Adapted To Be Secured To Conductor Formed On Printed Circuit Board Patents (Class 439/876)
  • Patent number: 11909288
    Abstract: A stator of an electric machine is already known, comprising stator teeth and grooves formed between the stator teeth, in which electrical conductor elements of an electrical individual coil winding are provided as individual coils, wherein an interconnection is provided on at least one end side of the stator, which has a ring section and multiple, in particular a number corresponding to the number of stator teeth, tooth sections protruding from the ring section in the radial direction. The interconnection ring comprises multiple bus bars for interconnecting the electrical individual coils of the electrical winding. The individual coils are produced from a conventional conductor material, e.g. copper. In the stator according to the invention, an electrical winding made of CNT conductor elements is provided.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: February 20, 2024
    Assignee: Robert Bosch GmbH
    Inventors: Matthias Roepke, Jens Sauermann, Juergen Kujath
  • Patent number: 11749918
    Abstract: A contact pad is provided. The contact pad may be a strip-shaped component and forms at least one opening. A circuit device is also provided. The circuit device has a circuit board, at least one contact pad as mentioned above, and a cable. The contact pad is mounted on the circuit board as a connecting spot. The cable has at least one wire. The wire is mounted on the contact pad and covers the opening of the contact pad. An interval is formed in the opening and between the circuit board and the wire. With such structure, a capacitance formed between the wire and the circuit board may be the smallest and the impedance value may be the largest. Besides, the capacitance value can be adjusted via changing the material inside the interval or an area of the contact pad or the opening.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: September 5, 2023
    Assignee: BIZLINK INTERNATIONAL CORP.
    Inventors: Hsin-Tuan Hsiao, Yi-Hsing Chung, Ting-Jhen Pan
  • Patent number: 11735879
    Abstract: An electrical device that comprises a printed circuit board, which has a first mounting surface, a second mounting surface, a mounting edge, and a plurality of mounting pads on the first mounting surface and the second mounting surface, and an electrical component that has a ball grid array. The electrical device further comprises an adaptor, interposed between the mounting edge and the electrical component, and comprising a body, made of an electrically non-conductive material, and a plurality of electrical pins, made of an electrically conductive material and passing at least partially through the body of the adaptor. The first end of each one of the plurality of electrical pins is electrically directly mounted to a corresponding one of the spaced apart solder balls. The second end of each one of the plurality of electrical pins is electrically directly mounted to a corresponding one of the plurality of mounting pads.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: August 22, 2023
    Assignee: ATL TECHNOLOGY, LLC
    Inventors: John Carl Holloway, Bradford James Brown, Donovan M. Finnestad
  • Patent number: 10714461
    Abstract: The present invention relates to an electronic unit having at least one first electronic component and one second electronic component that are fastened to a substrate. A shielding is arranged between the first and second electronic components that comprises an elevated portion that projects from a plane defined by the substrate or that extends from its surface, that acts as a shielding and that is formed in one piece with the substrate.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: July 14, 2020
    Assignee: VISHAY SEMICONDUCTOR GMBH
    Inventors: Christoph Paul Gebauer, Alexander Kamay
  • Patent number: 10355429
    Abstract: A connection terminal device and an electronic device having the same are provided. The connection terminal device includes a connection terminal device body, and a connection terminal connected to the connection terminal device body. The connection terminal device also has a front unit disposed on a front surface of the connection terminal device body, a rear unit disposed on a rear surface of the connection terminal device body, and a support disposed on the rear surface of the connection terminal device body. When force is applied to the connection terminal, supporting force is transferred to the rear unit of the connection terminal device body.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: July 16, 2019
    Assignees: SAMSUNG ELECTRONICS CO., LTD., HYUPJINCONNECTOR CO., LTD.
