (40) pivotally attached to a side of the base and locked in an opposite side of the base. The load plate (40) is stamped from a sheet of metal to form at least one pressing protrusion (43) to engagingly press an IC (60) in order to hold the IC (60) on the base. At least one pressing protrusion (43) has an outer edge (431) adjacent the IC (60) when the IC (60) is held on the base. The outer edge (431) is coined, thereby weeding out burrs formed on said outer edge (431) after the load plate (40) is stamped. As a result, the shape of the coined outer edge (431) of the pressing protrusion (43) can avoid scraping an IHS conglutinated on the IC (60) when the load plate (40) presses the IC (60), thereby to safely interconnect the IC (60) with the PCB.

Abstract: An electrical connector assembly includes a connector mounted in an insulating housing and connected electrically to an electronic device received in the insulating housing. An anchoring device includes a mounting frame fixed to a circuit board and formed with an opening for receiving the insulating housing, and U-shaped first and second pressing rods mounted pivotally and respectively on opposite first and second sides of the mounting frame. Each of the first and second pressing rods has an intermediate rod portion having a bent central section to abut against the electronic device. Lateral rod portions of the second pressing rod press respectively against two extensions of the first pressing rod, and are anchored releasably to the first side of the mounting frame.

Abstract: Disclosed is a BGA connector assembly including an insulative housing (11) with a plurality of terminals (15) in electrical connection with corresponding solder balls (3) that extend from a surface of the housing. The solder balls form a soldering region (30) for attachment to a printed circuit board. The whole electrical connector assembly has a center of gravity biased from a center of the soldering region, and at least one recess (111) is formed in the housing. The at least one recess prevents the connector assembly from becoming inclined with respect to the printed circuit board when the solder balls are attached to the printed circuit board.

Abstract: A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.

Abstract: An LGA socket includes a socket body (20) receiving a number of contacts (70), a stiffener (30) attached to the socket body, and a socket plate (40) and a load lever (50) respectively mounted to opposite ends of the stiffener. The socket plate has a connecting side (401) to connect the stiffener, a pressing side (402) to engage the load lever, and a pair of opposite lateral sides (403) respectively and integrally connected to the connecting side and the pressing side. The opposite lateral sides have a pair of clasping sections (4031) and a pair of accessorial pressing members (4032) adjacent the pressing side. The clasping sections and the accessorial pressing members can jointly press a top surface of the LGA package (60). Thus, reliable electrical connection between conductive pads on the LGA package and the corresponding contacts received in the socket body is ensured.

Abstract: An IC socket that is capable of obtaining stable, reliable electrical connections between an IC package and a socket housing, even in the case that the IC package is placed at a position shifted from a predetermined position on the socket housing then pressed, during connection of the IC package, without grinding down the peripheral wall of a mounting surface, onto which the IC package is mounted. Metal plates, for guiding the IC package, are provided on at least a portion of the peripheral wall that surrounds the mounting surface of the socket housing. The metal plates are of a shape such that they are coplanar with or protrude upward from an upper surface of the peripheral wall, and such that they are coplanar with or protrude inward from an inner surface of the peripheral wall.

Abstract: An electrical connecting apparatus comprises: a plurality of plate-like probes, each of which electrically connects an electrode of a device under test and a conductive portion formed in a base plate, and each of which has a tip to be pressed against the electrode on one end side of the probe and a curved outer face on one side in the width direction of the probe, and each of which further has a first recess opening on the one side; and an assembler for assembling the probes into the base plate such that the probes are arranged at intervals in the thickness direction and that the tips are projected to the side opposite to the base plate.

Abstract: An IC socket (1) includes an insulative housing (2) and large numbers of contacts (9) received therein. The housing defines arrayed contact receiving cavities (22) for accommodating the contacts. The cavities are arranged in array by first partition walls (24) and second partition walls (25), which are perpendicular to each other. The first partition wall is higher than the second partition wall. Each first partition wall is provided with protruding portions (240) and sunken portions (241), which are alternatively arranged.

Abstract: In some embodiments, a system includes a socket having a first set of socket contacts exposed on a first side of the socket and a second set of socket contacts exposed on a second side of the socket; and a frame comprising at least one surface to engage two lower surfaces of the second side of the socket. The two lower surfaces may be coupled by a lower corner surface of the second side of the socket, and wherein the lower corner surface does not engage the frame.