    Inventors: Myeong-Hwa Kim, Yang-Jean Park, Yeon-Kwan Moon, Jin-Woo Park, Myung-Suk Bae, Jung-Hyun Cho, Jin-Hyuk Choi, Jae-Ryong Han, Jang-Won Hur
  • Patent number: 10193241
    Abstract: A fixing method for fixing a terminal to a conductive pattern with a brazing filler metal disposed therebetween includes: a first step of disposing the brazing filler metal on the conductive pattern; a second step of bringing the terminal into contact with the brazing filler metal; and a third step of forming a penetrating hole in the terminal by irradiating a laser beam onto the terminal. In the third step, the laser beam is irradiated onto the terminal in such a manner that the penetrating hole is filled with the brazing filler metal melted by the irradiation of the laser beam.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: January 29, 2019
    Assignee: Japan Aviation Electronics Industry, Ltd.
    Inventors: Takushi Yoshida, Hiroshi Akimoto, Yosuke Seki
  • Patent number: 9882289
    Abstract: An electrical connector unit and having an electrical connector and a connection tab connected to the electrical connector or connecting the electrical connector to a carrier-strip when a carrier strip is included in the electrical connector unit. The connector tab has a weakened shear resistance zone, so when the connection tab is sheared to separate it from the electrical connector or to separate the electrical connector and the carrier-strip, a reduced shearing force is required to shear the connection tab.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: January 30, 2018
    Assignees: TE Connectivity India Private, TE Connectivity Germany GmbH
    Inventors: Volker Seipel, Erik Glombitza, Jens Nickel, Sowmya Shivananda
  • Patent number: 9775983
    Abstract: A method for manufacturing a lead includes pre-forming at least one relief section along a length of an elongated conductor having a first end and an opposing second end. The conductor with the pre-formed relief section is inserted into a conductor lumen defined along a length of an elongated lead body. The lead body has a first end and an opposing second end. An electrode is disposed at the first end of the lead body. The first end of the conductor is electrically coupled to the electrode. A terminal is disposed at the second end of the lead body. The second end of the conductor is electrically coupled to the terminal.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: October 3, 2017
    Assignee: Boston Scientific Neuromodulation Corporation
    Inventors: Andrew DiGiore, John Michael Barker, Anne Margaret Pianca, Michael Adam Moffitt, Matthew Lee McDonald, Joshua Dale Howard
  • Patent number: 9214763
    Abstract: A fly line connector is disclosed. A pin is connected to a main body. A fly line is wrapped around the pin. A first engaging portion is formed on the main body. A first engaging hole is formed in the main body and is opposite to the first engaging portion. When a number of the fly line connectors are combined together, the first engaging portion of one of the fly line connectors is engaged with the first engaging hole of the other one of the fly line connectors.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: December 15, 2015
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hsin-Wei Tsai, Ssu-Wei Fu, Ming-Cheng Lee
  • Patent number: 9155200
    Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.
    Type: Grant
    Filed: June 25, 2013
    Date of Patent: October 6, 2015
    Assignee: Interplex Industries, Inc.
    Inventor: Jack Seidler
  • Patent number: 9142932
    Abstract: An electrical connector having a fusible element for mounting on a substrate includes an insulative housing and a contact terminal retained in the insulative housing. The contact terminal includes a resilient contacting arm extending beyond a mating face of the insulative housing and a soldering portion for mating with the fusible element. A gelatinous flux is deployed on the fusible element, and/or on the soldering portion, and/or between the fusible element and the soldering portion, and then flux is dried to immovably fix the fusible element with respect to the soldering portion. The dried flux will be re-juvenile to clean and remove an oxidized layer originally existed on the soldering portion so as to achieve robust welding quality. Besides, a method for trimming an electrical connector to have robust welding properties is also disclosed.
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: September 22, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Been-Yang Liaw, Chih-Pi Cheng, Fu-Jin Peng, Zhan-Jun Xu
  • Patent number: 9118157
    Abstract: An electrical connector is to be connected to a mating electrical connector in a connecting direction. The electrical connector includes a terminal; and a housing for holding the terminal. The terminal includes a board connecting portion to be connected to a board; a holding portion fixed to the housing; a contact region for contacting a mating contact portion of the mating electrical connector; a contact piece capable of elastically deforming; and a contact portion formed at a distal end portion of the contact piece. The housing includes an inner piece portion and an outer piece portion. The contact piece is disposed between the inner piece portion and the outer piece portion. The outer piece portion includes inner piece holding portions at both sides thereof. The inner piece holding portions are away from each other by a distance greater than a width of the inner piece portion.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: August 25, 2015
    Assignee: HIROSE ELECTRIC CO., LTD.
    Inventor: Takashi Miyaki
  • Patent number: 9004957
    Abstract: A wire connecting structure and a cable connector assembly is provided. The wire connecting structure includes an electrical conductor, a cable and a resin. The electrical conductor includes a wire connecting portion. The cable includes an insulator and a core wire surrounded by and exposed from the insulator, the core wire connected to the wire connecting portion. The resin seals a part of the core wire exposed from the insulator and a part of the wire connecting portion.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: April 14, 2015
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Masayuki Aizawa, Kenji Takahashi, Keita Mashino
  • Patent number: 8956191
    Abstract: Provided is a connector comprising a plurality of rows of contacts and minimized in a front-rear direction. A first contact 30 positioned in an upper-row has a special shape constituted by a held portion 32 held by a housing 20, a connection portion 33 extending in a width direction from a rear end of the held portion 32, a first bent portion 35 extending from a front end of the connection portion 33 and being bent downward, and a first contact portion 36 extending downward from the first bent portion 35. A second contact 40 positioned in a lower-row has an L-shape. A second contact portion 44 of the second contact 40 is positioned obliquely rearward of the first contact portion 36 of the first contact 30.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: February 17, 2015
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventors: Toshihiro Oka, Nobuhiro Ogawa, Shigeyasu Kitamura
  • Publication number: 20150044889
    Abstract: An electrical connector includes an insulating body having a bottom surface, a receiving groove formed in the bottom surface, and at least one support block projecting downwardly from the bottom surface for connection with a circuit board and cooperating with the bottom surface to define a venting space that communicates with the receiving groove and a solder hole in the circuit board. A conductive terminal includes a first positioning portion extending into and positioned in the receiving groove, and a second positioning portion connected to the first positioning portion and extending through the venting space and adapted to be positioned in the solder hole.
    Type: Application
    Filed: June 30, 2014
    Publication date: February 12, 2015
    Inventors: CHUNG-FU WANG, NIEN-HUNG YAO, HSIN-YU YANG, YU-SHAN KAO
  • Patent number: 8821187
    Abstract: A board connector (10) includes a housing (20) made of resin and in which terminal fittings (80) connectable to conductive portions of a board (90) are to be mounted. Fixing members (60) fix the housing (20) on the board (90). Each fixing member (60) is made of metal and includes a housing mounting portion (61). The housing mounting plate (61) is to be mounted on a wall surface of the housing (20) by inserting front and rear ends of the housing mounting plate (61) in mounting grooves (26) formed in the wall surface of the housing (20). The housing mounting plate (61) has a first rib (71) extending in forward and backward directions, and a second rib (72) extending in forward and backward directions and arranged to fit within the height range of the first rib (71) with respect to a height direction perpendicular to forward and backward directions.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: September 2, 2014
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Tetsuya Aihara
  • Patent number: 8808011
    Abstract: A contact capable of electrically connecting an electrically conductive portion provided on a plate-like member with an electrically conductive member different from the plate-like member. The contact includes a main body; a movable portion held by the main body so as to be reciprocal in directions of increasing and decreasing of a projecting amount thereof outwardly of the main body; and a biasing mechanism that biases the movable portion in such a direction that the projecting amount of the movable portion increases. The main body includes a tubular portion, a solder inflow suppressing portion, and a soldering portion.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: August 19, 2014
    Assignee: Kitagawa Industries Co., Ltd.
    Inventors: Hiroki Kitano, Hideo Yumi, Tatsuya Nakamura
  • Patent number: 8804352
    Abstract: A circuit board assembly includes a motherboard, a first daughterboard, and a first metal bar. Two ends of the first metal bar are respectively fastened to the motherboard and the first daughterboard, and are electrically connected between the motherboard and the first daughterboard. The first metal bar is supported between the motherboard and the first daughterboard, so as to position the first daughterboard separately over the motherboard and enable the first daughterboard to be substantially perpendicular to the motherboard.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: August 12, 2014
    Assignee: Delta Electronics, Inc.