Abstract: A pick-up cap (13) is provided for an LGA connector (12). The LGA connector includes a load plate (24) defining a rectangular opening (240) in a middle portion thereof and a pair of pressing portions (241) surrounding the opening. The pick-up cap defines a main body (32) and a pair of wings (34) extending from two opposite sides of the main body. A plurality of first projections (325) extends from one of the two rest sides of the main body. A resilient arm (326) extends from the other of the two rest sides of the main body. A second projection (324) is provided at two ends of the resilient arm, respectively. The pick-up cap further defines a tongue portion (35) extending from the side defining the first projections.

Abstract: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.

Abstract: A socket is adapted for electrically connecting a chip module and a printed circuit board, and the socket includes a main body having a base and a plurality of contacts arranged in the base for resiliently contacting with the chip module, wherein the base includes a foundation and two lateral sidewalls extending from the foundation; an upper lid movably connecting to the main body; and a lock member securing the upper lid and the main body together. Each of the two lateral sidewalls has a projection disposed on at least one corner of an upper surface thereof for abutting against the upper lid.

Abstract: An apparatus for adjoining along a mating axis a first and second circuit board to directly mate a first integrated connector of the first board with a second integrated connector of the second board is disclosed. The apparatus comprises an attachment plate to be supported in a substantially horizontal plane; a plurality of extension arms extending downward from the plate to suspendingly restrain the first board away from the plate; at least one stop configured to be secured to the distal end of one of the plurality of extension arms to support the first board in suspension away from the plate; and a plurality of attachment elements to secure the plate to the second circuit board without applying substantial forces to the first circuit board.

Abstract: To provide a connector for camera module use capable of preventing a defective contact of the connector. A connector for camera module use in which a camera module 12 is accommodated in a connector box 23, which is covered with a shield case, and engaged by an engaging member, the camera module 12 including: a solid image pickup element; a lens unit having a lens for guiding light to the solid image pickup element; and a lens holder by which the solid image pickup element is held, wherein a distance between the lens and the solid image pickup element is adjusted to a predetermined focal distance by the lens holder, and the connector for camera module use comprises a pushing member 21, and the pushing member 21 includes: an opening portion 21a formed at the center, the size of which is larger than that of the lens unit; leaf-spring-shaped elastic members 22, 22 . . .

Abstract: Disclosed is a LGA socket connector including an insulative housing (2), a stiffener (3), a clip (4), and a lever (5) defining thereof a driving portion (50) and a locking portion (52) linked thereto. The stiffener is configured to grasp a periphery of the housing. The clip and the locking portion of the lever are essentially pivotally moved about longitudinal ends of the housing respectively, but with the driving portion disposed adjacent one transverse side of the housing. At least one of the clip and the stiffener is provided with a recessed region (300) adjacent said transverse side of the housing, thereby preventing the whole connector from becoming inclined when the connector is horizontally locked and placed on the printed circuit board.

Abstract: An LGA connector includes an insulative housing with a plurality of electrical terminals received therein, a stiffener defining a cavity in a middle portion thereof for partially receiving the housing therein. The insulative house is generally rectangular-shaped, which defines a surrounding wall, each corner of the surrounding wall defines a stopper which protruding outwardly. In assembly, when the housing is pushed into the cavity of the stiffener to a predetermined position, the stoppers will abut against the bottom portion for preventing the housing from being excessively pushed into the cavity or being push out of the cavity in a underside direction.

Abstract: A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pin-out of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.

Abstract: A land grid array socket includes an insulative housing (2), a stiffener (4) partly covering and reinforcing the housing, a metal clip (5) pivotably engaged on one end of the stiffener, and a lever (6) mounted on two opposite ends of the stiffener for fastening the clip onto the housing. The housing includes a floor (20), a number of sidewalls (24, 26) extending upwardly from the floor and a receiving space defined between the bottom wall and the sidewalls. A pair of step (263) is formed on the floor, for sustaining the LGA package (3) thereon. The sidewall that is far from the clip defines a plurality of rigid blocks (2683) in an inner side for resisting scrape between the sidewall and the LGA package. Therefore, the sidewall of the housing can be protected from scraping damage during insertion of the LGA package into the housing.

Abstract: An assembly for a computer system is mountable on a circuit board of a computer system. The assembly includes a base portion for engaging with an electronic component mounted on the circuit board. The assembly also includes a spring formed of memory metal. The spring is operable to urge the base portion against the electronic component to urge the electronic component towards the circuit board. The spring is configured to provide a greater spring force for urging the base portion against the electronic component when the spring is above a predetermined temperature than when it is below said predetermined temperature.