    Inventors: Ming-Hsien Hsieh, Kuo-Hua Lin, Yi-Min Chen
  • Patent number: 8796559
    Abstract: Disclosed herein are a lead pin for a printed circuit board and a printed circuit board using the same. The lead pin for a printed circuit board includes: a connection pin; and a pin head part formed at one end portion of the connection pin and including a protrusion, the diameter thereof being formed to be increasingly small based on a surface contacting the connection pin and the outer peripheral surface thereof being provided with a protrusion-shaped or depression-shaped band, whereby it forms a protrusion-shaped band or a depression-shaped band on the pin head part of the lead pin to increase a contacting area with the solder, thereby improving an adhesion between the lead pin and the printed circuit board.
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: August 5, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Yong Ho Baek, Seok Hyun Park, Ki Taek Lee
  • Patent number: 8754332
    Abstract: Provided is a flexible substrate wherein a connection portion between the flexible substrate and an electric circuit board meets requirements of narrow wiring pitch and low resistance at the connection portion. An electric circuit structure, which has the flexible substrate and the electric circuit board to which the flexible substrate is connected, is also provided. A wiring pattern (22) is formed on a flexible base film (21), a connection terminal (25) connected electrically to an electrode terminal of another electric circuit board is arranged at an end portion of the wiring pattern (22), and the connection terminal (25) includes wide connection terminals (25b, 25c) having a terminal width extending across plural lines of the wiring pattern (22).
    Type: Grant
    Filed: August 3, 2009
    Date of Patent: June 17, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yukihiro Sumida, Takeshi Muraoka
  • Patent number: 8674220
    Abstract: A housing for an electronic control device includes at least two housing parts, at least one housing base, a housing lid and an electronic connection between components disposed inside the housing and components disposed outside the housing. The connection is fixed to the base of the housing. The electronic connection is either constructed as a single-component flexible printed circuit board or as at least one partial flexible printed circuit board including at least one uniform open area of a copper conductor track outside an area covered by the housing lid. The width of the uniform region is oriented to a predefined contacting type of peripheral components and is longer than necessary for the contacting type. The invention therefore provides for a variable adaptation of generic electronics housings, thereby not necessarily requiring a novel structure of the housing with corresponding expensive individual packaging.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: March 18, 2014
    Assignee: Continental Automotive GmbH
    Inventors: Josef Loibl, Karl Smirra
  • Patent number: 8672718
    Abstract: A board connecting terminal includes a contact that comes into contact with a mate side terminal, an indent that comes into contact with a pad formed on a circuit board, a terminal attaching part connected to the indent to attach the board connecting terminal to the circuit board, and an engaging piece connected to the contact and having a part held by a holder on which the circuit board is mounted. In the terminal attaching part, when the board connecting terminal is attached to the circuit board, a part of the terminal attaching part enters a through hole passing through the circuit board in a thickness direction thereof to restrain the indent from moving in a planar direction of the circuit board.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: March 18, 2014
    Assignee: Yazaki Corporation
    Inventors: Yasuo Suzuki, Shinji Yamada, Hirohito Toriyama
  • Patent number: 8602830
    Abstract: A terminal component that is inexpensive and has a high degree of freedom of mounting and a portable electronic device using the terminal component are provided. The terminal component 15 includes a metal plate 41 having a contact surface 15a to contact a power supply terminal 105 of a charging stand 101, wherein at least two portions of an end part of the metal plate 41 are bent, and a resin member 43 that is held by the bent portions. A part to be mounted 41c on a sub-substrate 31 is formed at the bent portions of the metal plate 41.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: December 10, 2013
    Assignee: Kyocera Corporation
    Inventor: Yugo Ito
  • Publication number: 20130258631
    Abstract: A Printed Circuit Assembly has a multiplicity of connectors with each connector containing insulating matrices with each matrix containing a multiplicity of conducting or non-conducting standoffs with each standoff contacting one or more printed circuit boards. The standoffs permit controlled-impedance electrical connections, thermal management and mechanical rigidity of the overall assembly making the assembly suitable for use in any environment including the most harsh extremes.
    Type: Application
    Filed: April 2, 2012
    Publication date: October 3, 2013
    Inventor: Robert Winston Carter
  • Patent number: 8500462
    Abstract: A junction box for a solar panel comprises a housing, a lid, a first connector and a second connector. The housing comprises sidewalls and a top wall defining an interior space. The first coupling comprises a first contact element and the second coupling comprises a second contact element. Said contact elements penetrate at least one of the sidewalls, so that the contact elements provide an electrical contact from external contact elements to internal contact elements, such as solder tails. Internal contact elements are arranged at least partially in said interior space. The top wall comprises an opening extending only partially in said top wall. Said opening is located such in the top wall that access to said solder tails in a substantially perpendicular direction to the surface of a solar panel for connecting the solder tail to the solar panel is provided.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: August 6, 2013
    Assignees: Applied Materials, Inc., Multi-Holding AG
    Inventors: Brian Wade Mills, Robert D. Street, Danny Cam Toan Lu, Yacov Elgar, Ian Worthington Weatherley, Dustin Delmar Reede Carver, Jeffrey S. Sullivan, Ian McKay Pratt
  • Patent number: 8497429
    Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: July 30, 2013
    Assignee: Interplex Industries, Inc.
    Inventor: Jack Seidler
  • Patent number: 8469753
    Abstract: A pin for a semiconductor device is disclosed. A connection head includes a plurality of curved protruded ribs and a plurality of recessed grooves. The curved protruded ribs and recessed grooves are alternately arranged. The curved protruded ribs radially extend from the center of the connection head. A pin stem is connected to the connection head.
    Type: Grant
    Filed: November 25, 2011
    Date of Patent: June 25, 2013
    Assignee: Nan Ya PCB Corp.
    Inventors: Shih-Tsung Lin, Yu-Shi Wong, Tzu-Yuan Hsu, Yu-Wei Chen
  • Patent number: 8454397
    Abstract: An electrically conductive terminal includes a solder tail configured to be soldered to a contact pad of a circuit member and at least one deflectable contact arm. Each deflectable arm is configured to engage a counterpart terminal of a mating electrical component. A body having a pair of side edges and oppositely facing side surfaces is provided between and connects the solder tail and the contact arm. Each side surface has a pair of non-parallel channels therein with at least one of the channels extending between the pair of side edges.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: June 4, 2013
    Assignee: Molex Incorporated
    Inventors: Norihiro Nishi, Kazushige Asakawa
  • Publication number: 20130137314
    Abstract: Provided is a wire-to-board connector including a plug attached to a wire, and a receptacle mounted on a circuit board. The plug and the receptacle are formed of metal. The plug is fitted into the receptacle to electrically connect the wire to the circuit board. The receptacle has an accommodating portion formed in a tubular shape. The plug has an inserted portion to be inserted into the accommodating portion of the receptacle. The inserted portion includes a body plate and an elastic piece elastically supported in a cantilevered manner by the body plate. The elastic piece of the inserted portion has a free end. The accommodating portion has an engaged portion. When the inserted portion is inserted into the accommodating portion, the free end engages with the engaged portion along with an elastic deformation of the elastic piece, thereby allowing the plug to be fitted into the receptacle.
    Type: Application
    Filed: November 8, 2012
    Publication date: May 30, 2013
    Applicant: Japan Aviation Electronics Industry, Ltd.
    Inventor: Japan Aviation Electronics Industry, Ltd.