Abstract: A contact pin made of an electroconductive plate comprising a contact portion formed at a first end edge portion of the plate, the upper end contact portion being designed to electrically connect a part and having a central portion protruded to be an arcuate shape, the central portion being designed to abut against the part to establish an electrical connection between the central portion and the part. A socket for en electrical part comprises a base having the contact pin mentioned above, an intermediate connector provided on the base for establishing an electrical connection between the contact pin and the terminal of the electrical part. The intermediate connector has a connecting electrode which is electrically connected with the contact pin.

Abstract: A socket assembly with incorporated memory structure is provided. A chip carrier socket assembly includes dual stage clamping actuation. A first clamping actuation stage provides clamping force for ball grid array (BGA) contact pads and a second clamping actuation stage provides clamping force for a thermal interface. The first clamping actuation stage provides clamping force proximate to a perimeter of a carrier where a plurality of BGA contact pads are located. The second clamping actuation stage provides clamping force generally centrally of the chip carrier socket assembly for thermal interface actuation.

Abstract: An electrical connector assembly (10) includes a socket body (50), a frame (20) arranged around the socket body, and a socket plate (30) and a load lever (40) mounted to opposite ends of the socket body respectively. The socket body has a number of first sidewalls (505, 506). The first sidewalls form a number of protrusions (502) distant from a center of the socket body on exterior surfaces. The frame includes a number of second sidewalls (201, 202). The second sidewalls correspondingly define a number of slots (204) to mate with the respective protrusions. Via engagement between the protrusions and the corresponding slots, the frame can press down the socket body and prevent opposite ends of the socket body from bending upward, thereby reinforcing the socket body.

Abstract: A hybrid electronic circuit package (102, FIG. 1) includes non-insertable conductive features (110) and insertable conductive features (112) at a surface of the package. A hybrid receptacle (120), such as a socket, for example, includes non-insertable contacts (124) and insertable contacts (126), which are positioned in a complementary manner with the non-insertable and insertable features of the package. A vertical securement device (132, 134, 136) applies a vertical compressive force to the package (102) to compress the non-insertable features (110) against the non-insertable contacts (124). Further, a normal force securement device can be used to provide a sustained normal force to compress the insertable features and contacts together. In one embodiment, the non-insertable features are land grid array lands and the insertable features are low insertion force features.

Abstract: An integrated circuit (IC) package testing device using a selectable number of leaf springs to provide a resilient and consistent normal force to the IC package and the method of operating the device. The leaf springs are shaped to provide the proper compliance and resilient force and are shaped to fit side-by-side within the lid of the device. The springs can be easily changed for differently sized IC packages.

Abstract: In one embodiment there is disclosed a protective cover for a multi-pin electrical device socket. The socket, prior to having a device inserted therein, is covered with a cover having an inner surface facing the socket, a portion of the periphery of the inner surface of the cover contacting a frame having an open area surrounded by the frame structure. The inner surface of the cover has at least one protrusion thereon, with the protrusion adapted to contact an inserted electrical device thereby causing the cover to cease contacting at least one portion of the frame when the electrical device is installed in the socket.

Abstract: An electrical connector (1) for electrically connecting an electronic package with a circuit substrate. The connector includes a housing (11), a fastening device assembled with the housing, and a stiffener (12) surrounding the housing. The stiffener includes a back end (123), and a pair of spaced first walls (125) adjoining the back end. Each first wall has a latch (128) extending upwardly therefrom, and then bends inwardly. The back end has a pair of spaced spring fingers (129) extending substantially horizontally, and then bends slightly upwardly. The latches are fastened to the housing for locating the housing in a vertical direction. The spring fingers abut against the housing for locating the housing in a horizontal direction. The stiffener reinforces the housing, and protects the housing from deformation or warpage.

Abstract: A socket cover with a recessed center, method for using such a socket cover and system using such a socket cover are described herein.

Abstract: An land grid array (LGA) connector assembly comprises an insulative frame, a plurality of contacts received in the insulative frame, a reinforcement covering a circumference of the insulative frame, a clip assembled on the reinforcement and a lever mounted to the reinforcement and engaging with the clip. The clip is formed with a pivotal portion pivotally assembled on the reinforcement. The pivotal portion has at least one stopping portion on a edge thereof, the stopping portion is extending towards the insulative frame and abuts against the insulative frame to prevent the clip from moving flatly when the clip is in a close position.