  • Patent number: 8419447
    Abstract: A surface-mount technology (SMT) device connector (100) for connecting a removable component (150) to a substrate (160). The SMT device connector (100) includes an insulated housing (135) for receiving the removable component (150) and the insulated housing (135) is surface mounted to a SMT device connector location on the substrate (160). The SMT device connector also includes two stress relief posts (110) protruding from a mounting surface (137) of the insulated housing (135). The two stress relief posts (110) correspond to two stress relief post apertures (111) in the substrate (160) and the two stress relief posts (110) are not required to be constrained along a longitudinal axis (140) of the insulated housing (137) in the corresponding stress relief post apertures (111) to relieve stress on the SMT device connector (100) during SMT reflow.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: April 16, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Gary Marc Freedman
  • Patent number: 8328564
    Abstract: A connector is provided for mounting a module to a printed circuit board. The connector includes a housing having end walls defining a slot for receiving a module. Terminals are mounted within the housing on either side of the slot. Each terminal includes a tail. A solder mass is attached to each tail and is used to bond the connector to the printed circuit board. The solder mass is attached to each tail without the use of a reflow process. The solder mass can be attached to the tail of the terminal either through a mechanical attachment or through bonding. A reflow process is then used to attach the connector to the printed circuit board.
    Type: Grant
    Filed: June 13, 2003
    Date of Patent: December 11, 2012
    Assignee: Molex Incoporated
    Inventors: Kent E. Regnier, Victor Zaderej
  • Patent number: 8241760
    Abstract: A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part.
    Type: Grant
    Filed: September 14, 2006
    Date of Patent: August 14, 2012
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventor: Toshiaki Chuma
  • Publication number: 20120156948
    Abstract: There is provided a board connection structure capable of preventing occurrence of a connection failure, which would otherwise be caused by an uneven temperature increase in connection region of circuit boards during thermo-compression bonding.
    Type: Application
    Filed: February 22, 2010
    Publication date: June 21, 2012
    Applicant: PANASONIC CORPORATION
    Inventor: Masahito Kawabata
  • Patent number: 8172591
    Abstract: An electrical connector assembly (100) for mounting to a printed circuit board, comprises a plurality of contacts (3) and a processor (1), the contact (3) comprises a base portion (31), a pair of contacting portions (34) and a solder portion (35) extend from the base portion (31), the processor (1) comprises a plurality of pins (11) each includes a cylinder portion (110) and a cone portion (111) extending downwardly from the cylinder portion (110), the bottom end of the cone portion (111) is thinner than the top end thereof to guiding the pins (11) inserted into the contacts (3), the contacting portions (34) contacts with the cone portion (111) respectively.
    Type: Grant
    Filed: July 5, 2010
    Date of Patent: May 8, 2012
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Darrell Lynn Wertz
  • Patent number: 8167630
    Abstract: Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side of the into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the housing, thereby reducing warpage. Solder resist areas are formed on central portions of the contacts to promote uniformity of solder volume.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: May 1, 2012
    Assignee: FCI Americas Technology LLC
    Inventors: Timothy A. Lemke, Timothy W. Houtz
  • Patent number: 8153900
    Abstract: A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side opposed to the electrode pad of a head part formed in one end of a shaft part. The lead pin is bonded to the electrode pad in a state in which the conductive material extends to the back surface side of a head part beyond a flange part of the head part and reaches the shaft part of the lead pin.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: April 10, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hirokazu Takeuchi, Kiyotaka Shimada, Masayoshi Ebe, Yoshinori Furihata
  • Patent number: 8142240
    Abstract: Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the head part, having a step part. When the lead pin for the package substrate is mounted on the package substrate, the bulge phenomenon of a solder paste that surrounds the head part and is melted is prevented by a flange part, thereby making it possible to prevent the connection pin from being polluted and to improve a contact defect such as a short defect or the like when coupling a socket.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: March 27, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Heung Jae Oh, Ki Taek Lee, Dong Gyu Lee, Sung Won Jeong, Jin Won Choi
  • Patent number: 8070535
    Abstract: A printed circuit board terminal includes a rectangular metal wire rod having a substantially rectangle cross-section. One longitudinal end portion of the printed circuit board terminal includes an insertion portion that is configured to be inserted into a through hole provided in a printed circuit board and soldered. A conducting metal plated layer is provided on an entire surface of the rectangular metal wire rod. One marginal portion of the insertion portion, which faces a long side direction of the rectangle cross-section, is removed to reduce a dimension in the long side direction corresponding to a width direction.
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: December 6, 2011
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Hideki Goto
  • Patent number: 8052435
    Abstract: A connector soldered to a PCB has an insulating housing of which two opposite ends recessed to form a pair of receiving recesses, terminals mounted in the insulating housing having soldering portions projected out of a bottom of the insulating housing, a positioning member. The positioning member has a base slice received in the receiving recess, a side edge of the front of the base slice extending downward and then being bent perpendicularly to form a soldering slice located to be lower than the bottom of the base for being soldered with the PCB. As the thickness of the base slice is less than the height of the receiving recess, intervals are accordingly formed between the positioning member and the top and bottom sides of the receiving recess to achieve an up-and-down movement of the positioning member.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: November 8, 2011
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Hung-Chi Wang, Mei-Chuan Yang
  • Patent number: 8003894
    Abstract: A soldering nest provided in a bus bar, having an aperture for the introduction of a terminal lead (40) to be soldered thereinto, and the introduction of the terminal lead may be effected from a first surface plane of the bus bar (10) and soldering may be effected from a second, opposite surface plane of the bus bar (10). The aperture is formed by a conical bore (20) which is perpendicular or approximately perpendicular to the surface plane of the bus bar (10) and whose cone angle is at least 30?. The apex of the conical bore (20) is oriented toward the first surface plane of the bus bar (10), and the conical bore (20) terminates in a circular aperture (21) whose diameter is slightly greater than the diameter of the terminal lead (40).
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: August 23, 2011
    Inventor: AndrĂ¡s Fazakas
  • Patent number: 7976319
    Abstract: An electrical connector includes a housing having a mating end and a board end. The housing has a plurality of contact cavities extending along a longitudinal axis between the mating and board ends. A plurality of contacts are received within the contact cavities. The contacts have a mating end and a mounting end, and the contacts have a flexible tail at the mounting end. The tail has a first portion extending along the longitudinal axis and a second portion angled with respect to the first portion with the second portion having a board mounting surface configured to mount to a circuit board. The tail includes a slot open along the board mounting surface.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: July 12, 2011
    Assignee: Tyco Electronics Corporation
    Inventors: Hung Thai Nguyen, Brent D. Yohn
  • Patent number: 7972186
    Abstract: An elastic sheet structure includes a plate portion, two wedged portion formed at opposite sides of the plate portion, and a latching portion formed another side of the plate portion. The wedged portion and the latching portion can be formed by bending two extending portions of the plate portion downwardly, the wedged portion is used to resist with a circuit board, the latching portion is for insertion into a hole of the circuit board to latch with the circuit board.
    Type: Grant
    Filed: March 30, 2010
    Date of Patent: July 5, 2011
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Mei-Tsu Tsao
  • Patent number: 7944710
    Abstract: The disclosure involves the efficient termination of a winding PCB of a planar inductive component to a main PCB, using relatively little space and providing a low-resistance connection. The disclosed methods are especially suitable for planar structures where several winding PCBs, and/or winding PCBs and a main PCB, are all enclosed by the magnetic path components. The methods allow for a winding PCB to simply rest on the main PCB, or other winding PCBs, without any clearance. The disclosure employs mating sets of conductive annular rings with an optional interlocking terminal pin that allows two PCBs to be fixedly coupled together, while preserving a minimum distance between the solder-mask layers of the two PCBs in order to prevent the formation of unwanted electrical connections between the two PCBs. Solder is used to ensure effective coupling in each assembly of mating annular rings and optional terminal pin.
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: May 17, 2011
    Assignee: Battery-Biz Inc.
    Inventors: Victor Marten, Aakar Patel, Mark Vanstone
  • Patent number: 7909665
    Abstract: An improved electrical connector for use with a glazing is disclosed. The glazing preferably comprises a ply of glazing material having a first electrically conductive component mounted thereon, and a second electrically conductive component, joined to the first by a solder. The second component comprises first and second connector feet linked by a bridge portion, the bridge portion being at a height h above each of the connector feet, and each of the feet comprises at least one protrusion having a height d. At least one of h or d is chosen to maximise the adhesion between the second electrically conductive component and the first electrically conductive component. Preferably, the glazing is an automotive glazing.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: March 22, 2011
    Assignee: Pilkington Group Limited
    Inventor: Michael Lyon
  • Patent number: 7909666
    Abstract: There are provided the steps of preparing a contact (10, 20), which is formed from a metallic sheet including a base portion (11, 21), an elastic deformation portion (12, 22), and a contact portion (13, 23), and in which a recess (15, 25) is formed on a bottom surface of the base portion and a plurality of through-holes (16, 26, 27) are formed to be arranged above the recess and in parallel to the bottom surface of the base portion to extend through the base portion, and holding solder on the through-holes formed on the contact. A desired, solder-attached contact (10a, 20a) is fabricated by the manufacturing method. Further, the solder is a solder ball (90) and the step of holding solder includes the step of preparing the solder ball and the step of press fitting the solder ball into the through-hole.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: March 22, 2011
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Yuji Nakamura
  • Patent number: 7878870
    Abstract: An electrical contact (3) includes a body section (30), a contacting arm (31) extending upward from the body section (30), a soldering section (32) formed by cutting out from the body section and then extending outwardly. The soldering section (32) comprising a first extending arm (321) connected to the body section (30), a second extending arm (322) bent downwardly from the first extending arm (321), and a soldering pad (323) extending from the second extending arm (322) toward the body section (30). An opening (300) is defined after the soldering section (30) is cut out from the body section.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: February 1, 2011
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Chia-Wei Fan
  • Publication number: 20110009013
    Abstract: An elastic sheet structure includes a plate portion, two wedged portion formed at opposite sides of the plate portion, and a latching portion formed another side of the plate portion. The wedged portion and the latching portion can be formed by bending two extending portions of the plate portion downwardly, the wedged portion is used to resist with a circuit board, the latching portion is for insertion into a hole of the circuit board to latch with the circuit board.
    Type: Application
    Filed: March 30, 2010
    Publication date: January 13, 2011
    Applicant: CHI MEI COMMUNICATION SYSTEMS, INC.
    Inventor: MEI-TSU TSAO
  • Publication number: 20100304625
    Abstract: There are provided the steps of preparing a contact (10, 20), which is formed from a metallic sheet including a base portion (11, 21), an elastic deformation portion (12, 22), and a contact portion (13, 23), and in which a recess (15, 25) is formed on a bottom surface of the base portion and a plurality of through-holes (16, 26, 27) are formed to be arranged above the recess and in parallel to the bottom surface of the base portion to extend through the base portion, and holding solder on the through-holes formed on the contact. A desired, solder-attached contact (10a, 20a) is fabricated by the manufacturing method. Further, the solder is a solder ball (90) and the step of holding solder includes the step of preparing the solder ball and the step of press fitting the solder ball into the through-hole.
    Type: Application
    Filed: October 30, 2007
    Publication date: December 2, 2010
    Inventor: Yuji Nakamura
  • Patent number: 7837522
    Abstract: An electrical contact including a head, a tail including an opposing pair of major surfaces and a hole, a body connected at one end thereof to the head and at another end thereof to the tail, a peg arranged adjacent to the hole and to extend perpendicular or substantially perpendicular to one of the opposing pair of major surfaces and including at least one beveled side, and a solder member attached to the tail such that the peg creates and fits in a protrusion in a surface of the solder member when the solder member is attached to the tail, such that a portion of the solder member extends into the hole, and such that the solder member engages the at least one beveled side of the peg.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: November 23, 2010
    Assignee: Samtec, Inc.
    Inventors: David Hoover, John Mongold, Donald Knowlden
  • Patent number: 7828562
    Abstract: An electrical connector includes a base having a plurality of through holes, and a plurality of conducting pins respectively located in the through holes. There is a convex block located at the side wall of the base for each of the through holes. Each of the conducting pins has an arm portion. The arm portion and the convex block are located at the same side. The arm portion has a through opening, and one end of the arm portion is bent and extended to form a contacting portion. The contacting portion has an opening that links with the through opening to form a channel that makes the convex block pass through the channel without interference. Because of the lack of interference, the conducting pin will not be damaged due to contact with the convex block when the conducting pin is installed into the through hole.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: November 9, 2010
    Assignee: Lotes Co., Ltd.
    Inventor: Yongquan Wu